JPH076580Y2 - Switch wafer - Google Patents
Switch waferInfo
- Publication number
- JPH076580Y2 JPH076580Y2 JP1989013581U JP1358189U JPH076580Y2 JP H076580 Y2 JPH076580 Y2 JP H076580Y2 JP 1989013581 U JP1989013581 U JP 1989013581U JP 1358189 U JP1358189 U JP 1358189U JP H076580 Y2 JPH076580 Y2 JP H076580Y2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- resin
- switch
- switch wafer
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H19/00—Switches operated by an operating part which is rotatable about a longitudinal axis thereof and which is acted upon directly by a solid body external to the switch, e.g. by a hand
- H01H19/02—Details
- H01H19/08—Bases; Stationary contacts mounted thereon
Description
【考案の詳細な説明】 ［産業上の利用分野］ 本考案は、ロータリスイツチ、スライドスイツチ等に使
用されるスイツチウエハに係り、特に、ソリの少ないス
イツチウエハに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a switch wafer used for a rotary switch, a slide switch, etc., and more particularly to a switch wafer with less warpage.
［従来の技術］ 第４図〜第６図は従来例の説明図で、第４図はロータリ
スイツチのウエハの正面図、第５図は同裏面図、第６図
は第４図のＡ−Ａ線の断面図である。[Prior Art] FIGS. 4 to 6 are explanatory views of a conventional example. FIG. 4 is a front view of a wafer of a rotary switch, FIG. 5 is a rear view of the same, and FIG. 6 is A- of FIG. It is sectional drawing of the A line.
これ等の図面において、１は樹脂より成るスイツチウエ
ハ、２は該スイツチウエハ１の表面にインサート成形さ
れたパターン、３はパターン２の成形時に、該パターン
２の移動を阻止するために、下型に設けたパターン２の
押えピンによつてパターン２の裏面の樹脂に形成された
孔である。In these drawings, 1 is a switch wafer made of resin, 2 is a pattern insert-molded on the surface of the switch wafer 1, and 3 is a lower mold for preventing the movement of the pattern 2 when the pattern 2 is molded. This is a hole formed in the resin on the back surface of the pattern 2 by the pressing pin of the pattern 2 provided on the.
［考案が解決しようとする課題］ ところが、前記孔３は、スイツチウエハ１の裏面に点在
するため、第６図に示す如く孔３のない部分のパターン
２の裏面の樹脂厚は、パターン２の厚みに比べて大であ
るので、この部分の樹脂が成形後変形し、ソリが生じ、
パターン２の精度が悪くなるという問題があり、また、
パターン２の形状変更のたびに前記押えピンの配列を変
えねばならないので、融通性に欠けていた。[Problems to be solved by the invention] However, since the holes 3 are scattered on the back surface of the switch wafer 1, as shown in FIG. Since it is thicker than the thickness of, the resin in this part deforms after molding, causing warpage,
There is a problem that the accuracy of pattern 2 deteriorates, and
Since the arrangement of the pressing pin has to be changed every time the shape of the pattern 2 is changed, the flexibility is lacking.
本考案は、このような従来の課題を解決するめたのもの
で、本考案の目的は、従来に比しスイツチウエハのソリ
を少くしてパターン精度が大きく、また、パターンの形
状変更に対して融通性のあるスイツチウエハを提供しよ
うとするものである。The present invention has been made to solve such a conventional problem, and an object of the present invention is to reduce the warp of the switch wafer and to increase the pattern accuracy and to be flexible in changing the shape of the pattern. The present invention is intended to provide a switch wafer having certain characteristics.
［課題を解決するための手段］ 本考案は、上記のような課題を解決するために、一面に
所望形状のパターンをインサート成形した樹脂より成る
スイツチウエハにおいて、前記パターンの裏面の樹脂
に、前記パターン形状に沿つて凹溝を形成している。[Means for Solving the Problems] In order to solve the above problems, the present invention provides a switch wafer made of resin in which a pattern having a desired shape is insert-molded on one surface, wherein the resin on the back surface of the pattern is A groove is formed along the pattern shape.
［作用］ 本考案のスイツチウエハは上記のような構成を有し、パ
ターンの裏面のスイツチウエハを構成する樹脂に前記パ
ターン形状に沿つて凹溝を形成しているので、樹脂の収
縮歪をこの凹溝で吸収し、樹脂の後収縮を最小限におさ
えることが出来るので、精度の高いパターンを形成した
スイツチウエハを提供出来る。また、前記凹溝は、パタ
ーンの形状変更に対して融通性をもつているので、パタ
ーンの形状変更に容易に対処し得る。[Operation] The switch wafer of the present invention has the above-mentioned structure, and since the resin forming the switch wafer on the back surface of the pattern is formed with the concave groove along the pattern shape, the contraction strain of the resin is reduced. Since it can be absorbed by the groove and the post-shrinkage of the resin can be suppressed to a minimum, it is possible to provide a switch wafer having a highly accurate pattern formed. Further, since the groove has flexibility for changing the shape of the pattern, it is possible to easily deal with changing the shape of the pattern.
［実施例］ 以下に、本考案の実施例を添付の図面に基づき説明す
る。[Embodiment] An embodiment of the present invention will be described below with reference to the accompanying drawings.
第１図〜第３図は本考案の実施例の説明図で、第１図は
ロータリ型のスイツチウエハの正面図、第２図は同裏面
図、第３図は第１図のＢ−Ｂ線の断面図である。1 to 3 are explanatory views of an embodiment of the present invention. FIG. 1 is a front view of a rotary type switch wafer, FIG. 2 is a rear view of the same, and FIG. 3 is BB of FIG. It is sectional drawing of a line.
