JPH07329246A - Metal clad laminated sheet and production thereof - Google Patents
Metal clad laminated sheet and production thereofInfo
- Publication number
- JPH07329246A JPH07329246A JP12622794A JP12622794A JPH07329246A JP H07329246 A JPH07329246 A JP H07329246A JP 12622794 A JP12622794 A JP 12622794A JP 12622794 A JP12622794 A JP 12622794A JP H07329246 A JPH07329246 A JP H07329246A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- glass cloth
- laminated
- metal foil
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、耐マイグレーション性
に優れた配線板の製造に好適な積層板およびその製造法
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated board suitable for manufacturing a wiring board having excellent migration resistance and a method for manufacturing the laminated board.
【０００２】[0002]
【従来の技術】配線板の代表的な製造法として、金属箔
を絶縁基材に貼り合わせた金属張り積層板を出発材料と
し、エッチングによって配線を形成するサブトラクティ
ブ法がある。この方法は、エッチングだけで配線形成が
でき、製造が容易である。また、多層配線の形成の場合
も、複数の両面配線形成物である内層板を作り、プリプ
レグ等を介して多層化接着を行うことによって容易に形
成できる。このような配線板の製造には、支持体強度を
得られること、比較的低コストであることから、ガラス
布入りの基材を用いた積層板が多用されている。2. Description of the Related Art As a typical method for manufacturing a wiring board, there is a subtractive method in which wiring is formed by etching using a metal-clad laminate having a metal foil attached to an insulating base material as a starting material. In this method, wiring can be formed only by etching, and the manufacturing is easy. Further, also in the case of forming a multi-layer wiring, it can be easily formed by forming an inner layer plate which is a plurality of double-sided wiring formed products and performing multi-layer bonding through a prepreg or the like. In the production of such a wiring board, a laminated board using a base material containing a glass cloth is often used because it can obtain a support strength and is relatively low in cost.
【０００３】[0003]
【発明が解決しようとする課題】印刷配線板は、電子機
器の発達に伴い、軽薄短小化が進み、配線間隔が狭くな
るなど、電気絶縁性に不利な状況となってきている。特
に、配線間隔が狭いところで、配線材料である金属が電
位によって移動するマイグレーション現象が起こり、絶
縁性が低下するという課題が起こってきている。マイグ
レーションの発生のしやすさは、配線間隔と相互の配線
間の電位差との関係から決まるものであり、ガラス布が
基材中に用いられていると、その界面でのマイグレーシ
ョン速度が特に速く、絶縁劣化を加速することが知られ
ている。With the development of electronic equipment, printed wiring boards have become disadvantageous in terms of electrical insulation, such as lightness, thinness, shortness, and narrowing of wiring intervals. In particular, in a place where the wiring interval is narrow, a migration phenomenon in which a metal, which is a wiring material, moves due to an electric potential occurs, and there is a problem that the insulating property is lowered. The easiness of occurrence of migration is determined by the relationship between the wiring interval and the potential difference between the mutual wirings. When glass cloth is used in the substrate, the migration speed at the interface is particularly high, It is known to accelerate insulation deterioration.
【０００４】このため、相互にある程度の電位差のある
配線の場合、配線間隔をあまり狭くできないこと、設計
段階で相互の配線の電位差まで考慮し、これを回避する
ことが行われてきた。また、このような対策が行えない
場合には、マイグレーションの起こりにくい金属、例え
ば、ニッケルめっきなどを行い、その上に、銅配線を行
う等の対策が行われてきた。For this reason, in the case of wirings having a certain potential difference with each other, it has been attempted that the wiring interval cannot be made too narrow and the potential difference between the wirings is taken into consideration at the design stage to avoid this. Further, when such measures cannot be taken, measures have been taken such as applying a metal that is unlikely to cause migration, for example, nickel plating, and providing copper wiring thereon.
【０００５】これらの方法は、配線の自由度を奪ってし
まうことや、金属張り積層板をエッチングするだけで配
線形成できるというサブトラクティブ法のメリットを減
じるものであった。These methods have been deprived of the degree of freedom of wiring, and reduced the merit of the subtractive method that wiring can be formed only by etching the metal-clad laminate.
