JPH0733006U - Microwave circuit - Google Patents

Abstract

(57) [Abstract] [Purpose] In a microwave circuit in which a signal line from a high-frequency circuit arranged on the back surface of a ground conductor is connected to a microstrip line by penetrating the ground conductor and the dielectric substrate by a coaxial line. , It is to realize a vertical connection portion between a microwave integrated circuit and a coaxial line, which has a simple structure and is well matched. [Structure] The present invention is similar to the former prior art in that a through hole 4 is provided in the ground conductor 1 and the dielectric substrate 3, and a tubular or rod-shaped dielectric 6 is inserted into the through hole 4. The present invention is particularly directed to a central conductor 5 provided with a flat land portion 10 at least at one end along the axis of the dielectric 6.
Is formed by projecting and inserting the land portion 10 on the microstrip line 2, and the land portion 10 is bent, for example, by 90 ° and directly soldered to the microstrip line 2 constituting the microwave integrated circuit. It was done.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 According to the present invention, for example, a dielectric substrate having a microstrip line formed on the top surface is mounted on the surface of a ground conductor forming a metal case, and a signal line from a high frequency circuit arranged on the back surface of the ground conductor is connected to the dielectric substrate. The present invention relates to a microwave circuit formed by connecting a ground conductor and a dielectric substrate to a microstrip line through a coaxial line, and particularly relates to a vertical line between the microwave integrated circuit formed by the microstrip line and the coaxial line. Regarding the structure of the connection part.

[0002]

[Prior art]

 Generally, in order to make a high frequency connection between a microwave circuit arranged in a metal case and an external circuit, it is necessary to make a connection with a structure in which a metal case wall is penetrated. The vertical connection between the microwave integrated circuit formed by the above-described microstrip line and the coaxial line is often used in the connection between the internal circuit and the external circuit. As a condition at this time, it is necessary to prevent inconsistency at the connection part.

FIG. 4 shows a vertical connection structure between the microwave integrated circuit and the coaxial line shown in Japanese Utility Model Laid-Open No. 61-189606, and the structure will be briefly described. A dielectric substrate 3 on which various microwave integrated circuits are formed by using a microstrip line 2 is attached to the upper surface of a metal case bottom 1 which functions as a flat ground conductor.

The dielectric substrate 3 located on the lower surface of one end of the microstrip line 2 is provided with a through hole 24 penetrating to the lower surface of the metal case bottom portion 1. The through hole 24 has a metal lead wire 25 at its center. , And the ground metal cylinder 26a is externally inserted around the outer periphery of the dielectric rod 26 so as to be able to make electrical contact with the bottom part 1 of the metal case without contacting the microstrip line 2. The metal lead wire 25 penetrates the microstrip line 2 from the dielectric substrate 3 and is soldered at its upper end. The dielectric tube 26 is configured as a 50 ohm coaxial line in which the metal lead wire 25 is an inner conductor, and the metal case 1 is an outer conductor via the ground metal cylinder 26a.

In the prior art described above, it was necessary to provide a circular solder land pattern 27 at the solder joint between the metal lead wire 25 and the microstrip line 2, but this solder land pattern 27 is parallel in the microwave band. Since it works as a capacity, it was a cause of inconsistency. As another conventional technique, as shown in FIG. 5, a through hole 34 is provided in the bottom portion 1 of the metal case adjacent to the dielectric substrate 3, and a metal lead wire 35 is provided at the center of the through hole 34. There is also a technique in which the dielectric rod 36 is inserted and the metal lead wire 35 is connected to the microstrip line 2 formed on the dielectric substrate 3 by using a bonding wire 38. However, in the above-mentioned conventional technique, the bonding wire 38 acts as a series inductance in the microwave band, which causes a mismatch.

[0006]

[Problems to be solved by the device]

 As described above, in any of the above-mentioned conventional techniques, the vertical connection portion between the microwave integrated circuit and the coaxial line has a parallel capacitance or series inductance component in the microwave band. There was a problem that it showed the function of blocking the transmission and caused the mismatch of the connection part.

In view of the drawbacks of the prior art, the present invention is to realize a vertical connection portion of a matched microwave integrated circuit and a coaxial line with a simple structure.

