JPH08190866A - Manufacture of insulating substrate - Google Patents
Manufacture of insulating substrateInfo
- Publication number
- JPH08190866A JPH08190866A JP7002302A JP230295A JPH08190866A JP H08190866 A JPH08190866 A JP H08190866A JP 7002302 A JP7002302 A JP 7002302A JP 230295 A JP230295 A JP 230295A JP H08190866 A JPH08190866 A JP H08190866A
- Authority
- JP
- Japan
- Prior art keywords
- ink
- manufacturing
- insulating substrate
- substrate
- original plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 219
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 84
- 238000007639 printing Methods 0.000 claims abstract description 114
- 238000005192 partition Methods 0.000 claims abstract description 52
- 238000000034 method Methods 0.000 claims abstract description 47
- 239000000463 material Substances 0.000 claims description 20
- 239000000126 substance Substances 0.000 claims description 20
- 239000002245 particle Substances 0.000 claims description 17
- 230000005291 magnetic effect Effects 0.000 claims description 12
- 239000004744 fabric Substances 0.000 claims description 7
- 239000010985 leather Substances 0.000 claims description 7
- 238000010304 firing Methods 0.000 claims description 3
- 239000005445 natural material Substances 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000003754 machining Methods 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 9
- 239000010410 layer Substances 0.000 description 8
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000005294 ferromagnetic effect Effects 0.000 description 6
- 239000003302 ferromagnetic material Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 238000007711 solidification Methods 0.000 description 6
- 230000008023 solidification Effects 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 102000004169 proteins and genes Human genes 0.000 description 2
- 108090000623 proteins and genes Proteins 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
Landscapes
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は絶縁性基板の製造方法に
関し、特に、印刷原版を用いて絶縁性基板の基板本体表
面に隔壁を形成する絶縁性基板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an insulating substrate, and more particularly to a method for manufacturing an insulating substrate in which partition walls are formed on the surface of the substrate body of the insulating substrate using a printing original plate.
【0002】[0002]
【従来の技術】絶縁性基板は、近年では、例えば、フラ
ットパネルディスプレイ(ここでは、LCD、EL、P
DP、VF等の総称として用いる。)やCRT(Cat
hode-ray tude)といった画像表示装置に
おいてその性能を左右するものとして特に重要な役割を
果たしている。前記PDP(プラズマパネルディスプレ
イ)は、絶縁性基板を発光部に使用したものであり、電
力の消費効率、小型化の容易性、画像のフリッカ、ジタ
ー、歪みが無いといった利点を有し、商用化に向けて研
究の対象になっている。2. Description of the Related Art In recent years, insulating substrates have been used, for example, in flat panel displays (here, LCD, EL, P.
Used as a generic term for DP, VF, etc. ) And CRT (Cat
In an image display device such as a hode-ray tude, it plays a particularly important role as a factor that influences its performance. The PDP (plasma panel display) uses an insulating substrate for a light emitting portion, and has advantages of power consumption efficiency, easy miniaturization, and no image flicker, jitter, or distortion, and is commercialized. Has been the subject of research towards.
【0003】このPDPの一般的構成は、図5に示すよ
うに、背面基板1上に一定間隔で互いに平行にワイヤ状
の陽電極2を複数配置し、これら各陽電極2と交差する
方向に一定間隔で互いに平行に板状の陰電極3を複数配
置したものである。前記背面基板1は、いわゆる背面ガ
ラスであって、上面(図中上側)に前記陽電極2を収納
する深さ100〜200μm程度の電極溝4が50μm
程度の幅で一定間隔で互いに平行に複数形成されてい
る。As shown in FIG. 5, the general structure of this PDP is such that a plurality of wire-like positive electrodes 2 are arranged on a rear substrate 1 at regular intervals in parallel with each other, and are arranged in a direction intersecting with the respective positive electrodes 2. A plurality of plate-shaped negative electrodes 3 are arranged parallel to each other at regular intervals. The rear substrate 1 is a so-called rear glass, and an electrode groove 4 having a depth of about 100 to 200 μm for accommodating the positive electrode 2 is 50 μm on the upper surface (upper side in the drawing).
A plurality of them are formed in parallel with each other at regular intervals with a certain width.
【0004】[0004]
【発明が解決しようとする課題】ところで、PDPにあ
っては、隣り合う陽電極2間の絶縁を保持しつつ前記陽
電極2および陰電極3を高密度に設置することにより高
品位の画像が形成可能であるため、特に陽電極2の設置
密度の向上のために電極溝4を高密度に形成するための
背面基板1の加工技術が求められている。By the way, in the PDP, a high-quality image can be obtained by installing the positive electrode 2 and the negative electrode 3 at a high density while maintaining the insulation between the adjacent positive electrodes 2. Since it can be formed, a processing technique for the rear substrate 1 for forming the electrode grooves 4 at a high density is required particularly for improving the installation density of the positive electrodes 2.
【0005】しかしながら、電極溝4の形成は、従来、
背面基板1表面にショットブラストや研磨等の加工を施
すことが一般的であり、電極溝4の形成密度を向上する
ことが困難であった。すなわち、ガラスが有する割れや
すい等の加工上の欠点のため、従来から前記加工法によ
るガラスの加工能率は低いものになっていた。したがっ
て、背面基板1の電極溝4の形成数を増大すれば、背面
基板1の製造能率の大幅な低下や製造コストの上昇を招
くことが懸念される。このため、低コストかつ製造能率
が向上する絶縁性基板の製造方法の開発が求められてい
た。However, the formation of the electrode groove 4 has been conventionally performed.
It is common to subject the surface of the back substrate 1 to processing such as shot blasting or polishing, and it is difficult to improve the formation density of the electrode grooves 4. That is, due to processing defects such as fragility of glass, the processing efficiency of glass by the above-described processing method has been conventionally low. Therefore, if the number of the electrode grooves 4 formed on the back substrate 1 is increased, there is a concern that the manufacturing efficiency of the back substrate 1 may be significantly reduced and the manufacturing cost may be increased. Therefore, there has been a demand for development of a method for manufacturing an insulating substrate that is low in cost and has improved manufacturing efficiency.
【0006】また、前記問題に鑑みて印刷技術を利用し
て背面基板1面上に陽電極2間を仕切る隔壁を形成する
ことも研究されているが、固化することにより隔壁とな
るインクの背面基板1における印刷時の厚さ寸法を確保
することが困難で、陽電極2同士間の遮蔽が不十分であ
り、前記問題の解決に至らないものになっていた。In view of the above problems, it has been studied to form a partition wall for partitioning the positive electrodes 2 on the surface of the rear substrate 1 by using a printing technique. However, when the partition wall is solidified, the back surface of the ink becomes a partition wall. It was difficult to secure the thickness dimension of the substrate 1 at the time of printing, and the shielding between the positive electrodes 2 was insufficient, so that the above problems could not be solved.
【0007】さらに、エッチングによって背面基板1に
溝を形成することにより隔壁を形成する技術も検討され
ているが、形成できる隔壁の高さは通常30μm程度で
あるのが現状であり、前記問題の解決に至らないものに
なっていた。Further, a technique of forming a partition wall by forming a groove in the rear substrate 1 by etching has been studied, but the height of the partition wall that can be formed is usually about 30 μm, which is a problem at present. It was something that could not be resolved.
