JPH0728645U - Thermal printer - Google Patents

Thermal printer

Info

Publication number
JPH0728645U
JPH0728645U JP035021U JP3502193U JPH0728645U JP H0728645 U JPH0728645 U JP H0728645U JP 035021 U JP035021 U JP 035021U JP 3502193 U JP3502193 U JP 3502193U JP H0728645 U JPH0728645 U JP H0728645U
Authority
JP
Japan
Prior art keywords
circuit board
driving
wiring pattern
heating resistors
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP035021U
Other languages
Japanese (ja)
Inventor
法宜 東海林
克明 齋田
法光 三本木
義則 佐藤
雄一 石田
修 滝澤
Original Assignee
セイコー電子工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by セイコー電子工業株式会社 filed Critical セイコー電子工業株式会社
Priority to JP035021U priority Critical patent/JPH0728645U/en
Priority to FR9407789A priority patent/FR2707556B1/en
Priority to KR1019940015014A priority patent/KR950000399A/en
Publication of JPH0728645U publication Critical patent/JPH0728645U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/3351—Electrode layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/33515—Heater layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electronic Switches (AREA)

Abstract

(57)【要約】 【構成】 表面に複数の発熱抵抗体と、この発熱抵抗体
を駆動制御する駆動用ＩＣ２と、該駆動用ＩＣ２に電源
及び制御信号を伝達する配線パターンが形成され、裏面
に放熱板３が固定された発熱抵抗体基板１と、該発熱抵
抗体基板１の配線パターンと電気的に接続される外部回
路接続用端子４７を形成した回路基板４とを有し、前記
回路基板４の適宜箇所に他の部位よりも可撓性の高い部
分を形成してなる。でき、かつ、さほど回路基板の面積
を大きくしなくても、他の部分より 【効果】 屈曲させたい部位が任意に選択でき、可撓性
の優れた回路基板を供することが可能であるため、小型
機器への搭載が可能で、しかもサーマルヘッドのクリー
ニングや機器のメンテナンスを容易に行うことができ
る。 (57) [Summary] [Structure] A plurality of heating resistors, a driving IC 2 for driving and controlling the heating resistors, and a wiring pattern for transmitting power and control signals to the driving IC 2 are formed on the back surface. And a circuit board 4 having an external circuit connection terminal 47 electrically connected to the wiring pattern of the heat generating resistor substrate 1, and the circuit board 4 having the heat generating resistor substrate 1 fixed to the heat radiating plate 3. A portion having higher flexibility than other portions is formed at an appropriate portion of the substrate 4. Even if the area of the circuit board is not increased so much, [Effect] It is possible to arbitrarily select a portion to be bent than other portions, and it is possible to provide a circuit board having excellent flexibility. It can be mounted on a small device and the thermal head can be easily cleaned and the device can be easily maintained.

Description

【考案の詳細な説明】[Detailed description of the device]

【０００１】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、例えば可撓性回路基板等を介して制御されるサーマルヘッドを内蔵 した小型の電子機器に使用されるサーマルプリンタに関する。 The present invention relates to a thermal printer used in a small electronic device having a built-in thermal head controlled via a flexible circuit board or the like.

【０００２】[0002]

【従来の技術】[Prior art]

従来のサーマルヘッドは、図９に示すように、発熱抵抗体に給電するための電 極を形成した絶縁性の発熱抵抗体基板１上に発熱抵抗体列１１及び該発熱抵抗体 列１１の発熱抵抗体を選択的に発熱させるための駆動用ＩＣ２とを設け、該駆動 用ＩＣ２への制御信号および電源の供給は、プリント配線された回路基板を介し て行う構成が一般的であった。 As shown in FIG. 9, a conventional thermal head has a heating resistor array 11 and heat generation of the heating resistor array 11 on an insulating heating resistor substrate 1 on which an electrode for supplying power to the heating resistor is formed. In general, a driving IC 2 for selectively heating the resistor is provided, and control signals and power are supplied to the driving IC 2 via a printed circuit board.

【０００３】 一方、前記回路基板を外部制御回路と接続するためには、前記回路基板を補強 材で補強したプリント基板として、一端にコネクタを取り付けることにより接続 する構造や、回路基板４を可撓性の高い回路基板として構成し、この回路基板４ の電極端子を直接図示しない外部制御回路のコネクタに差し込む構造等が用いら れている。On the other hand, in order to connect the circuit board to an external control circuit, a structure in which the circuit board is a printed board reinforced with a reinforcing material and a connector is attached to one end to connect the circuit board 4 and the circuit board 4 is flexible. The circuit board is constructed as a highly flexible circuit board, and the electrode terminals of the circuit board 4 are directly inserted into a connector of an external control circuit (not shown).

【０００４】 近年、電子機器は小型化が進み、これら小型の電子機器に搭載されるプリンタ も、サーマルヘッドによるものが多用されるようになってきている。 このような用途においては、部品自体を小さくすることと、部品点数を少なく することが必要となる。このためには、前述の二種類の構造のうち、可撓性回路 基板を用いた場合の方が部品点数を簡略にできるため、こちらの構造が一般的に 多く用いられている。In recent years, electronic devices have been downsized, and printers mounted on these small electronic devices have been increasingly used with thermal heads. In such applications, it is necessary to reduce the size of the parts themselves and the number of parts. To this end, of the two types of structures described above, the structure using a flexible circuit board can simplify the number of parts, and thus this structure is generally used.

【０００５】[0005]

【考案が解決しようとする課題】[Problems to be solved by the device]

駆動用ＩＣを搭載したサーマルヘッドは、制御用の信号端子が多く存在するた め、一層のみのプリント配線を用いた回路基板で対応することは極めて難しく、 二層あるいは四層のプリント配線を形成した回路基板が必要である。 Since a thermal head equipped with a drive IC has many signal terminals for control, it is extremely difficult to handle it with a circuit board that uses only one printed wiring. Two or four layers of printed wiring are formed. A printed circuit board is required.

【０００６】 しかしながら、多層のプリント配線を用いた場合、当然のことながら、一層の プリント配線を用いた場合より基板の厚みが増大し、可撓性が劣ることになる。 反面、小型機器への搭載の他、サーマルヘッドのクリーニングや機器のメンテ ナンスを行う場合など、部分的に回路基板を屈曲させなければならないことがあ り、この部分は十分な可撓性が要求される。However, when the multilayer printed wiring is used, the thickness of the substrate is naturally increased and the flexibility is deteriorated as compared with the case where the single-layer printed wiring is used. On the other hand, the circuit board may need to be partially bent when mounting it on a small device, cleaning the thermal head, or maintaining the device.This part requires sufficient flexibility. To be done.

【０００７】 このために、回路基板の一部に単層部分を形成して可撓性を良くし、この部分 を屈曲させるようにすることが行われるが、図５、図６に示すように、多層配線 の部分を避けるためには、屈曲させる部位が限られてしまい、このため、図７、 図８に示すように、単層の屈曲部を設けるために多層配線部は前記屈曲部を避け て形成することが必要となり、その結果、回路基板の面積を増大してしまう等の 課題があった。For this reason, a single layer portion is formed on a part of the circuit board to improve flexibility, and this portion is bent, but as shown in FIGS. In order to avoid the portion of the multi-layer wiring, the portion to be bent is limited. Therefore, as shown in FIG. 7 and FIG. It is necessary to avoid the formation, and as a result, there is a problem that the area of the circuit board is increased.

【０００８】[0008]

【課題を解決するための手段】[Means for Solving the Problems]

上記課題を解決するため、本考案では、回路基板の所定屈曲部分に基板の屈曲 性を良くするため、複数の抜き孔を設けるか、または、屈曲部分のみ導体層およ び絶縁層の構成を少なくするようにしたものである。 In order to solve the above problems, in the present invention, in order to improve the flexibility of the circuit board at a predetermined bending portion, a plurality of holes are provided, or only the bending portion is provided with a conductor layer and an insulating layer. I tried to reduce it.

