JPH0737631A - Lead terminal for hybrid integrated circuit - Google Patents

Abstract

(57) [Abstract] [Purpose] To obtain a high quality and inexpensive hybrid IC by using rational lead terminals. [Structure] A lead terminal for a hybrid IC in which a U-shaped contact member is press-fitted and held in a rectangular resin molded body, and one end thereof has a gull wing structure.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead terminal of a hybrid integrated circuit (hereinafter referred to as a hybrid IC) used in various video / audio equipment such as video / television and information communication equipment such as personal computers, word processors, and telephones. Is.

[0002]

2. Description of the Related Art In recent years, electronic devices have become smaller and lighter and have more functions.
The performance has been significantly improved, and in particular, the reduction in size and weight is increasing with the demand for personalization and handicap of equipment. Against this background, small hybrid ICs are occupying an important position as means for standardizing circuit blocks.

A conventional hybrid IC and its structure will be described below. FIG. 3 shows the structure and manufacturing method of a conventional hybrid IC. Reference numeral 7 is a thick film mounting substrate.
Is a comb-shaped lead terminal. After press-fitting the clip portion 10a of the lead terminal 10 into contact with the input / output electrode conductor 4b of the thick-film mounting substrate 7, a joining member such as solder is supplied from above the clip portion 10a, and an appropriate heating source such as a light beam is supplied. The joining member is melted by irradiating laser light or the like, and soldering of the thick film mounting substrate 7 and the lead terminal 10 is completed.
Then, the connecting portion 10b of the lead terminal 10 is bent and cut to obtain a hybrid IC.

[0004]

However, in the conventional hybrid IC whose basic structure is to use the above-mentioned comb-shaped lead terminals, lead dimensional accuracy, particularly pitch accuracy: P, facing two-side accuracy: O, high. Accuracy: It is difficult to secure a high accuracy of H, and soldering when attaching the lead terminals to the thick-film mounting board is handled in individual steps. Hybrid IC
When mounting the PCB on a printed circuit board, the lead terminals may be misaligned or fall out during the entire reflow, and this also has the problem of having to resort to expensive local heating methods such as laser reflow equipment in individual processes. Was.

The present invention solves the above-mentioned conventional problems, and an object thereof is to provide a high-quality and inexpensive hybrid IC by providing a highly accurate and rational lead terminal.

[0006]

In order to achieve this object, the hybrid IC lead terminal of the present invention has a structure in which a U-shaped contact member is press-fitted and held on two opposite sides of a rectangular resin molding frame. Have

[0007]

With this structure, it is possible to secure the accuracy of the lead terminals and prevent the positional deviation, and it is possible to realize a hybrid IC that can be reflow-soldered when mounted on a printed circuit board.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

1 and 2 show a lead terminal of the present invention and a hybrid IC equipped with the lead terminal, respectively. The lead terminal 1 is a rational assembly structure having a rectangular resin molding frame 2 and a U-shaped contact member 3 as main constituent elements.
The rectangular resin molding frame 2 is formed by transfer molding a heat-resistant resin such as PPS (polyphenylene sulfide), and is made of an integral body in which four sides: ABCD are connected. For example, the U-shaped contact member 3 is press-fitted and held in a predetermined portion of the opposite sides A and C of the resin-molded frame 2. These contact members 3
The simple substance shape and its accuracy can be easily secured in advance by an etching method or a pressing method. Moreover, since the contact members 3 are accurately press-fitted and held in the predetermined portions of the A side and the C side of the resin molding frame 2, the pitch precision of the individual lead terminals 3a and 3b: P, of course, Opposite side A
It is possible to realize the lead terminal 1 in which the positional variation of the lead terminals 3a and 3c between C and O can be secured with high accuracy. These lead terminals 1 are joined to the input / output electrode conductors 4b at predetermined positions on the mounting substrate 7 via connecting members such as solder, and finally become the hybrid IC 9.

As described above, according to this embodiment, the press-fitting holding structure of the rectangular resin molding frame and the contact member makes it possible to easily secure the positional accuracy of the lead terminals, the shape accuracy of the pitch, and the like. It is also possible to prevent the phenomenon of dislocation during reflow of terminals, and to prevent the occurrence of open defects in the soldered parts.

[0011]

As described above, the present invention is a lead terminal having an integral connection structure in which a contact member is press-fitted and held in a resin molding frame, so that not only the lead accuracy but also reflow at the same time as other electronic parts. Since it can be mounted on a thick film substrate by soldering, a high quality and inexpensive hybrid IC can be provided.

[Brief description of drawings]

FIG. 1 is a hybrid IC using the lead terminal of the present invention.
Perspective view showing the assembly of the

FIG. 2 is a hybrid IC using the lead terminal of the present invention.
Perspective view showing the configuration of

FIG. 3 is a perspective view showing a configuration of a hybrid IC using a conventional lead terminal.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 lead terminal 2 resin molding frame 3 contact members 3a, 3b, 3c lead terminals 4a, 4b input / output electrode conductors 7 thick film mounting board 9 hybrid IC 10 comb-shaped lead terminals 10a clip portion 10b connecting portion

Front Page Continuation (72) Inventor Mitsunori Wada 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (2)

[Claims] 1. A rectangular resin molding frame body facing at least 2
A lead terminal for a hybrid integrated circuit, characterized in that a U-shaped contact member is press-fitted and held over the side. 2. The lead terminal for a hybrid integrated circuit according to claim 1, wherein a connecting end of the U-shaped contact member is extended and the portion has a gull wing structure.