【0008】隔壁の形成を要する絶縁性基板の前記PD
P以外の適用例においても、隔壁の突出寸法の確保が難
解な問題となっていた。一方、例えばCRTのシャドー
マスクのように、絶縁性基板に微細な穴を多数形成する
適用例においては、穴の形成能率が低いことに鑑みて逆
に絶縁性基板に印刷技術利用して被覆部分を形成する対
策が考えられるが、比較的広い面積に微細(前記シャド
ーマスクの場合、突出寸法10μm、幅20〜50μ
m、ピッチ140〜20μm程度)な被覆部分を形成す
ることは精度の確保が困難であり、また、半導体回路の
形成等に使用される写真技術を応用すればコストが大幅
に上昇するといった問題が生じる。The PD of the insulating substrate which requires formation of partition walls
Also in the application examples other than P, securing the protrusion size of the partition wall has been a difficult problem. On the other hand, in an application example in which a large number of fine holes are formed in an insulating substrate, such as a shadow mask of a CRT, on the contrary, in view of the low efficiency of forming holes, the insulating substrate is coated using a printing technique. Although it is possible to consider a countermeasure to form a small area, in a relatively wide area, in the case of the shadow mask, the projection size is 10 μm and the width is 20 to 50 μm.
m, pitch 140 to 20 μm), it is difficult to ensure accuracy, and if the photographic technology used for forming semiconductor circuits is applied, the cost will increase significantly. Occurs.
【0009】本発明は上記事情に鑑みてなされたもの
で、製造能率が向上し、しかも加工精度が容易に得られ
る低コストの絶縁性基板の製造方法を提供することを課
題としている。The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a low-cost method of manufacturing an insulating substrate which improves manufacturing efficiency and easily obtains processing accuracy.
【0010】[0010]
【課題を解決するための手段】上記課題を解決するた
め、本発明に係る絶縁性基板の製造方法では、形成すべ
き隔壁の平面形状をなすインク浸透部を有する印刷原版
を絶縁性基板の基板本体の表面に装着し、該印刷原版を
基板本体の裏側から磁力で吸着して基板本体表面に密接
させる第1の工程と、インクを前記印刷原版に擦り付け
ることにより前記インク浸透部を通じて前記基板本体に
印刷する第2の工程と、基板本体に印刷したインクを固
化させる第3の工程とを備えることを前記課題の解決手
段とした。In order to solve the above problems, in the method of manufacturing an insulating substrate according to the present invention, a printing original plate having an ink permeation portion having a planar shape of a partition wall to be formed is used as a substrate of the insulating substrate. A first step of mounting on the surface of the main body and adsorbing the printing original plate from the back side of the substrate main body by magnetic force to bring it into close contact with the surface of the substrate main body; and the substrate main body through the ink permeation section by rubbing ink on the printing original plate. The method for solving the above-mentioned problems is provided with a second step of printing on the substrate and a third step of solidifying the ink printed on the substrate body.
【0011】請求項2記載の絶縁性基板の製造方法で
は、第2の工程において、インクの擦り付けが印刷原版
表面を摺動するスクイージの往復動によりなされること
を前記課題の解決手段とした。In the method for manufacturing an insulating substrate according to a second aspect, in the second step, the rubbing of ink is performed by reciprocating movement of a squeegee that slides on the surface of the printing original plate.
【0012】請求項3記載の絶縁性基板の製造方法で
は、前記インクが基材中に電気絶縁性物質の粒子を分散
してなることを前記課題の解決手段とした。In the method for producing an insulating substrate according to a third aspect of the present invention, the ink is formed by dispersing particles of an electrically insulating substance in a base material.
【0013】請求項4記載の絶縁性基板の製造方法で
は、請求項3記載の絶縁性基板の製造方法であって、前
記粒子の前記基板本体との少なくとも一部が同材質であ
ることを前記課題の解決手段とした。According to a fourth aspect of the present invention, there is provided the method for producing an insulating substrate according to the third aspect, wherein at least a part of the particles of the substrate is made of the same material. It was used as a solution to the problem.
【0014】請求項5記載の絶縁性基板の製造方法で
は、請求項3記載の絶縁性基板の製造方法であって、前
記第3の工程が、インク中の粒子を基板と一体に焼成す
る工程であることを前記課題の解決手段とした。According to a fifth aspect of the present invention, there is provided a method for producing an insulating substrate according to the third aspect, wherein the third step is a step of firing particles in the ink integrally with the substrate. That is the means for solving the above problems.
【0015】請求項6記載の絶縁性基板の製造方法で
は、請求項1ないし4のいずれかに記載の絶縁性基板の
製造方法であって、前記第3の工程は、インクに遠赤外
線を照射する工程であることを前記課題の解決手段とし
た。A method for manufacturing an insulating substrate according to a sixth aspect is the method for manufacturing an insulating substrate according to any one of the first to fourth aspects, wherein in the third step, the ink is irradiated with far infrared rays. The above-mentioned steps are defined as means for solving the above-mentioned problems.
【0016】請求項7記載の絶縁性基板の製造方法で
は、前記インクは紫外線硬化性物質を含有し、前記第3
の工程は、インクに紫外線を照射して前記紫外線硬化性
物質を硬化させる工程であることを前記課題の解決手段
とした。In the method of manufacturing an insulating substrate according to claim 7, the ink contains an ultraviolet curable substance,
The above step is a step of irradiating the ink with ultraviolet rays to cure the ultraviolet curable substance, which is the means for solving the problems.
【0017】請求項8記載の絶縁性基板の製造方法で
は、前記インクは電気伝導性物質を含有し、前記第3の
工程は、溶融した前記電気伝導性物質を冷却して凝固さ
せる工程であることを前記課題の解決手段とした。In the method for manufacturing an insulating substrate according to claim 8, the ink contains an electrically conductive substance, and the third step is a step of cooling and solidifying the molten electrically conductive substance. This is the means for solving the above problems.
【0018】請求項9記載の絶縁性基板の製造方法で
は、基板本体へのインクの印刷完了後に、基板本体裏側
の磁力による吸着力を弱め、印刷原版本体をその裏側か
ら磁力で吸着して基板本体から離脱する第4の工程を備
えることを前記課題の解決手段とした。According to a ninth aspect of the present invention, in the method for producing an insulating substrate, after the completion of printing the ink on the substrate body, the attraction force due to the magnetic force on the back side of the substrate body is weakened and the printing original plate body is attracted by the magnetic force from the back side of the substrate. The provision of the fourth step of detaching from the main body was the means for solving the above-mentioned problems.
【0019】請求項10記載の絶縁性基板の製造方法で
は、請求項1ないし9のいずれかに記載の絶縁性基板の
製造方法における第3の工程において固化の完了したイ
ンクの上に、第1の工程および第2の工程によってイン
クを印刷する第5の工程を備えることを前記課題の解決
手段とした。According to a tenth aspect of the present invention, there is provided a method for producing an insulating substrate, wherein the first ink is solidified in the third step of the method for producing an insulating substrate according to any one of the first to ninth aspects. The above-mentioned step and the fifth step of printing the ink by the second step are provided as means for solving the above problems.
【0020】請求項11記載の絶縁性基板の製造方法で
は、請求項1ないし10のいずれかに記載の絶縁性基板
の製造方法であって、前記基板本体が天然素材からなる
布または皮革であることを前記課題の解決手段とした。The method for manufacturing an insulating substrate according to claim 11 is the method for manufacturing an insulating substrate according to any one of claims 1 to 10, wherein the substrate body is a cloth or leather made of a natural material. This is the means for solving the above problems.
