JPH08213738A - 無電解槽における誘導時間を短縮する方法 - Google Patents

無電解槽における誘導時間を短縮する方法

Info

Publication number: JPH08213738A
Authority: JP; Japan
Prior art keywords: copper; noble metal; circuit board; ionic; solution
Prior art date: 1994-10-28
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP7298869A

Other languages

English (en)

Japanese (ja)

Inventor

David R Richards

デビッド・アール・リチャーズ

Yaroslaw A Magera

ヤロスロー・エー・マジェラ

Vernon L Brown

バーノン・エル・ブラウン

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Motorola Solutions Inc

Original Assignee

Motorola Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1994-10-28

Filing date

1995-10-24

Publication date

1996-08-20

1995-10-24 Application filed by Motorola Inc filed Critical Motorola Inc

1996-08-20 Publication of JPH08213738A publication Critical patent/JPH08213738A/ja

Status Pending legal-status Critical Current

Links

230000006698 induction Effects 0.000 title claims description 10
238000004904 shortening Methods 0.000 title description 2
238000000034 method Methods 0.000 claims abstract description 19
239000010949 copper Substances 0.000 claims abstract description 17
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
229910052802 copper Inorganic materials 0.000 claims abstract description 15
230000003197 catalytic effect Effects 0.000 claims abstract description 6
239000008367 deionised water Substances 0.000 claims abstract description 6
229910021641 deionized water Inorganic materials 0.000 claims abstract description 6
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 6
229910000510 noble metal Inorganic materials 0.000 claims description 12
229910052751 metal Inorganic materials 0.000 claims description 8
239000002184 metal Substances 0.000 claims description 8
239000003054 catalyst Substances 0.000 claims description 7
QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 3
239000005751 Copper oxide Substances 0.000 claims description 3
229910000431 copper oxide Inorganic materials 0.000 claims description 3
238000000151 deposition Methods 0.000 claims description 3
239000010970 precious metal Substances 0.000 claims description 3
238000005507 spraying Methods 0.000 claims description 2
238000005406 washing Methods 0.000 claims 2
239000010408 film Substances 0.000 claims 1
238000001465 metallisation Methods 0.000 claims 1
230000008707 rearrangement Effects 0.000 claims 1
239000010409 thin film Substances 0.000 claims 1
239000011347 resin Substances 0.000 abstract description 18
229920005989 resin Polymers 0.000 abstract description 18
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract description 10
238000007747 plating Methods 0.000 abstract description 9
239000002245 particle Substances 0.000 abstract description 7
239000004020 conductor Substances 0.000 abstract description 6
229910044991 metal oxide Inorganic materials 0.000 abstract description 5
150000004706 metal oxides Chemical class 0.000 abstract description 5
229910052763 palladium Inorganic materials 0.000 abstract description 5
239000000758 substrate Substances 0.000 abstract description 5
KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 abstract description 2
239000007787 solid Substances 0.000 abstract description 2
150000001638 boron Chemical class 0.000 abstract 1
239000000243 solution Substances 0.000 description 9
238000007772 electroless plating Methods 0.000 description 4
238000010924 continuous production Methods 0.000 description 2
230000008021 deposition Effects 0.000 description 2
239000000945 filler Substances 0.000 description 2
230000000977 initiatory effect Effects 0.000 description 2
239000000463 material Substances 0.000 description 2
239000012266 salt solution Substances 0.000 description 2
230000004913 activation Effects 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
238000006243 chemical reaction Methods 0.000 description 1
238000006073 displacement reaction Methods 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
239000012528 membrane Substances 0.000 description 1
230000003287 optical effect Effects 0.000 description 1
230000003647 oxidation Effects 0.000 description 1
238000007254 oxidation reaction Methods 0.000 description 1
238000002791 soaking Methods 0.000 description 1
238000001179 sorption measurement Methods 0.000 description 1
239000007921 spray Substances 0.000 description 1
239000000126 substance Substances 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)
Manufacturing Of Printed Wiring (AREA)

JP7298869A 1994-10-28 1995-10-24 無電解槽における誘導時間を短縮する方法 Pending JPH08213738A (ja)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US33047394A	1994-10-28	1994-10-28
US330473		1994-10-28

Publications (1)

Publication Number	Publication Date
JPH08213738A true JPH08213738A (ja)	1996-08-20

Family

ID=23289937

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP7298869A Pending JPH08213738A (ja)	1994-10-28	1995-10-24	無電解槽における誘導時間を短縮する方法

Country Status (6)

Country	Link
JP (1)	JPH08213738A (2)
KR (1)	KR960014396A (2)
DE (1)	DE19540122C2 (2)
FR (1)	FR2726205B1 (2)
GB (1)	GB2294476B (2)
TW (1)	TW293984B (2)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2885113B2 (ja) *	1995-01-30	1999-04-19	日本電気株式会社	印刷配線板およびその製造方法
US7588835B2 (en)	2005-03-11	2009-09-15	Hitachi Chemical Company, Ltd.	Method of treating the surface of copper and copper

