JPH0415841U - - Google Patents

Info

Publication number
JPH0415841U
JPH0415841U JP1990058399U JP5839990U JPH0415841U JP H0415841 U JPH0415841 U JP H0415841U JP 1990058399 U JP1990058399 U JP 1990058399U JP 5839990 U JP5839990 U JP 5839990U JP H0415841 U JPH0415841 U JP H0415841U
Authority
JP
Japan
Prior art keywords
semiconductor device
type semiconductor
tab type
manufacturing apparatus
inner lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990058399U
Other languages
Japanese (ja)
Other versions
JPH087635Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990058399U priority Critical patent/JPH087635Y2/en
Publication of JPH0415841U publication Critical patent/JPH0415841U/ja
Application granted granted Critical
Publication of JPH087635Y2 publication Critical patent/JPH087635Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例に係るＴＡＢ式半導
体装置の製造装置を示す一部破断斜視図、第２図
イ〜ハはいずれも、本考案の製造装置によるイン
ナーリードの加工状態を示す要部断面図、第３図
は従来のインナーリードの加工状態を示す一部破
断斜視図、第４図は従来のインナーリードの加工
状態を示す要部断面図である。 １……半導体ペレツト、２……電極、３……Ｔ
ＡＢテープ、４ａ……透孔、５……銅箔、６……
インナーリード、１０……パンチ、１１……凹部
。 FIG. 1 is a partially cutaway perspective view showing a TAB type semiconductor device manufacturing apparatus according to an embodiment of the present invention, and FIGS. 2A to 2C each show the processing state of an inner lead by the manufacturing apparatus of the present invention. FIG. 3 is a partially cutaway perspective view showing a conventional inner lead in a processed state, and FIG. 4 is a main part sectional view showing a conventional inner lead in a processed state. 1...Semiconductor pellet, 2...Electrode, 3...T
AB tape, 4a...through hole, 5...copper foil, 6...
Inner lead, 10... punch, 11... recess.

Claims (1)

【実用新案登録請求の範囲】 透孔を所定間隔で穿設してなるフイルム上の積
層した銅箔をエツチングして透孔内に延びるイン
ナーリードを形成したＴＡＢテープの透孔内に半
導体ペレツトを配置し、半導体ペレツト上の電極
とインナーリードとを弾性したＴＡＢ式半導体装
置のインナーリードを弾性を有するパンチにて圧
押し整形するＴＡＢ式半導体装置の製造装置にお
いて、 上記パンチの押圧面に凹部を形成したことを特
徴とするＴＡＢ式半導体装置の製造装置。[Scope of Claim for Utility Model Registration] Semiconductor pellets are placed in the holes of a TAB tape that has inner leads extending into the holes formed by etching the copper foil laminated on the film with holes formed at predetermined intervals. In a manufacturing apparatus for a TAB type semiconductor device in which an elastic punch is used to press and shape an inner lead of a TAB type semiconductor device in which an elastic electrode and an inner lead are placed on a semiconductor pellet, a recess is formed on the pressing surface of the punch. A manufacturing apparatus for a TAB type semiconductor device, characterized in that:
JP1990058399U 1990-05-31 1990-05-31 TAB semiconductor device manufacturing equipment Expired - Fee Related JPH087635Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990058399U JPH087635Y2 (en) 1990-05-31 1990-05-31 TAB semiconductor device manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990058399U JPH087635Y2 (en) 1990-05-31 1990-05-31 TAB semiconductor device manufacturing equipment

Publications (2)

Publication Number Publication Date
JPH0415841U true JPH0415841U (en) 1992-02-07
JPH087635Y2 JPH087635Y2 (en) 1996-03-04

Family

ID=31583974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990058399U Expired - Fee Related JPH087635Y2 (en) 1990-05-31 1990-05-31 TAB semiconductor device manufacturing equipment

Country Status (1)

Country Link
JP (1) JPH087635Y2 (en)

Also Published As

Publication number Publication date
JPH087635Y2 (en) 1996-03-04

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees