JPH07320221A - Polishing machine for magnetic head manufacturing - Google Patents

Abstract

PURPOSE:To lessen scratching and track chipping of polished surface and to improve the yield by stabilizing a polishing state and to polishing magnetic head substrate under a uniform polishing pressure to have a mirror finished surface. CONSTITUTION:A magnetic head substrate 2 is held by a substrate holding member 3 so as to face the polishing surface 1a of a surface plate 1 for polishing. This substrate holding member 3 is oscillated, and rotated according to rotation of the surface plate 1 for polishing around a supporting member 4. The opening angle theta at which the magnetic head substrate 2 is held by the substrate holding member 3 is specified to >=140 deg..

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus for manufacturing a magnetic head, which is used, for example, for mirror-finishing a magnetic gap forming surface.

[0002]

2. Description of the Related Art In a manufacturing process of a magnetic head, mirror finishing is required to improve the surface property of a magnetic gap forming surface. Normally, either mechanical polishing or non-contact polishing is adopted for mirror surface processing.

In mechanical polishing, a magnetic head substrate held by a substrate holding member, which is a jig, is placed on a polishing platen made of tin (Sn) or the like, and the abrasive grains are rotated while the polishing platen is rotated. Is a method of polishing while supplying a diamond slurry using diamond. In particular, in order to improve the polishing accuracy, the substrate holding member was rotated with the rotation of the polishing platen around the supporting member facing the hole provided in the substrate holding member, and was connected to the supporting member. The substrate holding member is oscillated in the radial direction on the polishing platen by the rotation of the arm.

On the other hand, the non-contact polishing has almost the same structure as the mechanical polishing, but the magnetic head substrate is polished by immersing the magnetic head substrate in the diamond slurry filled on the polishing platen.

[0005]

However, when the size of the wakuu (which means the magnetic head substrate in this case) becomes small in order to secure the processing accuracy, the polishing state becomes unstable and the polishing pressure becomes uneven. Due to the reduction in machining efficiency, tracks on the track width regulating groove are broken, and scratches more than the abrasive grain size on the magnetic gap forming surface occur frequently, resulting in a reduction in machining yield.

Moreover, if a magnetic gap forming surface is formed in a state where the surface damage is deep and a head is formed, magnetic characteristics deteriorate and head output cannot be expected. Further, in manufacturing a metal in-gap head (hereinafter, referred to as MIG head), the surface of the magnetic alloy film is mirror-finished in order to remove the sag at the track edge, but in this case, the polishing pressure is uneven. , Of course, the deterioration of the magnetic gap formation surface,
Film peeling of the magnetic alloy film and track breakage on the track width regulation groove occur.

Therefore, the present invention has been proposed in view of the above-mentioned technical problems of the prior art, and makes the polishing state stable, and the magnetic head substrate is mirror-polished under a uniform polishing pressure. However, it is an object of the present invention to provide a polishing apparatus for manufacturing a magnetic head, which can reduce scratches on the polished surface and chipping of tracks and improve the yield.

[0008]

A polishing apparatus for manufacturing a magnetic head according to the present invention comprises a disk-shaped polishing platen and a magnetic head substrate arranged so as to face the polishing surface of the polishing platen. A substrate holding member which is held on one main surface and has a blind hole on the other end surface on the opposite side to the one main surface, and a spherical tip end facing the blind hole of the substrate holding member, A support member for supporting a substrate holding member which is brought into point contact with the bottom surface of the blind hole and is rotated around the contact portion with the rotation of the polishing platen, and the substrate holding member connected to the support member. And a rocking member for rocking on a polishing surface plate. In this apparatus, the contact point between the bottom of the blind hole of the substrate holding member and the tip of the supporting member, and the both side edges of the surface of the magnetic head substrate held by the substrate holding member facing the surface plate are respectively defined. The above-mentioned problem is solved by setting the angle θ formed by the joined lines (hereinafter referred to as the opening angle θ) to 140 degrees or more.

As the polishing surface plate used here, it is desirable to use one having a plurality of circular grooves formed concentrically on the polishing surface.

[0010]

According to the present invention, the contact point between the bottom of the blind hole of the substrate holding member for holding the magnetic head substrate and the tip of the supporting member and the surface of the magnetic head substrate held by the substrate holding member facing the surface plate. Since the angle formed by the line connecting each of the both side edges is 140 degrees or more, the polishing state is stable, and the magnetic head substrate is polished by a uniform polishing pressure. It is possible to avoid the occurrence of scratches, missing tracks, etc.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments to which the present invention is applied will be described in detail below with reference to the drawings. The magnetic head manufacturing polishing apparatus of this embodiment is an example of a mechanical polishing apparatus that presses a magnetic head substrate that is an object to be polished against a rotating polishing surface plate and performs polishing while supplying a slurry that is a polishing liquid. is there.

As shown mainly in FIGS. 1 and 2, this polishing apparatus for manufacturing a magnetic head comprises a polishing platen 1, a substrate holding member 3 which is a jig for holding a magnetic head substrate 2, and a polishing plate. A supporting member 4 for supporting a substrate holding member 3 which is rotated by the rotation of the plate 1, and a swinging member 5 which is connected to the supporting member 4 and swings the substrate holding member 3 on the polishing platen 1. It consists of and.

The polishing surface plate 1 is formed in a disk shape from a material such as Sn, Sn-kemet, Sn-Ni, Sn-Sb. These relatively soft S
The reason why the n-type surface plate is used is to improve the finished surface. The polishing surface 1a of the polishing platen 1 is provided with a plurality of concentric circular grooves 6, 7 and 8 at predetermined intervals for the purpose of holding diamond slurry or SiO ₂ slurry. There is.

The polishing platen 1 is adapted to rotate in a direction indicated by an arrow A in FIG. 1 by a drive source such as a motor. The rotation speed of the polishing platen 1 can be freely adjusted by a drive source, and can be appropriately set to a speed required.

The substrate holding member 3 holds the magnetic head substrate 2 on its one main surface 3a (hereinafter referred to as the substrate holding surface 3a), and also opposes the polishing surface 1a of the polishing platen 1. By arranging and applying a load (self-weight of the substrate holding member 3) to this, it serves to stabilize the polishing state. The substrate holding member 3 is formed as a rectangular parallelepiped having a size large enough to hold the magnetic head substrate 2.

On the other end surface 3b of the substrate holding member 3 opposite to the substrate holding surface 3a, a swinging member 5 to be described later is provided.
A support member housing hole 9 is formed which faces the support member 4 connected to the. The support member accommodation hole 9 is formed as a blind hole having a spherical bottom surface 9a and having a spherical shape in the thickness direction until reaching a predetermined position described later.

The support member 4 is formed as a round bar having a spherical tip 4a, and is provided so that the tip 4a faces the bottom surface 9a of the support member receiving hole 9. The tip portion 4a of the support member 4 contacts the bottom surface 9a of the support member housing hole 9 in a point contact state.

The position of the contact point B connects the contact point B and both side edges 2b and 2c of the surface 2a of the magnetic head substrate 2 held by the substrate holding member 3 facing the surface plate 1 respectively. Angle θ formed by lines C and D (hereinafter referred to as opening angle θ)
Is set to be 140 degrees or more. 140
The above-mentioned degree is set in order to make the processing pressure for polishing the magnetic head substrate 2 uniform and to stabilize the polishing state to avoid the occurrence of scratches, track breaks, etc., and is based on the experimental results described later. is there.

On the other hand, the oscillating member 5 is connected to the supporting member 4 projecting from the supporting member accommodating hole 9 and oscillated in the radial direction of the polishing platen 1 indicated by an arrow E in FIG. 1 by a driving source (not shown). It is designed to do. The swing speed and swing range are
It can be set freely. The swing member 5
The connecting portion between the support member 4 and the support member 4 fixes the support member 4 so as not to rotate.

In the magnetic head manufacturing polishing apparatus thus configured, the magnetic head substrate 2 held by the substrate holding member 3 is placed on the polishing surface 1a of the polishing surface plate 1 and the substrate is held. The member 3 is pressed against the polishing surface 1a by its own weight. Then, when the polishing surface plate 1 is rotated,
With the rotation of the polishing platen 1, the substrate holding member 3 rotates about the support member 4 in the direction indicated by the arrow F in FIG. At this time, the swinging member 5 swings the substrate holding member 3 in the direction indicated by the arrow E in FIG. In such a movement state, the magnetic head substrate 2 is polished while supplying the diamond slurry onto the polishing surface 1a.

