JPH0786330A - Semiconductor device and semiconductor device mounting method - Google Patents

Abstract

(57) [Abstract] An object of the present invention is to provide a plurality of first joint portions on a mounting surface, and to arrange each of the first joint portions on a predetermined surface of a substrate. The reliability of the semiconductor device mounted on the substrate is improved by bonding the bonding portion with a predetermined bonding means. A first bonding portion arranged so as to be distributed over the entire mounting surface of a semiconductor chip is provided, and each first bonding portion is bonded to a corresponding second bonding portion of a substrate. By doing so, it is possible to realize the semiconductor device and the mounting method of the semiconductor device, which can suppress the distortion of the semiconductor chip due to the temperature change or the like and thus improve the reliability.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device and a method for mounting the semiconductor device, and is suitable for application to, for example, a flip-chip type IC chip (hereinafter referred to as an IC flip-chip) and a mounting method for the IC flip-chip. is there.

[0002]

2. Description of the Related Art As shown in FIG. 5 and FIG.
In an IC flip chip mounting substrate 3 in which the IC flip chip 2 is mounted on each of the IC flip chips 2, a plurality of joint portions 2A provided on the lower surface of the IC flip chip 2 (hereinafter referred to as the mounting surface),
Corresponding to this, it is formed by joining the joining portions 1A respectively provided on the predetermined surfaces of the substrate 1 with the joining material 4 such as bumps. In this case
In the IC flip chip 2, as shown in FIG. 7, the joint portions 2A are provided so as to be lined up along each side of the mounting surface, and accordingly, are joined to the substrate 1 at the peripheral portion of the mounting surface.

[0003]

However, in this type of IC flip chip mounting substrate 3, since the IC flip chip 2 is directly bonded onto the substrate 1 via the bonding material 4, the IC flip chip 2 and the substrate 1 are bonded together. Due to the difference in the thermal expansion coefficient between the IC chip and the IC chip, stress or strain may occur in the IC flip chip 2, the substrate 1 and the bonding material 4, and as a result, the IC flip chip 2 and the bonding material 4 may be destroyed. . In this case, the magnitude of the distortion of the IC flip chip 2 caused between the arbitrary first and second bonding materials 4 due to the temperature change depends on the position of the first bonding member 4 from the position where the second bonding material 4 is attached. The longer the distance to the position where 4 is attached (hereinafter referred to as the inter-bonding material distance), the larger the distance.

Therefore, in the IC flip chip 2 of this type, the larger the chip 2, the larger the distance between the respective bonding materials, so that the distortion generated in the IC flip chip 2 also increases, and as a result, the chip 2 and the bonding material 4 are easily broken. Therefore, there is a problem that the reliability of the IC flip chip 2 with respect to the temperature change is lowered.

The present invention has been made in consideration of the above points, and is intended to propose a semiconductor device capable of improving reliability and a method of mounting the semiconductor device.

[0006]

In order to solve such a problem, in the present invention, a plurality of first joint portions 11 are mounted on the mounting surface.
Are provided respectively, and each first joint portion 11 is provided with a corresponding second joint portion 1 provided on a predetermined surface of the substrate 12.
In the semiconductor device mounted on the substrate 12 so as to be bonded to the substrate 3 using a predetermined bonding means 14, the semiconductor chip 1
The first joint portions 11 arranged so as to be distributed over the entire mounting surfaces of 0 and 20 are provided.

In the present invention, a plurality of first joint portions 11 are provided on the mounting surface, and each first joint portion 1 is provided.
In the mounting method of the semiconductor device, 1 is mounted on the substrate 12 so as to be bonded to the corresponding second bonding portions 13 provided on the predetermined surface of the substrate 12 by using the predetermined bonding means 14. The joint portion 11 is connected to the semiconductor chips 10 and 20.
It is arranged so that it is distributed over the entire mounting surface of
Each of the joint portions 11 is joined to the second joint portion 13 of the substrate 12 via the joining means 14.

Further, in the present invention, each first joint portion 11 is arranged along the diagonal line of the predetermined surface from the central portion of the mounting surface of the semiconductor chip 10.

Further, in the present invention, each first joint portion 11 is arranged along the straight line which is perpendicular to each end side of the predetermined surface from the central portion of the mounting surface of the semiconductor device 20.

[0010]

By providing the first joint portions 11 arranged so as to be distributed over the entire mounting surfaces of the semiconductor chips 10 and 20, the distance between the first joint portions 11 is suppressed to be small. Therefore, it is possible to suppress the distortion of the semiconductor chips 10 and 20 due to the temperature change and the like.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

In FIG. 1, reference numeral 10 indicates an IC chip as a whole, and a plurality of electrodes and dummy electrodes (hereinafter collectively referred to as electrodes 11) are linearly formed on the mounting surface so as to extend along respective diagonal lines from a central portion. Are provided in each. Therefore, as shown in FIG. 2, a plurality of lands 13 are provided on the pattern surface of the substrate 12 on which the IC flip chip 10 is mounted, in the same arrangement as the electrodes 11 of the IC flip chip 10.

As a result, in the IC flip chip 10, the electrodes 11 are connected to the substrate 12 via the bumps 14.
Are mounted on the substrate 12 by being bonded to the corresponding lands.

In the above-mentioned structure, in the IC flip chip mounting board, the magnitude of distortion of the IC flip chip 10 caused between any two joining materials is proportional to the distance between the joining materials.
In this case, in the conventional IC flip chip 2 as shown in FIGS. 5 to 7, it is clear from FIGS. 3 and 7 that the longest distance between the bonding materials is at the corners different from each other located on the same diagonal line. Between the two bonding materials 4A and 4B and 4C and 4D, respectively. Therefore, when the IC flip chip 2 is mounted on the substrate 1, it is between the two bonding materials 4A and 4B and 4C and 4D. The IC chip tip 2 has the largest distortion.

However, in the IC flip chip 10 of the embodiment, since the plurality of bumps 4 are arranged at the central portion of the mounting surface as described above, even if the distance between the bonding materials is the longest, the two bonding materials 4A described above are used. And 4B, and 4C and 4C and 4D are sufficiently shorter than the distance between the bonding materials, and accordingly, when the IC flip chip 10 is mounted on the substrate 12, the IC flip chip 10 caused by a temperature change caused by a temperature change or the like. In comparison with the conventional IC flip chip 2, the magnitude of the distortion can be reduced sufficiently in practical use.

According to the above configuration, the IC flip chip 1
By arranging a plurality of bumps 14 as bonding materials on the mounting surface of No. 0 so as to be along the respective diagonals, it is possible to suppress chip distortion due to temperature change as compared with the conventional IC flip chip 2. Therefore, it is possible to prevent the IC flip chip 10, the bump 14, etc. from being damaged due to a temperature change or the like, and thus improve the reliability of the IC flip chip.

Further, in this case, assuming that the number of electrodes 11 formed on the IC flip chip 10 is the same as the number of electrodes formed on the conventional IC flip chip 2, this embodiment has the same structure.
In the IC flip chip 10, since the distance between the adjacent electrodes 11 can be increased, the bump 14 used for bonding with the substrate 12 can be enlarged. As a result, the bumps 14 are less likely to be broken, so that the reliability of the IC flip chip 10 can be further improved.

Further, assuming that the pitch between the electrodes 11 in the IC flip chip 10 is the same as the pitch between the electrodes 11 of the conventional IC flip chip 2,
It is possible to form more input / output electrodes than the number of input / output electrodes that can be formed on the IC flip chip 2, thus improving the reliability of the IC flip chip.

