JPH08192501A - Protective film for synthetic resin panel - Google Patents
Protective film for synthetic resin panelInfo
- Publication number
- JPH08192501A JPH08192501A JP7022343A JP2234395A JPH08192501A JP H08192501 A JPH08192501 A JP H08192501A JP 7022343 A JP7022343 A JP 7022343A JP 2234395 A JP2234395 A JP 2234395A JP H08192501 A JPH08192501 A JP H08192501A
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- synthetic resin
- resin plate
- film
- density polyethylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 23
- 229920003002 synthetic resin Polymers 0.000 title claims abstract description 15
- 239000000057 synthetic resin Substances 0.000 title claims abstract description 15
- 229920001684 low density polyethylene Polymers 0.000 claims abstract description 19
- 239000004702 low-density polyethylene Substances 0.000 claims abstract description 19
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims abstract description 13
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000003856 thermoforming Methods 0.000 claims description 7
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 claims 2
- 238000000465 moulding Methods 0.000 abstract description 9
- 239000010410 layer Substances 0.000 description 16
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 6
- 239000005977 Ethylene Substances 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229920000092 linear low density polyethylene Polymers 0.000 description 3
- 239000004707 linear low-density polyethylene Substances 0.000 description 3
- 239000004711 α-olefin Substances 0.000 description 3
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は加熱成形される合成樹脂
板の保護フィルムに関する。更に詳しくは、本発明は、
合成樹脂板を加熱成形する際に、保護フィルムを貼着し
たままでも保護フィルムが軟化し装置等に粘着すること
なく加熱成形可能であり、かつ加熱成形後に保護フィル
ムを剥離することなく検査可能で、更に容易に剥離可能
な加熱成形用合成樹脂板保護フィルムに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a protective film for heat-molding synthetic resin plates. More specifically, the present invention provides
When a synthetic resin plate is thermoformed, it can be thermoformed without the protective film softening and sticking to the device even when the protective film is attached, and it can be inspected without peeling off the protective film after thermoforming. The present invention relates to a synthetic resin plate protective film for thermoforming, which can be peeled off more easily.
【０００２】[0002]
【従来の技術】合成樹脂板用保護フィルムは、従来より
アクリル板やポリカーボネート板等の表面に取扱の際の
傷付きを防止するために使用されている。2. Description of the Related Art Protective films for synthetic resin plates have hitherto been used for preventing scratches on the surfaces of acrylic plates, polycarbonate plates and the like during handling.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、保護フ
ィルムを貼着したままの合成樹脂板を加熱成形に供する
と成形作業中に保護フィルムが溶融し作業者の衣服や装
置等に粘着したり、成形を終えたあとで成形品の表面に
保護フィルムが固着したり、粘着層のＥＶＡ樹脂が成形
品に付着したり、あるいは成形作業の出来ばえを保護フ
ィルムの外部からは検査できなくなるなどの問題があっ
た。However, when the synthetic resin plate with the protective film attached is subjected to heat molding, the protective film melts during the molding work and sticks to the worker's clothes or equipment, or is molded. After finishing, there is a problem that the protective film adheres to the surface of the molded product, the EVA resin of the adhesive layer adheres to the molded product, and the quality of the molding work cannot be inspected from the outside of the protective film. It was
【０００４】このために、加熱成形される樹脂板が傷付
けられることのないように、加工工程の最終まで合成樹
脂板に貼合され保護する機能を果たし、不用時に容易に
ハクリすることのできる保護フィルムが望まれてきた。Therefore, in order to prevent the heat-molded resin plate from being damaged, the resin plate is bonded to the synthetic resin plate until the end of the processing step so as to protect the resin plate and can be easily peeled off when not in use. Film has been desired.
【０００５】[0005]
【課題を解決するための手段】本発明者は上記課題につ
いて種々検討した結果、特定範囲のＭＩ値、密度値を有
する低密度ポリエチレン層と特定範囲の酢酸ビニル含量
値を有するＥＡＶ層とを特定範囲のヘイズ値となるよう
に、ポリエチレンのＭＩ、密度；ＥＶＡの酢酸ビニル含
量並びに両層の厚み等を選択し・積層することにより、
上記課題が解決されることを見出し、本発明を完成する
に至った。すなわち、本発明は： 、 ＭＩ ５．０〜０．１ｇ／１０分、密度 ０．９
１０〜０．９３５ｇ／ｃｍ3 よりなる低密度ポリエチレ
ン層と、ＭＩ ５．０〜０．１ｇ／１０分、酢酸ビニル
含量 ５〜１５％よりなるＥＶＡ層よりなり、フィルム
ヘイズが１５％以下である多層構造の加熱成形用合成樹
脂板保護フィルムに関する。また、 に記載の合成樹脂板保護フィルムを貼着した加熱
成形用アクリル樹脂板に関する。As a result of various studies on the above problems, the present inventor identified a low density polyethylene layer having an MI value and a density value within a specific range and an EAV layer having a vinyl acetate content value within a specific range. By selecting and laminating the MI of polyethylene, the density; the vinyl acetate content of EVA, the thickness of both layers, etc. so that the haze value in the range is obtained.
