JPH08197879A - Ic card - Google Patents

Abstract

PURPOSE: To obtain a stable electrical connection, to simplify the manufacturing steps at a low cost by providing a folding part at the contact part of an upper case component with a lower case component. CONSTITUTION: An IC card comprises an upper case component 1 and a lower case component 2 or 12 which can be vertically split. The component 2 has a folding shape at the inside so as to surround the two edges 3a, 3b of the upper surface of a frame 3. The contact part 1a folded in the U-shaped sectional shape of the component 1 has the shape brought into contact with and engaged with the surface of the folded part 2a of the component 2. These upper and lower components are brought into electric contact with the surface of the case metal plate. The upper and lower components are formed in such shapes. Thus, even if a twisting stress is applied to the card and the upper component is deviated from the lower component, the contact is not lost. Further, the manufacturing steps can be simplified with a low cost.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inexpensive and highly reliable IC card.

[0002]

2. Description of the Related Art Conventionally, an IC card has a board on which an IC is mounted, a connector for joining the board to an electronic device, a case component for protecting these internal components from external force, and an internal component mounted and fixed in the case component. It is composed of a frame.

Due to the nature of the IC card, this case part is
A metal plate made of stainless steel or the like is suitable because it is thin and light and has high strength, and moreover, it is required to have a shield performance for preventing destruction and malfunction of the IC due to static electricity from the outside. On the other hand, the frame is required to have a role as a spacer for mounting and fixing the board and the connector and for preventing parts such as ICs mounted on the board from coming into direct contact with metal case parts. Therefore, a synthetic resin that requires a complicated shape and thickness to some extent and is excellent in workability is suitable. For this reason, the case part and the frame part are made of different materials, and it is necessary to mount the frame inside the case part after manufacturing the case part and the frame part separately. For this reason, the case parts are divided into two parts, the upper and lower parts of which are joined together on the lateral surface of the frame when combined.

[0004]

With the development of high-density packaging technology for semiconductors, as IC cards have only the function of storing data, and become PC cards having an I / O function, card cases The performance required for the car is becoming severe. That is, it has become necessary to provide not only the protection of the IC from static electricity but also the performance as a better case of the electromagnetic wave shield that prevents malfunction of the IC due to electromagnetic waves from the outside. Specifically, it has become necessary to electrically join metal upper and lower case parts to prevent electromagnetic waves from entering. However, with the current case parts, when trying to make the upper and lower case parts conductive with each other in the frame shape, the end faces of the very thin case parts on the lateral sides of the frame are brought into contact with each other. It becomes necessary to greatly improve the dimensional accuracy. Further, when the card is heated, the frame expands so that a gap is formed at the end surfaces of the upper and lower case components. Further, when stress is applied to the card, the end faces of the upper and lower cases are displaced to create a gap, which makes it difficult to achieve stable conduction. In order to solve these problems, a method of ultrasonic welding when combining the upper and lower cases has been attempted, but it requires a special device and has a large welding area. It is necessary to highly position it so as not to melt it, and there is a drawback that the cost becomes very high.

The present invention has been made in order to solve the above-mentioned drawbacks, and an object of the present invention is to provide an IC card which is stable in conduction, has a simple manufacturing process, is inexpensive, and has high reliability. .

[0006]

Means for Solving the Problems As a result of intensive studies to achieve the above-mentioned object, the present inventors have found that the above-mentioned object can be achieved by providing a folded portion at the contact portion of the upper and lower case parts. They have found and completed the present invention.

That is, the present invention relates to an IC card comprising an internal component having a board on which an IC is mounted and a connector joined to an electronic device, a frame for mounting and fixing the internal component, and a case component for accommodating the internal component. The parts consist of an upper case part and a lower case part, which are divided into two parts on the top and bottom.
It is a metal plate with a folded part inside so as to surround one edge or two edges, and the upper case part has a U-shaped cross section and fits in contact with the end face or surface of the folded part of the lower case part. The IC card is a metal plate having a structure.

The present invention will be described in detail below.

The IC card of the present invention broadly refers to a card including an integrated circuit, and includes a microprocessor and a memory (electrically erasable, electrically writable ROM, ultraviolet erasable, electrically writable ROM, etc. as a memory). Including, or including only memory (so-called RAM card, RO
M card, ROM cartridge, etc.), and also refers to a card including an I / O function, that is, what is called a PC card by a general name.

In the present invention, the metal plate serving as the case component has a thickness made of stainless steel, magnesium alloy, zinc alloy, aluminum alloy or the like having high strength and good workability.
Plates of 0.05 to 0.3 mm can be used.

Examples of the thermoplastic resin suitable for forming the frame of the present invention include polycarbonate resin, polybutylene terephthalate resin, ABS resin, polypropylene resin, modified polyphenylene ether resin and the like.
These resins may be mixed with a filler such as glass fiber, talc, conductive whiskers, etc. depending on required properties such as heat resistance, strength and conductivity.

Next, the present invention will be described with reference to the drawings.