【０００６】その他の方法として、積層板にガラス布な
どを用いないことも考えられるが、支持体強度が不十分
なだけでなく、高密度配線板の場合、特に重要な寸法安
定性を損なうという課題があった。As another method, it is conceivable not to use glass cloth or the like for the laminated plate, but not only the strength of the support is insufficient, but also in the case of a high-density wiring board, particularly important dimensional stability is impaired. There were challenges.
【０００７】そこで、支持体強度や寸法安定性を確保す
るために、ガラス布などを用いた基材とし、金属箔との
間に、樹脂のみの層を設けることも考えられるが、ガラ
ス布がないので、耐マイグレーション性が向上するもの
の、一般の樹脂を含浸したガラス布入りのプリプレグ
と、未硬化の樹脂層を設けた金属箔を積層接着すると、
一般的に、プリプレグの樹脂と金属箔に設けた樹脂層の
樹脂が混ざってしまい、当初の目的を達成できない。目
的達成のためには、金属箔に設ける樹脂層を予め硬化さ
せておけばよいが、エポキシ樹脂など、耐熱性にすぐれ
た樹脂は、硬化させると固くて脆くなり、ロールへの巻
き取り時や取り扱い時に樹脂層にクラックが発生した
り、剥離するという課題がある。Therefore, in order to secure the strength and dimensional stability of the support, it is conceivable to use a glass cloth or the like as a base material and to provide a resin-only layer between the base material and the metal foil. Since there is no migration resistance, the prepreg containing a glass cloth impregnated with a general resin and a metal foil provided with an uncured resin layer are laminated and bonded, although the migration resistance is improved.
Generally, the resin of the prepreg and the resin of the resin layer provided on the metal foil are mixed, and the original purpose cannot be achieved. To achieve the purpose, the resin layer provided on the metal foil may be pre-cured, but a resin having excellent heat resistance, such as an epoxy resin, becomes hard and brittle when cured, and when wound on a roll or There are problems that the resin layer is cracked or peeled off during handling.
【０００８】本発明は、耐マイグレーション性に優れた
配線板の製造に好適な積層板およびその製造法を提供す
るものである。The present invention provides a laminated board suitable for manufacturing a wiring board having excellent migration resistance and a method for manufacturing the same.
【０００９】[0009]
【課題を解決するための手段】本発明の金属張り積層板
は、図１に示すように、基材が、ガラス布に熱硬化性樹
脂を含浸・硬化させた層３と、高分子量エポキシ樹脂層
２とからなり、金属箔１との接着面側が高分子量エポキ
シ樹脂層であることを特徴とする。In the metal-clad laminate of the present invention, as shown in FIG. 1, a base material is a layer 3 in which glass cloth is impregnated and cured with a thermosetting resin, and a high molecular weight epoxy resin. It is characterized in that it is composed of the layer 2 and has a high molecular weight epoxy resin layer on the side of the surface thereof which is adhered to the metal foil 1.
【００１０】このような積層板を製造する方法として
は、ガラス布に熱硬化性樹脂を含浸したプリプレグと、
高分子量エポキシ樹脂フィルムと、金属箔とを、この順
に積層し、加圧加熱して積層一体化することによって行
うことができる。As a method for producing such a laminated board, a prepreg obtained by impregnating glass cloth with a thermosetting resin,
It can be performed by laminating a high molecular weight epoxy resin film and a metal foil in this order, and pressurizing and heating to integrally laminate them.
【００１１】また、ガラス布に熱硬化性樹脂を含浸した
プリプレグの両面に、高分子量エポキシ樹脂フィルム
と、金属箔とを積層し、加圧加熱して積層一体化するこ
ともできる。It is also possible to laminate a high molecular weight epoxy resin film and a metal foil on both surfaces of a prepreg obtained by impregnating a glass cloth with a thermosetting resin, and pressurize and heat to integrate them.
【００１２】さらには、高分子量エポキシ樹脂層付き金
属箔と、ガラス布に熱硬化性樹脂を含浸したプリプレグ
を積層し、加圧加熱して積層一体化することもでき、ガ
ラス布に熱硬化性樹脂を含浸したプリプレグの両面に、
高分子量エポキシ樹脂層付き金属箔を積層し、加圧加熱
して積層一体化することもできる。Further, it is possible to laminate a metal foil with a high molecular weight epoxy resin layer and a prepreg impregnated with a thermosetting resin on a glass cloth, and heat and pressurize them to integrate them. On both sides of the prepreg impregnated with resin,
A metal foil with a high molecular weight epoxy resin layer may be laminated and heated under pressure to be laminated and integrated.