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2939804A (en) *	1958-01-23	1960-06-07	Uarco Inc	Resin particle coated with metal
GB1003575A (en) *	1962-04-19	1965-09-08	Sperry Gyroscope Co Ltd	Chemical plating process
US3372037A (en) *	1965-06-30	1968-03-05	Ibm	Magnetic materials
GB1322081A (en) *	1970-06-03	1973-07-04	Shipley Co	Electroless nickel solution
US3857724A (en) *	1971-08-20	1974-12-31	Ibm	Primer for electroless plating
GB1360592A (en) *	1973-02-14	1974-07-17	Rca Corp	Electroless cobalt plating bath
US4640718A (en) *	1985-10-29	1987-02-03	International Business Machines Corporation	Process for accelerating Pd/Sn seeds for electroless copper plating
JPH0713304B2 (ja) *	1987-12-14	1995-02-15	日立化成工業株式会社	銅の表面処理法
US5110633A (en) *	1989-09-01	1992-05-05	Ciba-Geigy Corporation	Process for coating plastics articles
US5162144A (en) *	1991-08-01	1992-11-10	Motorola, Inc.	Process for metallizing substrates using starved-reaction metal-oxide reduction
EP0530144A3 (en) *	1991-08-23	1994-08-24	Ciba Geigy Ag	Process for metallising plastic articles
US5212138A (en) *	1991-09-23	1993-05-18	Applied Electroless Concepts Inc.	Low corrosivity catalyst for activation of copper for electroless nickel plating

1995
- 1995-10-02 FR FR9511552A patent/FR2726205B1/fr not_active Expired - Fee Related
- 1995-10-06 TW TW084110519A patent/TW293984B/zh active
- 1995-10-16 GB GB9521107A patent/GB2294476B/en not_active Expired - Fee Related
- 1995-10-19 KR KR1019950036104A patent/KR960014396A/ko not_active Ceased
- 1995-10-24 JP JP7298869A patent/JPH08213738A/ja active Pending
- 1995-10-27 DE DE19540122A patent/DE19540122C2/de not_active Expired - Fee Related

Also Published As

Publication number	Publication date
DE19540122A1 (de)	1996-05-02
DE19540122C2 (de)	1997-08-21
FR2726205B1 (fr)	1997-09-26
FR2726205A1 (fr)	1996-05-03
TW293984B (2)	1996-12-21
GB2294476B (en)	1998-03-11
KR960014396A (ko)	1996-05-22
GB9521107D0 (en)	1995-12-20
GB2294476A (en)	1996-05-01

Publication	Publication Date	Title
US5380560A (en)	1995-01-10	Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition
US4659587A (en)	1987-04-21	Electroless plating process and process for producing multilayer wiring board
US5907790A (en)	1999-05-25	Aluminum-palladium alloy for initiation of electroless plating
JP3153682B2 (ja)	2001-04-09	回路板の製造方法
EP0866735B1 (en)	2002-10-02	Process for the fabrication of a silicon/integrated circuit wafer
US5162144A (en)	1992-11-10	Process for metallizing substrates using starved-reaction metal-oxide reduction
US6696173B1 (en)	2004-02-24	Conducting path structures situated on a non-conductive support material, especially fine conducting path structures and method for producing same
EP0176736B1 (en)	1988-07-13	Process for selective metallization
US5084299A (en)	1992-01-28	Method for patterning electroless plated metal on a polymer substrate
US5405656A (en)	1995-04-11	Solution for catalytic treatment, method of applying catalyst to substrate and method of forming electrical conductor
KR100188481B1 (ko)	1999-06-15	유전기질과 도금기질을 직접 전기도금 하는 방법
JPH022949B2 (2)	1990-01-19
JP2001020077A (ja)	2001-01-23	無電解めっき方法及び無電解めっき液
JP2004513221A5 (2)	2005-06-02
JPH07180089A (ja)	1995-07-18	電気鍍金方法及び構成
US4066809A (en)	1978-01-03	Method for preparing substrate surfaces for electroless deposition
KR20030095688A (ko)	2003-12-24	인쇄회로기판 및 이의 도금방법
JPS61265853A (ja)	1986-11-25	金属接点の形成方法
US3839083A (en)	1974-10-01	Selective metallization process
US5545430A (en)	1996-08-13	Method and reduction solution for metallizing a surface
JPH08213738A (ja)	1996-08-20	無電解槽における誘導時間を短縮する方法
JPH03170680A (ja)	1991-07-24	非導電性支持体を直接金属被覆する方法
EP0308011B1 (en)	1995-01-04	Method of locally providing metal on a surface of a substrate
DE19631565A1 (de)	1998-01-29	Verfahren zum Herstellen von Palladiumkontaktbumps auf Halbleiterschaltungsträgern
JPS6131188B2 (2)	1986-07-18