JPH0760876B2 - SEMICONDUCTOR DEVICE MANUFACTURING FRAME, SEMICONDUCTOR DEVICE USING THE SAME, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing frame, a semiconductor device using the same, and a semiconductor manufacturing method, and more specifically, further miniaturization of a semiconductor device having at least a two-terminal structure and manufacturing cost reduction. The present invention relates to those that can be reduced.

[0002]

2. Description of the Related Art Among semiconductor devices, for example, a diode having a two-terminal structure used in various circuits as a low voltage generating element has a plurality of lead wires arranged on the same axis line at regular intervals. After the die bonding step of bonding the chip element to one lead wire side is performed on the lead frame provided with the pair, the chip is passed through the wire bonding step of connecting the electrode portion of the chip element and the other lead wire. It is well known that the device or the lead wire is manufactured through a series of steps such as a resin molding step of sealing with a resin. In addition, a gold wire is generally used as a wire for wire bonding, and the gold wire is thermocompression bonded to the electrode portion and the lead wire of the chip element, respectively.

[0003]

By the way, when the semiconductor device is energized, heat is generated in the chip element.
Since the heat causes the chip element to expand and causes distortion, a wire connection failure may occur in which the wire (gold wire) once connected is disconnected from the chip element.
Further, the heat generated in the chip element can be radiated to the other lead wire only through the gold wire and the resin molded body, and since the heat dissipation efficiency in the chip element is poor, a heat storage state that causes characteristic failure, or There is also a problem that thermal stress easily occurs in the chip element. For this reason, it has been desired to eliminate the above-mentioned connection failure, which is a cause of the defective semiconductor device, and to improve the heat dissipation efficiency in the chip element, thereby making the product quality constant and improving the productivity accordingly.

In the conventional semiconductor device,
Since the lead wire, the chip element bonded to the lead wire, and all the wires connecting the chip element and the lead wire in a loop shape must be sealed with the mold body, the thickness of the resin mold body generally increases. As a result, the size of the product has inevitably increased.

The present invention has been conceived under the circumstances as described above, and in a semiconductor device such as the diode described above, the above problems can be solved by a simple structure to improve productivity. Its challenges are to achieve improvement, long-term stability of performance, reduction of manufacturing cost, and miniaturization of products.

In order to solve the above problems, the present invention takes the following technical means. That is, the invention described in claim 1 of the present application includes the left and right side frame portions,
A frame for manufacturing a semiconductor device, comprising a plurality of pairs of lead portions extending inwardly and inwardly from each side frame portion with the same axis, wherein a main portion of the lead portion is provided at an opposing portion of the lead portions forming each pair. It is characterized in that the chip holding part which is elastically deformable in the axial direction of the lead part by being bent or formed with a through hole is formed in the frame reference plane by punching or etching. I am trying.

According to a second aspect of the present invention, a pair of lead portions arranged on the same axis line so as to face each other at a predetermined interval, and a chip element electrically connected to these lead portions. And a through hole is formed in a facing portion of the pair of lead portions facing each other so as to have a bent shape with respect to the main portion of the lead portions. A chip holding part that is elastically deformable in the axial direction is formed by punching or etching in a plane including the main part of the lead part, and the chip element is provided between the chip holding parts provided in the facing part. It is characterized by being clamped and supported.

The invention according to claim 3 of the present application is provided with a plurality of pairs of left and right side frame parts and a plurality of lead parts extending inwardly and inwardly from each side frame part with the same axis line, and each pair of leads is formed. The chip sandwiching portion which is elastically deformable in the axial direction of the lead portion by punching or etching is formed in the facing portion of the lead portion in a shape bent to the main portion of the lead portion or by forming a through hole. A method of manufacturing a semiconductor device using a manufacturing frame formed in a frame reference plane according to claim 1, wherein the chip element is elastically supported between the chip holding portions by pushing the chip element between the chip holding portions. Step, resin-molding the elastically supported chip element or part of the lead portion, supporting the chip element and resin-molding. Separating the finished lead portion from the side frame.