【0021】[0021]
【作用】請求項1記載の絶縁性基板の製造方法によれ
ば、印刷原版を基板本体に吸着した状態で、印刷原版に
対するインクの擦り付けおよび基板本体へのインクの印
刷を行なうので、印刷原版と基板本体との間にずれが防
止され、基板本体へのインクの乗りや、インクの印刷位
置精度が確保される。基板本体に印刷されたインクは、
インク浸透部を型とする立体形状を形成し、固化される
ことにより基板本体表面に突設された状態になる。According to the method of manufacturing an insulating substrate according to claim 1, since the printing original plate is adsorbed on the substrate main body, the ink is rubbed against the printing original plate and the ink is printed on the substrate main body. Displacement between the substrate body and the substrate body is prevented, and the accuracy of the ink on the substrate body and the printing position accuracy of the ink are secured. The ink printed on the board body is
A three-dimensional shape with the ink permeation portion as a mold is formed and solidified to be in a state of being projected on the surface of the substrate body.
【0022】請求項2記載の絶縁性基板の製造方法によ
れば、印刷原版に対するスクイージの往復動により、基
板本体へのインクの印刷が確実になされる。また、印刷
原版が基板本体に圧接状態で面接触しているので、スク
イージの往復動の際に印刷原版と基板本体との間の面方
向のずれが防止される。According to the second aspect of the present invention, there is provided a method of manufacturing an insulating substrate, whereby the squeegee reciprocates relative to the printing original plate to reliably print the ink on the substrate body. Further, since the printing original plate is in surface-contact with the substrate main body in a pressure contact state, the displacement of the printing original plate and the substrate main body in the surface direction is prevented when the squeegee reciprocates.
【0023】請求項3記載の絶縁性基板の製造方法によ
れば、電気的絶縁性の隔壁が形成される。また、基板本
体が電気的絶縁性材料で形成されている場合には、隔壁
に基板本体と略同様の性質を持たせることができるとと
もに、隔壁と基板本体との間の一体化が確実になされ
る。According to the third aspect of the present invention, there is formed the electrically insulating partition wall. When the substrate body is made of an electrically insulating material, the partition wall can have substantially the same properties as the substrate body, and the integration between the partition wall and the substrate body is ensured. It
【0024】請求項4記載の絶縁性基板の製造方法によ
れば、隔壁と基板本体との各種性質が近いので、隔壁と
基板本体との一体化が確実になされるとともに、隔壁と
基板本体とが全体的に略一様な電気的、物理的性質を有
する絶縁性基板を形成することができる。According to the insulating substrate manufacturing method of the present invention, since the barrier ribs and the substrate body have similar properties, the barrier ribs and the substrate body are surely integrated with each other, and the barrier ribs and the substrate body are secured together. It is possible to form an insulating substrate having substantially uniform electrical and physical properties.
【0025】請求項5記載の絶縁性基板の製造方法によ
れば、基板本体に印刷したインクを焼くことにより、基
材を蒸発させてインク中の粒子からなる隔壁を焼成す
る。According to the manufacturing method of the insulating substrate of the fifth aspect, the ink printed on the substrate body is burned to evaporate the base material and burn the partition walls made of particles in the ink.
【0026】請求項6記載の絶縁性基板の製造方法によ
れば、遠赤外線の作用によって、インクの表層および内
部が均等に加熱・固化される。また、インクの加熱と同
時に基板本体も加熱されるので、インク内の成分と基板
本体とがインクの固化とともに一体化され、固化時間の
短縮も可能である。According to the method of manufacturing an insulating substrate of claim 6, the surface layer and the inside of the ink are uniformly heated and solidified by the action of far infrared rays. Further, since the substrate body is also heated at the same time as the ink is heated, the components in the ink and the substrate body are integrated with the solidification of the ink, and the solidification time can be shortened.
【0027】請求項7記載の絶縁性基板の製造方法によ
れば、紫外線硬化物質の硬化によってインクが固化され
るので、インクおよび基板本体の入熱が少なく、入熱や
冷却による歪みや変形等の心配が無い。According to the method for manufacturing an insulating substrate of claim 7, the ink is solidified by the curing of the ultraviolet curable substance, so that the heat input to the ink and the substrate body is small, and the distortion and deformation due to the heat input and cooling are caused. There is no worry.
【0028】請求項8記載の絶縁性基板の製造方法によ
れば、所定位置に印刷したインクを印刷時または印刷後
に加熱してインク内の電気伝導性物質を溶融し、第3の
工程において冷却凝固させる。According to the method of manufacturing an insulating substrate of claim 8, the ink printed at a predetermined position is heated at the time of printing or after printing to melt the electrically conductive substance in the ink, and then cooled in the third step. Solidify.
【0029】請求項9記載の絶縁性基板の製造方法によ
れば、基板本体へのインクの印刷の完了後に、基板本体
裏側の磁力の発生源で発生する磁力を弱めるか磁力の発
生源を基板本体から遠ざけて印刷原版に対する吸着力を
弱める。印刷原版の基板本体からの離脱は、印刷原版裏
面からの磁力による吸着なので、印刷原版の広い範囲に
わたって吸着力が作用し、印刷原版に歪み等を生じさせ
ることなく安定に離脱を行なうことができる。According to the method of manufacturing an insulating substrate of claim 9, after the printing of the ink on the substrate body is completed, the magnetic force generated by the magnetic source on the back side of the substrate body is weakened or the magnetic source is used as the substrate. Keep away from the main body to weaken the adsorption force to the printing original plate. Since the separation of the printing original plate from the substrate main body is caused by the magnetic force from the back surface of the printing original plate, the attraction force acts over a wide range of the printing original plate, and the printing original plate can be stably released without causing distortion or the like. .
【0030】請求項10記載の絶縁性基板の製造方法に
よれば、固化の完了したインク上にインクの印刷を再度
行なうことにより、より厚肉の隔壁を形成する。また、
第5の工程と第2の工程との間で異種のインクを使用す
れば、種々の性状の隔壁を形成することができる。According to the manufacturing method of the insulating substrate of the tenth aspect, a thicker partition wall is formed by printing the ink again on the solidified ink. Also,
By using different kinds of ink between the fifth step and the second step, it is possible to form partition walls of various properties.
【0031】請求項11記載の絶縁性基板の製造方法に
よれば、印刷原版と基板本体との密接力によって皮革や
布を挟持した状態でインクの印刷がなされる。According to the eleventh aspect of the manufacturing method of the insulating substrate, the ink is printed with the leather or the cloth being sandwiched by the contact force between the printing original plate and the substrate body.
【0032】[0032]
【実施例】以下、本発明に係る絶縁性基板の製造方法の
一実施例を図1から図3を参照して説明する。説明の便
宜上、図1、図2中上側を絶縁性基板(以下、「PDP
用背面基板」と略称する)の上側と称する。前記PDP
用背面基板は、基板本体10表面に印刷原版11を利用
した印刷技術を適用して多数の隔壁12が形成された構
成となっている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method of manufacturing an insulating substrate according to the present invention will be described below with reference to FIGS. For convenience of explanation, the upper side of FIGS. 1 and 2 is an insulating substrate (hereinafter, referred to as “PDP”).
(Abbreviated as “rear substrate”). The PDP
The rear substrate for use has a structure in which a large number of partition walls 12 are formed on the surface of the substrate body 10 by applying a printing technique using the printing original plate 11.
【0033】前記基板本体10は、ガラス製の板材であ
って、平坦な表面を有している。The substrate body 10 is a glass plate material and has a flat surface.
