JPH08511572A - 安定化カチオン硬化性組成物 - Google Patents
安定化カチオン硬化性組成物Info
- Publication number
- JPH08511572A JPH08511572A JP7501785A JP50178595A JPH08511572A JP H08511572 A JPH08511572 A JP H08511572A JP 7501785 A JP7501785 A JP 7501785A JP 50178595 A JP50178595 A JP 50178595A JP H08511572 A JPH08511572 A JP H08511572A
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- epoxy
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
- G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/08—Saturated oxiranes
- C08G65/10—Saturated oxiranes characterised by the catalysts used
- C08G65/105—Onium compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/08—Saturated oxiranes
- C08G65/10—Saturated oxiranes characterised by the catalysts used
- C08G65/12—Saturated oxiranes characterised by the catalysts used containing organo-metallic compounds or metal hydrides
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
- C08G2650/16—Photopolymerisation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Epoxy Resins (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
- Laminated Bodies (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
- Magnetic Record Carriers (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.a)エポキシモノマー及びビニルエーテル含有モノマーからなる群から選 択される少なくとも一種のカチオン硬化性モノマーと、 b)(1)有機金属錯体カチオンの少なくとも一種の塩と、 (2)第1種〜第5種からなる群から選択される少なくとも一種の安定化 添加剤又はその活性部とを含んでなる二成分開始剤との前記成分a)及びb)を 含んでなるエネルギー重合性組成物であって、 前記第1種は、式III R1−Z1−R1 (III) (式中、Z1は から選択される二価部分であり、各R1は独立してC1〜C10アルキル基及び縮合 又は非縮合芳香族環数1〜4の基から選択される基であり、R1同士が一緒に環 原子数5〜7の複素環を形成できる)で表される化合物であり; 前記第2種は、式IV (式中、Z2は二価の−O−、−S−又は−NH−であり;各R2は独立して水素 であるか、前記で定義したR1であるか、2つのR2が一緒に少なくとも一個の飽 和または不飽和の環を形成でき、前記環が炭素数1〜30のアルキル、アルケニ ル又はアルキニル基で置換されていても非置換であってもよく;これらの炭素原 子はO、 S及びNから選択される10個以下の個々の非カテネート化ヘテロ原子で中断さ れていてもよく; xは1又は2であり、そしてbは3〜10の整数である)で表される大環状化 合物を含んでなり; 前記第3種は、式V及びVIを有する化合物により表され: (式中、各R2は独立して前記で定義した通りである);及びトリピリジルトリ アジン類 (式中、各R2は独立して前記で定義した通りである); 前記第4種は、式VII (式中、Z3は窒素、リン、ヒ素又はアンチモンであり;各R1は 独立して前記で定義した通りであり、そしてR3はR1又はアルキレン及びフェニ レン基から選択される二官能基であり、cは1又は2である)で表される化合物 であり; 前記第5種は、シッフ塩基であり、式VIII: (式中、R2及びR3は独立して前記で定義した通りであり、dは1又は2であり )の化合物により表すことができ;前記組成物は任意に少なくとも一種のモノ− 若しくはポリ−アルコール又は硬化速度を増加するための少なくとも一種の添加 剤を含んでなる組成物。 2.有機金属錯体カチオンの前記塩が、下式 〔(L1)y(L2)zM〕+qXn (I) (式中、MはCr、Ni、Mo、W、Mn、Tc、Re、Fe、Ru、Os、C o、Rh及びIrを含む群から選択され; L1は無か、芳香族化合物及び複素環芳香族化合物から選択でき且つMの原子 価殻にπ電子6個を与えることができるπ電子を与える同一又は異なるリガンド の1つ又は2つを表し; L2は無か、シクロペンタジエニル及びインデニルアニオン基から選択でき且 つMの原子価殻にπ電子6個を与えることができるπ電子を与える同一又は異な るリガンドの1つ又は2つを表し; qは錯体カチオンの残留電荷である1又は2の整数であり; y及びZは0、1又は2の整数であるが、yとzの総和は2に等しく; Xは金属又はメタロイドの有機スルホネートアニオン及びハロゲン含有錯体ア ニオンから選択されるアニオンであり;そして nは錯体カチオンの電荷qを中和するのに必要とする錯体アニオン数である1 又は2の整数である)で表される請求項1に記載の組 成物。 3.前記塩が、ビス−(η6−アレーン)鉄錯体カチオン及びビス(η5−シク ロペンタジエニル)鉄錯体カチオンからなる群から選択される請求項1又は2に 記載の組成物。 4.ビス−(η6−アレーン)鉄錯体カチオンとともに使用される前記安定化 添加剤が第1種〜第3種からなる群から選択される式を有するか、ビス−η5− シクロペンタジエニル)鉄錯体カチオンとともに使用される前記安定化添加剤が 第2種、第4種及び第5種からなる群から選択される請求項3に記載の組成物。 5.