JPH081966B2 - Method of manufacturing LED display element - Google Patents
Method of manufacturing LED display elementInfo
- Publication number
- JPH081966B2 JPH081966B2 JP9173090A JP9173090A JPH081966B2 JP H081966 B2 JPH081966 B2 JP H081966B2 JP 9173090 A JP9173090 A JP 9173090A JP 9173090 A JP9173090 A JP 9173090A JP H081966 B2 JPH081966 B2 JP H081966B2
- Authority
- JP
- Japan
- Prior art keywords
- led chip
- metallized film
- glass substrate
- display element
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、ガラス製品（眼鏡、窓ガラス、ビューファ
インダーなど）に取付けるLED表示素子の製造方法に関
するものである。TECHNICAL FIELD The present invention relates to a method for manufacturing an LED display element attached to a glass product (glasses, window glass, viewfinder, etc.).
ガラス製品にLED（発光ダイオード）表示素子を取付
ける場合には、ガラスの透明性を損なわないために、基
板に透明なガラス板を用いており、その一例を第２図に
示す。When an LED (light emitting diode) display element is attached to a glass product, a transparent glass plate is used as the substrate in order not to impair the transparency of the glass, and one example is shown in FIG.
図中、21はガラス基板、22はこの基板21上に所定パタ
ーンとなるように形成したメタライズ膜、23はこのメタ
ライズ膜22の所定箇所に装着したLEDチップ、24はこのL
EDチップ23と前記メタライズ膜22を接続するAlワイヤ
ー、25は前記LEDチップ23とAlワイヤー24の部分を覆っ
ているジャンクションコーティング剤である。In the figure, 21 is a glass substrate, 22 is a metallized film formed in a predetermined pattern on this substrate 21, 23 is an LED chip mounted at a predetermined position of this metallized film 22, and 24 is this L
An Al wire connecting the ED chip 23 and the metallized film 22 is a junction coating agent 25 which covers the LED chip 23 and the Al wire 24.
しかし、このような構造では、LEDチップ23とメタラ
イズ膜22の間の接続にAlワイヤー24を用いているため、
熱ストレスに弱く断線の恐れがある。また、ジャンクシ
ョンコーティング剤25を平らなガラス基板21上に厚くコ
ーティングすることが難しいので、耐湿性に劣るといっ
た欠点がある。However, in such a structure, since the Al wire 24 is used for the connection between the LED chip 23 and the metallized film 22,
It is susceptible to heat stress and may break. Further, since it is difficult to coat the junction coating agent 25 thickly on the flat glass substrate 21, there is a drawback that the moisture resistance is poor.
本発明の目的は、熱ストレスに強く、かつ耐湿性に優
れたLED表示素子の製造方法を提供することにある。An object of the present invention is to provide a method for manufacturing an LED display element that is strong against heat stress and excellent in moisture resistance.
本発明は、ガラス基板上に所定パターンのメタライズ
膜を形成する工程と、ガラス基板のメタライズ膜上に導
電性接着剤を塗布する工程と、導電性接着剤塗布面に一
方の電極面にAuバンプが形成されたLEDチップをその他
方の電極面が接着剤塗布面と接合するようにマウントす
る工程と、前記LEDチップのAuバンプ上にUV硬化樹脂を
塗布する工程と、メタライズ膜が形成された他のガラス
基板を前記LEDチップに載せ、加圧しならがUV光を照射
してUV硬化樹脂を硬化させた後、加圧状態に保ちながら
導電性接着剤を加熱硬化させる工程とを含むことを特徴
とするものである。The present invention comprises a step of forming a metallized film having a predetermined pattern on a glass substrate, a step of applying a conductive adhesive on the metallized film of a glass substrate, and an Au bump on one electrode surface of the conductive adhesive applied surface. A step of mounting the LED chip on which the other electrode surface is bonded to the adhesive application surface, a step of applying a UV curing resin on the Au bumps of the LED chip, and a metallized film were formed. Placing another glass substrate on the LED chip, irradiating UV light while applying pressure to cure the UV curable resin, and then heat curing the conductive adhesive while maintaining the pressure state. It is a feature.
以下、本発明を図面に示す実施例に基づいて詳細に説
明する。Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.
第１図（Ａ）〜（Ｆ）は本発明の一実施例を示すもの
で、まず第１図（Ａ）のようにガラス基板１上に所定パ
ターンのメタライズ膜２を形成する。メタライズ膜２に
は、ITO,ITO＋Ni・P,ITO＋Ni・Ｐ＋Auなどを用いる。1 (A) to 1 (F) show an embodiment of the present invention. First, as shown in FIG. 1 (A), a metallized film 2 having a predetermined pattern is formed on a glass substrate 1. For the metallized film 2, ITO, ITO + Ni.P, ITO + Ni.P + Au or the like is used.
次に、第１図（Ｂ）のように所定の位置に導電性接着
剤（Agペーストなど）３を塗布し、この塗布面上に第１
図（Ｃ）のようにLEDチップ４をダイボンディングなど
によりマウントする。この場合、LEDチップ４の一方の
電極面にはAuバンプ５を形成しておき、他方の電極面が
導電性接着剤３と接合するようにマウントする。そし
て、第１図（Ｄ）のようにLEDチップ４の周囲にスペー
サー６を設置する。スペーサー６の寸法精度は、LEDチ
ップ４の厚みに対して＋０％，−20％とする。スペーサ
ー６の周りには、ディスペンサーを用いてエポキシ樹脂
などのシール剤７を塗布し、100℃,30min程度の熱処理
を行う。Next, as shown in FIG. 1 (B), a conductive adhesive (Ag paste or the like) 3 is applied at a predetermined position, and the first application is made on this application surface.
The LED chip 4 is mounted by die bonding or the like as shown in FIG. In this case, the Au bumps 5 are formed on one electrode surface of the LED chip 4 and mounted so that the other electrode surface is bonded to the conductive adhesive 3. Then, as shown in FIG. 1D, a spacer 6 is installed around the LED chip 4. The dimensional accuracy of the spacer 6 is + 0% and -20% with respect to the thickness of the LED chip 4. A sealant 7 such as an epoxy resin is applied around the spacer 6 using a dispenser, and heat treatment is performed at 100 ° C. for about 30 minutes.
この後、第１図（Ｅ）のようにLEDチップ４のAuバン
プ５上にUV硬化樹脂８を塗布し、その上にメタライズ膜
２′が形成された他のガラス基板１′を前記LEDチップ
４、スペーサー６などを挟むようにガラス基板１に重
ね、第１図（Ｆ）のように２枚のガラス基板1,1′を上
下から加圧しながらUV光を照射してUV硬化樹脂８を硬化
させる。この時、硬化収縮によりAuバンプ５とメタライ
ズ膜２′が密着する。続いて、加圧状態のまま導電性接
着剤３及びシール剤７を加熱硬化させる。加熱温度は20
0℃、加熱時間は4hr程度とする。Then, as shown in FIG. 1 (E), UV curing resin 8 is applied on the Au bumps 5 of the LED chip 4, and another glass substrate 1'having a metallized film 2'formed thereon is attached to the LED chip. 4, the spacer 6 and the like are placed on the glass substrate 1 so that the two glass substrates 1 and 1 ′ are pressed from above and below as shown in FIG. Let it harden. At this time, the Au bump 5 and the metallized film 2 ′ are brought into close contact with each other due to curing shrinkage. Then, the conductive adhesive 3 and the sealant 7 are heated and cured in the pressurized state. The heating temperature is 20
The heating time is 0 ° C and the heating time is about 4 hours.
上記各工程での処理が完了すると、LEDチップ４が一
対のガラス基板1,1′に電気的に直接接続されるように
挟持され、かつ封止状態となっているLED表示素子が得
られる。When the processing in each of the above steps is completed, an LED display element is obtained in which the LED chip 4 is sandwiched so as to be electrically directly connected to the pair of glass substrates 1, 1 ', and is in a sealed state.