[0009]

According to the present invention, the chip element is arranged between the respective chip holding portions provided on the pair of lead portions, and the chip holding portions are supported by elastic pressure. Is held between the lead portions, and the chip element and the lead portion are electrically connected by direct contact at the chip holding portion.
Therefore, the conventional wire bonding for connecting the chip element and the lead portion is not necessary, so that the factor of the defective semiconductor device such as the defective connection is eliminated.

Further, the elastic reaction force acting on each of the chip sandwiching portions which are arranged on the axis of the lead portion and are in pressure contact with the chip element acts on the lead portion in the axial direction thereof. Does not act on the bending force due to the elastic reaction force. Therefore, the lead portion is not deformed due to the elastic reaction force, and the positional relationship between the lead portions or their chip holding portions is always maintained constant. That is, since the holding force of each chip sandwiching portion with respect to the chip element can be made constant, no contact failure occurs between the chip element and the chip sandwiching portion or the lead portion.

Moreover, the expansion of the chip element caused by the heat generated during the energization operation can be absorbed by the elastic deformation of the chip holding portion to avoid the occurrence of distortion in the chip element, and the heat can be applied to the chip holding portion or the lead portion. Since the heat can be directly radiated, the heat radiation efficiency in the chip element can be remarkably improved as compared with the case where the conventional wire bonding is performed.

Further, in the present invention, the chip sandwiching portion formed at the tip of the lead portion formed to face each other inwardly so as to hold the chip element in the sandwiched state, has a shape bent with respect to the main portion of the lead portion. Since it is a form formed with a hole or a through hole and can be easily formed by punching or etching at the time of forming the manufacturing frame, for example, it is complicated in manufacturing the manufacturing frame such as performing bending after punching. Not really.

In addition, since the chip holding portion is formed in the reference plane of the manufacturing frame, the thickness of the resin mold body for sealing the chip elements held between them is the same as that of the chip element itself. Just a little thicker than the thickness,
Since it can be made extremely thin as a whole, the semiconductor device can be made small in size, in which the dimension in the thickness direction is remarkably reduced as compared with the conventional one.

As described above, according to the invention of the present application, it is possible to eliminate the factor of defectiveness due to wire bonding, and to effectively prevent defective chip elements due to heat generated during energization operation. It is possible to largely give the device a constant product quality and a consequent improvement in productivity.

Further, since the wire bonding step can be omitted and an expensive gold wire need not be used, it is very advantageous in terms of cost, and the gold wire is also resin-sealed together with the chip element or the lead portion. Since the resin mold can be made smaller than in the conventional case where it is necessary, the semiconductor device can be further downsized.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below with reference to the drawings. In this embodiment, an example in which the present invention is applied to a diode generally known as a two-terminal element is shown.

As shown in FIG. 1, the diode D includes a pair of lead portions 1 and 1 arranged on the same axis line at a predetermined interval, and a chip electrically connected to the lead portions 1 and 1. And element 2. Further, a part of the chip element 2 and the lead portions 1, 1 is covered with the resin mold 3.

In the present invention, each of the lead portions 1 and 1 is provided with a chip holding portion 4 which is elastically deformable in the axial direction of the lead portion 1 at a portion facing the other. In the case of this embodiment, the chip holding portion 4
As shown in FIGS. 1 and 2, the base portion 5 extends obliquely from the main portion of the lead portion 1, and the tip of the base portion 5 is bent in a direction opposite to the extending direction and extends obliquely. The base 5 and the chip pressure contact portion 6 are integrally formed as a cantilever beam with the main portion of the lead portion 1 as a whole.

Further, in forming the diode D, a lead frame 7 having a plurality of pairs of lead portions 1 and 1 as shown in FIG. 2 is used, but in the present invention, a protective mask treatment and an etching solution are used. The lead frame 7 is processed by an etching process capable of performing patterning by cutting off unnecessary portions and performing fine processing with strict processing accuracy, and the chip holding portion 4 at each of the facing inner ends of the lead portion is also processed. The lead frame is formed at the same time as the above etching process.