【0034】前記印刷原版11は、厚さ数100μm程
度の薄板材であって、前記基板本体10表面に形成すべ
き隔壁12形状をなす溝状のインク浸透部13がその厚
さ方向に貫通されている。印刷原版11としては、
(1)強磁性体粉を結合材中に分散固定して形成された
印刷原版11、あるいは(2)強磁性体からなる薄板に
インク浸透部13を形成した印刷原版11、などが使用
可能である。The printing original plate 11 is a thin plate material having a thickness of several 100 μm, and a groove-shaped ink permeation portion 13 having a partition wall 12 shape to be formed on the surface of the substrate body 10 is penetrated in the thickness direction. ing. As the printing original plate 11,
It is possible to use (1) a printing original plate 11 formed by dispersing and fixing ferromagnetic powder in a binder, or (2) a printing original plate 11 in which an ink permeation portion 13 is formed on a thin plate made of a ferromagnetic material. is there.
【0035】(1)強磁性体粉を結合材中に分散固定し
たものとしては、ナイロンやポリエステル等の合成繊
維、またはステンレス等の金属細線などで織ったメッシ
ュスクリーンの、印刷パターンをなすインク浸透部13
以外の部分に、強磁性体粉を添加した樹脂層を形成した
ものなどが使用可能である。この場合、前記樹脂層の形
成方法としては、周知のフォトレジストに強磁性体粉末
を添加したものを前記スクリーンに塗布し、これを印刷
パターンの反転形状に露光した後、不要な部分を除去し
てインク浸透部13を形成する方法が好適である。強磁
性体としては、鉄,コバルト,ニッケルまたはこれらの
合金、酸化物系磁性材料、化合物系磁性材料など、従来
周知の強磁性体はいずれも使用可能である。なお、樹脂
層のみにより十分な引っ張り強度を得ることができれ
ば、前記メッシュスクリーンを省いて、金属粉を添加し
た樹脂(いわゆるゴム磁石、プラスチック磁石を含む)
のみから印刷原版11を形成してもよい。その場合に
は、印刷原版11をエッチングまたは機械加工し、印刷
パターンをなす開口部(インク浸透部)を形成する。ま
た、メッシュスクリーンを強磁性体で形成してもよい。(1) As the one in which ferromagnetic powder is dispersed and fixed in a binder, ink permeation forming a printing pattern of a mesh screen woven with synthetic fibers such as nylon and polyester, or fine metal wires such as stainless steel Part 13
It is possible to use, for example, a resin layer to which ferromagnetic powder is added, which is formed in other portions. In this case, as a method for forming the resin layer, a well-known photoresist to which ferromagnetic powder is added is applied to the screen, and the screen is exposed to an inverted shape of a printing pattern, and then an unnecessary portion is removed. A method of forming the ink permeation portion 13 by using the above method is preferable. As the ferromagnetic material, any of the conventionally known ferromagnetic materials such as iron, cobalt, nickel or alloys thereof, oxide-based magnetic materials, and compound-based magnetic materials can be used. If sufficient tensile strength can be obtained only with the resin layer, the mesh screen is omitted and metal powder-added resin (so-called rubber magnets and plastic magnets are included)
The printing original plate 11 may be formed only from the above. In that case, the printing original plate 11 is etched or machined to form an opening portion (ink permeation portion) forming a printing pattern. Further, the mesh screen may be formed of a ferromagnetic material.
【0036】(2)強磁性金属薄板にインク浸透部13
を形成したものとしては、軟鉄、コバルト合金、ニッケ
ル合金等の強磁性金属の薄板を打ち抜き、レーザー加
工、エッチングなどの手法により加工し、印刷パターン
をなすインク浸透部13を形成したものが使用できる。
インク浸透部13を形成した金属薄板に、補強用のメッ
シュスクリーンを張り合わせて使用しても良い。(2) Ink penetrating part 13 on a thin ferromagnetic metal plate
For forming the ink, a thin plate of a ferromagnetic metal such as soft iron, cobalt alloy, nickel alloy or the like may be punched and processed by a method such as laser processing or etching to form the ink penetrating portion 13 forming a print pattern. .
A metal mesh plate on which the ink permeation part 13 is formed may be used by adhering a reinforcing mesh screen.
【0037】前記隔壁12は、前記印刷原版11のイン
ク浸透部13に充填されることにより基板本体10表面
に印刷されるインク14を固化したものである。このイ
ンク14は、プロテイン等を含有し、温度変化等によっ
て流動状態から固化可能な基材14a内に前記基板本体
10と同質のガラス粒子14bを分散したものである
(図2参照)。The partition wall 12 is formed by solidifying the ink 14 to be printed on the surface of the substrate body 10 by being filled in the ink permeation portion 13 of the printing original plate 11. The ink 14 contains a protein or the like, and glass particles 14b of the same quality as the substrate body 10 are dispersed in a base material 14a which can be solidified from a fluid state by temperature change or the like (see FIG. 2).
【0038】以下本発明の絶縁性基板の製造方法を説明
する。当該絶縁性基板の製造方法は、概略いわゆるスク
リーン印刷の手法によって突出寸法数100μmの隔壁
12を基板本体10面上に形成するものであって、ま
ず、図1に示すように、印刷原版11を基板本体10の
表面に装着し、該印刷原版11を基板本体の裏側から電
磁石15の磁力で吸着して基板本体10表面に密接させ
る。(第1の工程) この際、前記電磁石15は、図示しない電流供給手段に
おいて、電流を調整することにより印刷原版11の吸着
力が制御されている。The method of manufacturing the insulating substrate of the present invention will be described below. In the method for manufacturing the insulating substrate, a partition wall 12 having a protrusion dimension of several hundred μm is formed on the surface of the substrate body 10 by a so-called screen printing method. First, as shown in FIG. It is mounted on the surface of the substrate body 10, and the printing original plate 11 is adsorbed by the magnetic force of the electromagnet 15 from the back side of the substrate body to be brought into close contact with the surface of the substrate body 10. (First Step) At this time, in the electromagnet 15, the attracting force of the printing original plate 11 is controlled by adjusting the current in a current supply unit (not shown).
【0039】次に、図2に示すように、印刷原版11上
面上を摩擦・摺動可能に設けられたスクイージ16の最
初の移動方向(図中矢印方向)前側にインク14を供給
し、スクイージ16を動かすことによりインク14を前
記印刷原版11に擦り付け、前記インク浸透部13を通
じて前記基板本体10に印刷する。(第2の工程)前記
インク14の擦り込みは、印刷原版11の上面上をスク
イージ16を摩擦・摺動を一往復させることにより、イ
ンク14をインク浸透部13において基板本体10表面
に押しつける。この工程においては、電磁石15の吸着
力によって印刷原版11の全面が基板本体10表面に圧
接状態にあって隙間等の発生が防止され、面方向に十分
な摩擦力が生じるのでスクイージ16が印刷原版11表
面を摩擦しつつ往復動する際にも印刷原版11のずれを
効果的に防止でき、精度を高めることができる。Next, as shown in FIG. 2, the ink 14 is supplied to the front side of the squeegee 16 provided on the upper surface of the printing original plate 11 so as to be frictional and slidable in the initial moving direction (the direction of the arrow in the figure) to squeegee. The ink 14 is rubbed against the printing plate 11 by moving 16 and printing is performed on the substrate body 10 through the ink permeation portion 13. (Second step) In the rubbing of the ink 14, the squeegee 16 is rubbed and slid once over the upper surface of the printing original plate 11 to press the ink 14 against the surface of the substrate body 10 in the ink permeation portion 13. In this step, the attraction force of the electromagnet 15 causes the entire surface of the printing original plate 11 to be in pressure contact with the surface of the substrate body 10 to prevent the occurrence of gaps and the like, and a sufficient frictional force is generated in the surface direction. Even when reciprocating while rubbing the surface of the printing plate 11, it is possible to effectively prevent the displacement of the printing original plate 11 and improve the accuracy.