なお、第４図〜第６図に示した従来例と同一部分には同
一符号を付して重複する説明は省略する。The same parts as those in the conventional example shown in FIGS. 4 to 6 are designated by the same reference numerals, and a duplicate description will be omitted.
本考案と従来例との相違点は、スイツチウエハ１の表面
にインサート成形されたパターン２の裏面の樹脂に、第
３図に示すようにパターン２の形状に沿つて凹溝４を形
成した点である。The difference between the present invention and the conventional example is that a groove 4 is formed along the shape of the pattern 2 in the resin on the back surface of the pattern 2 insert-molded on the surface of the switch wafer 1 as shown in FIG. Is.
本考案の上記のような構成によれば、第３図に示す如
く、パターン２の裏面の樹脂には、パターン２の形状に
沿つて凹溝４が形成されているので、パターン２の形状
に沿つて樹脂層をなくすことが出来、従つて、樹脂の収
縮歪をこの凹溝４で吸収し、樹脂の後収縮を最小限にお
さえることが出来るので、精度の高いパターン２を形成
したスイツチウエハ１を提供出来る。According to the above-described structure of the present invention, as shown in FIG. 3, the resin on the back surface of the pattern 2 has the concave groove 4 formed along the shape of the pattern 2, so that the shape of the pattern 2 is formed. Along with this, the resin layer can be eliminated, and accordingly, the shrinkage strain of the resin can be absorbed by the concave groove 4 and the post-shrinkage of the resin can be suppressed to the minimum, so that the switch wafer having the highly accurate pattern 2 formed thereon. Can provide 1.
なお、前記凹溝４は、従来の孔３と同様に、下型に設け
たパターン２の押えピンによつて形成され、従つてこの
凹溝４の形成は、パターン２の移動阻止の役目をも果た
す。The groove 4 is formed by the holding pin of the pattern 2 provided on the lower die, like the conventional hole 3, and thus the formation of the groove 4 serves to prevent the movement of the pattern 2. Also fulfills.
また、パターン２の形状の変更に対しては、凹溝４は融
通性をもつており、同一金型を使用出来るので、従来に
比し有利である。Further, the concave groove 4 has flexibility for changing the shape of the pattern 2, and the same mold can be used, which is advantageous as compared with the conventional case.
［考案の効果］ 本考案によれば、上述した如く、スイツチウエハの一面
に形成したパターンの裏面に凹溝を形成することによつ
て、スイツチウエハを構成する樹脂の後収縮を最小限に
おさえることが出来、パターンの精度の高いスイツチウ
エハを提供出来る。[Advantages of the Invention] According to the present invention, as described above, by forming the concave groove on the back surface of the pattern formed on one surface of the switch wafer, the post-shrinkage of the resin forming the switch wafer can be minimized. It is possible to provide a switch wafer having a high pattern accuracy.
更にまた、パターン形状の変更に対しても融通性をもつ
という効果も併有する。Furthermore, it also has the effect of being flexible in changing the pattern shape.
第１図〜第３図は本考案の実施例の説明図で、第１図は
ロータリスイツチのウエハの正面図、第２図は同裏面
図、第３図は第１図のＢ−Ｂ線の断面図、第４図〜第６
図は従来例を示し、第４図はロータリスイツチのウエハ
の正面図、第５図は同裏面図、第６図は第４図のＡ−Ａ
線の断面図である。 １……スイツチウエハ、２……パターン、３……孔、４
……凹溝。1 to 3 are explanatory views of an embodiment of the present invention. FIG. 1 is a front view of a wafer of a rotary switch, FIG. 2 is a rear view of the same, and FIG. 3 is a line BB of FIG. Sectional views of FIGS. 4 to 6
FIG. 4 shows a conventional example, FIG. 4 is a front view of a wafer of a rotary switch, FIG. 5 is a rear view of the same, and FIG. 6 is an AA of FIG.
It is sectional drawing of a line. 1 ... Switch wafer, 2 ... pattern, 3 ... hole, 4
...... Groove.
Claims (1)
形した樹脂より成るスイツチウエハにおいて、前記パタ
ーンの裏側の樹脂に、前記パターン形状に沿つて凹溝を
形成したことを特徴とするスイツチウエハ。1. A switch wafer made of resin having a pattern of a desired shape insert-molded on one surface, wherein a groove is formed along the pattern shape in the resin on the back side of the pattern.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989013581U JPH076580Y2 (en) | 1989-02-09 | 1989-02-09 | Switch wafer |
| KR2019890015465U KR920002549Y1 (en) | 1989-02-09 | 1989-10-24 | Switch wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989013581U JPH076580Y2 (en) | 1989-02-09 | 1989-02-09 | Switch wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02106645U JPH02106645U (en) | 1990-08-24 |
| JPH076580Y2 true JPH076580Y2 (en) | 1995-02-15 |
Family
ID=11837141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989013581U Expired - Lifetime JPH076580Y2 (en) | 1989-02-09 | 1989-02-09 | Switch wafer |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH076580Y2 (en) |
| KR (1) | KR920002549Y1 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5669136A (en) * | 1979-11-12 | 1981-06-10 | Fuji Heavy Ind Ltd | Multiparts monoblock injection molding method |
| JPS59194317A (en) * | 1984-04-02 | 1984-11-05 | ミツミ電機株式会社 | Pushbutton switch |
-
1989
- 1989-02-09 JP JP1989013581U patent/JPH076580Y2/en not_active Expired - Lifetime
- 1989-10-24 KR KR2019890015465U patent/KR920002549Y1/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| KR900016206U (en) | 1990-09-03 |
| KR920002549Y1 (en) | 1992-04-25 |
| JPH02106645U (en) | 1990-08-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |