JPH075426Y2 - 温度特性試験槽 - Google Patents
温度特性試験槽Info
- Publication number
- JPH075426Y2 JPH075426Y2 JP1988011234U JP1123488U JPH075426Y2 JP H075426 Y2 JPH075426 Y2 JP H075426Y2 JP 1988011234 U JP1988011234 U JP 1988011234U JP 1123488 U JP1123488 U JP 1123488U JP H075426 Y2 JPH075426 Y2 JP H075426Y2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- air
- characteristic test
- test
- temperature characteristic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000012360 testing method Methods 0.000 title claims description 40
- 230000003028 elevating effect Effects 0.000 claims description 6
- 238000009423 ventilation Methods 0.000 claims description 6
- 239000003507 refrigerant Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988011234U JPH075426Y2 (ja) | 1988-02-01 | 1988-02-01 | 温度特性試験槽 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988011234U JPH075426Y2 (ja) | 1988-02-01 | 1988-02-01 | 温度特性試験槽 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01118379U JPH01118379U (2) | 1989-08-10 |
| JPH075426Y2 true JPH075426Y2 (ja) | 1995-02-08 |
Family
ID=31219606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988011234U Expired - Lifetime JPH075426Y2 (ja) | 1988-02-01 | 1988-02-01 | 温度特性試験槽 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH075426Y2 (2) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2610373C3 (de) * | 1975-04-02 | 1981-09-17 | Tyler Refrigeration Corp., 49120 Niles, Mich. | Kühltruhe |
| JPS58141175U (ja) * | 1982-03-17 | 1983-09-22 | 株式会社東芝 | オ−プンシヨ−ケ−ス |
| JPS613378U (ja) * | 1984-06-13 | 1986-01-10 | 日本建鐵株式会社 | 冷凍冷蔵オ−プンシヨ−ケ−ス |
| JPH0652147B2 (ja) * | 1984-10-26 | 1994-07-06 | 三菱電機株式会社 | オープンショーケース |
| JPS61203281U (2) * | 1985-06-07 | 1986-12-20 | ||
| JPS62169063A (ja) * | 1986-01-21 | 1987-07-25 | Kumamoto Nippon Denki Kk | 環境試験装置 |
| JPH01196583A (ja) * | 1988-02-01 | 1989-08-08 | Takamisawa Cybernetics Co Ltd | 温度特性試験槽 |
-
1988
- 1988-02-01 JP JP1988011234U patent/JPH075426Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01118379U (2) | 1989-08-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5838568A (en) | Heated circuit assembly tester and method | |
| TW201942993A (zh) | 檢查裝置 | |
| JPS59500036A (ja) | 集積回路チツプ用保持装置 | |
| KR20220036892A (ko) | 챔버 씰링을 위한 반도체 번인 오븐 | |
| KR20080053768A (ko) | 웨이퍼 척, 이를 구비하는 웨이퍼의 전기적 특성을테스트하는 장치 및 테스트하는 방법 | |
| CN101965521A (zh) | 半导体元件测试系统、测试处理器、测试头、半导体元件测试器的界面区块、分类经测试的半导体元件的方法、及支持半导体元件测试的方法 | |
| JPH075426Y2 (ja) | 温度特性試験槽 | |
| KR100482371B1 (ko) | 집적소자 테스트 시스템 및 그 방법 | |
| CN103792485B (zh) | 自动化测试设备和测试方法 | |
| JPS6221083A (ja) | 電子機器の温度特性試験器 | |
| KR19980071258A (ko) | 피검사체의 특성을 검사하기 위한 검사 방법 및 장치 | |
| CN115174894A (zh) | 一种高低温环境摄像头测试装置及系统 | |
| WO2014106152A1 (en) | Systems and methods for handling substrates at below dew point temperatures | |
| JPH0752624Y2 (ja) | 温度試験器 | |
| CN114814534A (zh) | 电路板测试结构及电路板测试治具 | |
| JPH0527014Y2 (2) | ||
| JPH05333106A (ja) | 温度特性試験装置 | |
| JP4065059B2 (ja) | Ｉｃ試験装置 | |
| CN120072017A (zh) | 一种用于内存条的高低温测试设备 | |
| JPH0752625Y2 (ja) | 温度特性試験槽 | |
| JPH01196583A (ja) | 温度特性試験槽 | |
| CN216310187U (zh) | 一种分区式晶体管老化系统 | |
| JPH01196584A (ja) | 温度特性試験槽 | |
| CN115436211A (zh) | 复式快速温变冲击试验箱 | |
| JP4859156B2 (ja) | 温度特性試験装置 |