【0040】次に、電磁石15の通電を解除し、基板本
体10から印刷原版11を離脱した後(図3参照)、基
板本体10に印刷したインク14を乾燥固化させる。
(第3の工程)インク14の固化は、インク14の材料
に対応して燒結等によって行なってもよい。また、燒結
の際、インク14にはプロテインが含有されているの
で、有機溶剤などに比べてインク14印刷時の体積の収
縮が少なく、目的の形状が維持される。Next, after the energization of the electromagnet 15 is released and the printing original plate 11 is detached from the substrate body 10 (see FIG. 3), the ink 14 printed on the substrate body 10 is dried and solidified.
(Third Step) The ink 14 may be solidified by sintering or the like, depending on the material of the ink 14. In addition, since the ink 14 contains protein during sintering, the volume shrinkage during printing of the ink 14 is less than that of the organic solvent, and the target shape is maintained.
【0041】前記電磁石15の通電解除は、電磁石15
を基板本体10から遠ざけることにかえてもよい。印刷
原版11の基板本体10から離脱する方法としては、印
刷原版11をその裏面から磁力で吸着することが適して
いる。この方法によれば、印刷原版11の広い範囲にわ
たって吸着力が作用し、印刷原版11に歪み等を生じさ
せることなく安定に離脱を行なうことができる。また、
この離脱作業にあっては、印刷原版11を隔壁12の高
さ方向に沿って正確に移動することができるので、隔壁
形状に影響を与えることが無い。基板本体10から離脱
後の印刷原版11は、再度基板本体10への装着位置に
移動し、以下、繰り返しインク14の印刷に使用され
る。なお、前記電磁石15にかえて永久磁石で印刷原版
11を吸着することも可能である。この場合、印刷原版
11の吸着力の調整を、永久磁石を基板本体10に対し
て接近離間させることにより行なう。De-energization of the electromagnet 15 is performed by the electromagnet 15
It may be replaced with moving away from the substrate body 10. As a method of separating the printing original plate 11 from the substrate body 10, it is suitable to adsorb the printing original plate 11 from its back surface by magnetic force. According to this method, the suction force acts over a wide range of the printing original plate 11, and the printing original plate 11 can be stably detached without causing distortion or the like. Also,
In this detaching operation, since the printing original plate 11 can be accurately moved along the height direction of the partition wall 12, the partition wall shape is not affected. The printing original plate 11 that has been separated from the substrate body 10 moves to the mounting position on the substrate body 10 again, and is repeatedly used for printing the ink 14 hereinafter. It is also possible to attract the printing original plate 11 with a permanent magnet instead of the electromagnet 15. In this case, the attraction force of the printing original plate 11 is adjusted by moving the permanent magnet toward and away from the substrate body 10.
【0042】本発明の絶縁性基板の製造方法によれば、
印刷原版11を電磁石15の吸着力で吸着して基板本体
10に圧接した状態で印刷原版10に対するインク14
の擦り付けおよび印刷を行なうので、印刷原版11の厚
さ寸法が大きい場合であっても印刷原版11の基板本体
10との密着性の確保と面方向へのずれ防止とがなさ
れ、基板本体10へのインク14の乗りや、インク14
の印刷位置精度が確保され、基板本体10表面に目的形
状の隔壁12を高精度かつ容易に形成することができ、
PDP用背面基板の製造コストが低減するとともに、そ
の製造能率が向上する。加えて、印刷原版11における
インク浸透部13の設計が容易であるので、隔壁12の
形成間隔や形状、形成位置等の設定の自由度が向上す
る。According to the method of manufacturing an insulating substrate of the present invention,
Ink 14 with respect to the printing original plate 10 in a state where the printing original plate 11 is attracted by the attraction force of the electromagnet 15 and is pressed against the substrate body 10.
Since the rubbing and the printing are performed, even when the thickness of the printing original plate 11 is large, the adhesion of the printing original plate 11 to the substrate body 10 is secured and the displacement in the surface direction is prevented. Rink of ink 14 and ink 14
The printing position accuracy of is secured, and the partition wall 12 of the target shape can be formed with high accuracy and easily on the surface of the substrate body 10.
The manufacturing cost of the back substrate for PDP is reduced and its manufacturing efficiency is improved. In addition, since the ink permeation portion 13 of the printing original plate 11 can be easily designed, the degree of freedom in setting the intervals, shapes, positions of formation of the partition walls 12 is improved.
【0043】また、本発明の絶縁性基板の製造方法は、
前記インク14中に分散されるガラス粒子14bを基板
本体10と異なる種類のガラス、あるいはセラミック粒
子等に置換することも可能であり、特に、隔壁12の基
板本体10と接する部分のみを基板本体10と近い材質
にして他の部分を安価な絶縁性樹脂にするなどの、隔壁
12を異種の材料で形成する場合においては有利であ
り、PDP用背面基板の製造能率の効果が顕著である。The method of manufacturing an insulating substrate according to the present invention is
It is also possible to replace the glass particles 14b dispersed in the ink 14 with glass of a different type from the substrate body 10, ceramic particles, or the like. In particular, only the portion of the partition wall 12 that contacts the substrate body 10 is replaced. This is advantageous when the partition wall 12 is formed of a different material, such as a material close to the above and other portions made of an inexpensive insulating resin, and the effect of the manufacturing efficiency of the rear substrate for PDP is remarkable.
【0044】なお、本発明は、紙にインクを印刷する用
途に限定されず、例えば、インクとして微細な半田粒子
をフラックスや有機溶剤等に分散させたクリーム半田、
プリント基板製造用マスクとして使用されるレジスト材
料、未硬化状態の樹脂原料等を使用することも可能であ
る。本発明の絶縁性基板の製造方法では、厚いインク塗
膜を正確に形成することができるから、例えばプリント
基板やCRTのシャドーマスク等の製造プロセスにおい
て上記各材料を印刷する場合には特に好適である。The present invention is not limited to the use of printing ink on paper. For example, cream solder in which fine solder particles as ink are dispersed in a flux or an organic solvent,
It is also possible to use a resist material used as a mask for producing a printed circuit board, an uncured resin raw material, or the like. In the method for manufacturing an insulating substrate of the present invention, a thick ink coating film can be accurately formed, so that it is particularly suitable for printing each of the above materials in a manufacturing process such as a printed circuit board or a shadow mask of a CRT. is there.
【0045】自然乾燥によって固化可能なインクを使用
する場合には、インクの乾燥に遠赤外線を利用すること
も可能である。この方法の場合、インクの表層および内
部が均等に加熱・固化されるので、隔壁内部に応力の残
留が少なく品質が安定する。また、インクの加熱と同時
に基板本体も加熱されるので、インク内の成分と基板本
体とがインクの固化とともに容易かつ確実に一体化がな
され、固化時間の短縮も可能である。When an ink which can be solidified by natural drying is used, far infrared rays can be used for drying the ink. In the case of this method, the surface layer and the inside of the ink are heated and solidified evenly, so that the residual stress inside the partition wall is small and the quality is stable. Further, since the substrate body is also heated at the same time as the ink is heated, the components in the ink and the substrate body are easily and surely integrated with the solidification of the ink, and the solidification time can be shortened.
