JPH0780348B2 - Heat resistant thermal transfer foil - Google Patents
Heat resistant thermal transfer foilInfo
- Publication number
- JPH0780348B2 JPH0780348B2 JP61262553A JP26255386A JPH0780348B2 JP H0780348 B2 JPH0780348 B2 JP H0780348B2 JP 61262553 A JP61262553 A JP 61262553A JP 26255386 A JP26255386 A JP 26255386A JP H0780348 B2 JPH0780348 B2 JP H0780348B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- layer
- transfer foil
- resistant
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011888 foil Substances 0.000 title claims description 29
- 229920000642 polymer Polymers 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 19
- 238000006116 polymerization reaction Methods 0.000 claims description 15
- 238000001465 metallisation Methods 0.000 claims description 7
- 238000001771 vacuum deposition Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 68
- 229920005989 resin Polymers 0.000 description 32
- 239000011347 resin Substances 0.000 description 32
- 239000010408 film Substances 0.000 description 15
- 238000007740 vapor deposition Methods 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 230000001681 protective effect Effects 0.000 description 11
- 239000011241 protective layer Substances 0.000 description 10
- 239000012790 adhesive layer Substances 0.000 description 9
- -1 polyethylene terephthalate Polymers 0.000 description 8
- 238000000576 coating method Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000002932 luster Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- OOLUVSIJOMLOCB-UHFFFAOYSA-N 1633-22-3 Chemical compound C1CC(C=C2)=CC=C2CCC2=CC=C1C=C2 OOLUVSIJOMLOCB-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 229920000298 Cellophane Polymers 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229920002301 cellulose acetate Polymers 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000011086 glassine Substances 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229920001059 synthetic polymer Polymers 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- HGAZMNJKRQFZKS-UHFFFAOYSA-N chloroethene;ethenyl acetate Chemical compound ClC=C.CC(=O)OC=C HGAZMNJKRQFZKS-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000005243 fluidization Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 150000002688 maleic acid derivatives Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/382—Contact thermal transfer or sublimation processes
- B41M5/38207—Contact thermal transfer or sublimation processes characterised by aspects not provided for in groups B41M5/385 - B41M5/395
- B41M5/38214—Structural details, e.g. multilayer systems
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
- Duplication Or Marking (AREA)
Description
【発明の詳細な説明】 ［技術分野］ 本発明は、金属蒸着感熱転写箔に関し、紙、セロハン
紙、グラシン紙、プラスチック、セラミックス、ガラス
等の表面に各種図柄、文字、記号などを金属光沢豊かに
転写法により表現するのに用いるの耐熱性を飛躍的に向
上させると共にクラックの生じない耐熱性感熱転写箔に
関するものである。Description: TECHNICAL FIELD The present invention relates to a metal-deposited heat-sensitive transfer foil, which has various metallic patterns such as paper, cellophane paper, glassine paper, plastic, ceramics, glass, etc. with a rich metallic luster. The present invention relates to a heat-resistant heat-sensitive transfer foil which is dramatically improved in heat resistance and used in expressing by a transfer method and which does not cause cracks.
［従来の技術］ 従来より、転写箔の耐熱性を上げるために保護層として
熱硬化型焼付樹脂層や２駅硬化型樹脂層などが採用され
ている。しかし、ベースフイルムがポリエチレンテレフ
タレートフイルムなどの熱可塑性合成高分子フイルムの
為、自づと加熱限界があり完全なものは得られなかっ
た。また、無理をして硬化したものに付いては、硬過ぎ
て熱転写時にクラックなどの発生がみられ、柔軟性のあ
る且つ耐熱性の高い保護層は得られなかった。[Prior Art] Conventionally, a thermosetting baking resin layer, a two-station curing resin layer, or the like has been used as a protective layer in order to improve the heat resistance of a transfer foil. However, since the base film is a thermoplastic synthetic polymer film such as polyethylene terephthalate film, there is a heating limit by itself, and a perfect film cannot be obtained. In addition, the hardened and hardened material was too hard and cracks and the like were observed during thermal transfer, and a flexible and highly heat resistant protective layer could not be obtained.