The MIG head is manufactured by using the magnetic head manufacturing polishing apparatus having the above-described structure according to the following steps. First, as shown in FIG. 3, the flat magnetic head substrate 2 is chamfered by a grinder.

The magnetic head substrate 2 is a Mn-Zn ferrite single crystal substrate, a Mn-Zn ferrite polycrystalline substrate, a Ni-Zn ferrite single crystal substrate, a Ni-Zn ferrite polycrystalline substrate, or a single substrate thereof. A bonded substrate in which a crystalline substrate and a polycrystalline substrate are bonded is used. In addition to this, Al
₂ O ₃ , oxides such as MgO and ZrO ₂ , SiC, Ti
Carbides such as C and WC, Si ₃ N ₄ , AlN, TaN, T
A non-magnetic ceramic substrate made of nitride such as iN or a compound thereof is used.

Next, as shown in FIG. 4, a plurality of track width regulating grooves 10 are formed on the main surface 2a of the magnetic head substrate 2 at predetermined intervals over the entire magnetic head substrate. The space for forming the track width regulating grooves 10 is the same as that of the adjacent track width regulating grooves 1.
The length of the main surface 2a remaining between 0s is set to be the track width dimension of the magnetic gap. Also, this track width regulation groove 1
In forming 0, as shown in FIG. 5, in order to set the opening angle α of the track edge to 90 degrees or more, it is formed in a groove having a substantially V-shaped cross section with an arcuate bottom surface.

In this embodiment, the opening angle α of the track edge is
The track width regulating groove was formed by machining using a grindstone so that the groove width was 120 degrees.

Next, as shown in FIG. 6, winding grooves 11 and 12 for winding a coil and a glass groove 1 for glass fusion are formed in a direction orthogonal to the track width regulating groove 10.
3 and 14 are formed. Winding grooves 11, 12 and glass groove 1
In order to divide the magnetic head substrate 2 into two in the subsequent process, three and four are formed, respectively, and the winding groove 11, the glass groove 13, the winding groove 12, and the glass groove 14 are formed in this order.

Next, the magnetic head substrate 2 is polished using the above-described polishing apparatus for magnetic head manufacturing. First, as shown in FIG. 7, the magnetic head substrate 2 is held on the substrate holding surface 3 a of the substrate holding member 3. In order to hold the magnetic head substrate 2 on the substrate holding surface 3a, an adhesive or the like is applied to the back surface 2b of the magnetic head substrate 2 opposite to the surface 2a which is the gap forming surface, and this is applied to the substrate holding surface 3a. Make sure to attach it.

Then, the substrate holding member 3 is placed on the polishing platen 1 so that the surface 2a, which is the gap forming surface of the magnetic head substrate 2, faces the polishing surface 1a of the polishing platen 1. As a result, the surface 2a of the magnetic head substrate 2 that serves as the gap forming surface comes into contact with the polishing surface 1a of the polishing surface plate 1.

Next, the support member 4 is inserted into the support member housing hole 9 formed in the back surface 3b of the substrate holding member 3. Then, the polishing platen 1 is rotated, the substrate holding member 3 is swung by the swinging member 5, and the slurry 15 in which the abrasive grains are mixed in the solvent is supplied onto the polishing surface 1a while the magnetic head substrate 2 is moved. Perform polishing.

The slurry 15 has concentric circular grooves 6 to 8 formed on the polishing surface 1a. Therefore, the circular grooves 6 to 8 are formed.
It will be filled within.

The slurry used for polishing is a mixture of abrasive grains in a solvent. For example, the abrasive grains include diamond, SiC, S having a grain size of 0.5 μm or less.
Fine abrasive grains such as iO ₂ , Al ₂ O ₃ and MgO can be used. As the solvent, hydrophilic groups such as H ₂ O, H ₂ O ₂ and N are used.
Solvents with high dispersibility such as aOH, KOH, HCI, etc., or solvents based on non-hydrophilic mineral oil as a base oil (Japanese Industrial Standard J
IS 1st type, 2nd type 1 to 6), or an ambipolar emulsion (W / O, O / W type), a chemical solution, a synthetic type chemical oil agent, and the like. In addition to these, at least antioxidants, activators (alcoholic glycerin, polyethylene glycol),
If it is a non-hydrophilic group, an additive such as an extreme pressure agent may be added.