なお、上記工程でLEDチップのマウント工程とスペー
サーの設置・シール処理工程の順序を入替えてもよい。In the above process, the order of the LED chip mounting process and the spacer installation / sealing process may be exchanged.
以上のように本発明によれば、LEDチップを２枚のガ
ラス基板で挟むとともに、UV硬化樹脂などによって封止
状態とするので、耐湿性に優れ、かつ熱ストレスに強い
LED表示素子を得ることができる。しかも、UV硬化樹脂
を用いるため、光を効率よく取出すことができる。As described above, according to the present invention, the LED chip is sandwiched between the two glass substrates and is sealed with the UV curable resin or the like, so that it has excellent moisture resistance and is resistant to heat stress
An LED display device can be obtained. Moreover, since UV curable resin is used, light can be extracted efficiently.
第１図（Ａ）〜（Ｆ）は本発明に係るLED表示素子の製
造方法の一実施例を示す工程説明図、第２図はLED表示
素子の従来の構造例を示す断面図である。 １及び１′……ガラス基板 ２及び２′……メタライズ膜 ３……導電性接着剤、４……LEDチップ ５……Auバンプ、６……スペーサー ７……シール剤、８……UV硬化樹脂1A to 1F are process explanatory views showing an embodiment of a method for manufacturing an LED display element according to the present invention, and FIG. 2 is a sectional view showing an example of a conventional structure of the LED display element. 1 and 1 '... Glass substrate 2 and 2' ... Metallized film 3 ... Conductive adhesive 4 ... LED chip 5 ... Au bump, 6 ... Spacer 7 ... Sealing agent, 8 ... UV curing resin
Claims (1)
膜を形成する工程と、ガラス基板のメタライズ膜上に導
電性接着剤を塗布する工程と、導電性接着剤塗布面に一
方の電極面にAuバンプが形成されたLEDチップをその他
方の電極面が接着剤塗布面と接合するようにマウントす
る工程と、前記LEDチップのAuバンプ上にUV硬化樹脂を
塗布する工程と、メタライズ膜が形成された他のガラス
基板を前記LEDチップに載せ、加圧しながらUV光を照射
してUV硬化樹脂を硬化させた後、加圧状態に保ちながら
導電性接着剤を加熱硬化させる工程とを含むことを特徴
とするLED表示素子の製造方法。1. A step of forming a metallized film having a predetermined pattern on a glass substrate, a step of applying a conductive adhesive on the metallized film of a glass substrate, and a step of applying Au to one electrode surface on the conductive adhesive applied surface. A step of mounting the LED chip on which the bumps are formed so that the other electrode surface is bonded to the adhesive application surface, a step of applying UV curable resin on the Au bumps of the LED chip, and a metallized film are formed. After mounting another glass substrate on the LED chip, irradiating UV light while applying pressure to cure the UV curable resin, and then heat curing the conductive adhesive while maintaining the pressure state. A method for manufacturing a characteristic LED display element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9173090A JPH081966B2 (en) | 1990-04-06 | 1990-04-06 | Method of manufacturing LED display element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9173090A JPH081966B2 (en) | 1990-04-06 | 1990-04-06 | Method of manufacturing LED display element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03290983A JPH03290983A (en) | 1991-12-20 |
| JPH081966B2 true JPH081966B2 (en) | 1996-01-10 |
Family
ID=14034631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9173090A Expired - Lifetime JPH081966B2 (en) | 1990-04-06 | 1990-04-06 | Method of manufacturing LED display element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH081966B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6136626A (en) * | 1994-06-09 | 2000-10-24 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light-emitting device and production method thereof |
| EP1473781A3 (en) * | 1994-07-21 | 2007-02-21 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light-emitting device and production method thereof |
| US5583350A (en) * | 1995-11-02 | 1996-12-10 | Motorola | Full color light emitting diode display assembly |
-
1990
- 1990-04-06 JP JP9173090A patent/JPH081966B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03290983A (en) | 1991-12-20 |
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