［発明の目的］ 本発明は上記従来の問題点に鑑み、極めて良好な柔軟
性、耐クラック性などを有し、かつ熱転写時の耐熱性が
飛躍的に向上し、結果的には接着性も向上した耐熱性感
熱転写箔を提供することにある。[Object of the Invention] In view of the above-mentioned conventional problems, the present invention has extremely good flexibility, crack resistance and the like, and the heat resistance at the time of thermal transfer is dramatically improved, and as a result, the adhesiveness is also improved. It is to provide an improved heat-resistant heat-sensitive transfer foil.
［発明の構成］ 即ち本発明は、例えばベースフイルムの面上に要すれば
離型層、保護層、金属蒸着層、接着剤層を順次形成した
従来公知の金属蒸着感熱転写箔に於て、該金属蒸着層の
片面または両面に耐熱性高分子層を設けたことを特徴と
する耐熱性感熱転写箔で、該耐熱性高分子層が真空蒸着
重合法またはプラズマ重合法によって形成され、かつ該
耐熱性高分子層の厚さが50〜1000nmであることを特徴と
する耐熱性感熱転写箔に関するものである。[Structure of the Invention] That is, the present invention provides a conventionally known metal-deposited heat-sensitive transfer foil in which, for example, a release layer, a protective layer, a metal deposition layer, and an adhesive layer are sequentially formed on the surface of a base film. A heat-resistant heat-sensitive transfer foil, characterized in that a heat-resistant polymer layer is provided on one side or both sides of the metal vapor deposition layer, wherein the heat-resistant polymer layer is formed by a vacuum vapor deposition polymerization method or a plasma polymerization method, and The present invention relates to a heat-resistant heat-sensitive transfer foil, characterized in that the thickness of the conductive polymer layer is 50 to 1000 nm.
即ち本発明の耐熱性感熱転写箔においては、従来の保護
層として熱硬化型焼付樹脂層や２液硬化型樹脂層を用い
ると，熱可塑性合成高分子ベースフイルムの耐熱性から
自づと加熱限界があり完全な耐熱性を有しかつ硬過ぎず
熱転写時にクラックなどが発生しない柔軟性の有る保護
層が得られなかったという欠点を、少なくとも保護層と
してまたは別に耐熱性高分子層を設け、かつ該耐熱性高
分子層が真空蒸着重合法またはプラズマ重合法によって
形成され、かつ該耐熱性高分子層の厚さが50〜1000nmで
あるごとき耐熱性高分子層を用いることにより上述従来
品にあった完全な耐熱性を有しかつ硬過ぎず熱転写時に
クラックなどが発生しない柔軟性の有る保護層が得られ
ないという諸欠点を解消した極めて良好な柔軟性、耐ク
ラック性などを有し、かつ熱転写時の耐熱性が飛躍的に
向上し、結果的には接着性も向上した耐熱性感熱転写箔
を完成したものである。That is, in the heat-resistant heat-sensitive transfer foil of the present invention, when a thermosetting baking resin layer or a two-component curing resin layer is used as the conventional protective layer, the heat resistance of the thermoplastic synthetic polymer base film causes a heating limit. There is a drawback that a flexible protective layer which has complete heat resistance and is not too hard and does not generate cracks at the time of thermal transfer cannot be obtained, and at least a heat resistant polymer layer is provided as a protective layer, and The heat-resistant polymer layer is formed by a vacuum deposition polymerization method or a plasma polymerization method, and the heat-resistant polymer layer has a thickness of 50 to 1000 nm. It has extremely good flexibility and crack resistance, etc., which has perfect heat resistance and is not too hard and does not provide a flexible protective layer that does not cause cracks during thermal transfer. And heat resistance during heat transfer is significantly improved, resulting in has been completed the heat-sensitive transfer foil also improves adhesion.