In this embodiment, S having a particle size of 0.1 μm or less is used.
A slurry containing iO ₂ as abrasive grains and H ₂ O as a main component as a solvent was used. The opening angle θ of the substrate holding member 3 at this time
Was 140 degrees.

After the polishing is completed, the magnetic head substrate 2 is removed from the substrate holding member 3 and washed. Next, as shown in FIG. 8, the track width regulating groove 10 and the winding grooves 11, 1
2. The magnetic head substrate 2 including the glass grooves 13 and 14
The magnetic alloy thin film 16 is formed on the surface 2a which will be the gap forming surface.

[0033] As the magnetic alloy thin film 16, Sendust (Fe-Si-Al), Fe-Si-Al + O 2, Fe
-Si-Al + Ti, Fe-Ga-Si-Ru-based alloy,
Fe-Ga-Si-Ru alloy _{+ O 2, Fe-Ga-} S
Examples thereof include a crystalline magnetic film such as i-Ru alloy + N ₂ or a Fe-based finely-bonded film or a Co-based finely-bonded film. Further, a laminated film or an alloy film of them may be used.

When forming the magnetic alloy thin film 16,
In order to improve the adhesion with the substrate, an oxide film of SiO ₂ , Ta ₂ O ₅ or the like, a nitride film of Si ₃ N ₄ or the like, Cr, Al, P
A metal film of t or the like, or a laminated film thereof may be interposed as a base film between the substrate and the magnetic alloy thin film 16. In this embodiment, as shown in FIG.
As the magnetic alloy thin film 16, Fe-G is used as the Cr film.
A film made of an a-Si-Ru alloy was used.

Next, as shown in FIG. 10, a protective film 18 is formed on the magnetic alloy thin film 16 in order to prevent erosion of the magnetic alloy thin film 16 due to glass fusion. Protective film 1
8 is an oxide film of ZrO ₂ , Ta ₂ O ₅ or the like, Si
A nitride film of ₃ N ₄ or the like, a metal film of Cr, Al, Pt or the like, or a laminated film thereof can be used.

Next, as shown in FIG. 11, in order to eliminate the sagging of the track edge portion, the protective film 18 formed on the surface 2a to be the gap forming surface is removed and the magnetic alloy thin film 16 is mirror-finished. Target track width Tw
And Then, the magnetic head substrate 2 is attached to the glass groove 13
The magnetic core half board 1 is cut between the winding groove 12 and the winding groove 12.
9 and 20 are produced.

Next, these magnetic core half substrates 19 and 20
After forming the gap film on the abutting surface of the magnetic core half body, the magnetic core half substrates 19 and 20 are abutted on each other while aligning the tracks, as shown in FIG. Next, the magnetic core half substrates 19 and 20 are pressed to wind the winding grooves 11 and 12.
The fused glass 21 is poured into the glass grooves 13 and 14 for gap bonding. As a result, a recording gap, a reproducing gap, or a magnetic gap g functioning as a recording / reproducing gap is formed between the adjacent track width regulating grooves 10.

Next, each magnetic core half board 19, 20
Further, the winding guide groove 22 is formed in order to improve the winding state of the coil wound in the winding grooves 11 and 12.
After that, the surface which becomes the medium sliding surface 23 exhibiting the magnetic gap g is cylindrically polished, and the medium sliding surface 23 is grooved so as to have a predetermined contact width to form step portions 24 and 25.

Then, the MIG head shown in FIG. 13 is completed by cutting the chip with a predetermined azimuth angle.

The above is an example of the mechanical polishing apparatus. The polishing surface plate 1 is filled with the slurry and the magnetic head substrate 2 is used.
The magnetic head substrate 2 may be polished by so-called non-contact polishing, which is performed without directly contacting the polishing surface 1a. In this non-contact polishing, the magnetic head substrate 2 is simply
Is not brought into contact with the polishing surface 1a, and the other device configuration is exactly the same as the mechanical polishing device.