【００１３】本発明に用いる熱硬化性樹脂としては、実
質的にエポキシ樹脂であることが好ましく、金属箔とし
ては、銅箔であることが好ましい。The thermosetting resin used in the present invention is preferably an epoxy resin, and the metal foil is preferably a copper foil.
【００１４】さらに詳細に説明すると、まず、ガラス布
と熱硬化性樹脂からなるプリプレグを用意する。ガラス
布には、ガラス織布、ガラス不織布のいずれも使用で
き、熱硬化性樹脂は、耐熱性、電気特性、価格などから
選択され、これらのバランスから、エポキシ樹脂は特に
適している。厚さは特に制限はなく、目的に応じて、厚
さや、枚数を決めればよい。Explaining in more detail, first, a prepreg made of glass cloth and thermosetting resin is prepared. As the glass cloth, either glass woven cloth or glass non-woven cloth can be used, and the thermosetting resin is selected from heat resistance, electric characteristics, price, etc. From the balance of these, epoxy resin is particularly suitable. The thickness is not particularly limited, and the thickness and the number of sheets may be determined according to the purpose.
【００１５】次に、高分子量エポキシ樹脂層付き金属
箔、もしくは、高分子量エポキシ樹脂フィルムと金属箔
を用意する。金属箔は、電気的特性から、一般的に銅箔
が好適である。その厚さは、特に制限はしないが、一般
的には、５から７０ミクロンであり、特に高密度配線の
形成には、５から１８ミクロンが適している。Next, a metal foil with a high molecular weight epoxy resin layer, or a high molecular weight epoxy resin film and a metal foil are prepared. Generally, copper foil is suitable for the metal foil because of its electrical characteristics. The thickness is not particularly limited, but is generally 5 to 70 microns, and particularly 5 to 18 microns is suitable for forming high density wiring.
【００１６】高分子量エポキシ樹脂フィルムには、市販
のものとしては、エポキシ樹脂フィルムＡＳ３０００
（日立化成工業株式会社製、商品名）等を用いることが
でき、高分子量エポキシ樹脂層付き金属箔を使用すると
きは、ＡＳ３０００（日立化成工業株式会社製、商品
名）等の樹脂ワニスを金属箔に塗工して用いることがで
きる。高分子量エポキシ樹脂フィルムまたは高分子量エ
ポキシ樹脂層の厚さは、効果とコストから、１０から５
０ミクロンが適している。Commercially available high molecular weight epoxy resin films include epoxy resin film AS3000.
(Hitachi Chemical Co., Ltd., trade name) can be used, and when a metal foil with a high molecular weight epoxy resin layer is used, a resin varnish such as AS3000 (Hitachi Chemical Co., Ltd., trade name) is used as a metal. It can be applied to a foil and used. The thickness of the high molecular weight epoxy resin film or the high molecular weight epoxy resin layer is 10 to 5 due to the effect and cost.
0 micron is suitable.
【００１７】ガラス布／樹脂製プリプレグの片面もしく
は両面に、高分子量エポキシ樹脂、金属箔となるよう
に、上記の材料を積層して、加圧加熱して接着する。エ
ポキシ樹脂含浸のプリプレグを使用した時の加圧加熱条
件は、使用した樹脂によって若干異なるが、一般的に圧
力２０〜５０ｋｇｆ／ｃｍ2、１６０〜１７０℃、５０
〜９０分が適している。なお、この条件は、例示であ
り、制限するものではない。On one or both sides of the glass cloth / resin prepreg, the above materials are laminated so as to be a high molecular weight epoxy resin and a metal foil, and they are pressure-heated and bonded. The pressure and heating conditions when the prepreg impregnated with the epoxy resin is slightly different depending on the resin used, but generally the pressure is 20 to 50 kgf / cm 2 , 160 to 170 ° C., 50
~ 90 minutes is suitable. Note that this condition is an example, and is not a limitation.
【００１８】なお、本発明の積層板を用いて、両面の配
線板を製造する場合には、スルーホール部分を樹脂埋め
後再穴開けや、スルーホール部分のみニッケル下地めっ
きを行うなど、公知の方法を用いることにより、スルー
ホールまで含めて、耐マイグレーション性を容易に向上
できる。In the case of producing a wiring board on both sides by using the laminated board of the present invention, it is known that the through hole portion is filled with resin and then re-punched, or only the through hole portion is plated with nickel underlayer. By using the method, it is possible to easily improve the migration resistance including the through holes.
【００１９】[0019]
【作用】本発明に用いる、高分子量エポキシ樹脂は、積
層接着時の温度においても、粘度が極めて高く、流動性
が低いので、プリプレグと隣り合わせて、積層し、加圧
加熱しても、樹脂どうしが混ざりあうこともなく、ガラ
ス布の繊維が銅箔と接することがない。このため、配線
形成時にも、配線とガラス布が接することがない。The high-molecular-weight epoxy resin used in the present invention has extremely high viscosity and low fluidity even at the temperature at the time of laminating and bonding. Therefore, even if it is laminated next to the prepreg and heated under pressure, the resin does not react. The fibers of the glass cloth never come into contact with the copper foil. Therefore, even when the wiring is formed, the wiring does not come into contact with the glass cloth.
【００２０】[0020]
実施例１ （１）厚さ０．１ミリのガラス織布／ポリイミド樹脂製
プリプレグであるＧＥＡ−６７１（日立化成工業株式会
社製、商品名）に、厚さ５０ミクロンのエポキシ樹脂フ
ィルムＡＳ３０００（日立化成工業株式会社製、商品
名）と、厚さ１８ミクロンの銅箔ＴＳＴＯ（古河サーキ
ットフォイル株式会社製、商品名）を積層して２５ｋｇ
ｆ／ｃｍ2、１８０℃、０．５Ｔｏｒｒ、９５分の条件
で加圧加熱し積層板を作成した。 （２）この積層板の銅箔の不要な箇所を、エッチング除
去して回路を形成し、ソルダーレジストをスクリーン印
刷して片面配線板を得た。Example 1 (1) A glass woven cloth / polyimide resin prepreg having a thickness of 0.1 mm, GEA-671 (manufactured by Hitachi Chemical Co., Ltd., trade name), has a 50-micron thick epoxy resin film AS3000 (Hitachi). 25 kg by stacking 18 micron thick copper foil TSTO (Furukawa Circuit Foil Co., Ltd., trade name) with Kasei Kogyo Co., Ltd. (trade name)
A laminated plate was prepared by heating under pressure under the conditions of f / cm 2 , 180 ° C., 0.5 Torr, and 95 minutes. (2) An unnecessary portion of the copper foil of this laminate was removed by etching to form a circuit, and a solder resist was screen-printed to obtain a single-sided wiring board.
【００２１】実施例２ （１）厚さ０．１ミリのガラス織布／ポリイミド樹脂製
プリプレグであるＧＥＡ−６７１（日立化成工業株式会
社製、商品名）の両面に、厚さ５０ミクロンのエポキシ
樹脂フィルムＡＳ３０００（日立化成工業株式会社製、
商品名）と、厚さ１８ミクロンの銅箔ＴＳＴＯ（古河サ
ーキットフォイル株式会社製、商品名）を積層して２５
ｋｇｆ／ｃｍ2、１８０℃、０．５Ｔｏｒｒ、９５分の
条件で加圧加熱し積層板を作成した。 （２）この積層板に穴をあけ、ＣＵＳＴ−２０１（日立
化成工業株式会社製、商品名）で無電解銅めっき後、電
気硫酸銅めっきを用いて厚さ約７ミクロンのめっき層を
形成した。 （３）厚さ５０ミクロンの感光性ドライフィルムである
フォテックＨ−Ｋ４５０（日立化成工業株式会社製、商
品名）をラミネート後、露光、現像してエッチング用レ
ジストパターンを形成し、エッチングして配線形成を行
った。Example 2 (1) On both sides of 0.1 mm thick glass woven fabric / polyimide resin prepreg GEA-671 (trade name, manufactured by Hitachi Chemical Co., Ltd.), an epoxy having a thickness of 50 μm was used. Resin film AS3000 (manufactured by Hitachi Chemical Co., Ltd.,
(Trade name) and copper foil TSTO (trade name, manufactured by Furukawa Circuit Foil Co., Ltd.) having a thickness of 18 microns are laminated to form 25
A laminated plate was prepared by heating under pressure under the conditions of kgf / cm 2 , 180 ° C., 0.5 Torr, and 95 minutes. (2) A hole was made in this laminated plate, and after electroless copper plating with CUST-201 (manufactured by Hitachi Chemical Co., Ltd., trade name), a plating layer having a thickness of about 7 microns was formed using electro copper sulfate plating. . (3) After laminating Phototec H-K450 (trade name, manufactured by Hitachi Chemical Co., Ltd.), which is a photosensitive dry film having a thickness of 50 microns, it is exposed and developed to form a resist pattern for etching, and etching is performed to form wiring. Formed.