即ち本発明は、ベースフイルム（１）の上に直接または
離型剤層（２）を介して、保護樹脂層（３）を設けるか
設けずして、厚さが50〜1000nmの真空蒸着重合法または
プラズマ重合法によって形成さた耐熱性高分子層（４）
設けるか設けずして、金属蒸着層（５）、厚さが50〜10
00nmの真空蒸着重合法またはプラズマ重合法によって形
成さた耐熱性高分子層（４′）を設けるか設けずして、
接着剤層（５）を順次形成し、必要に応じてさらにその
上に接着剤層（６）を設けてなることを特徴とする耐熱
性感熱転写箔を提供することを可能としたものである。That is, according to the present invention, the vacuum deposition layer having a thickness of 50 to 1000 nm is provided on the base film (1) directly or via the release agent layer (2) with or without the protective resin layer (3). Heat-resistant polymer layer formed by a conventional method or a plasma polymerization method (4)
With or without a metal vapor deposition layer (5), thickness 50-10
With or without the heat-resistant polymer layer (4 ') formed by the 00 nm vacuum vapor deposition polymerization method or plasma polymerization method,
It is possible to provide a heat-resistant heat-sensitive transfer foil characterized in that an adhesive layer (5) is sequentially formed and, if necessary, an adhesive layer (6) is further provided thereon.
なお、本発明においては、耐熱性高分子層（４）または
耐熱性高分子層（４′）の内何れかの一方は必ず設ける
ことが必要である。In the present invention, either the heat resistant polymer layer (4) or the heat resistant polymer layer (4 ') must be provided.
また保護層を省略して耐熱性高分子層（４）を1000nm程
度にお比較的厚い層としても良く、この場合には転写後
の表面の耐熱性に優れたものが得られる。Further, the protective layer may be omitted and the heat-resistant polymer layer (4) may be a relatively thick layer of about 1000 nm. In this case, a layer having excellent heat resistance on the surface after transfer can be obtained.
本発明の耐熱性感熱転写箔におけるベースフイルム
（１）としては充分な自己保持性を有するものであれば
何れも用いられるが、例えばポリエステル、ポリアミ
ド、ポリアミドイミド、ポリエチレン、ポリプロピレ
ン、セルロースアセテート、ポリカーボネート、ポリ塩
化ビニル、フッ素樹脂などの樹脂類またはセロハン紙、
グラシン紙などのフイルム状物またはシート状物、剥離
紙または剥離フイルムなどが適宜用いられる。特にベー
スフイルム（１）としては前記樹脂類のフイルム状物で
厚さが９〜50μｍ程度のものを用いるのが、皺や亀裂な
どのない耐熱性感熱転写箔の製造が連続的に大量生産出
来る点から好ましい。As the base film (1) in the heat-resistant heat-sensitive transfer foil of the present invention, any one can be used as long as it has sufficient self-holding property, and examples thereof include polyester, polyamide, polyamideimide, polyethylene, polypropylene, cellulose acetate, polycarbonate and poly. Resins such as vinyl chloride and fluororesin, or cellophane paper,
A film-like or sheet-like material such as glassine paper, release paper or release film, etc. are appropriately used. In particular, as the base film (1), a film-shaped material of the above-mentioned resins and having a thickness of about 9 to 50 μm is used, and it is possible to continuously mass-produce the heat-resistant heat-sensitive transfer foil without wrinkles or cracks. Is preferred.
尚、ベースフイルム（１）が保護樹脂層（３）や耐熱性
高分子層（４）との剥離性が良くない場合にはパラフィ
ンワックス、シリコーン、フッ素樹脂、界面活性剤など
を塗布して離型剤層（２）を形成して於てもよい。If the base film (1) does not have good releasability from the protective resin layer (3) or the heat-resistant polymer layer (4), a paraffin wax, silicone, fluororesin, surfactant or the like may be applied to release the base film (1). The mold agent layer (2) may be formed.
本発明の耐熱性感熱転写箔において、耐熱性感熱転写箔
を構成する金属蒸着層（５）自体は機械的強度が弱く摩
擦による損傷などを受けやすいので、金属蒸着層（５）
の面上に保護樹脂層を設けるようにしてもよい。保護樹
脂層の厚さは特に制限は無いが通常0.5〜２μｍの範囲
から適宜選ばれる。In the heat-resistant heat-sensitive transfer foil of the present invention, the metal vapor-deposited layer (5) itself constituting the heat-resistant heat-sensitive transfer foil has weak mechanical strength and is easily damaged by friction.
You may make it provide a protective resin layer on the surface. The thickness of the protective resin layer is not particularly limited, but is usually appropriately selected from the range of 0.5 to 2 μm.
かかる保護樹脂層を形成するための樹脂としては、例え
ば熱可塑性樹脂、熱硬化性樹脂、電子線硬化性樹脂、紫
外線硬化性樹脂の何れもが用いられ、例えばアクリル系
樹脂、スチレン系樹脂、アクリル−スチレン共重合体、
塩化ビニル系樹脂、酢酸ビニル系樹脂、塩化ビニル−酢
酸ビニル共重合体、ポリビニルブチラール、ポリカーボ
ネート、ニトロセルロース、セルロースアセテート、ウ
レタン系樹脂、尿素系樹脂、メラミン系樹脂、尿素−メ
ラミン系樹脂、エポキシ系樹脂、アルキッド系樹脂、ア
ミノアルキッド系樹脂、ロジン変性マレイン酸樹脂など
の単独または混合物が好ましく用いられる。As the resin for forming such a protective resin layer, for example, any of a thermoplastic resin, a thermosetting resin, an electron beam curable resin, and an ultraviolet curable resin is used. For example, an acrylic resin, a styrene resin, an acrylic resin. -Styrene copolymer,
Vinyl chloride resin, vinyl acetate resin, vinyl chloride-vinyl acetate copolymer, polyvinyl butyral, polycarbonate, nitrocellulose, cellulose acetate, urethane resin, urea resin, melamine resin, urea-melamine resin, epoxy resin Resins, alkyd resins, aminoalkyd resins, rosin-modified maleic acid resins and the like are preferably used alone or in a mixture.
保護樹脂層の形成は、前記保護樹脂層を形成するための
樹脂の有機溶剤溶液、水溶液などをロールコーティング
法、グラビアコーティング法、リバースコーティング
法、スプレイコーティング法などの通常のコーティング
法により塗布し、乾燥（熱硬化性樹脂、電子線硬化性樹
脂、紫外線硬化性樹脂などの場合は硬化）することによ
って行われる。The formation of the protective resin layer, an organic solvent solution of the resin for forming the protective resin layer, an aqueous solution or the like is applied by a usual coating method such as a roll coating method, a gravure coating method, a reverse coating method, a spray coating method, It is performed by drying (curing in the case of a thermosetting resin, an electron beam curable resin, an ultraviolet curable resin, etc.).
保護樹脂層はそれが透明または半透明である限りに於て
染料または顔料などの着色料で着色してもよい。The protective resin layer may be colored with a coloring agent such as a dye or a pigment as long as it is transparent or translucent.
本発明の耐熱性感熱転写箔における耐熱高分子重合層
（４）（４′）を構成する耐熱性高分子としては保護樹
脂層（３）、金属蒸着層（５）等に対して密着性に優れ
るものであること、および比較的低温（例えば150℃以
下）で薄膜形成することが出来るものが要求される。か
かる特性を満足する耐熱高分子重合層を真空蒸着重合法
またはプラズマ重合法によって形成するに適したモノマ
ーとしては、例えば二無水ピロメリット酸および４−４
ジアミノジフェニールエーテルの組合せ、２−２パラシ
クロファンなどを挙げることができる。The heat-resistant polymer constituting the heat-resistant polymer layer (4) (4 ') in the heat-resistant heat-sensitive transfer foil of the present invention has excellent adhesion to the protective resin layer (3), the metal deposition layer (5), etc. What is required is a material capable of forming a thin film at a relatively low temperature (for example, 150 ° C. or lower). Suitable monomers for forming the heat-resistant polymer layer satisfying such characteristics by vacuum vapor deposition polymerization method or plasma polymerization method include, for example, pyromellitic dianhydride and 4-4.
A combination of diaminodiphenyl ethers, 2-2 paracyclophane and the like can be mentioned.
耐熱高分子重合層（４）（４′）は常法により例えば真
空蒸着重合法やプラズマ重合法により形成される。耐熱
高分子重合層（４）（４′）の厚さは通常50〜1000nmの
範囲、より好ましくは100〜300nmの範囲から選ばれる。
厚さが50nm未満では金属蒸着層（５）表面を完全に被覆
する事が出来ず、耐熱効果が不充分であり、耐熱高分子
重合層（４）（４′）を設けた意味がなく、一方1000nm
を越えると耐熱高分子重合層（４）（４′）が厚すぎて
風合いを損ない、また経済的でなく非能率的である。The heat resistant polymer layer (4) (4 ') is formed by a conventional method such as a vacuum vapor deposition polymerization method or a plasma polymerization method. The thickness of the heat-resistant polymer layer (4) (4 ') is usually selected in the range of 50 to 1000 nm, more preferably 100 to 300 nm.