In the above embodiment, the electrodes 11 of the IC flip chip 10 are sequentially formed along the respective diagonal lines as shown in FIG. 1, but the present invention is not limited to this. For example, as shown in FIG. 4, the electrodes 11 may be sequentially formed so as to connect the central portions of the respective sides of the mounting surface of the IC flip chip 20 that face each other. If the electrodes 11 are formed so that the distance between the bumps 14 does not become large, various other patterns can be applied as the arrangement pattern of the electrodes 11.

Further, in the above-described embodiment, the bumps 14 as means (bonding material) for bonding the IC flip chip 10 and the substrate 12 are formed on the mounting surface of the IC flip chip 10 along the respective diagonal lines. However, the present invention is not limited to this.
And the bonding material other than the bump 14 as a whole
A bump arrangement pattern as shown in FIG. 1 may be formed on the mounting surface of the IC flip chip 10.

In this case, the bonding material other than the bump 14 may bond the IC flip chip 10 and the substrate 12 at a position other than between the electrode 11 of the IC flip chip 10 and the land 13 of the substrate 12.

[0022]

As described above, according to the present invention, a plurality of first joint portions are provided on the mounting surface, and each of the first joint portions is provided on the predetermined surface of the substrate. Two
In a semiconductor device which is mounted on a substrate by bonding to the bonding portion of the semiconductor chip using a predetermined bonding means, a first bonding portion arranged so as to be distributed over the entire mounting surface of the semiconductor chip is provided. As a result, it is possible to realize the semiconductor device and the mounting method of the semiconductor device, which can suppress the distortion of the semiconductor chip due to the temperature change or the like and thus improve the reliability.

[Brief description of drawings]

FIG. 1 is a plan view showing an electrode formation pattern in an IC flip chip of an embodiment.

FIG. 2 is a plan view showing a land pattern of a substrate on which the IC flip chip shown in FIG. 1 is mounted.

FIG. 3 is a plan view for explaining a distance between joining materials.

FIG. 4 is a plan view showing another embodiment.

FIG. 5 is a perspective view showing a state in which a conventional IC flip chip is mounted on a substrate.

FIG. 6 is a side view showing a state in which an IC flip chip and a substrate are joined using a joining material.

FIG. 7 is a plan view showing a formation pattern of a joint portion formed in a conventional IC flip chip.

[Explanation of symbols]

1, 12 ... Substrate, 1A, 2A ... Joint, 2, 10,
20 ... IC flip chip, 3 ... IC flip chip mounting substrate, 4, 4A to 4D ... Bonding material, 11 ... Electrode, 1
3 ... Land, 14 ... Bump.

Claims (4)

[Claims] 1. A plurality of first joint portions are respectively provided on a mounting surface, and each of the first joint portions is joined to a corresponding second joint portion provided on a predetermined surface of a substrate by a predetermined joining means. A semiconductor device mounted on the substrate in such a manner as to be bonded by using the above-mentioned semiconductor chip, wherein the semiconductor device is provided with the first bonding portion arranged so as to be distributed over the entire surface of the mounting surface of the semiconductor chip. Semiconductor device. 2. A plurality of first joint portions are respectively provided on the mounting surface, and each of the first joint portions is joined to a corresponding second joint portion provided on a predetermined surface of the substrate by a predetermined joining means. In the method for mounting a semiconductor device, which is mounted on the substrate in such a manner as to be bonded to each other, the first bonding portion is arranged so as to be distributed over the entire mounting surface of the semiconductor chip, and each of the first 2. The method for mounting a semiconductor device, wherein each of the joint portions is joined to the second joint portion of the substrate via the joining means. 3. The semiconductor according to claim 1, wherein each of the first bonding portions is arranged along a diagonal line of the predetermined surface from a central portion of the mounting surface of the semiconductor chip. apparatus. 4. The first joint portions are arranged so as to extend along straight lines perpendicular to respective end sides of the predetermined surface from a central portion of the mounting surface of the semiconductor device. The semiconductor device according to claim 1.