【００２２】実施例３ （１）厚さ０．１ミリのガラス織布／ポリイミド樹脂製
プリプレグであるＧＥＡ−６７１（日立化成工業株式会
社製、商品名）に、厚さ５０ミクロンのエポキシ樹脂フ
ィルムＡＳ３０００（日立化成工業株式会社製、商品
名）と、厚さ１８ミクロンの銅箔ＴＳＴＯ（古河サーキ
ットフォイル株式会社製、商品名）を積層して２５ｋｇ
ｆ／ｃｍ2、１８０℃、０．５Ｔｏｒｒ、９５分の条件
で加圧加熱し積層板を作成し、銅箔の不要な箇所をエッ
チング除去して、内層回路板を３枚それぞれ別の配線パ
ターンを形成したものを作成した。 （２）この３枚の内層回路板と、２枚の厚さ５０ミクロ
ンのエポキシ樹脂フィルムＡＳ３０００（日立化成工業
株式会社製、商品名）とを交互に重ね、最外層にも２枚
の厚さ５０ミクロンのエポキシ樹脂フィルムＡＳ３００
０（日立化成工業株式会社製、商品名）を重ね、さらに
その外側に、２枚の厚さ１８ミクロンの銅箔ＴＳＴＯ
（古河サーキットフォイル株式会社製、商品名）を重
ね、２５ｋｇｆ／ｃｍ2、１８０℃、０．５Ｔｏｒｒ、
９５分の条件で加圧加熱し積層板を作成した。 （３）この積層板に穴をあけ、ＣＵＳＴ−２０１（日立
化成工業株式会社製、商品名）で無電解銅めっき後、電
気硫酸銅めっきを用いて厚さ約７ミクロンのめっき層を
形成した。 （４）厚さ５０ミクロンの感光性ドライフィルムである
フォテックＨ−Ｋ４５０（日立化成工業株式会社製、商
品名）をラミネート後、露光、現像してエッチング用レ
ジストパターンを形成し、エッチングして配線形成を行
った。Example 3 (1) A glass woven cloth / polyimide resin prepreg having a thickness of 0.1 mm, GEA-671 (manufactured by Hitachi Chemical Co., Ltd., trade name), was coated with a 50 micron thick epoxy resin film. 25 kg of AS3000 (manufactured by Hitachi Chemical Co., Ltd.) and 18-micron-thick copper foil TSTO (manufactured by Furukawa Circuit Foil Co., Ltd.)
F / cm 2 , 180 ℃, 0.5 Torr, pressurize and heat under the conditions of 95 minutes to create a laminated board, remove unnecessary portions of the copper foil by etching, and three inner layer circuit boards with different wiring patterns Was formed. (2) The three inner-layer circuit boards and two 50-micron-thick epoxy resin films AS3000 (manufactured by Hitachi Chemical Co., Ltd., trade name) are alternately laminated, and the outermost layer has two thicknesses. 50 micron epoxy resin film AS300
0 (manufactured by Hitachi Chemical Co., Ltd., product name) is stacked, and two 18-micron-thick copper foil TSTOs are further placed on the outside.
(Furukawa Circuit Foil Co., Ltd., trade name) is overlaid, 25 kgf / cm 2 , 180 ° C., 0.5 Torr,
A laminated plate was prepared by heating under pressure for 95 minutes. (3) A hole was made in this laminated plate, and after electroless copper plating with CUST-201 (Hitachi Chemical Co., Ltd., trade name), a plating layer having a thickness of about 7 microns was formed using electro copper sulfate plating. . (4) Phototec H-K450 (trade name, manufactured by Hitachi Chemical Co., Ltd.), which is a photosensitive dry film having a thickness of 50 microns, is laminated, exposed and developed to form a resist pattern for etching, and etching is performed to form wiring. Formed.