FIG. 1 is a schematic sectional view showing an upper case component of an IC card of the present invention, and FIGS. 2A and 2B are ICs of the present invention.
3A to 3E are schematic cross-sectional views showing two embodiments of the lower case part of the card, and FIGS. 3A to 3E are schematic cross-sectional views illustrating the manufacturing process of the IC card of the present invention.

The IC card of the present invention comprises the upper case part 1 shown in FIG. 1 and either of the lower case parts 2 and 12 shown in FIG. It has become. Lower case part 2 shown in FIG.
Has a shape that is folded back inwardly so as to surround the two edges 3a and 3b on the upper surface of the frame 3, and the contact portion 1a that is folded back in a U-shaped cross section of the upper case component 1 is a lower case component 2
The upper and lower case parts have an electric contact with each other on the surface of the case metal plate. It is desirable that the lower case part has a shape in which the two edges 3a and 3b on the upper surface of the frame 3 are folded back, as shown in 2 in FIG. 2 (a). However, in order to simplify the assembly of the IC card, As shown in 12 in 2 (b), one edge 3a on the upper surface of the frame 3 is folded back so that the end surface 12a is in contact with the contact surface 1a of the upper case component 1 is not particularly problematic for electrical contact. do not become.

By taking such a shape of the upper and lower case parts, a twisting stress is applied to the card, and the contact is not lost even when the upper case part and the lower case part are misaligned. Here, even in the case of the conventional shape where the joint part is the side surface of the card, the end faces of the upper and lower cases are folded back inward,
It is possible to increase the joint area to facilitate conduction between the upper and lower case components, but since the external dimensions of the IC card are defined by the standard, this method reduces the external shape of the frame or the upper and lower cases of the frame. Since it is necessary to provide a groove to insert a fold-back at the part corresponding to the fitting part of the component, it is not a suitable method because it reduces the internal capacity and causes extra labor during assembly,
As in the present invention, it is desirable that the upper and lower case parts have an electrical contact on the upper part of the IC card.

[0016]

The IC card of the present invention provides stable conduction,
A highly reliable IC card can be manufactured. That is, the contact portions of the upper and lower case components are provided with the folded-back portion so as to surround the frame of the lower case component, and the upper case component is fitted into the folded-back portion of the lower case component while being in contact with each other. It was possible to manufacture a high IC card.

[0017]

The present invention will now be described with reference to the drawings according to the manufacturing steps of the embodiments, but the present invention is not limited to these embodiments.

Example As shown in FIG. 3A, a stainless steel plate 4 having a thickness of 0.2 mm
A polyolefin-based heat-sensitive adhesive NP-605 (manufactured by Sony Chemical Co., Ltd., trade name) was overlaid and temporarily adhered using a heat press to form a laminate 6 having a synthetic resin adhesive layer 5 on the stainless steel plate 4. . As shown in FIG. 3 (b), the laminated plate 6 is put into a press die and pressed so that the adhesive synthetic resin layer 5 is on the inner side, and is molded into a predetermined shape to form the lower case component 2. It was This lower case part 2 is inserted into an injection molding die having a cavity having the same shape as the frame to be formed, and is then heated and fluidized in the cylinder of the injection molding machine Panlite GS-3111 (Teijin Kasei) Polycarbonate resin (trade name) manufactured by the company is press-fitted and filled into the cavity of the injection molding die to form the frame 3 shown in FIG. 3C, and the heat and pressure are combined with the synthetic resin adhesive layer 5 and cooled. Then, the lower case part 2 and the frame 3 are integrally molded. Next, as shown in FIG. 3D, the IC 7a is mounted on the frame 3.
The substrate 7 on which the above components were mounted and the connector (not shown) were fixed. As shown in FIG. 3 (e), the upper case component 1 which is processed into a shape such that the laminated plate 6 is fitted into the folded portion 8 of the lower case component 2 by pressing is fitted, and the frame 3 is screwed to the frame 3. It was fixed and an IC card was manufactured. When the resistance value between the upper and lower case parts of this IC card was measured, it was 0.1 Ω or less, which was a sufficient value for the shielding performance.

[0019]

As described above, the IC card of the present invention is an inexpensive and highly reliable IC card in which stable conduction can be obtained between the case parts and the manufacture is simple.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing an upper case component of an IC card of the present invention.

2A and 2B are schematic cross-sectional views showing two embodiments of a lower case component of an IC card of the present invention.

3A to 3E are schematic cross-sectional views for explaining the manufacturing process of the IC card of the present invention.

[Explanation of symbols]

 1 Upper case part 2, 12 Lower case part 3 Frame 4 Stainless steel plate 5 Synthetic resin adhesive layer 6 Laminate plate 7 Board 8 Folding part 9 Screw

Claims (1)

[Claims] 1. An IC card comprising an internal component having a board on which an IC is mounted and a connector joined to an electronic device, a frame for mounting and fixing the internal component, and a case component for housing them, wherein the case components are vertically arranged. It consists of an upper case part and a lower case part that are divided into two parts.The lower case part is a metal plate with a folded portion inside so as to surround one edge or two edges on the upper surface of the frame. An IC card, which is a metal plate having a U-shaped cross section and having a structure to be fitted in contact with an end surface or a surface of the folded portion of the lower case component.