JPH0720917Y2 - Resin mold device - Google Patents
Resin mold deviceInfo
- Publication number
- JPH0720917Y2 JPH0720917Y2 JP1987111469U JP11146987U JPH0720917Y2 JP H0720917 Y2 JPH0720917 Y2 JP H0720917Y2 JP 1987111469 U JP1987111469 U JP 1987111469U JP 11146987 U JP11146987 U JP 11146987U JP H0720917 Y2 JPH0720917 Y2 JP H0720917Y2
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- resin
- heat sink
- pellet
- movable pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【考案の詳細な説明】 産業上の利用分野 本考案は、ペレットマウント部としての放熱板を外装樹
脂材にて完全被覆した絶縁型の樹脂モールド装置に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION Industrial Field of the Invention The present invention relates to an insulating resin molding apparatus in which a heat dissipation plate as a pellet mount is completely covered with an exterior resin material.
従来の技術 樹脂封止型半導体装置は一般にペレットマウント部とし
ての放熱板の一部を露出させて樹脂外装しシャーシベー
スや放熱器等に熱的に密着して放熱を良好にしている
が、近年は熱伝導性の良好な樹脂が開発されたことによ
り放熱板の全面を樹脂被覆した絶縁型の樹脂封止型半導
体装置が多用されている。2. Description of the Related Art In general, a resin-sealed semiconductor device exposes a part of a heat dissipation plate as a pellet mount part and is resin-coated to thermally adhere to a chassis base, a radiator, etc. to improve heat dissipation. Since a resin having good thermal conductivity has been developed, an insulating resin-sealed semiconductor device in which the entire surface of a heat dissipation plate is covered with resin is widely used.
この半導体装置の構造例を第５図及び第６図に示すと、
（１）は放熱板、（２）（２）…は放熱板（１）から外
方に延びる例えば３本一組のリードで、中央のリードの
一端は放熱板（１）と一体化され、両側のリードの各一
端は放熱板（１）の近傍に位置する。（３）は放熱板
（１）上にマウントされた半導体ペレット、（４）
（４）は半導体ペレット（３）の表面電極とリード
（２）（２）の一端部とを電気的に接続する金属細線、
（５）は放熱板（１）全面とリード先端部を含む主要部
をエポキシ樹脂等にて被覆成形した外装樹脂材である。A structural example of this semiconductor device is shown in FIG. 5 and FIG.
(1) is a heat sink, (2) (2) ... is a set of, for example, three leads extending outward from the heat sink (1), one end of the central lead is integrated with the heat sink (1), One end of each of the leads on both sides is located near the heat sink (1). (3) is a semiconductor pellet mounted on the heat sink (1), (4)
(4) is a fine metal wire that electrically connects the surface electrode of the semiconductor pellet (3) and one end of the leads (2) and (2),
(5) is an exterior resin material obtained by coating and molding the entire surface of the heat dissipation plate (1) and the main part including the lead tips with epoxy resin or the like.
上記半導体装置は、第７図に示すように複数本一組のリ
ード（２）と放熱板（１）とをそれぞれ複数組、タイバ
ー（６）（７）で一体化したリードフレーム（８）を使
い、半導体ペレットのマウント、ワイヤボンディング後
第８図に示す樹脂モールド装置の上下金型（９）（10）
でタイバー（７）とリード（２）を挾持して位置決め
し、キャビティ（11）内に収納した半導体ペレット
（３）を含む主要部をランナ（14）、ゲート（15）を経
て注入される溶融樹脂にて封止し製造される。このとき
放熱板裏面には放熱性を良好にするため例えば0.6mm程
度の樹脂膜（12）が形成される。樹脂封止後、タイバー
（７）及びリード（２）の連結部を切断して個々の半導
体装置に分割する。As shown in FIG. 7, the above semiconductor device has a lead frame (8) in which a plurality of sets of leads (2) and heat sinks (1) are respectively combined and are integrated by tie bars (6) and (7). After using, mounting semiconductor pellets and wire bonding, upper and lower molds (9) (10) of the resin molding device shown in FIG.