【0046】インクとして紫外線硬化性物質を含有した
ものを使用する場合には、紫外線硬化性物質の硬化によ
ってインクを固化する。この絶縁性基板の製造方法によ
れば、インクおよび基板本体の入熱が少なく、入熱や冷
却による歪みや変形等の心配が無く、隔壁の形成精度が
一層向上する。When an ink containing an ultraviolet curable substance is used as the ink, the ink is solidified by curing the ultraviolet curable substance. According to this method for manufacturing an insulating substrate, heat input to the ink and the substrate body is small, there is no fear of distortion or deformation due to heat input or cooling, and the partition wall formation accuracy is further improved.
【0047】インクとして電気伝導性物質を含有するも
のを使用する場合には、所定位置に印刷したインクを印
刷時または印刷後に加熱してインク内の電気伝導性物質
を溶融した後、冷却固化させる。この絶縁性基板の製造
方法によれば、例えば電気伝導性物質として半田を用い
た場合には、半田が溶融時に流動して基板本体上に形成
した溝や基板本体上においた部材間の隙間などの間に入
り込んで密着性を確実に確保することができ、特に半導
体素子の製造等にあっては優れた効果を発揮する。When an ink containing an electrically conductive substance is used as the ink, the ink printed at a predetermined position is heated at the time of printing or after the printing to melt the electrically conductive substance in the ink, and then cooled and solidified. . According to this method for manufacturing an insulating substrate, for example, when solder is used as the electrically conductive substance, when the solder melts, the solder flows and the grooves formed on the substrate body or the gaps between the members placed on the substrate body, etc. The adhesiveness can be surely ensured by entering the gaps, and an excellent effect is exhibited particularly in the manufacture of semiconductor elements.
【0048】基板本体としては、皮革や天然素材からな
る布であってもよい。これらの材料で形成された基板本
体は、一般に印刷時の平坦度の確保が難しいが、本発明
の製造方法によれば、印刷原版と基板本体との密接力に
よって基板本体である皮革や布を挟持した状態でインク
の印刷がなされるので、印刷時の基板本体のズレを防止
することができ、これらの基板本体にインクを大面積で
あっても容易に厚肉印刷することができる。前記布、皮
革としては、非磁性の材料を選択する。The substrate body may be a cloth made of leather or a natural material. The substrate body formed of these materials is generally difficult to secure the flatness at the time of printing, but according to the manufacturing method of the present invention, the leather or cloth which is the substrate body is formed by the close contact force between the printing original plate and the substrate body. Since the ink is printed in the sandwiched state, it is possible to prevent the displacement of the substrate main bodies at the time of printing, and it is possible to easily perform the thick printing on the substrate main bodies even if the ink has a large area. A non-magnetic material is selected as the cloth or leather.
【0049】また、前述した強磁性材料の微粉末をイン
クに混合しておくことにより、インク浸透部内に保持さ
れたインクをシート材に向けて磁力で吸引し、インク浸
透部からのインクの排出性向上を図ることなども可能で
ある。インク浸透部13内に凹凸を設ければ、多様な形
状の隔壁12を形成することもできる。ただし、インク
浸透部13内の凹凸は、印刷原版11の離脱において印
刷されたインク形状が破壊されない形状とする。By mixing the fine powder of the ferromagnetic material described above with the ink, the ink held in the ink permeation portion is magnetically attracted toward the sheet material and the ink is ejected from the ink permeation portion. It is also possible to improve the productivity. If unevenness is provided in the ink permeation portion 13, the partition wall 12 having various shapes can be formed. However, the unevenness in the ink permeation portion 13 is a shape that does not destroy the printed ink shape when the printing original plate 11 is separated.
【0050】隔壁12は、図4に示すように、基板本体
10と接する部分のみを基板本体10と同質のガラス粒
子14bを多量に含有する同質層17とし、他の部分を
基板本体10と異なる材質からなる異質層18とするこ
ともできる。このような隔壁12は、インク浸透部13
へのインクの擦り付けを2度に分けて行なうなどの方法
で形成することができる。また、前記異質層18として
は、例えば、安価な絶縁性樹脂などが考えられ、この場
合、プラズマディスプレイパネル用背面基板の製造コス
トの一層の低減が可能となる。As shown in FIG. 4, the partition wall 12 has a homogeneous layer 17 containing a large amount of glass particles 14b of the same quality as that of the substrate body 10 only in the portion in contact with the substrate body 10, and the other portion is different from the substrate body 10. The heterogeneous layer 18 made of a material can also be used. The partition wall 12 is provided in the ink permeation portion 13
It can be formed by a method such as rubbing the ink onto the surface in two steps. Further, as the heterogeneous layer 18, for example, an inexpensive insulating resin can be considered, and in this case, the manufacturing cost of the back substrate for the plasma display panel can be further reduced.
【0051】[0051]
【発明の効果】以上説明したように、本発明に係る請求
項1記載の絶縁性基板の製造方法によれば、強磁性材料
を具備し、形成すべき隔壁の平面形状をなすインク浸透
部を有する印刷原版を絶縁性基板の基板本体の表面に装
着し、該印刷原版を基板本体の裏側から磁力で吸着して
基板本体表面に密接させる第1の工程と、インクを前記
印刷原版に擦り付けることにより前記インク浸透部を通
じて前記基板本体に印刷する第2の工程と、基板本体に
印刷したインクを固化させる第3の工程とを備え、印刷
原版を磁力で吸着して基板本体に圧接した状態で印刷原
版に対するインクの擦り付けおよび印刷を行なうので、
印刷原版の厚さ寸法が大きい場合であっても印刷原版の
基板本体との密着性の確保と面方向へのずれ防止とがな
され、基板本体へのインクの乗りや、インクの印刷位置
精度が確保され、基板本体表面に目的形状の隔壁を高精
度かつ容易に形成することができ、絶縁性基板の製造コ
ストが低減するとともに、その製造能率が向上する。加
えて、印刷原版におけるインク浸透部の設計が容易であ
るので、隔壁の形成間隔や形状、形成位置等の設定の自
由度が向上するといった優れた効果を奏する。As described above, according to the method of manufacturing an insulating substrate according to the first aspect of the present invention, the ink penetrating portion having a ferromagnetic material and having a planar shape of the partition to be formed is formed. The first step of mounting the printing original plate having the printing original plate on the surface of the substrate main body of the insulating substrate, and adhering the printing original plate to the surface of the substrate main body by magnetic attraction from the back side of the substrate main body; and rubbing the printing original plate with ink. A second step of printing on the substrate body through the ink permeation section and a third step of solidifying the ink printed on the substrate body, in a state in which the printing original plate is magnetically attracted and pressed against the substrate body. Since the ink is rubbed against the printing original plate and printed,
Even when the thickness of the printing original plate is large, the adhesion of the printing original plate to the substrate body is secured and the deviation in the surface direction is prevented. The partition wall having the desired shape can be formed accurately and easily on the surface of the substrate body, and the manufacturing cost of the insulating substrate can be reduced and the manufacturing efficiency thereof can be improved. In addition, since it is easy to design the ink permeation portion in the printing original plate, there is an excellent effect that the degree of freedom in setting the partition spacing, shape, formation position, etc. is improved.