This makes it possible to strictly control the size of the chip holding portion 4 and the space between the pair of chip holding portions 4 and 4. Further, the chip holding portions 4 and 4 are held by the chip element 2. The power can be made constant. In addition,
The interval between the chip pressing portions 6, 6 of the pair of chip holding portions 4, 4 in the natural state is set to be slightly smaller than the width of the chip element 2.

Thus, in the present invention, as shown in FIG. 1, the chip element 2 is pushed between the chip holding portions 4 and 4 to elastically hold them between them. As shown in FIG. 2, the chip element 2 is preliminarily tin-plated 8 (Sn-plated) on the surface of the electrode portion 2a, and tin-plated 8 on the surface opposite to the electrode portion 2a. A raised portion having the same shape as the electrode portion 2a is formed. As a result, after the chip element is pushed between the chip holding portions 4 and 4 as described above, the tin plating 8 is heated and welded to the chip element 2.
It is possible to further increase the bonding strength between the chip holding portions 4 and 4.

After the chip element 2 is held between the chip holding portions 4 and 4 in this way, a resin molding step, a lead cutting step of cutting the lead portions 1 and 1 from the lead frame 7 and the like are performed. Diode D as shown in 1
Is completed.

In the diode D configured as described above, the chip element 2 and the lead portion 1, 4 are directly brought into pressure contact with the chip pressure contact portions 6, 6 or the chip holding portions 4, 4. 1 is electrically connected to each other, there is no need to perform a wire bonding process between the chip device 2 and the lead portion 1 as in the related art. Therefore, unlike the conventional case, a connection failure does not occur, and heat can be directly radiated from the chip element 2 to the lead portion 1, the heat radiation efficiency of the chip element 2 is improved, and the performance of the diode D is improved. be able to.

Moreover, the chip element 2 and the chip holding portions 4 and 4 are arranged on the axis of the lead portion 1, and the elastic reaction force that the chip pressure contact portions 6 and 6 receive from the chip element 2 is the lead portion 1. , 1 in the axial direction, the bending force due to the elastic reaction force does not act on the lead portion 1. That is, since the lead portions 1 and 1 are not deformed due to the elastic reaction force,
The relative positional relationship between the chip holding portions 4 and 4 can always be made constant, and a stable holding force of the chip holding portions 4 and 4 with respect to the chip element 2 can be obtained.

Further, since the cantilevered beam-shaped chip holding portions 4 and 4 are formed in the reference plane of the lead frame, the chip element 2 which is held under pressure between the chip holding portions 4 and 4 is held. The thickness of the resin mold 3 for encapsulation may be slightly thinner than the thickness of the chip element 2 described above, and may be made thinner as a whole.
In this respect, bonding the chip element on the lead part,
Furthermore, in the conventional example in which the upper surface of the chip element and the other lead portion are wire-bonded in a loop shape, a certain thickness or more is required to seal all of the lead portion, the chip element, and the bonding wire without excess or deficiency. It can be said that, as compared with the conventional resin mold, a remarkable reduction in thickness can be achieved.

The scope of the present invention is not limited to the above embodiments. For example, in the embodiment shown in FIGS. 1 and 2 above, as shown in FIG. 3, the chamfered portion 9 is formed especially in the upper corners of the tip holding portions 4, 4 of the tip holding portions 4, 4.
By providing the above, the chip element 2 can be easily pushed and held between the chip pressure contact portions 6 and 6 from above. That is, when the chip element 2 is pushed in, it does not have to be performed from the lateral direction of the chip pressure contact portions 6 and 6 (direction of arrow A in FIG. 2), so that the lead portions 1 ... It is possible to further reduce the distance, and thereby increase the number of semiconductor devices that can be manufactured from the lead frame 7 having a constant length. This means that it is possible to improve the production efficiency by improving the product retention and reducing the lead frame 7 feed interval in each manufacturing process.