【０００９】[0009]

【作用】[Action]

上記のように、回路基板の希望の位置に回路基板が屈曲し易くなるように加工 を施す構造としたため、上記加工部分は他の部分より可撓性に優れ、また、屈曲 させたい部位は任意に選択できるようになる。 As described above, the structure is designed so that the circuit board can be easily bent at the desired position on the circuit board.Therefore, the processed part is more flexible than other parts, and the part you want to bend is arbitrary. You will be able to choose.

【００１０】[0010]

【実施例】【Example】

以下に、この考案の実施例を図に基づいて説明する。 図１、図２に本考案のサーマルヘッドの回路基板の一実施例を示す。 図面において、回路基板４は二層導体からなる多層導体基板であり、前記多層 導体基板には二種類の配線が形成される。即ち、基板の表裏に形成された第一導 体層４２と第二導体層４４である。これら第一導体層４２と第二導体層４４はス ルーホール４８を介して基板の表裏を電気的に接続している。４１は第一絶縁層 、４３は第二絶縁層である。 An embodiment of the present invention will be described below with reference to the drawings. 1 and 2 show an embodiment of the circuit board of the thermal head of the present invention. In the drawing, a circuit board 4 is a multi-layer conductor board composed of two-layer conductors, and two kinds of wirings are formed on the multi-layer conductor board. That is, the first conductor layer 42 and the second conductor layer 44 formed on the front and back of the substrate. The first conductor layer 42 and the second conductor layer 44 electrically connect the front and back surfaces of the substrate via the through holes 48. Reference numeral 41 is a first insulating layer, and 43 is a second insulating layer.

【００１１】 一方、１は発熱抵抗体基板であり、該発熱抵抗体基板１には発熱抵抗体列１１ と複数の駆動用ＩＣ２が設けられており、前記発熱抵抗体列１１を駆動制御する 前記各駆動用ＩＣ２には、それぞれ共通の電気信号を入力する必要がある。 このため、前記回路基板４の表裏に形成された第一導体層と第二導体層とは互 いに直交して表裏に配置された後、スルーホール４８を介して前記表裏の各導体 層が電気的に接続され構造が一般的である。On the other hand, reference numeral 1 denotes a heat generating resistor substrate, and the heat generating resistor substrate 1 is provided with a heat generating resistor array 11 and a plurality of driving ICs 2, and drives and controls the heat generating resistor array 11. It is necessary to input a common electric signal to each driving IC 2. Therefore, after the first conductor layer and the second conductor layer formed on the front and back sides of the circuit board 4 are arranged on the front and back sides at right angles to each other, the conductor layers on the front and back sides are separated through the through holes 48. The structure is generally electrically connected.

【００１２】 この構成において、屈曲部が二層導体部分である時、前記導体層のうち、前記 屈曲部と平行に配置された導体層の間に前記導体層と平行になるように複数の孔 ４６を形成したものであり、該孔を形成することにより前記可撓性基板の一部を 部分的にさらに撓みやすくするようにしたものである。In this structure, when the bent portion is a two-layer conductor portion, a plurality of holes are formed in the conductor layer so as to be parallel to the conductor layer between the conductor layers arranged parallel to the bent portion. 46 is formed, and by forming the hole, a part of the flexible substrate is made to be more easily bendable.

【００１３】 図３、図４は本考案の他の実施例を示すものであり、多層に形成された回路基 板４の一部に屈曲方向と平行な単層のみの配線部分を形成することにより、他の 部分より一層基板の撓み性を向上させ、該単層部分を介して前記基板を屈曲させ るようにしたものである。FIGS. 3 and 4 show another embodiment of the present invention, in which a single-layer wiring portion parallel to the bending direction is formed on a part of the circuit board 4 formed in multiple layers. Thus, the flexibility of the substrate is further improved as compared with other portions, and the substrate is bent through the single layer portion.