【００２３】実施例４ （１）厚さ０．１ミリのガラス織布／ポリイミド樹脂製
プリプレグであるＧＥＡ−６７１（日立化成工業株式会
社製、商品名）に、厚さ５０ミクロンのエポキシ樹脂フ
ィルムＡＳ３０００（日立化成工業株式会社製、商品
名）と、厚さ１８ミクロンの銅箔ＴＳＴＯ（古河サーキ
ットフォイル株式会社製、商品名）を積層して２５ｋｇ
ｆ／ｃｍ2、１８０℃、０．５Ｔｏｒｒ、９５分の条件
で加圧加熱し積層板を作成し、銅箔の不要な箇所をエッ
チング除去して、内層回路板を３枚それぞれ別の配線パ
ターンを形成したものを作成した。このときに、プリプ
レグには予め直径０．５ｍｍの穴をあけておいたので、
穴内部にはエポキシ樹脂フィルムが充填されている。 （２）先の加圧加熱工程で樹脂が充填されている、プリ
プレグに形成した穴部分に、０．２ミリ径のドリルであ
るＭＵＳ０２０（三菱マテリアル株式会社製、商品名）
を用いて、８０ｋｒｐｍ、送り速度１．５ｍ／分、基板
の重ね枚数５枚の条件で穴開けしたのち、厚さ５０ミク
ロンの感光性ドライフィルムであるフォテックＨ−Ｋ４
５０（日立化成工業株式会社製、商品名）をラミネート
後、露光、現像してエッチング用レジストパターンを形
成し、エッチングして配線形成を行い３枚の内層回路板
を作成した。 （３）この３枚の内層回路板と、２枚の厚さ５０ミクロ
ンのエポキシ樹脂フィルムＡＳ３０００（日立化成工業
株式会社製、商品名）とを交互に重ね、最外層にも２枚
の厚さ５０ミクロンのエポキシ樹脂フィルムＡＳ３００
０（日立化成工業株式会社製、商品名）を重ね、さらに
その外側に、２枚の厚さ１８ミクロンの銅箔ＴＳＴＯ
（古河サーキットフォイル株式会社製、商品名）を重
ね、２５ｋｇｆ／ｃｍ2、１８０℃、０．５Ｔｏｒｒ、
９５分の条件で加圧加熱し積層板を作成した。 （４）この積層板に穴をあけ、ＣＵＳＴ−２０１（日立
化成工業株式会社製、商品名）で無電解銅めっき後、電
気硫酸銅めっきを用いて厚さ約７ミクロンのめっき層を
形成した。 （５）厚さ５０ミクロンの感光性ドライフィルムである
フォテックＨ−Ｋ４５０（日立化成工業株式会社製、商
品名）をラミネート後、露光、現像してエッチング用レ
ジストパターンを形成し、エッチングして配線形成を行
った。Example 4 (1) A glass woven cloth / polyimide resin prepreg having a thickness of 0.1 mm, GEA-671 (trade name, manufactured by Hitachi Chemical Co., Ltd.), and an epoxy resin film having a thickness of 50 μm were used. 25 kg of AS3000 (manufactured by Hitachi Chemical Co., Ltd.) and 18-micron-thick copper foil TSTO (manufactured by Furukawa Circuit Foil Co., Ltd.)
F / cm 2 , 180 ℃, 0.5 Torr, pressurize and heat under conditions of 95 minutes to create a laminated board, remove unnecessary portions of the copper foil by etching, and three inner layer circuit boards with different wiring patterns Was formed. At this time, a hole with a diameter of 0.5 mm was previously drilled in the prepreg,
An epoxy resin film is filled inside the hole. (2) MUS020 (manufactured by Mitsubishi Materials Co., Ltd.), which is a 0.2 mm diameter drill in the hole formed in the prepreg, which is filled with resin in the previous pressure and heating step.
After making a hole under the conditions of 80 krpm, feed speed of 1.5 m / min, and stacking of 5 substrates, Fotec H-K4 which is a photosensitive dry film with a thickness of 50 μm.
After laminating 50 (manufactured by Hitachi Chemical Co., Ltd., trade name), exposure and development were carried out to form a resist pattern for etching, and etching was performed to form wiring to form three inner layer circuit boards. (3) These three inner-layer circuit boards and two 50-micron-thick epoxy resin films AS3000 (manufactured by Hitachi Chemical Co., Ltd., trade name) are alternately laminated, and the outermost layer also has two thicknesses. 50 micron epoxy resin film AS300
0 (manufactured by Hitachi Chemical Co., Ltd., product name) is stacked, and two 18-micron-thick copper foil TSTOs are further placed on the outside.