If the thickness is less than 50 nm, the surface of the vapor-deposited metal layer (5) cannot be completely covered, the heat resistance effect is insufficient, and it is meaningless to provide the heat resistant polymer layer (4) (4 '). Meanwhile 1000 nm
If it exceeds, the heat-resistant polymer layers (4) and (4 ') are too thick and the texture is impaired, and it is not economical and inefficient.
本発明の耐熱性感熱転写箔における金属蒸着層（５）は
真空蒸着法、スパッタリング法、イオンプレーティング
法等の通常の金属など（合金および混合物も含む、以下
同様）の薄膜形成方法によって形成された金属蒸着層の
全てを包含する。The metal vapor deposition layer (5) in the heat resistant heat-sensitive transfer foil of the present invention is formed by a thin film forming method such as a vacuum vapor deposition method, a sputtering method, an ion plating method or the like (including alloys and mixtures, the same applies hereinafter). Includes all of the metallized layers.
本発明において金属蒸着層（５）は通常20〜100nmの範
囲、好ましくは30〜60nmの範囲から選ばれる。金属蒸着
層（５）の厚さが20nm未満では金属蒸着層（５）の光線
反射性が充分でなく、充分な金属光沢が得られず好まし
くない。一方100nmを越えても金属蒸着層（５）の光線
反射性はかわらないので金属光沢に関係せず経済性の点
からも好ましくない。In the present invention, the metal vapor deposition layer (5) is usually selected in the range of 20 to 100 nm, preferably 30 to 60 nm. When the thickness of the metal vapor deposition layer (5) is less than 20 nm, the light vapor reflectivity of the metal vapor deposition layer (5) is not sufficient and a sufficient metallic luster cannot be obtained, which is not preferable. On the other hand, if the thickness exceeds 100 nm, the light-reflecting property of the metal vapor deposition layer (5) does not change, so that it is not related to the metallic luster and is not preferable in terms of economy.
かかる金属蒸着層（５）を形成する金属としては例え
ば、アルミニウム、銅、金、銀、白金、亜鉛、錫、ニッ
ケル、チタン、クロム、インジウム、ガリウム、タンタ
ル、珪素などが用いられ、光線反射率と経済性の点から
通常はアルミニウムが好ましい。Examples of the metal that forms the metal vapor deposition layer (5) include aluminum, copper, gold, silver, platinum, zinc, tin, nickel, titanium, chromium, indium, gallium, tantalum, and silicon. From the viewpoint of economy, aluminum is usually preferable.
本発明の耐熱性感熱転写箔における接着剤層（６）とし
ては、被転写物に対して接着性が優れている事はもとよ
り前記金属蒸着層（５）および／または耐熱高分子重合
層（４′）に対しても接着性に優れていることが要求さ
れる。かかる要求を満たす接着剤としては、エチレン酢
酸ビニル系、塩素化ポリプロピレン系、塩化ビニル−酢
酸ビニル系、アクリル系、アクリル−塩化ビニル−酢酸
ビニル系などの溶剤型接着剤やエマルジョン接着剤の単
独またはブレンド物が好ましく用いられる。接着剤層
（６）の形成は前記接着剤層を形成する為の接着剤の有
機溶剤溶液や水溶液などをロールコーティング法、グラ
ビアコーティング法、リバースコーティング法、スプレ
イコーティング法などの通常のコーティングにより塗布
し、乾燥することによって行われる。接着剤層（６）の
厚さは通常0.5〜３μｍの範囲、より好ましくは0.8〜２
μｍの範囲から選ばれる。接着剤の厚さが0.5μｍ未満
では充分な転写強度が得られず好ましくない。一方３μ
ｍを越えると転写時に接着剤層の流動化にともない、被
転写体を汚すなどして好ましくない。The adhesive layer (6) in the heat-resistant heat-sensitive transfer foil of the present invention has excellent adhesiveness to the transferred material, as well as the metal deposition layer (5) and / or the heat-resistant polymer layer (4 ′). ) Is also required to have excellent adhesiveness. As an adhesive satisfying such requirements, ethylene vinyl acetate-based, chlorinated polypropylene-based, vinyl chloride-vinyl acetate-based, acrylic, acrylic-vinyl chloride-vinyl acetate-based solvent-based adhesives or emulsion adhesives alone or Blends are preferably used. The adhesive layer (6) is formed by applying an organic solvent solution or an aqueous solution of an adhesive for forming the adhesive layer by a usual coating method such as a roll coating method, a gravure coating method, a reverse coating method, a spray coating method or the like. And then dried. The thickness of the adhesive layer (6) is usually in the range of 0.5 to 3 μm, more preferably 0.8 to 2
It is selected from the range of μm. If the thickness of the adhesive is less than 0.5 μm, sufficient transfer strength cannot be obtained, which is not preferable. On the other hand, 3μ
When it exceeds m, it is not preferable because the transfer target is soiled due to fluidization of the adhesive layer during transfer.
