JPH087635Y2 - TAB semiconductor device manufacturing equipment - Google Patents

Description

[Detailed Description of the Invention] [Industrial field of application] The present invention relates to a manufacturing apparatus for a TAB semiconductor device (hereinafter referred to as a TAB IC) using a TAB (Tape Automated Bonding) tape.

[Prior Art] Conventionally, a TAB IC is composed of a semiconductor pellet 1 on which bump electrodes 2 are formed and a TAB tape 3 as shown in FIG. 3, for example. The TAB tape 3 includes, for example, a long polyimide film 4 having through holes 4a formed at predetermined intervals and a copper foil 5 on the polyimide film 4.
And the bump electrodes 2 corresponding to a plurality of inner leads 6 corresponding to bonding wires on the copper foil 5.
Are formed.

The semiconductor pellet 1 and the TAB tape 3 are electrically connected in the following connecting process. That is, in this connecting step, the corresponding inner leads 6 of the TAB tape 3 are superposed on each bump electrode 2 and heated and thermocompression-bonded from above, for example, while being pressed by a bonding tool. By the way, since the bump electrode 2 is high but low (about several tens of μm),
It is necessary to prevent the inner leads 6 that have been separated from coming into contact with the semiconductor pellet 1 and other bump electrodes 2.

Therefore, conventionally, as shown in FIG. 4, while the semiconductor pellet 1 is supported on the support base 9, the punch 10 is pressed from above by a soft and elastic silicon rubber punch 10 to make the punch.
The inner lead 6 is processed into a stepped shape, while the elastic deformation of the inner wire 10 makes it convex. In this way, the semiconductor pellet 1 in which the inner leads 6 are processed is covered with resin to complete the TAB IC. And the TAB formula after completion
When the inner lead 6 of the IC is cut by the user,
The tips of the inner leads 6 are processed so as to be deformed to the upper side of the semiconductor pellet 1. Therefore, the cut inner leads 6 are moved away from the semiconductor pellet 1, and there is no possibility that the inner leads 6 contact the semiconductor pellet 1 or the bump electrodes 2 thereof.

[Problems to be Solved by the Invention] However, since the lower end surface of the punch 10 is a flat surface, when the inner lead 6 is pressed, the lower end surface of the punch 10 comes into close contact with the upper surface of the inner lead 6. ,
Inner lead 6 when punch 10 returns upward after processing
However, there is a problem that the shape of the inner lead 6 processed into a desired state is deformed as indicated by reference numeral 6a. In particular, in the punch 10 used for a long period of time, the silicone rubber has a property of increasing the adhesiveness with the lapse of time, and the punch 10 and the inner lead 6 are more easily brought into close contact with each other.

When the inner lead 6 as described above is repeatedly processed by the punch 10 made of silicon rubber which is easily deformed, a convex step is formed on the lower end surface of the punch 10, and the step of the film 4 is sequentially moved. If the inner leads 6 do not match, the inner leads 6 are deformed so as to be twisted, and there is a problem in that they cannot be processed into a desired shape.

The present invention has been made to solve the above problems,
The purpose of the present invention is to provide a TAB type semiconductor device manufacturing apparatus capable of preventing the inner lead from being pulled up and deformed in close contact with the punch in order to process the inner lead into a desired shape with a punch made of silicon rubber. To do.

[Means for Solving the Problems] In order to achieve the above object, the TAB type semiconductor device manufacturing apparatus of the present invention etches a copper foil laminated on a film having through holes formed at predetermined intervals. A semiconductor pellet is placed in the through hole of a TAB tape having an inner lead extending into the through hole, and the inner lead of a TAB type semiconductor device in which the electrode on the semiconductor pellet and the inner lead are connected is pressed by an elastic punch. In the TAB type semiconductor device manufacturing apparatus for press shaping, a recess is formed on the pressing surface of the punch.

[Operation] In the TAB type semiconductor device manufacturing apparatus of the present invention, when the pressing surface of the punch made of silicon rubber presses the inner lead, first, the peripheral edge of the recess is pressed against the inner lead, and then the punch is further pressed. When the inner lead is pressed downward, the center portion of the concave portion projects in a convex shape, and the inner lead is processed into a desired shape. On the other hand, when the punch returns after the processing, the central portion of the concave portion is gradually separated from the inner lead first while the peripheral portion of the concave portion is still pressing the inner lead. For this reason, the punch does not return with the pressing surface of the punch closely contacting the entire surface of the inner lead, and it is prevented that the inner lead once processed into a desired shape is deformed by the return movement of the punch. .

Further, since the depression surface is formed on the pressing surface of the punch, the depression surface is formed on the pressing surface of the punch. It is possible to prevent the surface from being formed with a convex habit, and there is no possibility that the inner lead is twisted due to the convex habit.

[Embodiment] An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing a TAB type semiconductor device manufacturing apparatus according to an embodiment of the present invention. The semiconductor device in which the manufacturing apparatus of the present invention is used is the TAB type IC described above, and is composed of the semiconductor pellet 1 and the TAB type tape 3. The TAB tape 3 comprises a long polyimide film 4 laminated with a copper foil 5 and a plurality of inner leads 6 extending in the through holes 4a.
Are formed on the copper foil 5. In the manufacturing process of the TAB type IC, the inner lead 6 on the TAB tape 3 side is connected to the bump electrode 2 formed on the semiconductor pellet 1.
In this connecting step, the inner lead 6 is pressure-heated and bonded and integrated by a bonding tool (not shown). After the inner lead 6 is pressed as described later, the joint portion is covered with a resin (not shown) for protection and reinforcement.

