JPH0727632Y2 - Chip part socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a socket for use in mounting a rewritable ROM (Read Only Memory) or other chip component on a printed circuit board.

[Prior Art] A perforated socket for mounting a rewritable ROM on a printed circuit board has already been used. If the ROM is mounted in the perforated socket, the bottom of the ROM can be pressed using this hole to remove the ROM from the socket.
The contents of the removed ROM are erased by ultraviolet rays and the like, and new contents are written in the ROM.

[Problems to be Solved by the Invention] By the way, since the ROM socket has a hole for removal, it was impossible to automatically mount it by a vacuum suction type component mounter.

Therefore, an object of the present invention is to provide a socket that can be mounted by suction and that can easily remove a chip component.

[Means for Solving the Problems] The present invention for achieving the above object comprises an insulating base and a connecting conductor having an outer terminal portion and an inner terminal portion supported by the insulating base, and The outer terminal portion is formed to be soldered to the conductor of the printed circuit board, and the terminal of the chip component is formed to be connected to the inner terminal portion, and the insulating base body is used for removing the chip component. In a socket of a chip part having a hole corresponding to the opening of the printed circuit board, the detaching hole is closed by a closing member that can be broken or separated. It is related to the socket of.

It should be noted that instead of the closing member, a part that can be integrally broken or separated from the insulating substrate may be provided.

[Operation] Since the hole for removing the chip component of the socket of the present invention is closed by the closing member, it is possible to mount it on the printed circuit board using the suction device. When removing the chip component from the socket, the blocking member is broken or removed to press the bottom surface of the chip component. The bottom surface portion of the insulating substrate according to the second aspect also has the same function as the closing member.

[Embodiment] Next, a circuit board device including a ROM socket according to an embodiment will be described with reference to FIGS.

The ROM socket 1 includes an insulating base 2 and a connecting conductor 3. The connection conductor 3 has an outer terminal portion 3a for connecting to the conductor (electrode land) 5 of the printed circuit board 4 and an inner terminal portion 3b for connecting to the terminal 7 of the rewritable ROM 6 shown in FIG. The insulating substrate 2 has a recess 8 for accommodating the ROM 6 and a ROM removal hole 9 communicating with the recess 8. The inner terminal portion 3b of the connection conductor 3 is exposed inside the recess 8. The outer terminal portion 3a is arranged so as to face the conductor 5 of the printed circuit board 4.

A film 10 is adhered to the periphery of the hole 9 of the insulative substrate 2 so as to close the hole 9 of the insulative substrate 2 of the socket 1 with a heat-resistant adhesive capable of withstanding heating during soldering.
The film 10 is made of a polyimide film having a thickness of about 25 μm and a heat resistant temperature of 290 ° C., and can withstand the heat during solder reflow.

When mounting the socket 1 on the printed circuit board 4, cream solder (paste-like solder) 11 is applied on the conductor 5 of the printed circuit board 4 in advance, and the suction indicated by the chain line of the vacuum suction type component mounting machine is shown. The head 12 attracts the socket 1 and arranges it at a predetermined position on the printed circuit board 4. Thereafter, the cream solder 11 is melted (reflowed) at 220 ° C. to 240 ° C., and the outer terminal portion 3a is fixed to the conductor 5 of the printed circuit board 4 with the solder 11a as shown in FIG.

The ROM 6 is mounted in the recess 8 of the socket 1, and the terminal 7 of the ROM 6 is brought into contact with the inner terminal portion 3b of the socket 1. Since the inner terminal portion 3b has springiness and protrudes into the concave portion 8,
When M6 is inserted, it is elastically deformed so as to be pressed against the wall surface of the insulating base 2, contacts the terminals 7 of the ROM 6, and mechanically holds the ROM 6 in the recess 8.

When it becomes necessary to rewrite the contents of the ROM 6, a rod 12 is inserted from the bottom side of the printed circuit board 4 through the opening 4a of the printed circuit board 4 and the hole 9 of the socket 1 as shown in FIG. Break and press the bottom of ROM6, ROM6
Is removed from the socket 1. When the rewriting of the contents of the ROM 6 is completed, the ROM 6 is mounted in the recess 8 of the socket 1 again.

[Modification] The present invention is not limited to the above-described embodiments, and the following modifications are possible, for example.

(1) The film 10 may be peeled from the socket 1 without breaking the film 10 when the ROM 6 is removed.

(2) When the contents of the ROM 6 are rewritten multiple times, the old film 10 may be peeled off and a new film may be adhered.

(3) Instead of the film 10, a closing member made of a thin plate may be used.

(4) It can be applied to sockets for chip parts other than ROM6.

(5) In the embodiment, the outer terminal portion 3a and the inner terminal portion 3b are formed of the same connection conductor 3, but they may be formed of different connection conductors and connected to each other.

(6) As shown in FIG. 6, a thin portion 2a is provided on the bottom surface of the insulating substrate 2, and a groove 13 is further provided so as to surround the thin portion 2a.
You may make it possible to make it detach by pressing. Alternatively, the portion 2a may be broken.

[Advantages of the Invention] As is apparent from the above, according to the present invention, it is possible to provide a socket that can be mounted by suction and in which chip components can be easily removed.

[Brief description of drawings]

FIG. 1 is a sectional view showing a circuit board and a socket according to an embodiment of the present invention, FIG. 2 is a plan view of the socket shown in FIG. 1, and FIG. 3 is a longitudinal sectional view showing a state where a ROM is mounted in the socket. FIG. 4 is a plan view of the circuit board having the ROM of FIG. 3 mounted thereon, FIG. 5 is a sectional view showing a state in which the ROM is removed from the socket, and FIG. Is. DESCRIPTION OF SYMBOLS 1 ... Socket, 2 ... Insulating base, 3 ... Connection conductor, 3a ... Outer terminal part, 3b ... Inner terminal part, 4 ... Circuit board, 4a ... Opening,
5 ... Conductor, 6 ... ROM, 7 ... Terminal, 8 ... Recess, 9 ... Hole.

Claims (2)

[Scope of utility model registration request] 1. An insulating base, and a connecting conductor having an outer terminal portion and an inner terminal portion supported by the insulating base, and the outer terminal portion is soldered to a conductor of a printed circuit board. Is formed so as to connect the terminal of the chip component to the inner terminal portion, and the insulating substrate is provided with a hole for removing the chip component corresponding to the opening of the printed circuit board. A socket for chip parts, wherein the socket for detachment is closed by a closing member that can be broken or separated. 2. An insulating substrate, and a connecting conductor having an outer terminal portion and an inner terminal portion supported by the insulating substrate, and the outer terminal portion is soldered to a conductor of a printed circuit board. In the socket of the chip part formed so as to connect the terminal of the chip part to the inner terminal part, a part which can be broken or detached from the bottom surface part of the insulating base is formed. A socket for a chip component, wherein the socket is provided and the chip component is detached by utilizing this portion.