The tie bar (7) and the lead (2) are clamped and positioned, and the main part including the semiconductor pellet (3) stored in the cavity (11) is injected through the runner (14) and the gate (15). It is manufactured by sealing with resin. At this time, a resin film (12) of, for example, about 0.6 mm is formed on the back surface of the heat dissipation plate to improve heat dissipation. After the resin sealing, the connecting portion of the tie bar (7) and the lead (2) is cut to divide into individual semiconductor devices.
考案が解決しようとする問題点 ところで、放熱板（１）表面側には金属細線（４）があ
り、裏面の樹脂膜（12）を薄く成形しなければならない
ため放熱板（１）を境としてキャビティ（11）の上側
（11a）と下側（11b）（第８図参照）とではそれぞれ容
量が異なり、上側（11a）の方が下側（11b）よりも数倍
大きい。そこで、テャビティ（11）内に樹脂を注入する
と溶融樹脂は、流動抵抗が小さい放熱板（３）上面側を
速く流れ、ゲート対向面から放熱板（１）の裏面側に回
り込み、下側（11b）に進入した溶融樹脂と会合する。
の時点では樹脂の硬化が進んでいるので、会合面が接合
一体化しにくく気泡や断層の成形不良が発生し易く、こ
のような不良を回避するための溶融樹脂の粘度調整や圧
送速度の調整温度制御などが困難で、品質保証に不都合
が生じる。Problems to be solved by the invention By the way, since there is a thin metal wire (4) on the surface of the heat sink (1) and the resin film (12) on the back side must be thinly formed, the heat sink (1) is used as a boundary. The upper side (11a) and the lower side (11b) (see FIG. 8) of the cavity (11) have different capacities, and the upper side (11a) is several times larger than the lower side (11b). Therefore, when the resin is injected into the cavity (11), the molten resin flows quickly on the upper surface side of the heat dissipation plate (3) having a small flow resistance, wraps around from the gate facing surface to the back surface side of the heat dissipation plate (1), and then the lower side (11b) ) And the molten resin that has entered.
Since the resin is being hardened at the point of time, it is difficult to join and integrate the mating surfaces, and defective molding of bubbles and faults is likely to occur.To avoid such defectiveness, the viscosity adjustment of the molten resin and the adjustment temperature of the pumping speed are controlled. It is difficult to control, and quality assurance is inconvenient.
問題点を解決するための手段 本考案は、上下金型を衝合させて形成されるキャビティ
内に、半導体ペレットが載置されたペレットマウント部
をキャビティから浮かせた状態で位置させ、上記キャビ
ティ内に溶融樹脂を注入してペレットマウント部の全面
を樹脂被覆する樹脂モールド装置において、上記ペレッ
トマウント部の巾とほぼ同じ径を有しキャビティ内に突
出退入して樹脂注入中のキャビティ容量を変化させる可
動ピンを配置したことを特徴とする。Means for Solving the Problems In the present invention, a pellet mount part on which semiconductor pellets are mounted is placed in a cavity formed by abutting upper and lower molds in a state of being floated from the cavity. In a resin molding device that injects molten resin into the resin to cover the entire surface of the pellet mount section with resin, it has a diameter approximately the same as the width of the pellet mount section and protrudes and retracts into the cavity to change the cavity capacity during resin injection. It is characterized by arranging a movable pin to be moved.
作用 上記技術的手段によれば、可動ピンの突出・退入によっ
てキャビティに収納された放熱板裏面側のキャビティ容
量を樹脂注入初期では大きく設定し、樹脂注入途中でキ
ャビティ容量を正規容量に戻すことにより、樹脂注入を
スムーズにする。Action According to the above technical means, the cavity capacity on the back surface side of the heat sink housed in the cavity by the protrusion / retraction of the movable pin is set to be large in the initial stage of resin injection, and the cavity capacity is returned to the normal capacity during the resin injection. Makes resin injection smooth.
実施例 本考案の一実施例を第１図乃至第４図を参照して以下説
明する。第１図と第２図は本考案に係る樹脂モールド装
置の要部の側断面図と平面図、第３図と第４図はその動
作状態の要部の側断面図を夫々示す。まず、第１図及び
第２図において（１）、（２）、（３）はそれぞれ放熱
板、リード、半導体ペレットを示す。（16）は上金型、
（17）は下金型、（18）はキャビティ、（19）は可動ピ
ン、（20）はゲート、（21）はランナである。放熱板
（１）とリード（２）と半導体ペレット（３）について
は従来と同じでその説明を省略する。上下金型（16）
（17）は衝合によってキャビティ（18）を形成し、キャ
ビティ（18）内に放熱板（１）が収納されると共にラン
ナ（21）からゲート（20）を経て溶融樹脂が注入され
る。可動ピン（19）は下金型側のキャビティ底面に付設
され、上面が上記底面の一部をなすと共に突出・退入
し、放熱板裏面側のキャビティ容積を変化させる。Embodiment An embodiment of the present invention will be described below with reference to FIGS. 1 to 4. 1 and 2 are a side sectional view and a plan view of an essential part of a resin molding apparatus according to the present invention, and FIGS. 3 and 4 are side sectional views of the essential part in its operating state. First, in FIGS. 1 and 2, (1), (2), and (3) respectively indicate a heat sink, a lead, and a semiconductor pellet. (16) is the upper mold,
(17) is a lower mold, (18) is a cavity, (19) is a movable pin, (20) is a gate, and (21) is a runner. The heat sink (1), the lead (2), and the semiconductor pellet (3) are the same as the conventional ones, and the description thereof is omitted. Upper and lower molds (16)
(17) forms a cavity (18) by abutting, the heat sink (1) is housed in the cavity (18), and molten resin is injected from the runner (21) through the gate (20). The movable pin (19) is attached to the bottom surface of the cavity on the lower die side, and the top surface forms a part of the bottom surface and projects / retracts to change the cavity volume on the back surface side of the heat sink.
上記構成に基づき本考案の動作を次に示す。まず、従来
と同じく放熱板（１）のリード（２）とタイバー（第７
図、第８図参照）を上下金型（16）（17）で両端支持し
て位置決めしキャビティ（18）内に放熱板（１）を収納
する。次に、第３図に示すように、可動ピン（19）をキ
ャビティ底面より距離（l1）だけ下げて放熱板裏面側の
キャビティ容積を表面側と略等しくした後、ランナ（2
1）、ゲート（20）よりキャビティ（18）内に溶融樹脂
を注入する。そうすると、注入された溶融樹脂は、放熱
板（１）を境にして上下に分かれて進入していくが、放
熱板（１）の表裏面側（キャビティ上下側）における各
キャビティ容積は略等しいため流動抵抗も略等しく、同
等の速度で溶融樹脂は進入していく。そして、キャビテ
ィ下側（18b）に溶融樹脂が放熱板裏面側を被覆するの
に必要な量だけ注入されると、第４図に示すように、可
動ピン上面がキャビティ底面と略同一面又はやや低い位
置（l2≒０）に達するまで可動ピン（19）を上昇させ
る。これにより、放熱板裏面側の樹脂が短時間で拡げら
れ放熱板裏面側で溶融樹脂が会合することなく放熱板
（１）の表裏及び端面が完全樹脂被覆される。The operation of the present invention based on the above configuration will be described below. First, the leads (2) of the heat sink (1) and the tie bar (7th)
The upper and lower molds (16, 17) are supported at both ends to position the heat sink (1) in the cavity (18). Next, as shown in FIG. 3, the movable pin (19) is lowered from the bottom surface of the cavity by a distance (l 1 ) to make the cavity volume on the rear surface of the heat sink approximately equal to that on the front surface, and then the runner (2
1), molten resin is injected into the cavity (18) through the gate (20). Then, the injected molten resin is divided into upper and lower parts with the heat radiating plate (1) as a boundary and enters. However, since the cavity volumes on the front and back sides (cavity upper and lower sides) of the heat radiating plate (1) are substantially equal to each other. The flow resistances are almost equal, and the molten resin enters at the same speed. Then, when the molten resin is injected into the lower side of the cavity (18b) in an amount necessary to cover the rear surface of the heat sink, as shown in FIG. 4, the upper surface of the movable pin is substantially flush with the bottom surface of the cavity or slightly. The movable pin (19) is raised until it reaches a low position (l 2 ≈0). As a result, the resin on the back surface of the heat sink is spread in a short time, and the front and back surfaces and the end surface of the heat sink (1) are completely covered with the resin without the molten resin meeting on the back surface of the heat sink.
