JPH08505013A - プリント配線板から成る装置 - Google Patents

プリント配線板から成る装置

Info

Publication number
JPH08505013A
JPH08505013A JP7511179A JP51117995A JPH08505013A JP H08505013 A JPH08505013 A JP H08505013A JP 7511179 A JP7511179 A JP 7511179A JP 51117995 A JP51117995 A JP 51117995A JP H08505013 A JPH08505013 A JP H08505013A
Authority
JP
Japan
Prior art keywords
heat
wiring board
printed wiring
layer
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7511179A
Other languages
English (en)
Japanese (ja)
Inventor
ヴォルフガング マイアー−シュトイアーナゲル，
ラインハルト ファッセル，
ハーベルト クリンガー，
ハンス−イエルク シュミット，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JPH08505013A publication Critical patent/JPH08505013A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09572—Solder filled plated through-hole in the final product
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP7511179A 1993-10-21 1994-10-14 プリント配線板から成る装置 Pending JPH08505013A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19934335946 DE4335946C2 (de) 1993-10-21 1993-10-21 Anordnung bestehend aus einer Leiterplatte
DE4335946.9 1993-10-21
PCT/DE1994/001216 WO1995011580A1 (de) 1993-10-21 1994-10-14 Anordnung bestehend aus einer leiterplatte

Publications (1)

Publication Number Publication Date
JPH08505013A true JPH08505013A (ja) 1996-05-28

Family

ID=6500690

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7511179A Pending JPH08505013A (ja) 1993-10-21 1994-10-14 プリント配線板から成る装置

Country Status (4)

Country Link
EP (1) EP0674827A1 (de)
JP (1) JPH08505013A (de)
DE (1) DE4335946C2 (de)
WO (1) WO1995011580A1 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009277784A (ja) * 2008-05-13 2009-11-26 Toshiba Corp 部品内蔵プリント配線板、同配線板の製造方法および電子機器
WO2011046134A1 (ja) * 2009-10-13 2011-04-21 カルソニックカンセイ株式会社 多層基板の放熱構造
JP2017135209A (ja) * 2016-01-26 2017-08-03 株式会社テクノ高槻 多層基板及び電子回路基板
JP2017228581A (ja) * 2016-06-20 2017-12-28 大日本印刷株式会社 配線基板およびその製造方法、ならびに半導体装置の製造方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10315768A1 (de) * 2003-04-07 2004-11-25 Siemens Ag Mehrlagige Leiterplatte
DE102005022062A1 (de) 2005-05-12 2006-11-16 Conti Temic Microelectronic Gmbh Leiterplatte
DE102005063281A1 (de) * 2005-12-30 2007-07-05 Robert Bosch Gmbh Integriertes elektronisches Bauteil sowie Kühlvorrichtung für ein integriertes elektronisches Bauteil
DE102007029913A1 (de) 2007-06-28 2009-01-02 Robert Bosch Gmbh Elektrisches Steuergerät
US7808788B2 (en) 2007-06-29 2010-10-05 Delphi Technologies, Inc. Multi-layer electrically isolated thermal conduction structure for a circuit board assembly
DE102010030525A1 (de) * 2010-06-25 2011-12-29 Zf Friedrichshafen Ag Elektronische Steuerbaugruppe
DE102010039550A1 (de) * 2010-08-20 2012-02-23 Zf Friedrichshafen Ag Steuermodul
DE102010043077A1 (de) * 2010-10-28 2011-11-17 Continental Automotive Gmbh Mehrlagiger Schaltungsträger
DE102011077206B4 (de) 2011-06-08 2019-01-31 Zf Friedrichshafen Ag Leiterplatte und Steuergerät für ein Getriebe eines Fahrzeugs mit der Leiterplatte
DE102014118080B4 (de) * 2014-12-08 2020-10-15 Infineon Technologies Ag Elektronisches Modul mit einem Wärmespreizer und Verfahren zur Herstellung davon
DE102015112031B4 (de) 2015-07-23 2017-08-17 Halla Visteon Climate Control Corporation Anordnung zur Verbesserung einer Strombelastbarkeit von Leiterbahnen
DE102017109682A1 (de) * 2017-05-05 2018-11-08 Schaeffler Technologies AG & Co. KG Kühlkörper
AT519741B1 (de) * 2017-07-18 2018-10-15 Zkw Group Gmbh Thermische Kopplung von Kupferspreizflächen
DE102019202934B4 (de) 2019-03-05 2026-03-12 Schaeffler Technologies AG & Co. KG Schaltungsträger und leistungselektronische Schaltungsanordnung mit einem Schaltungsträger

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3305167C2 (de) * 1983-02-15 1994-05-05 Bosch Gmbh Robert Elektrische Schaltungsanordnung mit einer Leiterplatte
DE3505167A1 (de) * 1985-02-15 1986-08-28 GAS Gesellschaft für Antriebs- und Steuerungstechnik mbH & Co KG, 7742 St Georgen Linearantrieb
US4729061A (en) * 1985-04-29 1988-03-01 Advanced Micro Devices, Inc. Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom
IT1201315B (it) * 1985-06-17 1989-01-27 M A S Ind Spa Metodo per assicurare il raffreddamento di componenti elettronici fissati su di un multistrato per circuiti stampati e multistrato realizzato secondo detto metodo
FR2620587B1 (fr) * 1987-09-16 1993-07-02 Telemecanique Electrique Circuit imprime equipe d'un drain thermique
DE3843787A1 (de) * 1988-12-24 1990-07-05 Standard Elektrik Lorenz Ag Verfahren und leiterplatte zum montieren eines halbleiter-bauelements
US5019941A (en) * 1989-11-03 1991-05-28 Motorola, Inc. Electronic assembly having enhanced heat dissipating capabilities
US5113315A (en) * 1990-08-07 1992-05-12 Cirqon Technologies Corporation Heat-conductive metal ceramic composite material panel system for improved heat dissipation
DE4107312A1 (de) * 1991-03-07 1992-09-10 Telefunken Electronic Gmbh Montageanordnung von halbleiterbauelementen auf einer leiterplatte
GB2259408A (en) * 1991-09-07 1993-03-10 Motorola Israel Ltd A heat dissipation device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009277784A (ja) * 2008-05-13 2009-11-26 Toshiba Corp 部品内蔵プリント配線板、同配線板の製造方法および電子機器
WO2011046134A1 (ja) * 2009-10-13 2011-04-21 カルソニックカンセイ株式会社 多層基板の放熱構造
JP2017135209A (ja) * 2016-01-26 2017-08-03 株式会社テクノ高槻 多層基板及び電子回路基板
JP2017228581A (ja) * 2016-06-20 2017-12-28 大日本印刷株式会社 配線基板およびその製造方法、ならびに半導体装置の製造方法

Also Published As

Publication number Publication date
EP0674827A1 (de) 1995-10-04
WO1995011580A1 (de) 1995-04-27
DE4335946A1 (de) 1995-04-27
DE4335946C2 (de) 1997-09-11

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