JPH077169U - Film spacer for film circuit board - Google Patents

Abstract

(57) [Abstract] [Purpose] This is a spacer when the films for circuit boards are stacked and wound on a reel, preventing deformation of the film circuit boards and improving the flow of hot air during drying to reduce uneven heat treatment. Suggest what you can do. [Structure] Alternate front and back on both edges of the film spacer,
Protrusions having a wavy cross section are formed.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a film spacer for forming a gap between films when a film circuit board is wound around a reel in a process of manufacturing the film circuit board.

[0002]

[Prior art]

 Conventionally, as shown in FIGS. 3 (a) and 3 (b), for example, a conventional film spacer has a hemispherical projection 6 provided on both ends of the film spacer 5 by embossing or the like. Then, as shown in FIG. 4, the film spacer 5 was superposed on the film circuit board 7 and wound around the reel to prevent the adhesion of the resist in the resist coating process and the lead bending after the etching process.

[0003]

[Problems to be solved by the device]

 However, with conventional film spacers, when the films were stacked and wound on a reel, the hemispherical projections applied a load to the film, causing deformation of the film. Further, in the conventional film spacer, in order to widen the gap between the films, it is necessary to process the height of the protrusion by the required amount, which causes problems in workability and strength. Further, as the projections become larger, there is a problem in that the projections become an obstacle during drying after application of the resist and the hot air flow is poor and the heat treatment becomes uneven.

Accordingly, an object of the present invention is to prevent the film circuit board from being deformed by the film spacer, to improve the flow of hot air during drying, and to provide a film spacer having excellent processability and strength. .

[0005]

[Means for Solving the Problems]

 Therefore, the film spacer according to the present invention is characterized in that wavy protrusions are formed on both ends of the film spacer so that the contact portions of the film circuit board and the film spacer are linear so that they are linear.

[0006]

[Action]

 An embodiment of the present invention will be described in detail below with reference to the drawings. FIG. 1 shows a film spacer according to the present invention, and FIG. 2 shows a cross-sectional view of the film spacer wound around a reel together with a film circuit board. Wavy projections 2 are provided on both edges of the film spacer 1. As shown in FIG. 2, the protrusion has a shape such that the contact portion between the film spacer 1 and the film circuit board 3 is linear, for example, triangular. Further, the side surface portion 4 of the protrusion 2 is in an open state. Since the film spacer 1 of the present invention and the film circuit board 2 are in linear contact, the film circuit board 2 is in contact with the film circuit board 2 in comparison with the conventional film spacer having a hemispherical protrusion. The applied load is more dispersed and the deformation of the film can be reduced. Further, by forming the protrusions alternately on the front and back sides, the height of the protrusions due to embossing or the like can be half the required film gap, which is advantageous in terms of processability and the strength of the protrusions. It can also be used when there is a step of simultaneous resist coating on the front and back surfaces, such as a single-layer TAB tape, and it is necessary to prevent the resist layers on the front and back surfaces of the tape from contacting the spacers. Furthermore, since hot air passes through the open side surfaces on both the front and back sides, the resist layer dries faster and unevenness is less likely to occur.

[0007]

[Effect of device]

 By using the film spacer provided with the wavy continuous protrusions alternately on the front and back sides according to the present invention, it is possible to prevent the deformation of the film circuit board and reduce the heat treatment unevenness.

[Brief description of drawings]

FIG. 1 is a schematic view showing an example of a film spacer according to the present invention.

FIG. 2 is a cross-sectional view of a film spacer according to the present invention wound around a reel together with a film circuit board.

3A is a view showing a conventional example, and FIG. 3B is a cross-sectional view of a hemispherical projection portion thereof.

FIG. 4 is a schematic view of a conventional film spacer wound around a reel together with a film circuit board.

[Explanation of symbols]

 1 Film Spacer 2 Protrusion 3 Film Circuit Board 4 Side of Protrusion 5 Film Spacer 6 Hemispherical Protrusion

Claims (1)

[Scope of utility model registration request] 1. In the process of manufacturing a film circuit board,
A film circuit, which is a spacer that forms a gap between films when the film circuit board is wound around a reel, and is characterized in that protrusions having a wavy cross-section are alternately formed on both edges of the film spacer. Film spacer for substrates.