請求項1〜4のいずれかに記載の硬化した組成物。 6.a)請求項1〜4のいずれかに記載の硬化性組成物を準備する工程と、 b)前記組成物に、十分なエネルギーを熱及び光の少なくとも一つの形態でい ずれかの組み合わせ及び順序において加えて前記組成物を硬化させる工程と、 を含んでなる方法。 7.少なくとも一方の表面に請求項1〜5のいずれかに記載の組成物の層を有 する基材を含んでなる物品。 8.前記組成物が、接着剤、保護塗料又は研磨塗膜若しくは磁気媒体用バイン ダーである請求項7に記載の物品。 9.a)基材の少なくとも一方の表面に、請求項1〜4のいずれかに記載のエ ネルギー重合性組成物層を塗布する工程と、 b)前記組成物に、十分なエネルギーを熱及び光の少なくとも一つの形態で、 いずれかの組み合わせ及び順序において前記組成物を硬化させるに十分な時間供 給する工程と、 を含んでなる方法。 10.有機金属錯体カチオンの少なくとも一種の塩と、下式VI II: (式中、R2及びR3は独立して前記で定義した通りであり、dは1又は2である )により表されるシッフ塩基とを含んでなる請求項1〜4のいずれかに記載の二 成分開始剤を含んでなる物質の組成物°
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/078,738 US5494943A (en) | 1993-06-16 | 1993-06-16 | Stabilized cationically-curable compositions |
| US08/078,738 | 1993-06-16 | ||
| PCT/US1994/005243 WO1994029364A1 (en) | 1993-06-16 | 1994-05-12 | Stabilized cationically-curable compositions |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007130946A Division JP4662963B2 (ja) | 1993-06-16 | 2007-05-16 | 安定化カチオン硬化性組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08511572A true JPH08511572A (ja) | 1996-12-03 |
Family
ID=22145930
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7501785A Withdrawn JPH08511572A (ja) | 1993-06-16 | 1994-05-12 | 安定化カチオン硬化性組成物 |
| JP2007130946A Expired - Lifetime JP4662963B2 (ja) | 1993-06-16 | 2007-05-16 | 安定化カチオン硬化性組成物 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007130946A Expired - Lifetime JP4662963B2 (ja) | 1993-06-16 | 2007-05-16 | 安定化カチオン硬化性組成物 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US5494943A (ja) |
| EP (5) | EP1277778B1 (ja) |
| JP (2) | JPH08511572A (ja) |
| KR (1) | KR100381949B1 (ja) |
| CN (1) | CN1125456A (ja) |
| CA (1) | CA2162883A1 (ja) |
| DE (3) | DE69435343D1 (ja) |
| ES (2) | ES2227757T3 (ja) |
| WO (1) | WO1994029364A1 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7144471B2 (en) | 2001-02-13 | 2006-12-05 | International Business Machines Corporation | Bonding method and apparatus |
| JP2014106407A (ja) * | 2012-11-28 | 2014-06-09 | Toppan Printing Co Ltd | 液晶表示装置用カラーフィルタ |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5744557A (en) * | 1993-06-16 | 1998-04-28 | Minnesota Mining And Manufacturing Company | Energy-curable cyanate/ethylenically unsaturated compositions |
| KR0172779B1 (ko) * | 1995-03-29 | 1999-03-20 | 김주용 | 감광막 제거 방법 |
| DE19629082A1 (de) * | 1996-07-18 | 1998-01-22 | Siemens Ag | Thermisch härtbares einkomponentiges Low viskosity Adhesive-Klebstoffsystem für Verklebungen im Mikrobereich |
| FR2752582B1 (fr) * | 1996-08-21 | 2003-06-13 | Rhone Poulenc Chimie | Compositions a base de polyorganosiloxanes a groupements fonctionnels reticulables et leur utilisation pour la realisation de revetements anti-adherents |
| US5982271A (en) * | 1996-11-28 | 1999-11-09 | Tdk Corporation | Organic positive temperature coefficient thermistor |
| US6858260B2 (en) | 1997-05-21 | 2005-02-22 | Denovus Llc | Curable sealant composition |
| US6174932B1 (en) * | 1998-05-20 | 2001-01-16 | Denovus Llc | Curable sealant composition |
| US6277898B1 (en) * | 1997-05-21 | 2001-08-21 | Denovus Llc | Curable sealant composition |
| US5973020A (en) * | 1998-01-06 | 1999-10-26 | Rhodia Inc. | Photoinitiator composition including hindered amine stabilizer |
| US6187836B1 (en) | 1998-06-05 | 2001-02-13 | 3M Innovative Properties Company | Compositions featuring cationically active and free radically active functional groups, and methods for polymerizing such compositions |
| JP3737285B2 (ja) * | 1998-08-28 | 2006-01-18 | 積水化学工業株式会社 | 光硬化性組成物、光硬化性接着シート、及び接合方法 |
| JP3739211B2 (ja) * | 1998-08-28 | 2006-01-25 | 積水化学工業株式会社 | 光硬化型粘接着シート、光硬化型粘接着シートの製造方法及び接合方法 |
| US6306926B1 (en) * | 1998-10-07 | 2001-10-23 | 3M Innovative Properties Company | Radiopaque cationically polymerizable compositions comprising a radiopacifying filler, and method for polymerizing same |
| US6133335A (en) * | 1998-12-31 | 2000-10-17 | 3M Innovative Properties Company | Photo-polymerizable compositions and articles made therefrom |
| US6265459B1 (en) | 1998-12-31 | 2001-07-24 | 3M Innovative Properties Company | Accelerators useful for energy polymerizable compositions |
| US6482868B1 (en) | 1998-12-31 | 2002-11-19 | 3M Innovative Properties Company | Accelerators useful for energy polymerizable compositions |
| DE19912251A1 (de) * | 1999-03-18 | 2000-09-21 | Espe Dental Ag | Zweikomponentige Zubereitungen zur Herstellung von zahntechnischen Modellen |
| US6413699B1 (en) * | 1999-10-11 | 2002-07-02 | Macdermid Graphic Arts, Inc. | UV-absorbing support layers and flexographic printing elements comprising same |
| US6635689B1 (en) * | 2000-06-26 | 2003-10-21 | 3M Innovative Properties Company | Accelerators for cationic polymerization catalyzed by iron-based catalysts |
| US6391523B1 (en) * | 2000-09-15 | 2002-05-21 | Microchem Corp. | Fast drying thick film negative photoresist |
| WO2002057321A1 (en) * | 2001-01-16 | 2002-07-25 | Henkel Loctite Corporation | Oil-activated sheet metal adhesive compositions |
| US20040094264A1 (en) * | 2001-01-30 | 2004-05-20 | Hiroaki Yamaguchi | Method for adhering substrates using light activatable adhesive film |
| US6592801B2 (en) * | 2001-04-30 | 2003-07-15 | Essilor International Compagnie Generale D'optique | Photopolymerization of episulfides using metal complexes and its use for making ophthalmic lenses |
| US7053133B2 (en) * | 2001-05-29 | 2006-05-30 | Hiroaki Yamaguchi | Ultraviolet activatable adhesive film |
| US6955739B2 (en) * | 2001-06-19 | 2005-10-18 | 3M Innovative Properties Company | Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus |
| US20040266913A1 (en) * | 2001-09-13 | 2004-12-30 | Hiroaki Yamaguchi | Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition |
| US20050256230A1 (en) * | 2002-04-01 | 2005-11-17 | Hiroaki Yamaguchi | Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition |
| US6773474B2 (en) | 2002-04-19 | 2004-08-10 | 3M Innovative Properties Company | Coated abrasive article |
| GB0212977D0 (en) * | 2002-06-06 | 2002-07-17 | Vantico Ag | Actinic radiation curable compositions and their use |
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- 1994-05-12 ES ES98121860T patent/ES2227757T3/es not_active Expired - Lifetime
- 1994-05-12 DE DE69435343T patent/DE69435343D1/de not_active Expired - Lifetime
- 1994-05-12 EP EP02020091A patent/EP1277778B1/en not_active Expired - Lifetime
- 1994-05-12 EP EP98121861A patent/EP0896974B1/en not_active Expired - Lifetime
- 1994-05-12 DE DE69433493T patent/DE69433493T2/de not_active Expired - Fee Related
- 1994-05-12 KR KR1019950705722A patent/KR100381949B1/ko not_active Expired - Fee Related
- 1994-05-12 DE DE69434027T patent/DE69434027T2/de not_active Expired - Fee Related
- 1994-05-12 JP JP7501785A patent/JPH08511572A/ja not_active Withdrawn
- 1994-05-12 CA CA002162883A patent/CA2162883A1/en not_active Abandoned
- 1994-05-12 ES ES98121861T patent/ES2210647T3/es not_active Expired - Lifetime
- 1994-05-12 EP EP94916072A patent/EP0703937A1/en not_active Ceased
- 1994-05-12 EP EP02020090A patent/EP1277777A3/en not_active Withdrawn
- 1994-05-12 EP EP98121860A patent/EP0909773B1/en not_active Expired - Lifetime
- 1994-05-12 WO PCT/US1994/005243 patent/WO1994029364A1/en not_active Ceased
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1995
- 1995-11-03 US US08/552,632 patent/US5672637A/en not_active Expired - Lifetime
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7144471B2 (en) | 2001-02-13 | 2006-12-05 | International Business Machines Corporation | Bonding method and apparatus |
| JP2014106407A (ja) * | 2012-11-28 | 2014-06-09 | Toppan Printing Co Ltd | 液晶表示装置用カラーフィルタ |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007217709A (ja) | 2007-08-30 |
| EP0896974A3 (en) | 1999-05-06 |
| CA2162883A1 (en) | 1994-12-22 |
| ES2227757T3 (es) | 2005-04-01 |
| JP4662963B2 (ja) | 2011-03-30 |
| KR100381949B1 (ko) | 2003-08-21 |
| WO1994029364A1 (en) | 1994-12-22 |
| EP0909773A3 (en) | 1999-05-06 |
| EP1277777A2 (en) | 2003-01-22 |
| CN1125456A (zh) | 1996-06-26 |
| DE69433493T2 (de) | 2004-12-02 |
| EP0703937A1 (en) | 1996-04-03 |
| EP0909773B1 (en) | 2004-09-22 |
| US5672637A (en) | 1997-09-30 |
| DE69433493D1 (de) | 2004-02-19 |
| US5494943A (en) | 1996-02-27 |
| EP0896974A2 (en) | 1999-02-17 |
| EP1277778A3 (en) | 2003-11-26 |
| EP1277777A3 (en) | 2003-11-26 |
| EP0896974B1 (en) | 2004-01-14 |
| EP1277778B1 (en) | 2011-04-13 |
| DE69434027T2 (de) | 2005-09-08 |
| EP1277778A2 (en) | 2003-01-22 |
| DE69434027D1 (de) | 2004-10-28 |
| ES2210647T3 (es) | 2004-07-01 |
| DE69435343D1 (de) | 2011-05-26 |
| EP0909773A2 (en) | 1999-04-21 |
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