The punch 10 made of silicon rubber, which is a feature of the present invention, is formed by pressing the inner lead 6 away from the semiconductor pellet 1 after the step of joining the bump electrode 2 and the inner lead 6. That is, the punch 10 has a lower end surface, which is a pressing surface, and a curved surface 11 that is an example of a concave portion.
It is formed on. The curved surface 11 is formed such that the central portion 12 is the uppermost surface, and the curved surface 11 gradually descends downward toward the peripheral edge portion 13. The punch 10 is configured to repeat the raising / lowering operation in a state where the semiconductor pellet 1 is placed on the support base 9, and press down the inner leads 6 sequentially sent on the pass line.

The manufacture of the TAB type IC by the punch 10 having the curved surface 11 is performed as shown in FIGS.
That is, each bump electrode 2 of the semiconductor pellet 1 on the support 9
Corresponding inner lead 6 formed on TAB tape 3
Are superposed on each other, and a bonding tool (not shown) is lowered from above, for example, to apply pressure and heat to thermocompress each of them to form a united joint. After that, when the punch 10 is lowered, first, as shown in FIG.
13 first comes into pressure contact with the inner lead 6. Then, as shown in FIG. 2B, when the punch 10 is further lowered, the curved surface 11 is protruded by the elasticity of the punch 10 itself, and the central portion 12 is projected in a convex shape.
It is pressed into a stepped shape that keeps it away from. After shaping and processing the inner lead 6 into a desired shape in this manner, the punch 10 is raised as shown in FIG. At this time, in the curved surface 11 of the punch 10, the central portion 12 is first lifted and peeled off from the upper surface of the inner lead 6, and the peripheral edge portion
Peel off in sequence toward 13. Therefore, unlike the conventional case, the punch 10 does not rise while the punch 10 remains in close contact with the entire surface of the inner lead 6, and when the punch 10 rises, the inner lead 6 that has been processed once is punched.
It is prevented that the punch 10 is lifted together with the punch 10 and is deformed while being attached to the lower end surface of the punch 10.

When the curved surface 11 is formed as in this embodiment, the curved surface 11 is peeled off from the inner lead 6 sequentially from the central portion 12 as the punch 10 is raised, and the inner lead 6 is prevented from being deformed. The effect is further promoted. Also curved surface
As shown in FIG. 2 (a), the peripheral edge portion 13 of 11 first presses the tip portion of the inner lead 6 and then the punch 10 moves the inner lead 6
Since the inner lead 6 does not move during the machining, the machining accuracy is improved. Moreover, since the peripheral edge portion 3 is continuous over the entire circumference, it is possible to effectively press the plurality of inner leads 6.

Further, since the curved portion 11 is formed on the punch 10, even if the punch 10 is used for a long period of time and the pressing process of the inner lead 6 is repeated many times, a convex habit is generated on the lower end surface of the punch 10. Hard to do. Therefore, even if the position of the inner lead 6 of the TAB tape 3 moving along the pass line is deviated from the normal position, the inner lead 6 can be prevented from being twisted due to the convex habit.

Note that the pressing surface of the punch is not limited to the case where the curved surface 11 is formed as in the above-described embodiment, and a concave portion is provided by providing an annular or island-shaped wall of an appropriate height at the peripheral portion of the pressing surface. It can also be formed.

Further, the punch 10 is set to a thickness that allows bending in the vertical direction, the upper end is a convex surface, and when the inner lead is pressed, the convex surface is first pressed to press the central portion of the concave portion of the lower end surface downward, After the completion of pressing, the pressing of the convex surface may be released and the central portion of the lower end may be retracted to raise the punch 10.

[Effects of the Invention] As described above, in the TAB type semiconductor device manufacturing apparatus of the present invention, after the inner lead is processed into a desired shape, when the punch is restored, the peripheral edge of the recess is the inner lead. While pressing, the central part of the recess will be peeled off from the inner lead first, so the punch will not return with the pressing surface of the punch in close contact with the entire surface of the inner lead. Also, it is possible to prevent the inner lead from being deformed by the return movement of the punch.

In addition, the concave portion formed in the punch can prevent the pressing surface of the punch from having a convex habit, and can prevent the inner lead from being twisted due to the convex habit. .

[Brief description of drawings]

FIG. 1 is a partially cutaway perspective view showing an apparatus for manufacturing a TAB type semiconductor device according to an embodiment of the present invention, and FIGS. FIG. 3 is a partially cutaway perspective view showing a processed state of a conventional inner lead, and FIG. 4 is a sectional view of a main part showing a processed state of a conventional inner lead. 1 ... Semiconductor pellet, 2 ... Electrode, 3 ... TAB tape, 4a ... Through hole, 5 ... Copper foil, 6 ... Inner lead,
10 …… Punch, 11 …… Concave.

Claims (1)

[Scope of utility model registration request] 1. A semiconductor pellet is placed in a through hole of a TAB tape in which inner leads extending into the through hole are formed by etching a copper foil laminated on a film having through holes formed at predetermined intervals. In a TAB semiconductor device manufacturing apparatus in which an inner lead of a TAB semiconductor device in which an electrode on a semiconductor pellet and an inner lead are connected to each other is pressed and shaped by an elastic punch, a depression is formed on the pressing surface of the punch. Characterized by
TAB semiconductor device manufacturing equipment.