The inventors have found that the above problems can be solved and completed the present invention. That is, the present invention is: MI 5.0-0.1 g / 10 minutes, density 0.9
A low-density polyethylene layer composed of 10 to 0.935 g / cm 3 and an EVA layer composed of MI 5.0 to 0.1 g / 10 min and a vinyl acetate content of 5 to 15%, and a film haze of 15% or less. The present invention relates to a synthetic resin plate protective film for multi-layered thermoforming. Further, the present invention relates to an acrylic resin plate for thermoforming, to which the synthetic resin plate protective film described in 1 is attached.
【０００６】以下、本発明を具体的に説明する。本発明
に使用される低密度ポリエチレンは、線状低密度ポリエ
チレン（ＬＬ）、分岐状低密度ポリエチレン（ＬＤ）の
単独またはこれらのブレンド物である。分岐状低密度ポ
リエチレン（ＬＤ：いわゆる高圧法ポリエチレン）の使
用が耐熱性の観点から好ましい。線状低密度ポリエチレ
ンとしては、エチレンの単独重合体又はエチレンと炭素
数４〜１０の範囲にあるα−オレフィンとの共重合体で
あり、好ましくは炭素数６〜８のα−オレフィンとの共
重合体であり、これらの１種又は２種以上の混合組成で
もよい。The present invention will be specifically described below. The low density polyethylene used in the present invention is a linear low density polyethylene (LL), a branched low density polyethylene (LD), or a blend thereof. The use of branched low-density polyethylene (LD: so-called high-pressure polyethylene) is preferable from the viewpoint of heat resistance. The linear low-density polyethylene is a homopolymer of ethylene or a copolymer of ethylene and an α-olefin having a carbon number of 4 to 10, preferably a copolymer of an α-olefin having 6 to 8 carbon atoms. It is a polymer and may have a mixed composition of one kind or two or more kinds thereof.
【０００７】α−オレフィンの種類としては、１−ブテ
ン、１−ペンテン、１−ヘキセン、４−メチル−１−ペ
ンテン、１−ヘプテン、１−オクテン、１−デセン等が
ある。線状低密度ポリエチレンとしてエチレンと１−ブ
テンとの共重合体、エチレンと１−ヘキセンとの共重合
体の使用が好ましい。Examples of the α-olefin include 1-butene, 1-pentene, 1-hexene, 4-methyl-1-pentene, 1-heptene, 1-octene, 1-decene and the like. As the linear low density polyethylene, it is preferable to use a copolymer of ethylene and 1-butene, or a copolymer of ethylene and 1-hexene.
【０００８】本発明で使用される低密度ポリエチレンは
密度 ０．９１０〜０．９３５ｇ／ｃ１3 、好ましくは
０．９１５〜０．９２５ｇ／ｃｍ3 、ＭＩ ５．０〜
０．１ｇ／１０分、好ましくは２．０〜０．２ｇ／１０
分、更に好ましくは１．０〜０．３ｇ／１０分である。
密度が０．９１０ｇ／ｃｍ3 より低いと加熱成形時にフ
ィルムが軟化し作業者の衣服や、成形装置等に粘着する
場合があり好ましくない。密度が０．９３５ｇ／ｃｍ3
より高い場合は、フィルムの透明性が低下し加熱成形後
の検査が困難な場合があり好ましくない。ＭＩが０．１
ｇ／１０分より低い場合はフィルム成形が困難となる場
合があり、ＭＩが５．０ｇ／１０分より高い場合は加熱
成形時フィルムが軟化し、成形作業が困難になる場合が
あり好ましくない。[0008] low-density polyethylene used in the present invention has a density 0.910 to 0.935 g / c1 3, preferably 0.915~0.925g / cm 3, MI 5.0~
0.1 g / 10 minutes, preferably 2.0-0.2 g / 10
Min, more preferably 1.0 to 0.3 g / 10 min.
If the density is lower than 0.910 g / cm 3 , the film may be softened during heat molding and may stick to the clothes of a worker, a molding apparatus or the like, which is not preferable. Density is 0.935 g / cm 3
If it is higher than the above range, the transparency of the film is lowered and the inspection after the heat molding may be difficult, which is not preferable. MI is 0.1
If it is lower than g / 10 minutes, it may be difficult to form the film, and if MI is higher than 5.0 g / 10 minutes, the film may be softened at the time of heat forming and the forming operation may be difficult, which is not preferable.
【０００９】本発明で使用されるＥＶＡはＭＩ ５．０
〜０．１ｇ／１０分、好ましくは２．０〜０．２ｇ／１
０分、更に好ましくは１．０〜０．３ｇ／１０分、酢酸
ビニル含有量３〜１５％、好ましくは、５〜１３％であ
る。ＭＩが０．１ｇ／１０分より低い場合はフィルム成
形が困難となる場合があり、ＭＩが５．０ｇ／１０分よ
り高い場合は加熱成形後の保護フィルムのハクリが困難
になる場合があり好ましくない。酢酸ビニル含量が３％
より低い場合は合成樹脂板との粘着性が不十分な場合が
あり、１５％より高い場合は合成樹脂板よりのハクリが
困難な場合があり好ましくない。The EVA used in the present invention is MI 5.0.
~ 0.1 g / 10 minutes, preferably 2.0-0.2 g / 1
0 minutes, more preferably 1.0 to 0.3 g / 10 minutes, and the vinyl acetate content is 3 to 15%, preferably 5 to 13%. When the MI is lower than 0.1 g / 10 minutes, it may be difficult to form the film, and when the MI is higher than 5.0 g / 10 minutes, peeling of the protective film after heat molding may be difficult, which is preferable. Absent. Vinyl acetate content is 3%
If it is lower, the adhesiveness to the synthetic resin plate may be insufficient, and if it is higher than 15%, peeling from the synthetic resin plate may be difficult, which is not preferable.
【００１０】低密度ポリエチレン層とＥＶＡ層の厚み
は、特に制限されないが、作業性等の点より低密度ポリ
エチレン層は２０〜１００μ、ＥＶＡ層は５〜２０μが
好ましい。本発明の多層フィルムのヘイズは１５％以
下、好ましくは１０％以下である。ヘイズが１５％より
大きいと、加熱成形後の樹脂板の検査を保護フィルムと
貼合したままでは困難な場合があり好ましくない。The thicknesses of the low-density polyethylene layer and the EVA layer are not particularly limited, but from the viewpoint of workability, the low-density polyethylene layer is preferably 20-100 μm, and the EVA layer is preferably 5-20 μm. The haze of the multilayer film of the present invention is 15% or less, preferably 10% or less. If the haze is more than 15%, it may be difficult to inspect the resin plate after the thermoforming with the protective film attached, which is not preferable.
【００１１】なお、本発明においては、低密度ポリエチ
レンの密度、ＭＩ等；ＥＶＡの酢酸ビニル含量等；両層
の厚み等のパラメータを種々選択して、両層を積層した
場合にヘイズ値が１５％以下の特定値なるようにするこ
とが重要である。本発明の複合フィルムを製造するに
は、両フィルムを共押出してラミネートしても良いし、
また両フィルムを公知の接着剤を介して積層するなど公
知の積層法を適用できる。In the present invention, various parameters such as the density of low-density polyethylene, MI, etc .; vinyl acetate content of EVA, etc .; thickness of both layers are selected to obtain a haze value of 15 when both layers are laminated. It is important to have a specific value below%. To produce the composite film of the present invention, both films may be coextruded and laminated,
Further, a known laminating method such as laminating both films via a known adhesive can be applied.
【００１２】本発明で使用する低密度ポリエチレン及び
ＥＶＡには、酸化防止剤、滑剤、アンチブロッキング
剤、紫外線吸収剤、帯電防止剤、防曇剤、顔料等の添加
剤を使用しても良い。本発明で云う加熱成形とは雰囲気
温度１００℃以上での加工を云う。雰囲気温度が１００
℃より低い場合は特に大きな問題とはならない。The low density polyethylene and EVA used in the present invention may contain additives such as an antioxidant, a lubricant, an antiblocking agent, an ultraviolet absorber, an antistatic agent, an antifogging agent and a pigment. The thermoforming referred to in the present invention means processing at an ambient temperature of 100 ° C. or higher. Ambient temperature is 100
If it is lower than ℃, it does not cause a big problem.
【００１３】[0013]
【実施例】以下、実施例及び比較例によって本発明を詳
細に説明するが、これらは本発明の範囲を制限しない。 （実施例１）口径１００ｍｍφのダイス内接着タイプの
二層共押出フィルム用ダイスの外層となる供給口には、
口径５０ｍｍφ、Ｌ／Ｄ＝２６の押出機を接続し、内層
となる供給口には、口径５０ｍｍφ、Ｌ／Ｄ＝２８の押
出機を接続し、表１に示した分岐状低密度ポリエチレン
とＥＶＡを使用して、分岐状低密度ポリエチレン層の厚
さが５０μ、ＥＶＡ層の厚さを１０μにして複合フィル
ムを製膜した。フィルムのヘイズは、（株）村上色彩技
研所製ＨＭ１００型のヘイズメーターで測定した。その
測定結果を表１に示した。The present invention will be described in detail below with reference to Examples and Comparative Examples, but these do not limit the scope of the present invention. (Example 1) A supply port serving as an outer layer of a die for a two-layer coextrusion film of an adhesive type in a die having a diameter of 100 mmφ,
An extruder with a diameter of 50 mmφ and L / D = 26 was connected, and an extruder with a diameter of 50 mmφ and L / D = 28 was connected to the inner layer supply port. The branched low-density polyethylene and EVA shown in Table 1 Was used to form a composite film with the branched low-density polyethylene layer having a thickness of 50 μ and the EVA layer having a thickness of 10 μ. The haze of the film was measured by a HM100 type haze meter manufactured by Murakami Color Research Laboratory. The measurement results are shown in Table 1.
【００１４】次に、このフィルムを、アクリル樹脂押出
板に貼着した。このアクリル板を１８０℃に加熱した熱
風循環炉にて３分加熱後、プレス型により絞り部の直径
が２００ｍｍ、深さが５０ｍｍのシルクハット状の成形
品を作成した。次にこの成形品の曲げ加工状態を目視で
検査し、冷却後保護フィルムを剥離した。この結果を表
１に示した。Next, this film was attached to an acrylic resin extruded plate. This acrylic plate was heated for 3 minutes in a hot-air circulating furnace heated to 180 ° C., and then a top hat-shaped molded product having a diameter of the drawn portion of 200 mm and a depth of 50 mm was prepared by a press die. Next, the bent state of this molded product was visually inspected, and after cooling, the protective film was peeled off. The results are shown in Table 1.
【００１５】（実施例２〜６）表１に示す樹脂を使用し
た以外は実施例１と同様に行った。 （実施例７）分岐状低密度ポリエチレンをエチレンと１
−ブテンとの共重合体に代えた以外は実施例１と同様に
行った。 （実施例８）分岐状低密度ポリエチレンをエチレンと１
−ヘキセンの共重合体に代えた以外は実施例１と同様に
行った。 （比較例１〜５）表１に示す樹脂を使用した以外は実施
例１と同様に行った。複合フィルムのヘイズ値は、ＡＳ
ＴＭ規格Ｄ−１００３に基いて設計された（株）村上色
彩技術研究所製 ＨＭ−１００型により測定した。測定
はフィルムよりサンプル（４０ｍｍ×４０ｍｍ）を５サ
ンプル採取し、５サンプルの測定値の平均値を該フィル
ムのヘイズとした。(Examples 2 to 6) The same procedure as in Example 1 was carried out except that the resins shown in Table 1 were used. (Example 7) A branched low-density polyethylene was mixed with ethylene and 1
-The same procedure as in Example 1 was repeated except that the copolymer with butene was used instead. (Example 8) Branched low-density polyethylene was mixed with ethylene and 1
-A procedure similar to that of Example 1 was performed except that a hexene copolymer was used. (Comparative Examples 1 to 5) The same procedure as in Example 1 was carried out except that the resins shown in Table 1 were used. The haze value of the composite film is AS
It was measured by HM-100 model manufactured by Murakami Color Research Laboratory Co., Ltd. designed based on TM standard D-1003. For the measurement, 5 samples (40 mm × 40 mm) were taken from the film, and the average value of the measured values of the 5 samples was taken as the haze of the film.
【００１６】[0016]
【表１】 [Table 1]
【００１７】（註） ※１ ○：粘着性なし、×：粘着性あり。 ※２ ○：容易に剥離、×：成形品に固着。 ※３ ○：検査可能、 ×：検査不可。 ※４ ○：粘着性あり、×：粘着せず。(Note) * 1 ○: No tackiness, ×: There is tackiness. * 2 ○: Easy peeling, ×: Sticking to the molded product. * 3 ○: Inspection is possible, ×: Inspection is not possible. * 4 ○: Adhesive, ×: Not adhered.
【００１８】[0018]
【発明の効果】本発明のフィルムは、合成樹脂板を加熱
成形する際に、保護フィルムを貼着したまま加工、検査
が可能であり、かつ不用時には容易にハクリ可能な加熱
成形用合成樹脂板の保護フィルムを提供することにあ
る。INDUSTRIAL APPLICABILITY The film of the present invention can be processed and inspected while the protective film is still attached when the synthetic resin plate is thermoformed, and can be easily peeled off when not in use. Is to provide a protective film.
Claims (2)
０．９１０〜０．９３５ｇ／ｃｍ3 よりなる低密度ポ
リエチレン層と、ＭＩ ５．０〜０．１ｇ／１０分、酢
酸ビニル含量 ５〜１５％よりなるエチレン−酢酸ビニ
ル系共重合体（以下、ＥＶＡと略称する）層よりなり、
フィルムヘイズ値が１５％以下であることを特徴とす
る、多層構造の加熱成形用合成樹脂板保護フィルム。1. A low-density polyethylene layer having an MI of 5.0 to 0.1 g / 10 min and a density of 0.910 to 0.935 g / cm 3 , and an MI of 5.0 to 0.1 g / 10 min, vinyl acetate. An ethylene-vinyl acetate copolymer (hereinafter referred to as EVA) layer having a content of 5 to 15%,
A heat-moldable synthetic resin plate protective film having a multilayer structure, which has a film haze value of 15% or less.
ムを貼着した加熱成形用アクリル樹脂板。2. An acrylic resin plate for thermoforming, to which the synthetic resin plate protective film according to claim 1 is adhered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7022343A JPH08192501A (en) | 1995-01-18 | 1995-01-18 | Protective film for synthetic resin panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7022343A JPH08192501A (en) | 1995-01-18 | 1995-01-18 | Protective film for synthetic resin panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08192501A true JPH08192501A (en) | 1996-07-30 |
Family
ID=12080045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7022343A Pending JPH08192501A (en) | 1995-01-18 | 1995-01-18 | Protective film for synthetic resin panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08192501A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5181885A (en) * | 1975-01-13 | 1976-07-17 | Nippon Unicar Co Ltd | |
| JPS54133578A (en) * | 1978-04-10 | 1979-10-17 | Showa Denko Kk | Laminated film |
| JPH0174248U (en) * | 1987-11-06 | 1989-05-19 | ||
| JPH05229082A (en) * | 1992-02-25 | 1993-09-07 | Toray Gosei Film Kk | Surface protective film |
| JPH06145616A (en) * | 1992-11-10 | 1994-05-27 | Sekisui Chem Co Ltd | Surface-protection film |
| JPH06155686A (en) * | 1992-11-20 | 1994-06-03 | Mitsubishi Plastics Ind Ltd | Protective film for thermoplastic resin sheet |
| JPH06279742A (en) * | 1993-03-26 | 1994-10-04 | Sekisui Chem Co Ltd | Surface protection film |
| JPH06328632A (en) * | 1993-05-24 | 1994-11-29 | Nippon Unicar Co Ltd | Co-extruded adhesive film |
-
1995
- 1995-01-18 JP JP7022343A patent/JPH08192501A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5181885A (en) * | 1975-01-13 | 1976-07-17 | Nippon Unicar Co Ltd | |
| JPS54133578A (en) * | 1978-04-10 | 1979-10-17 | Showa Denko Kk | Laminated film |
| JPH0174248U (en) * | 1987-11-06 | 1989-05-19 | ||
| JPH05229082A (en) * | 1992-02-25 | 1993-09-07 | Toray Gosei Film Kk | Surface protective film |
| JPH06145616A (en) * | 1992-11-10 | 1994-05-27 | Sekisui Chem Co Ltd | Surface-protection film |
| JPH06155686A (en) * | 1992-11-20 | 1994-06-03 | Mitsubishi Plastics Ind Ltd | Protective film for thermoplastic resin sheet |
| JPH06279742A (en) * | 1993-03-26 | 1994-10-04 | Sekisui Chem Co Ltd | Surface protection film |
| JPH06328632A (en) * | 1993-05-24 | 1994-11-29 | Nippon Unicar Co Ltd | Co-extruded adhesive film |
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