(Furukawa Circuit Foil Co., Ltd., trade name) is overlaid, 25 kgf / cm 2 , 180 ° C., 0.5 Torr,
A laminated plate was prepared by heating under pressure for 95 minutes. (4) A hole was made in this laminated plate, and after electroless copper plating with CUST-201 (manufactured by Hitachi Chemical Co., Ltd., trade name), a plating layer having a thickness of about 7 microns was formed using electro copper sulfate plating. . (5) Phototec H-K450 (trade name, manufactured by Hitachi Chemical Co., Ltd.), which is a photosensitive dry film having a thickness of 50 μm, is laminated, exposed and developed to form a resist pattern for etching, and wiring is performed by etching. Formed.
【００２４】（試験） （１）電食試験 ８５℃、８５％ＲＨの条件下でＤＣ１００Ｖの電圧をギ
ャップを、０．５ミリの間隔（穴壁間隔は０．２ミリ）
で開いているスルーホール相互間に印加し、接続抵抗が
１０の６乗オーム以下になる時間を調べた。その結果、
いずれの実施例の基板も、５００時間後でも絶縁劣化し
なかった。(Test) (1) Electrolytic corrosion test Under conditions of 85 ° C. and 85% RH, a voltage of DC100V was applied with a gap of 0.5 mm (hole wall interval was 0.2 mm).
It was applied between the through-holes opened at, and the time when the connection resistance became 10 6 ohm or less was examined. as a result,
In the substrates of all the examples, the insulation did not deteriorate even after 500 hours.
【００２５】（２）接続信頼性 熱衝撃試験（１２５℃／３０分と−６５℃／３０分の交
互繰り返し）を行った結果、いずれの実施例も、３００
サイクル後の接続抵抗の変化率は１０％以下で異常がな
いことがわかった。(2) Connection reliability As a result of a thermal shock test (alternate repetition of 125 ° C./30 minutes and −65 ° C./30 minutes), 300 was obtained in each of the examples.
It was found that the change rate of the connection resistance after the cycle was 10% or less and there was no abnormality.
【００２６】（３）耐熱性 ２６０℃のはんだ浴に３０秒間フロートした結果、いず
れの実施例も、剥離などの異常がないことがわかった。(3) Heat resistance As a result of being floated in a solder bath at 260 ° C. for 30 seconds, it was found that there was no abnormality such as peeling in any of the examples.
【００２７】[0027]
【発明の効果】以上に説明したように、本発明により、
耐マイグレーション性に優れた配線板を製造するのに好
適な金属張り積層板とその製造法が、低コストで提供で
きる。As described above, according to the present invention,
A metal-clad laminate suitable for manufacturing a wiring board having excellent migration resistance and a manufacturing method thereof can be provided at low cost.
【図１】本発明の一実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the present invention.
Claims (7)
硬化させた層と、高分子量エポキシ樹脂層とからなり、
金属箔との接着面側が高分子量エポキシ樹脂層であるこ
とを特徴とする金属張り積層板。1. A substrate is a glass cloth impregnated with a thermosetting resin.
Consisting of a cured layer and a high molecular weight epoxy resin layer,
A metal-clad laminate characterized in that a high-molecular-weight epoxy resin layer is provided on the adhesive surface side to the metal foil.
レグと、高分子量エポキシ樹脂フィルムと、金属箔と
を、この順に積層し、加圧加熱して積層一体化すること
を特徴とする金属張り積層板の製造法。2. A metal comprising a prepreg obtained by impregnating a glass cloth with a thermosetting resin, a high molecular weight epoxy resin film, and a metal foil, which are laminated in this order and pressure-heated to integrate them. Method for manufacturing a laminated laminate.
レグの両面に、高分子量エポキシ樹脂フィルムと、金属
箔とを積層し、加圧加熱して積層一体化することを特徴
とする金属張り積層板の製造法。3. A metal lining characterized in that a high molecular weight epoxy resin film and a metal foil are laminated on both sides of a prepreg in which a glass cloth is impregnated with a thermosetting resin, and the layers are integrated by heating under pressure. Laminated board manufacturing method.
ラス布に熱硬化性樹脂を含浸したプリプレグを積層し、
加圧加熱して積層一体化することを特徴とする金属張り
積層板の製造法。4. A metal foil with a high molecular weight epoxy resin layer and a prepreg obtained by impregnating a glass cloth with a thermosetting resin are laminated,
A method for manufacturing a metal-clad laminate, which comprises pressurizing and heating to laminate and integrate.