[0008]

[Means for Solving the Problems]

 The present invention is similar to the former prior art in that the through hole 4 is provided in the ground conductor 1 and the dielectric substrate 3, and the tubular or rod-shaped dielectric 6 is inserted into the through hole 4. In particular, the present invention inserts a central conductor 5 having a plate-shaped land portion 10 at at least one end along the axis of the dielectric 6 so as to project the land portion 10 on the microstrip line 2, For example, the land portion 10 is bent by 90 ° and directly soldered to the microstrip line 2 constituting the microwave integrated circuit.

[0009]

[Action]

 According to this invention, since the flat land portion 10 provided on the upper end of the center conductor 5 is soldered to the microstrip line 2 which directly constitutes the microwave integrated circuit, a series inductance component does not occur. Further, by setting the width of the flat plate-shaped land portion 10 attached to the upper end of the center conductor 5 to an appropriate width length, it is possible to prevent the parallel capacitance component from occurring. Therefore, it is possible to form a vertical connection between the microwave integrated circuit and the coaxial line, which has good characteristics and does not cause mismatch.

[0010]

【Example】

 Hereinafter, embodiments of the present invention will be illustratively described in detail with reference to the drawings. However, unless otherwise specified, the dimensions, materials, shapes, relative positions, etc. of the structural parts described in this embodiment are not intended to limit the scope of the present invention thereto but merely a description. It's just an example. 1 and 2 show an embodiment according to the present invention, in which 1 is a bottom of a metal case, 3 is a dielectric substrate mounted on the upper surface of the bottom of the metal case 2, and 2 is a microstrip line 2. Is. Then, a through hole 4 is bored at a position adjacent to the end of the microstrip line 2 on the bottom 1 of the metal case, and the dielectric 6 is fitted tightly into the through hole 4. Then, as shown in FIG. 3, the metal lead portion 5 having the flat land portion 10 at the upper end is inserted from the upper surface side of the dielectric substrate 3 along the axis of the dielectric material 6 until it is exposed at the bottom surface of the metal case 1. .

As shown in FIG. 3, the metal lead portion 5 functioning as the central conductor is formed by pressing and deforming the upper end of the rod-shaped lead wire portion 9 into a flat plate shape, and connecting the flat plate portion to the lead wire portion 9. The flat land portion 10 is formed by bending at a right angle. The width of the flat land portion 10 is cut in advance so that it can be matched with the microstrip line 2 to be connected. Then, the flat land portion 10 is soldered to the microstrip line 2 with the solder portion 11 to form a vertical connection portion between the microwave integrated circuit according to the present invention and the coaxial line.

[0012]

[Effect of device]

 According to such a device, in the vertical connection portion between the microwave integrated circuit and the coaxial line, there is no portion that acts as a parallel capacitance or a direct inductance in the microwave band, so that the microwave integrated circuit with a good configuration and good matching characteristics can be obtained. The vertical connection between the circuit and the coaxial line can be formed. It has various remarkable effects.

[Brief description of drawings]

FIG. 1 is a sectional view showing a microwave circuit according to an embodiment of the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is an external perspective view of the center conductor used in FIG.

FIG. 4 is a sectional view showing a microwave circuit according to a conventional technique.

FIG. 5 is a sectional view showing a microwave circuit according to another conventional technique.

[Explanation of symbols]

 1 Ground Conductor 2 Microstrip Line 3 Dielectric Substrate 4 Through Hole 5 Center Conductor 6 Dielectric 9 Lead Wire Part 10 Flat Land Part 11 Solder Part

Claims (1)

[Scope of utility model registration request] 1. A dielectric substrate having a microstrip line formed on the upper surface is mounted on the surface of a flat ground conductor, and a signal line from a high frequency circuit arranged on the back surface of the ground conductor is connected to the ground conductor and the ground conductor. In a microwave circuit formed by penetrating a dielectric substrate and connecting to a microstrip line, a through hole is provided in the ground conductor and the dielectric substrate, and at least one of them is arranged along the central axis of the dielectric inserted in the through hole. A microwave circuit, wherein a central conductor having a flat land portion provided at an end is penetrated, and the flat land portion projecting on the dielectric is directly soldered to the microstrip line.