【0052】請求項2記載の絶縁性基板の製造方法によ
れば、第2の工程において、インクの擦り付けが印刷原
版表面を摺動するスクイージの往復動によりなされるの
で、インクが確実に基板本体に印刷され、隔壁の形成精
度が一層向上する。また、印刷原版が基板本体に圧接状
態で面接触しているので、スクイージの往復動の際に印
刷原版と基板本体との間の面方向のずれが防止され、高
い製造精度を容易に得られる。According to the method for manufacturing an insulating substrate of claim 2, in the second step, the rubbing of the ink is performed by the reciprocating movement of the squeegee that slides on the surface of the printing original plate. The printing accuracy is further improved by forming the partition wall. Further, since the printing original plate is in surface contact with the substrate body in a pressure contact state, when the squeegee reciprocates, a deviation in the surface direction between the printing original plate and the substrate body is prevented, and high manufacturing accuracy can be easily obtained. .
【0053】請求項3記載の絶縁性基板の製造方法で
は、前記インクが基材中に電気絶縁性物質の粒子を分散
してなるものであるので、電気的絶縁性の隔壁を基板本
体に容易に形成することができ、隔壁を有する絶縁性基
板を容易かつ低コストで製造することができる。In the method for manufacturing an insulating substrate according to claim 3, since the ink comprises particles of an electrically insulating substance dispersed in a base material, an electrically insulating partition wall can be easily formed on the substrate body. The insulating substrate having partition walls can be easily manufactured at low cost.
【0054】請求項4記載の絶縁性基板の製造方法で
は、前記粒子と前記基板本体との少なくとも一部が同材
質であり、隔壁と基板本体との各種性質が近いので、隔
壁と基板本体との一体化が確実になされるとともに、隔
壁と基板本体とが全体的に略均等な電気的、物理的性質
を有する絶縁性基板を容易かつ低コストで製造すること
ができる。In the method for manufacturing an insulating substrate according to claim 4, at least a part of the particles and the substrate body are made of the same material, and since the partition wall and the substrate body have similar properties, the partition wall and the substrate body are separated from each other. It is possible to easily and inexpensively manufacture an insulating substrate in which the partition wall and the substrate body have substantially the same electrical and physical properties while the integration is ensured.
【0055】請求項5記載の絶縁性基板の製造方法によ
れば、隔壁の形成工程が、インク中の粒子を基板と一体
に焼成する工程であって、基板本体に印刷したインクを
焼くことにより、基材を蒸発させてインク中の粒子から
なる隔壁を焼成するので、基板本体と隔壁との一体化が
一層確実に図れるとともに、絶縁性基板の電気性質や物
理的性質の均等性が容易である。According to the fifth aspect of the present invention, in the method for manufacturing an insulating substrate, the step of forming the partition wall is a step of firing particles in the ink integrally with the substrate, and by burning the ink printed on the substrate body. Since the base material is evaporated and the partition wall composed of particles in the ink is fired, it is possible to more surely integrate the substrate body and the partition wall, and it is easy to make the electrical properties and physical properties of the insulating substrate uniform. is there.
【0056】請求項6記載の絶縁性基板の製造方法によ
れば、遠赤外線の照射によってインクを固化するので、
インクの表層および内部が均等に加熱・固化され、隔壁
内部に応力の残留が少なく品質が安定する。また、イン
クの加熱と同時に基板本体も加熱されるので、インク内
の成分と基板本体とがインクの固化とともに容易かつ確
実に一体化がなされる。また、固化時間の短縮も可能で
ある。According to the insulating substrate manufacturing method of the sixth aspect, the ink is solidified by irradiation with far infrared rays.
The surface layer and the inside of the ink are uniformly heated and solidified, and the residual stress inside the partition wall is small and the quality is stable. Further, since the substrate body is heated at the same time as the ink is heated, the components in the ink and the substrate body are easily and surely integrated with the solidification of the ink. Further, it is possible to shorten the solidification time.
【0057】請求項7記載の絶縁性基板の製造方法によ
れば、紫外線硬化物質の硬化によってインクが固化され
るので、インクおよび基板本体の入熱が少なく、入熱や
冷却による歪みや変形等の心配が無く、隔壁の形成精度
が一層向上する。According to the method for manufacturing an insulating substrate of claim 7, since the ink is solidified by the curing of the ultraviolet curable substance, the heat input to the ink and the substrate body is small, and the distortion and deformation due to the heat input and cooling are caused. Therefore, the accuracy of forming the partition wall is further improved.
【0058】請求項8記載の絶縁性基板の製造方法によ
れば、所定位置に印刷したインクを印刷時または印刷後
に加熱してインク内の電気伝導性物質を溶融した後冷却
凝固させるので、電気伝導性物質が溶融時に流動して基
板本体上に形成した溝や基板本体上においた部材間の隙
間などの間に入り込んで密着性を確実に確保することが
できる。According to the manufacturing method of the insulating substrate of the eighth aspect, the ink printed at a predetermined position is heated at the time of printing or after printing to melt the electrically conductive substance in the ink and then cool and solidify the ink. When the conductive material melts, it flows and enters the grooves formed on the substrate body or the gaps between the members placed on the substrate body to ensure the adhesiveness.
【0059】請求項9記載の絶縁性基板の製造方法によ
れば、印刷原版をその裏面から磁力で吸着して基板本体
から離脱することにより、印刷原版の広い範囲にわたっ
て吸着力が作用して、印刷原版に歪み等を生じさせるこ
となく安定に離脱を行なうことができ、印刷の完了した
インク形状に影響を与えないので、隔壁の形成精度が一
層向上するとともに、印刷原版を長期にわたって繰り返
し使用する場合においてもインクの印刷精度を確保する
ことができる。According to the manufacturing method of the insulating substrate of the ninth aspect, the printing original plate is magnetically attracted from the back surface thereof and is separated from the substrate main body, so that the attraction force acts over a wide range of the printing original plate. The separation can be performed stably without causing distortion in the printing original plate, and since it does not affect the ink shape after printing, the accuracy of forming partition walls is further improved and the printing original plate is repeatedly used for a long period of time. Even in such a case, the printing accuracy of the ink can be secured.
【0060】請求項10記載の絶縁性基板の製造方法に
よれば、固化の完了したインク上にインクの印刷を再度
行なうことにより、より厚肉の隔壁を容易に高精度で形
成することができるとともに、固化の完了したインクに
異種のインクを重ねて印刷することにより、電気的、磁
気的、視覚的等において種々の性状の隔壁を形成するこ
とができる。According to the manufacturing method of the insulating substrate of the tenth aspect, the thicker partition wall can be easily formed with high accuracy by printing the ink again on the ink which has been solidified. At the same time, by printing different types of ink on the solidified ink, it is possible to form partition walls having various properties electrically, magnetically, and visually.
【0061】請求項11記載の絶縁性基板の製造方法に
よれば、印刷原版と基板本体との密接力によって基板本
体である皮革や布を挟持した状態でインクの印刷がなさ
れるので、印刷時の基板本体のズレを防止することがで
き、これらの基板本体に大面積で容易にインクを厚肉印
刷することができる。According to the method of manufacturing an insulating substrate as set forth in claim 11, ink is printed while the leather or cloth, which is the substrate body, is sandwiched by the contact force between the printing original plate and the substrate body. The deviation of the substrate bodies can be prevented, and thick ink can be easily printed on these substrate bodies in a large area.
【図1】本発明に係る絶縁性基板の製造方法の一実施例
を示す図であって、基板本体表面に印刷原版を設置吸着
する工程(第1の工程)を示す側断面図である。FIG. 1 is a diagram showing an embodiment of a method for manufacturing an insulating substrate according to the present invention, which is a side cross-sectional view showing a step (first step) of placing and adsorbing a printing original plate on the surface of a substrate body.
【図2】同実施例における、インクのインク浸透部への
擦り込み工程を(第2の工程)を示す側断面図である。FIG. 2 is a side sectional view showing the step of rubbing the ink into the ink permeation portion (second step) in the example.
【図3】同実施例によって製造する絶縁性基板を示す斜
視図である。FIG. 3 is a perspective view showing an insulating substrate manufactured according to the same embodiment.
【図4】同実施例によって製造する絶縁性基板を示す図
であって、同質層と異質層とからなる隔壁を設けた態様
を示す斜視図である。FIG. 4 is a view showing an insulating substrate manufactured according to the same example, and is a perspective view showing a mode in which a partition wall composed of a homogeneous layer and a heterogeneous layer is provided.
【図5】プラズマディスプレイパネルを示す斜視図であ
る。FIG. 5 is a perspective view showing a plasma display panel.
10 基板本体 11 印刷原版 12 隔壁 13 インク浸透部 14 インク 14a 基材 14b ガラス粒子 10 substrate body 11 printing original plate 12 partition wall 13 ink permeation part 14 ink 14a base material 14b glass particles
───────────────────────────────────────────────────── フロントページの続き (72)発明者 金 永生 大韓民国ソウル特別市東大門区典農洞206 −138 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kim Yong-seo 206-138 Nengno-dong, Dongdaemun-gu, Seoul, Republic of Korea
Claims (11)
製造方法であって、 形成すべき隔壁の平面形状をなすインク浸透部を有する
印刷原版を絶縁性基板の基板本体の表面に装着し、該印
刷原版を基板本体の裏側から磁力で吸着して基板本体表
面に密接させる第1の工程と、 インクを前記印刷原版に擦り付けることにより前記イン
ク浸透部を通じて前記基板本体に印刷する第2の工程
と、 基板本体に印刷したインクを固化させる第3の工程とを
備えることを特徴とする絶縁性基板の製造方法。1. A method of manufacturing an insulating substrate having a partition wall provided on the surface thereof, wherein a printing original plate having an ink permeation portion having a planar shape of the partition wall to be formed is mounted on the surface of the substrate body of the insulating substrate. Then, a first step of adsorbing the printing original plate from the back side of the substrate main body with a magnetic force to bring it into close contact with the surface of the substrate main body, and a step of printing on the substrate main body through the ink permeation section by rubbing ink on the printing original plate And a third step of solidifying the ink printed on the substrate body, the method for producing an insulating substrate.
あって、前記第2の工程において、インクの擦り付けが
印刷原版表面を摺動するスクイージの往復動によりなさ
れることを特徴とする絶縁性基板の製造方法。2. The method for manufacturing an insulating substrate according to claim 1, wherein in the second step, rubbing of ink is performed by reciprocating movement of a squeegee that slides on the surface of the printing original plate. A method for manufacturing an insulating substrate.
造方法であって、前記インクが基材中に電気絶縁性物質
の粒子を分散してなることを特徴とする絶縁性基板の製
造方法。3. The method for producing an insulating substrate according to claim 1, wherein the ink comprises particles of an electrically insulating substance dispersed in a base material. Method.
あって、前記粒子と前記基板本体との少なくとも一部が
同材質であることを特徴とする絶縁性基板の製造方法。4. The method for manufacturing an insulating substrate according to claim 3, wherein at least a part of the particles and the substrate body are made of the same material.
あって、前記第3の工程は、インク中の粒子を基板と一
体に焼成する工程であることを特徴とする絶縁性基板の
製造方法。5. The method for manufacturing an insulating substrate according to claim 3, wherein the third step is a step of firing particles in the ink integrally with the substrate. Production method.
縁性基板の製造方法であって、前記第3の工程は、イン
クに遠赤外線を照射する工程であることを特徴とする絶
縁性基板の製造方法。6. The method for manufacturing an insulating substrate according to claim 1, wherein the third step is a step of irradiating ink with far infrared rays. Substrate manufacturing method.
縁性基板の製造方法であって、前記インクは紫外線硬化
性物質を含有し、前記第3の工程は、インクに紫外線を
照射して前記紫外線硬化性物質を硬化させる工程である
ことを特徴とする絶縁性基板の製造方法。7. The method for manufacturing an insulating substrate according to claim 1, wherein the ink contains an ultraviolet curable substance, and in the third step, the ink is irradiated with ultraviolet rays. And a step of curing the ultraviolet curable substance.
造方法であって、前記インクは電気伝導性物質を含有
し、前記第3の工程は、溶融した前記電気伝導性物質を
冷却して凝固させる工程であることを特徴とする絶縁性
基板の製造方法。8. The method for manufacturing an insulating substrate according to claim 1, wherein the ink contains an electrically conductive substance, and the third step cools the melted electrically conductive substance. A method of manufacturing an insulating substrate, characterized in that the method comprises a step of solidifying by heating.
縁性基板の製造方法であって、基板本体へのインクの印
刷完了後に、基板本体裏側の磁力による吸着力を弱め、
印刷原版本体をその裏側から磁力で吸着して基板本体か
ら離脱する第4の工程を備えることを特徴とする絶縁性
基板の製造方法。9. The method for manufacturing an insulating substrate according to claim 1, wherein after the completion of printing the ink on the substrate body, the attraction force by the magnetic force on the back side of the substrate body is weakened.
A method of manufacturing an insulating substrate, comprising a fourth step of magnetically attracting the printing original plate body from the back side thereof to separate it from the substrate body.
絶縁性基板の製造方法であって、第3の工程において固
化の完了したインクの上に、第1の工程および第2の工
程によってインクを印刷する第5の工程を備えることを
特徴とする絶縁性基板の製造方法。10. The method for producing an insulating substrate according to claim 1, wherein the ink, which has been solidified in the third step, is subjected to the first step and the second step. A method of manufacturing an insulating substrate, comprising a fifth step of printing ink.
の絶縁性基板の製造方法であって、前記基板本体が天然
素材からなる布または皮革であることを特徴とする絶縁
性基板の製造方法。11. The method for manufacturing an insulating substrate according to claim 1, wherein the substrate body is a cloth or leather made of a natural material. .
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7002302A JPH08190866A (en) | 1995-01-10 | 1995-01-10 | Manufacture of insulating substrate |
| DE69501299T DE69501299T2 (en) | 1994-08-10 | 1995-08-09 | Process for producing a substrate with protruding portions |
| US08/513,156 US5830307A (en) | 1994-08-10 | 1995-08-09 | Production method for substrate having projecting portions |
| AT95420230T ATE161675T1 (en) | 1994-08-10 | 1995-08-09 | METHOD FOR PRODUCING A SUBSTRATE WITH PROJECTING PORTIONS |
| EP95420230A EP0701393B1 (en) | 1994-08-10 | 1995-08-09 | Production method for substrate having projecting portions |
| KR1019950024673A KR100210896B1 (en) | 1994-08-10 | 1995-08-10 | Screen printing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7002302A JPH08190866A (en) | 1995-01-10 | 1995-01-10 | Manufacture of insulating substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08190866A true JPH08190866A (en) | 1996-07-23 |
Family
ID=11525575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7002302A Pending JPH08190866A (en) | 1994-08-10 | 1995-01-10 | Manufacture of insulating substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08190866A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH071702A (en) * | 1992-12-16 | 1995-01-06 | Kengo Hiruta | Screen printer |
-
1995
- 1995-01-10 JP JP7002302A patent/JPH08190866A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH071702A (en) * | 1992-12-16 | 1995-01-06 | Kengo Hiruta | Screen printer |
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