つぎに実施例をあげて本発明を説明する。Next, the present invention will be described with reference to examples.
［実施例］ 実施例１ 厚さ25μｍのポリエチレンテレフタレートフイルムにポ
リエチレンワックスを極薄に塗布し離型層を設けた。次
いで保護樹脂層としてアクリルポリオール系樹脂を５μ
ｍの厚さに塗布形成した。更に２−２パラシクロファン
を５×10-6Torrの真空下で厚さ300nmに蒸着し、更に180
℃×1minの真空中加熱処理を行ない耐熱高分子重合層を
設けた。次いで更に純クロムを１×10-5Torrの真空下で
厚さ40nmに蒸着し金属蒸着層を設けた。次いで更にまた
２−２パラシクロファンを５×10-6Torrの真空下で厚さ
300nmに蒸着し、更に180℃×1minの真空中加熱処理を行
ない耐熱高分子重合層を設けた。次いで更に塩化ビニル
−酢酸ビニル−アクリル混合物系のホットメルト接着剤
を厚さ２μｍに塗布して本発明の耐熱性感熱転写箔を得
た。[Example] Example 1 A polyethylene terephthalate film having a thickness of 25 µm was coated with polyethylene wax extremely thinly to form a release layer. Next, 5μ of acrylic polyol resin is used as a protective resin layer.
The coating was formed to a thickness of m. Further, 2-2 paracyclophane was vapor-deposited to a thickness of 300 nm under a vacuum of 5 × 10 -6 Torr, and further 180
A heat-resistant polymer layer was provided by performing heat treatment in vacuum at ℃ × 1 min. Then, pure chromium was further vapor-deposited to a thickness of 40 nm under a vacuum of 1 × 10 −5 Torr to form a metal vapor-deposited layer. Then add 2-2 paracyclophane under a vacuum of 5 × 10 -6 Torr again.
It was vapor-deposited to a thickness of 300 nm and further heat-treated in vacuum at 180 ° C. for 1 min to form a heat-resistant polymer layer. Then, a vinyl chloride-vinyl acetate-acrylic mixture hot-melt adhesive was further applied to a thickness of 2 μm to obtain a heat-resistant heat-sensitive transfer foil of the present invention.
比較例１ 耐熱高分子層を省略した他は上記実施例１と同様にして
の従来タイプの感熱転写箔を得た。Comparative Example 1 A conventional type thermal transfer foil was obtained in the same manner as in Example 1 except that the heat resistant polymer layer was omitted.
［発明の効果］ 従来の感熱転写箔で、耐熱不良と称するものは、転写時
の熱により金属蒸着層の下の層、例えばベースフイルム
や保護層、中でも特に保護層が一部流動状態になり、そ
れにつれて、金属蒸着層も動く為に光沢が消失すること
をいう。本発明では金属蒸着層の片面または両面に直に
真空蒸着重合法またはプラズマ重合法で耐熱性高分子層
を強固に設けたので、ベースフイルムや保護層の転写時
の熱による流動の影響を金属蒸着層が受けるのを防止出
来たので耐熱性感熱転写箔の耐熱性を飛躍的に向上する
ことが出来たものである。[Advantages of the Invention] In the conventional thermal transfer foil, which is referred to as heat-resistant defect, the layer under the metal deposition layer, for example, the base film or the protective layer, in particular, the protective layer is partially fluidized due to the heat at the time of transfer. , Along with that, the gloss disappears because the metal deposition layer also moves. In the present invention, the heat-resistant polymer layer is firmly provided directly on one side or both sides of the metal vapor deposition layer by the vacuum vapor deposition polymerization method or the plasma polymerization method. Since it was possible to prevent the vapor-deposited layer from receiving, it was possible to dramatically improve the heat resistance of the heat resistant heat-sensitive transfer foil.