Next, the reason why the opening angle θ is set to 140 degrees or more will be described based on the following experimental results.
First, the dependence of the opening angle θ and the scratch occurrence rate was examined. In the experiment, the mechanical polishing apparatus shown in FIG. 15 was used to spray the diamond slurry in a spray form using a ferrite substrate as the magnetic head substrate, while the non-contact polishing apparatus shown in FIG. 16 was used to polish the ferrite substrate. Using SiO ₂
Polishing was performed with the slurry. Note that FIG. 15 and FIG.
Then, although the apparatus configuration is shown in a simplified manner, it is the same as the apparatus shown in FIG.

The experimental results are shown in FIG. Line A in FIG.
Is the experimental result of a ferrite substrate mechanically polished with diamond slurry, and line B is the experimental result of a ferrite substrate non-contact polished with SiO ₂ slurry.

From these results, it can be seen that scratches are sharply reduced from an opening angle θ of around 140 degrees in both mechanical polishing and non-contact polishing.

Next, the dependence of the opening angle θ and the occurrence rate of track breakage was examined. The result is shown in FIG. FIG. 17
In the middle, line C is the experimental result of the ferrite substrate mechanically polished using diamond slurry, and line D is the experimental result of the ferrite substrate non-contact polished using the SiO ₂ slurry.

In the ferrite substrate mechanically polished with diamond slurry, the change is linear,
In the ferrite substrate that has been subjected to non-contact polishing using a SiO ₂ slurry, almost no chipping is observed at an opening angle θ of 140 degrees.

Next, the polishing efficiency of the ferrite substrate mechanically polished with diamond slurry was examined. The result is shown in FIG. In FIG. 18, the line E has an opening angle θ of 10
Polishing efficiency when a substrate is attached so as to be 0 degree, line F
Indicates the polishing efficiency when the substrate is attached so that the opening angle θ is 140 degrees.

Compared with the case where the opening angle θ is 100 degrees,
When the opening angle θ is 140 degrees, it is about 35
The polishing efficiency is improved by about%.

Then, the dependency of the contact pressure during polishing and the scratch occurrence rate when diamond slurry was used was examined. The result is shown in FIG. In FIG. 19, a line G is an experimental result when the substrate is attached so that the opening angle θ is 100 degrees, and a line H is an experimental result when the substrate is attached so that the opening angle θ is 140 degrees.

0.1M for improving polishing efficiency and flattening the substrate
Although a contact pressure of Pa or more is required, the scratch occurrence rate in the conventional processing jig tends to increase. Therefore, by widening the opening angle θ in the polishing of brittle materials such as ferrite, stability during polishing can be obtained. It is thought that the sexuality has improved.

Next, the film peeling of the magnetic alloy film of the MIG head manufactured under the following conditions was examined. Si in the slurry
O ₂ slurry, contact pressure 0.1MPa, S on the polishing platen
An MIG head was manufactured according to the above-described steps using an n surface plate and non-contact polishing as a polishing mode.

In Sample 1, the magnetic head substrate 27 is held by using the conventional substrate holding member 26 shown in FIG. 20A, and the Sn surface plate 28 is held without rotating the magnetic head substrate 2.
It was pressed against and polished. In Sample 2, as shown in FIG. 3B, the magnetic head substrate 27 was held by the substrate holding member 29 so that the opening angle θ was 104 degrees, and polishing was performed. In the sample 3, as shown in FIG. 3C, the magnetic head substrate 2 was adjusted so that the opening angle θ was 140 degrees.
7 was held on the substrate holding member 29 and polished.

The results are shown in Table 1.

[0053]

[Table 1]

In Sample 1, it is considered that the contact pressure became unstable due to the influence of the fixed work, the hydroplane phenomenon of the slurry could not be induced, and it was caused by the contact between the surface plate and the magnetic head substrate. In Sample 2, although the magnetic head substrate floated due to rotation, it is considered that this occurred because the stability of the magnetic head substrate itself was poor due to the generation of moment. It is considered that in Sample 3, the contact pressure was made uniform, the stability of the magnetic head substrate was improved, and film peeling was suppressed.

Next, the scratch occurrence rate when the substrate size was changed was examined. The magnetic head substrate was polished by using SiO ₂ slurry as the slurry, a contact pressure of 0.1 MPa, a Sn surface plate as the polishing surface plate, and non-contact polishing as the polishing mode, and the number of scratches was examined.

Sample 4 has the conventional structure shown in FIG.
1500mm using the polishing machine of ²Size of substrate
Polished Sample 5 is similar to the conventional example shown in FIG.
400mm using the polishing equipment of²Polishing size substrate
did. In Sample 6, using the polishing apparatus of this example,
400 mm²The size substrate was polished.

The results are shown in Table 2.

[0058]

[Table 2]

In sample 4, since the substrate size is large, it can be assumed that the opening angle θ becomes 140 degrees or more even in the conventional apparatus and the stability during polishing is increased. When polishing the substrate having the track width regulating groove, it is necessary to reduce the size of the substrate in order to reduce the variation in tracks. However, when the substrate size is reduced as in Sample 5, the opening angle θ is decreased. However, the stability during polishing tends to be impaired and the degree of scratches tends to increase. It is considered that Sample 6 had an opening angle θ of 140 ° or more and the polishing state was similar to that of Sample 4 despite the small substrate size.

Next, the degree of occurrence of the work-affected layer was investigated.
I tried. SiO using conventional equipment ₂Grinding with slurry
Examine the polished surface of the ferrite single crystal substrate by polishing
It was On the other hand, using the apparatus of this embodiment, SiO₂Into slurry
By polishing the polished surface of the ferrite single crystal substrate.
Examined. Polished to confirm the altered layer.
Crystal strain was observed by the RHEED method.

As a result, in the case of using the conventional apparatus, the wustite phase (Fe) having crystal distortion, which seems to be a reaction product, is obtained.
O), spinel phase (Fe ₃ O ₄ ) and non-oriented SiO ₂ were scattered. On the other hand, in the case of using the apparatus of the present embodiment, the wustite phase (FeO) which is oriented in the substrate axis direction is used.
Were scattered around.

When the conventional apparatus is used, it is considered that the analysis result by the diffraction pattern indicates that the mechanical polishing and the reactive polishing proceed at the same time, and since the crystal strain occurs, the altered layer is expected to be deep. On the other hand, when the apparatus of this embodiment is used, the appearance of the wustite phase in the same direction as the substrate is considered to be the main cause of reactive polishing. It is expected that stable reactive polishing has progressed.

Finally, the electromagnetic conversion characteristics of the MIG head were examined. Sample 7 is S using a conventional device.
A magnetic head was manufactured by polishing with an iO ₂ slurry, and the electromagnetic conversion characteristics of the head were examined. Sample 8 is a magnetic head manufactured by polishing with a SiO ₂ slurry using the apparatus of this example, and the electromagnetic conversion characteristics of the head were examined.

In measuring the electromagnetic conversion characteristics, the reproduction output at 15 MHz was measured using a fixed electric machine and a vapor deposition tape. The results are shown in Table 3.

[0065]

[Table 3]

It is understood that the electromagnetic conversion characteristics of sample 8 are improved as compared with sample 7.

[0067]

As is apparent from the above description, according to the apparatus of the present invention, the opening angle is set to 140 degrees or more, so that the polishing state can be stabilized and scratches and scratches on the polishing surface can be achieved. Track breaks can be reduced and the manufacturing yield of magnetic heads can be greatly improved. In particular, when the MIG head is manufactured, it is possible to prevent the magnetic alloy film from peeling off and to reduce the track breakage.

Further, according to the apparatus of the present invention, it is possible to realize the cost reduction by improving the polishing efficiency and the working efficiency, and to improve the reproducing output of the head. Also,
Even a substrate having a small size of 400 mm ² or less can be polished in a stable state. Furthermore, by simplifying the apparatus structure without adding an additional jig such as a fixed guide or a work holder, maintenance and inspection (maintenance) and adjustment (alignment) can be facilitated.

[Brief description of drawings]

FIG. 1 is a perspective view of a polishing apparatus for manufacturing a magnetic head to which the present invention is applied.

FIG. 2 is an enlarged sectional view of an essential part of a polishing apparatus for manufacturing a magnetic head to which the present invention is applied.

3A to 3C sequentially show steps of manufacturing a MIG head using a polishing apparatus for manufacturing a magnetic head to which the present invention is applied.
It is a perspective view showing a magnetic head substrate manufacturing process.