【００１４】[0014]

【考案の効果】[Effect of device]

上記のように構成することにより、回路基板の所望の位置に屈曲部を形成する ことが出来、かつ、回路基板の平面的なスペースを大きくすることなく、部分的 に屈曲部を形成することができるので、スペース的に制約の多い小型機器への搭 載が容易に可能となり、しかも、サーマルヘッドのクリーニングや機器のメンテ ナンスも容易に行うことができる等の効果を有する。 With the above configuration, the bent portion can be formed at a desired position on the circuit board, and the bent portion can be partially formed without increasing the planar space of the circuit board. As a result, it is possible to easily mount it on a small device that has a lot of space constraints, and it is also possible to easily clean the thermal head and maintain the device.

【図面の簡単な説明】[Brief description of drawings]

【図１】本考案の回路基板の平面図である。FIG. 1 is a plan view of a circuit board of the present invention.

【図２】本考案の回路基板の断面図である。FIG. 2 is a sectional view of a circuit board of the present invention.

【図３】本考案の回路基板の他の実施例を示す平面図で
ある。FIG. 3 is a plan view showing another embodiment of the circuit board of the present invention.

【図４】本考案の回路基板の他の実施例を示す断面図で
ある。FIG. 4 is a sectional view showing another embodiment of the circuit board of the present invention.

【図５】従来の回路基板の平面図である。FIG. 5 is a plan view of a conventional circuit board.

【図６】従来の回路基板の断面図である。FIG. 6 is a cross-sectional view of a conventional circuit board.

【図７】従来の回路基板の他の実施例を示す平面図であ
る。FIG. 7 is a plan view showing another embodiment of the conventional circuit board.

【図８】従来の回路基板の他の実施例を示す断面図であ
る。FIG. 8 is a sectional view showing another embodiment of a conventional circuit board.

【図９】サーマルヘッドの全体断面図である。FIG. 9 is an overall sectional view of a thermal head.

【符号の説明】[Explanation of symbols]

１ 発熱抵抗体基板 ２ 駆動用ＩＣ ３ 放熱板 ４ 回路基板 １１ 発熱抵抗体列 ４１ 第一絶縁層 ４２ 第一導体層 ４３ 第二絶縁層 ４４ 第二導体層 ４５ 屈曲部位 ４６ 孔 ４８ スルーホール 1 Heating Resistor Substrate 2 Driving IC 3 Heat Sink 4 Circuit Board 11 Heating Resistor Row 41 First Insulating Layer 42 First Conductor Layer 43 Second Insulating Layer 44 Second Conductor Layer 45 Bending Portion 46 Hole 48 Through Hole

───────────────────────────────────────────────────── フロントページの続き (72)考案者 佐藤 義則 東京都江東区亀戸６丁目31番１号 セイコ ー電子工業株式会社内 (72)考案者 石田 雄一 東京都江東区亀戸６丁目31番１号 セイコ ー電子工業株式会社内 (72)考案者 滝澤 修 東京都江東区亀戸６丁目31番１号 セイコ ー電子工業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Yoshinori Sato 6-31-1 Kameido, Koto-ku, Tokyo Seiko Electronics Co., Ltd. (72) Yuichi Ishida 6-31-1 Kameido, Koto-ku, Tokyo Seiko Denshi Kogyo Co., Ltd. (72) Inventor Osamu Takizawa 6-31-1, Kameido, Koto-ku, Tokyo Seiko Denshi Kogyo Co., Ltd.