考案の効果 本考案によれば、放熱板を上下金型の衝合によるキャビ
ティ内に収納し、その表裏及び端面を完全樹脂被覆する
際、キャビティ底面より突出・退入する可動ピンを付設
してキャビティ容積を変えるようにしたから、キャビテ
ィ内に注入された放熱板を境に上下に分かれた溶融樹脂
が、放熱板裏面側で会合することなく充填され、気泡や
断層の発生などの成形不良を防止でき、樹脂粘度の調整
等が容易になって生産性が向上し、かつ、品質が保証さ
れる。Effect of the Invention According to the present invention, the heat sink is housed in the cavity due to the abutment of the upper and lower molds, and when the front and back surfaces and the end surfaces are completely covered with resin, a movable pin that projects and retracts from the bottom surface of the cavity is attached. Since the cavity volume is changed, the molten resin that has been injected into the cavity and is divided into upper and lower parts is filled without melting on the back side of the heat sink, which may cause molding defects such as bubbles and faults. It is possible to prevent the deterioration, facilitate the adjustment of the resin viscosity, improve the productivity, and guarantee the quality.
第１図と第２図は本考案に係る樹脂モールド装置の要部
の側断面図と平面図、第３図と第４図は本考案に係る樹
脂モールド装置の各動作状態を示す各側面図、第５図と
第６図は完全樹脂封止型半導体装置の部分断面平面図と
側断面図、第７図は第５図及び第６図半導体装置のリー
ドフレームの部分平面図、第８図は第７図リードフレー
ムの放熱板を樹脂被覆する上下金型の要部側断面図であ
る。 （１）……ペレットマウント部、（３）……半導体ペレ
ット、（16）……上金型、（17）……下金型、（18）…
…キャビティ、（19）……可動ピン。1 and 2 are a side sectional view and a plan view of a main part of a resin molding apparatus according to the present invention, and FIGS. 3 and 4 are side views showing respective operating states of the resin molding apparatus according to the present invention. 5 and 6 are partial cross-sectional plan views and side cross-sectional views of the completely resin-sealed semiconductor device, and FIG. 7 is a partial plan view of the lead frame of the semiconductor device shown in FIGS. 5 and 6. FIG. 7 is a side sectional view of the main parts of the upper and lower molds which cover the heat dissipation plate of the lead frame shown in FIG. (1) …… Pellet mount, (3) …… Semiconductor pellet, (16) …… Upper mold, (17) …… Lower mold, (18)…
… Cavity, (19) …… Movable pin.
Claims (1)
ィ内に、半導体ペレットが載置されたペレットマウント
部をキャビティから浮かせた状態で位置させ、上記キャ
ビティ内に溶融樹脂を注入してペレットマウント部の全
面を樹脂被覆する樹脂モールド装置において、上記ペレ
ットマウント部の巾とほぼ同じ径を有しキャビティ内に
突出退入して樹脂注入中のキャビティ容量を変化させる
可動ピンを配置したことを特徴とする樹脂モールド装
置。1. A pellet mount part on which semiconductor pellets are placed is positioned in a cavity formed by abutting upper and lower molds in a state of being floated from the cavity, and molten resin is injected into the cavity. In a resin molding device that coats the entire surface of the pellet mount with resin, a movable pin that has a diameter approximately the same as the width of the pellet mount and that protrudes and retracts into the cavity to change the cavity capacity during resin injection is placed. A resin molding device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987111469U JPH0720917Y2 (en) | 1987-07-20 | 1987-07-20 | Resin mold device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987111469U JPH0720917Y2 (en) | 1987-07-20 | 1987-07-20 | Resin mold device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6416634U JPS6416634U (en) | 1989-01-27 |
| JPH0720917Y2 true JPH0720917Y2 (en) | 1995-05-15 |
Family
ID=31349541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987111469U Expired - Lifetime JPH0720917Y2 (en) | 1987-07-20 | 1987-07-20 | Resin mold device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0720917Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4676210B2 (en) * | 2004-12-28 | 2011-04-27 | 三ツ星化成品株式会社 | Manufacturing method for interior parts for automobiles |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60130129A (en) * | 1983-12-16 | 1985-07-11 | Nec Corp | Method for sealing isolation-type semiconductor element with resin |
-
1987
- 1987-07-20 JP JP1987111469U patent/JPH0720917Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6416634U (en) | 1989-01-27 |
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