Further, in addition to the above, various forms of the chip holding portion 4 can be considered. For example, as shown in FIG. 4, at the end of the lead portion 1, a chip-holding portion 4 having a so-called double-supported beam shape, which is substantially elliptical in plan view and has a through hole 10 that allows elastic deformation in the central portion, is provided. You may do it.
By doing so, the surface on which the chip element is to be sandwiched is rounded, so that the chip element can be inserted and held between the lead portions more smoothly and the holding force can be stabilized.

Further, as shown in FIG. 5, the chip holding portion 4
By providing the notch engaging portions 11 and 11 on the base portion of the above, the relative movement of the lead portions 1 and 1 can be regulated by the engagement of these with the resin mold 3. That is,
Even when the lead portions 1, 1 receive a pulling force or the like from the outside, the relative positional relationship between the chip holding portions 4, 4 is maintained constant, and the chip element 2 and the chip holding portions 4, 4 or the lead portions 1, 4 are held. The contact state between 1 can be always kept good.

Further, in the embodiments shown in FIGS. 4 and 5, the width of the chip holding portion 4 may be formed to be approximately the same as the width of the lead portion, which further reduces the size of the component. You can proceed. Further, also in the embodiment shown in FIGS. 4 and 5, chamfering as in the embodiment of FIG. 3 may be performed so that the chip element can be pushed and held between the lead portions from above.

[Brief description of drawings]

FIG. 1 is a perspective view schematically showing a diode which is an example of a semiconductor device of the present invention.

FIG. 2 is a plan view of a manufacturing frame used for manufacturing the diode of FIG.

3 is a cross-sectional view showing a main part of a modified example of the manufacturing frame, which is a view corresponding to an enlarged cross-sectional view taken along line III-III of FIG.

FIG. 4 is a plan view showing a main part of another embodiment of the manufacturing frame of the present invention.

FIG. 5 is a sectional view showing still another embodiment of the present invention.

[Explanation of symbols]

 1 lead part 2 chip element 4 chip holding part 7 manufacturing frame (lead frame)

Claims (3)

[Claims] 1. A semiconductor device manufacturing frame comprising left and right side frame parts, and a plurality of pairs of lead parts extending inwardly and inwardly from each side frame part with the same axis line, the lead parts forming each pair. Is formed in a shape that is bent with respect to the main portion of the lead portion or a through hole is formed
A frame for manufacturing a semiconductor device, characterized in that the chip sandwiching portion elastically deformable in the axial direction of the lead portion is formed in the frame reference plane by punching or etching. 2. A pair of electrodes are arranged on the same axis line at a predetermined interval.
A semiconductor device comprising a pair of lead portions arranged so as to face each other and a chip element electrically connected to the lead portions, wherein the lead portions are provided on opposing portions of the pair of lead portions facing each other. Formed in a bent shape with respect to the main part of the part or
Hole and chip clamping portion which is elastically deformable in the axial direction of the lead portion is formed by punching or etching in a plane containing the main portion of the lead portion by is formed, the chip element, the counter A semiconductor device, wherein the semiconductor device is clamped and supported between respective chip clamping portions provided in the portion. 3. Left and right side frame parts, and a plurality of pairs of lead parts extending inwardly and inwardly from each side frame part with the same axis line, and a plurality of pairs of lead parts are provided in the facing parts of the lead parts forming each pair. Shaped in a bent shape with respect to the main part
Manufacturing of a semiconductor device using a manufacturing frame in which a chip holding portion that is elastically deformable in the axial direction of the lead portion by being formed or formed with a through hole is formed in a frame reference plane by punching or etching A step of elastically supporting the chip element between the chip sandwiching portions by pushing the chip element between the chip sandwiching portions, and molding the elastically supported chip element or part of the lead portion with resin. Steps, leads for which chip element support and resin molding have been completed
A step of separating the part from the side frame , and a method of manufacturing a semiconductor device.