実施例１および比較例１で得られた転写箔を用いて自動
車用外層部品に230℃×60sec.転写条件で転写した。The transfer foils obtained in Example 1 and Comparative Example 1 were used to transfer to outer layer parts for automobiles at 230 ° C. × 60 sec.
その結果実施例１の本発明の耐熱性感熱転写箔を用いた
ものには焼けや金属光沢ぼけは認められなかった。また
ABS樹脂との同時成形にも使用したが光沢に変化は全く
認められなかった。As a result, no burn or metallic luster was observed in the heat-resistant heat-sensitive transfer foil of Example 1 of the present invention. Also
It was also used for simultaneous molding with ABS resin, but no change in gloss was observed.
一方比較例１の従来の感熱転写箔を用いて実施例１と同
様のテストを行ったが金属光沢は見る影もなく灰褐色に
変色していた。On the other hand, the same test as in Example 1 was conducted using the conventional thermal transfer foil of Comparative Example 1, but the metallic luster was discolored to grayish brown without any visible shadow.
第１図は本発明の耐熱性感熱転写箔の部分拡大断面図で
ある。 （１）：ベースフイルム （２）：離型剤層 （３）：保護樹脂層 （４）（４′）：耐熱性高分子層 （５）：金属蒸着法 （６）：接着剤層FIG. 1 is a partially enlarged sectional view of a heat resistant heat-sensitive transfer foil of the present invention. (1): Base film (2): Release agent layer (3): Protective resin layer (4) (4 '): Heat resistant polymer layer (5): Metal deposition method (6): Adhesive layer
Claims (2)
の片面または両面に真空蒸着重合法またはプラズマ重合
法によって形成された耐熱性高分子層を設けたことを特
徴とする耐熱性感熱転写箔。1. A heat-resistant heat-sensitive transfer foil comprising a metal-deposited heat-sensitive transfer foil, wherein a heat-resistant polymer layer formed by a vacuum deposition polymerization method or a plasma polymerization method is provided on one side or both sides of the metal deposition layer.
特許請求の範囲第１項記載の耐熱性感熱転写箔。2. The heat-resistant heat-sensitive transfer foil according to claim 1, wherein the heat-resistant polymer layer has a thickness of 50 to 1000 nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61262553A JPH0780348B2 (en) | 1986-11-04 | 1986-11-04 | Heat resistant thermal transfer foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61262553A JPH0780348B2 (en) | 1986-11-04 | 1986-11-04 | Heat resistant thermal transfer foil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63115781A JPS63115781A (en) | 1988-05-20 |
| JPH0780348B2 true JPH0780348B2 (en) | 1995-08-30 |
Family
ID=17377403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61262553A Expired - Lifetime JPH0780348B2 (en) | 1986-11-04 | 1986-11-04 | Heat resistant thermal transfer foil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0780348B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2585829B2 (en) * | 1990-03-15 | 1997-02-26 | 尾池工業株式会社 | Thermal transfer ribbon and method for decorating character pattern formed using the same |
| JP4080077B2 (en) * | 1998-11-19 | 2008-04-23 | フジコピアン株式会社 | Method for forming metallic gloss image |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5914150A (en) * | 1982-07-15 | 1984-01-25 | Canon Inc | Optical recording medium |
| JPS58203088A (en) * | 1982-05-24 | 1983-11-26 | Toppan Printing Co Ltd | Sublimation transfer printing method |
| JPS6033031U (en) * | 1983-08-10 | 1985-03-06 | 木口 和夫 | Cans that can store multiple types of contents separately |
-
1986
- 1986-11-04 JP JP61262553A patent/JPH0780348B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63115781A (en) | 1988-05-20 |
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