FIGS. 4A to 4C sequentially show steps of manufacturing a MIG head using a magnetic head manufacturing polishing apparatus to which the present invention is applied.
It is a perspective view showing a track width regulation groove forming step.

FIGS. 5A to 5C sequentially show steps of manufacturing an MIG head using a magnetic head manufacturing polishing apparatus to which the present invention is applied.
It is a principal part enlarged front view of a track width regulation groove formation process.

FIG. 6 is a view sequentially showing steps of manufacturing a MIG head using a magnetic head manufacturing polishing apparatus to which the present invention is applied.
It is a perspective view which shows a winding groove and a glass groove formation process.

FIG. 7 sequentially shows steps of manufacturing a MIG head by using a magnetic head manufacturing polishing apparatus to which the present invention is applied.
FIG. 6 is an enlarged cross-sectional view of a main part showing a polishing step of a magnetic head substrate.

FIG. 8 sequentially shows steps of manufacturing a MIG head using a magnetic head manufacturing polishing apparatus to which the present invention is applied.
It is a perspective view which shows a magnetic alloy film formation process.

9A to 9C sequentially show steps of manufacturing an MIG head by using a magnetic head manufacturing polishing apparatus to which the present invention is applied.
It is a principal part enlarged front view which shows a magnetic alloy film forming process.

FIG. 10 is a main part enlarged front view showing a protective film forming step, which sequentially shows steps of manufacturing an MIG head using a magnetic head manufacturing polishing apparatus to which the present invention is applied.

FIG. 11 is an enlarged front view of essential parts showing a flattening polishing step, which sequentially shows steps of manufacturing an MIG head using the magnetic head manufacturing polishing apparatus to which the invention is applied.

FIG. 12 is a perspective view showing a glass fusing step, which sequentially shows steps of manufacturing an MIG head by using a magnetic head manufacturing polishing apparatus to which the present invention is applied.

FIG. 13 is an enlarged perspective view of a MIG head manufactured using the magnetic head manufacturing polishing apparatus to which the present invention is applied.

FIG. 14 is a characteristic diagram showing the relationship between the number of scratches and the opening angle.

FIG. 15 is a schematic view of a mechanical polishing device used when examining the relationship between the number of scratches and the opening angle.

FIG. 16 is a schematic view of a non-contact polishing apparatus used when examining the relationship between the number of scratches and the opening angle.

FIG. 17 is a characteristic diagram showing a relationship between a track breakage occurrence rate and an opening angle.

FIG. 18 is a characteristic diagram showing a relationship between a polishing amount and a polishing time.

FIG. 19 is a characteristic diagram showing the relationship between the number of scratches and contact pressure.

FIG. 20 is a schematic view of a polishing apparatus used for examining film peeling of a magnetic alloy film of a MIG head.

[Explanation of symbols]

 1 Polishing Surface Plate 1a Polishing Surface 2 Magnetic Head Substrate 3 Substrate Holding Member 4 Supporting Member 5 Swinging Member 6, 7, 8 Circular Groove 9 Supporting Member Storage Hole 9a Bottom 10 Track Width Restricting Groove 11, 12 Winding Groove 13, 14 glass groove 15 slurry 16 magnetic alloy film 21 fused glass 22 winding guide groove

Claims (2)

[Claims] 1. A disk-shaped polishing platen, and a magnetic head substrate held on one main surface so as to be arranged so as to face the polishing surface of the polishing platen. A substrate holding member having a blind hole on the other end surface, and a spherical tip end point-contacting the bottom surface of the blind hole facing the blind hole of the substrate holding member, and centering the contact portion. As a supporting member for supporting the substrate holding member that is rotated as the polishing surface plate rotates, and a swinging member that is connected to the supporting member and swings the substrate holding member on the polishing surface plate. A line connecting the contact point between the bottom of the blind hole of the substrate holding member and the tip of the supporting member, and both side edges of the surface of the magnetic head substrate held by the substrate holding member facing the surface plate. The magnetic head is characterized in that the angle formed by is 140 degrees or more. For the production of polishing apparatus. 2. The polishing apparatus for manufacturing a magnetic head according to claim 1, wherein a plurality of circular grooves are concentrically formed on the polishing surface of the polishing platen.