レグの両面に、高分子量エポキシ樹脂層付き金属箔を積
層し、加圧加熱して積層一体化することを特徴とする金
属張り積層板の製造法。5. A metal-clad laminate, characterized in that a metal foil with a high molecular weight epoxy resin layer is laminated on both surfaces of a prepreg in which glass cloth is impregnated with a thermosetting resin, and the laminate is integrated by heating under pressure. Manufacturing method.
あることを特徴とする請求項２から５のうちいずれかに
記載の積層板の製造法。6. The method for producing a laminated board according to claim 2, wherein the thermosetting resin is substantially an epoxy resin.
項２から６のうちいずれかに記載の積層板の製造法。7. The method for manufacturing a laminated plate according to claim 2, wherein the metal foil is a copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12622794A JPH07329246A (en) | 1994-06-08 | 1994-06-08 | Metal clad laminated sheet and production thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12622794A JPH07329246A (en) | 1994-06-08 | 1994-06-08 | Metal clad laminated sheet and production thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07329246A true JPH07329246A (en) | 1995-12-19 |
Family
ID=14929916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12622794A Pending JPH07329246A (en) | 1994-06-08 | 1994-06-08 | Metal clad laminated sheet and production thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07329246A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002098194A1 (en) * | 2001-05-31 | 2002-12-05 | Mitsui Mining & Smelting Co.,Ltd. | Copper plated circuit layer-carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer-carrying copper clad laminated sheet |
| KR100741449B1 (en) * | 2004-01-30 | 2007-07-23 | 히다치 가세고교 가부시끼가이샤 | Adhesion Assisting Agent-Bearing Metal Foil, Printed Wiring Board, and Production Method of Printed Wiring Board |
| KR100919971B1 (en) * | 2007-11-13 | 2009-10-14 | 삼성정밀화학 주식회사 | Metal foil laminate and printed wiring board with liquid crystal polymer prepreg and liquid crystal polymer correction layer |
| JP2012126104A (en) * | 2010-12-17 | 2012-07-05 | Panasonic Corp | Copper-clad laminate |
-
1994
- 1994-06-08 JP JP12622794A patent/JPH07329246A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002098194A1 (en) * | 2001-05-31 | 2002-12-05 | Mitsui Mining & Smelting Co.,Ltd. | Copper plated circuit layer-carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer-carrying copper clad laminated sheet |
| KR100866440B1 (en) * | 2001-05-31 | 2008-10-31 | 미쓰이 긴조꾸 고교 가부시키가이샤 | Manufacturing Method of Printed Wiring Board Using Copper Clad Laminated Plate with Copper Plating Circuit Layer and Copper Clad Laminated Plate with Copper Plating Circuit Layer |
| KR100741449B1 (en) * | 2004-01-30 | 2007-07-23 | 히다치 가세고교 가부시끼가이샤 | Adhesion Assisting Agent-Bearing Metal Foil, Printed Wiring Board, and Production Method of Printed Wiring Board |
| KR100741615B1 (en) * | 2004-01-30 | 2007-07-23 | 히다치 가세고교 가부시끼가이샤 | Adhesion Assisting Agent-Bearing Metal Foil, Printed Wiring Board, and Production Method of Printed Wiring Board |
| KR100767177B1 (en) * | 2004-01-30 | 2007-10-15 | 히다치 가세고교 가부시끼가이샤 | Adhesion Assisting Agent-Bearing Metal Foil, Printed Wiring Board, and Production Method of Printed Wiring Board |
| US7629045B2 (en) | 2004-01-30 | 2009-12-08 | Hitachi Chemical Company, Ltd. | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board |
| US7862889B2 (en) | 2004-01-30 | 2011-01-04 | Hitachi Chemical Co., Ltd. | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board |
| US8815334B2 (en) | 2004-01-30 | 2014-08-26 | Hitachi Chemical Co., Ltd. | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board |
| KR100919971B1 (en) * | 2007-11-13 | 2009-10-14 | 삼성정밀화학 주식회사 | Metal foil laminate and printed wiring board with liquid crystal polymer prepreg and liquid crystal polymer correction layer |
| JP2012126104A (en) * | 2010-12-17 | 2012-07-05 | Panasonic Corp | Copper-clad laminate |
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