Claims (3)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項１】 表面に複数の発熱抵抗体と、この発熱抵
抗体を駆動制御する駆動用ＩＣと、該駆動用ＩＣに電源
及び制御信号を伝達する配線パターンが形成され、裏面
に放熱板が固定された発熱抵抗体基板と、該発熱抵抗体
基板の配線パターンと電気的に接続される外部回路接続
用端子を形成した回路基板とを有し、前記回路基板の適
宜箇所に可撓性の高い屈曲部を形成したことを特徴とす
るサーマルプリンタ。1. A plurality of heating resistors, a driving IC for driving and controlling the heating resistors, a wiring pattern for transmitting a power source and a control signal to the driving IC are formed on the front surface, and a heat radiating plate is formed on the back surface. It has a fixed heating resistor substrate and a circuit substrate on which external circuit connecting terminals electrically connected to the wiring pattern of the heating resistor substrate are formed. A thermal printer characterized by having a high bend. 【請求項２】 表面上に複数の発熱抵抗体と、この発熱
抵抗体を駆動制御する駆動用ＩＣと、該駆動用ＩＣに電
源及び制御信号を伝達する配線パターンが形成され、裏
面に放熱板が固定された発熱抵抗体基板と、該発熱抵抗
体基板の配線パターンと電気的に接続される外部回路接
続用端子を形成した回路基板とを有し、前記回路基板の
適宜箇所に複数の抜き孔を設け、該抜き孔の形成部分を
介して前記回路基板を屈曲させることを特徴とする請求
項１記載のサーマルプリンタ。2. A plurality of heating resistors, a driving IC for driving and controlling the heating resistors, a wiring pattern for transmitting power and control signals to the driving IC are formed on the front surface, and a heat radiating plate is formed on the back surface. And a circuit board having external circuit connection terminals electrically connected to the wiring pattern of the heating resistor board, and a plurality of punched parts at appropriate positions of the circuit board. The thermal printer according to claim 1, wherein a hole is provided, and the circuit board is bent through a portion where the hole is formed. 【請求項３】 表面上に複数の発熱抵抗体と、この発熱
抵抗体を駆動制御する駆動用ＩＣと、該駆動用ＩＣに電
源及び制御信号を伝達する配線パターンが形成され、裏
面に放熱板が固定された発熱抵抗体基板と、該発熱抵抗
体基板の配線パターンと電気的に接続される外部回路接
続用端子を形成した多層の回路基板とを有し、前記回路
基板の一部に屈曲部を形成すると共に、該屈曲部の周辺
の導体層および絶縁層はたの部分よりも少ない層で形成
したことを特徴とする請求項１記載のサーマルプリン
タ。3. A plurality of heating resistors, a driving IC for driving and controlling the heating resistors, a wiring pattern for transmitting power and control signals to the driving IC are formed on the front surface, and a heat radiating plate is formed on the back surface. And a multi-layered circuit board having external circuit connection terminals electrically connected to the wiring pattern of the heating resistor board, and a part of the circuit board is bent. 2. The thermal printer according to claim 1, wherein the conductor layer and the insulating layer around the bent portion are formed with fewer layers than the other portions while forming the portion.
JP035021U 1993-06-28 1993-06-28 Thermal printer Pending JPH0728645U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP035021U JPH0728645U (en) 1993-06-28 1993-06-28 Thermal printer
FR9407789A FR2707556B1 (en) 1993-06-28 1994-06-24 Thermal printer with flexible circuit board.
KR1019940015014A KR950000399A (en) 1993-06-28 1994-06-28 Thermal printer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP035021U JPH0728645U (en) 1993-06-28 1993-06-28 Thermal printer

Publications (1)

Publication Number Publication Date
JPH0728645U true JPH0728645U (en) 1995-05-30

Family

ID=12430414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP035021U Pending JPH0728645U (en) 1993-06-28 1993-06-28 Thermal printer

Country Status (3)

Country Link
JP (1) JPH0728645U (en)
KR (1) KR950000399A (en)
FR (1) FR2707556B1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57115372A (en) * 1981-01-08 1982-07-17 Matsushita Electric Ind Co Ltd Thermal head
JPS6021262A (en) * 1983-07-15 1985-02-02 Matsushita Electric Ind Co Ltd Thermal head
US4626870A (en) * 1983-08-25 1986-12-02 Sharp Kabushiki Kaisha Dual density two-sided thermal head
JPS60257257A (en) * 1984-06-04 1985-12-19 Rohm Co Ltd Manufacture of thermal print head
JPS61162368A (en) * 1985-01-11 1986-07-23 Toshiba Corp Thermal head for printer

Also Published As

Publication number Publication date
FR2707556B1 (en) 1997-10-10
KR950000399A (en) 1995-01-03
FR2707556A1 (en) 1995-01-20

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