JPH089162Y2 - Substrate holding device - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION This invention is applicable to energy of ion beam, electron beam, plasma, etc. on a substrate in a vacuum or other atmosphere such as an ion implanter, an ion beam etching device, an electron beam irradiation device, etc. The present invention relates to a substrate holding device used when a particle having a particle is incident, and more specifically to a means for improving the cooling performance of the substrate.

[0002]

2. Description of the Related Art A conventional example of this type of substrate holding device is shown in FIG.

This substrate holding device includes a base 2 for supporting a substrate (for example, a wafer) 6 and a disc-shaped rubber-like elastic body attached to the surface of a substrate mounting seat 21 of the base 2 with an adhesive. 4 and a pressing ring 8 that presses the peripheral portion of the substrate 6 toward the base 2 by utilizing the force of a spring (not shown). Then, the substrate 6 held on this is subjected to a required treatment, for example, by being irradiated with an ion beam through the opening of the holding ring 8.

The rubber-like elastic body 4 directly attaches the substrate 6 to the base 2
Microscopically, this is because the contact area between the two is small to compensate for poor heat conduction, and the heat generated in the substrate 6 due to irradiation with an ion beam or the like is
The coolant is transmitted to the base 2 via the rubber-like elastic body 4, and is normally discharged to the outside by the coolant passing through the coolant passage 22 in the base 2, whereby the substrate 6 is cooled.
The rubber-like elastic body 4 is made of, for example, silicone rubber.

[0005]

[Problems to be Solved by the Invention] The rubber-like elastic body 4
In general, the entire back surface of the base 2 is adhered to the base 2 with an adhesive, but it was found by experiments that the heat conduction between the substrate 6 and the base 2 is poor. It is considered that this is because an adhesive layer is formed between the rubber-like elastic body 4 and the base 2.

In order to improve this, a means of partially adhering only the periphery of the rubber-like elastic body 4 to the base 2 was tried, but this is still better than the case of adhering the entire surface. However, the rubber-like elastic body 4 at the bonded part
Since the adhesive permeates into and cures, the adhesiveness to the base 2 and the like deteriorates, so that there is a problem that the heat conduction between the substrate 6 and the base 2 is not so good.

Therefore, the main object of the present invention is to improve the heat conduction between the substrate and the base, thereby improving the cooling performance of the substrate.

[0008]

To achieve the above object, the substrate holding device of the present invention has an O-ring portion integrally formed on the outer peripheral portion of a rubber-like elastic body as described above, and has a flat surface on the base. It is characterized in that a dovetail groove having a ring shape is formed, and the O-ring portion is pushed and fixed in the dovetail groove of the base in a state where the rubber-like elastic body is stretched.

[0009]

According to the above structure, the rubber-like elastic body can be mounted on the base properly without causing wrinkles. As a result, the adhesion between the rubber-like elastic body and the base and the substrate is improved, and since no adhesive is used, heat conduction between the substrate and the base is improved.

[0010]

1 is a sectional view showing a substrate holding device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing the rubber-like elastic body in FIG. 1 taken out. The same or corresponding portions as those of the conventional example in FIG. 3 are denoted by the same reference numerals, and the differences from the conventional example will be mainly described below.

In this embodiment, an O-ring portion 41 is integrally formed on the outer peripheral portion of the disk-shaped rubber-like elastic body 4 as described above, and the substrate is mounted on the base 2 as described above. A ring-shaped dovetail groove 23 is formed in a plan view so as to surround the seat 21. The diameter of the O-ring portion 41 of the rubber-like elastic body 4 in the natural state is slightly smaller than the diameter of the dovetail groove 23.

The O-ring portion 41 is pushed into the dovetail groove 23 of the base 2 in a state where the rubber-like elastic body 4 is stretched, so that the rubber-like elastic body 4 is attached to the substrate mounting seat 21 of the base 2. Fixed on the surface of.

According to the above structure, the rubber-like elastic body 4 can be mounted on the base 2 exactly without wrinkling. As a result, the adhesion between the rubber-like elastic body 4 and the base 2 and the substrate 6 is improved, and since an adhesive that deteriorates heat conduction is not used, the substrate 6 and the base 2 are not used.
The heat conduction between and becomes better. Therefore, the cooling performance of the substrate 6 is improved.

Further, since the rubber-like elastic body 4 is not adhered, it can be easily replaced.

The rubber-like elastic body 4 may be made of a material other than the above-mentioned silicone rubber, such as fluororubber.

Further, when the substrate mounting seat 21 of the base 2 has a sectional shape which is convex like a part of a spherical surface as in this embodiment, the adhesion between the rubber elastic body 4 and the substrate 6 is improved. Therefore, it is preferable to use a flat surface without doing so.

The base 2 is usually provided with the refrigerant passage 22 as in this embodiment, but whether or not the refrigerant passage 22 is provided does not affect the essence of the present invention.

The base 2 may be one that holds one substrate 6 such as a platen, or may be one that holds a plurality of substrates 6 such as a wafer disk.

[0019]

As described above, according to the present invention, the adhesion between the rubber-like elastic body and the base and the substrate is improved, and since no adhesive that deteriorates heat conduction is used, the substrate and the base are The heat conduction between the two becomes better. As a result, the cooling performance of the substrate is improved. Further, since the rubber-like elastic body is not adhered, it is easy to replace it.

[Brief description of drawings]

FIG. 1 is a sectional view showing a substrate holding device according to an embodiment of the present invention.

FIG. 2 is a sectional view showing a rubber-like elastic body in FIG. 1 taken out.

FIG. 3 is a cross-sectional view showing an example of a conventional substrate holding device.

[Explanation of symbols]

 2 base 21 substrate mounting seat 23 dovetail groove 4 rubber-like elastic body 41 O-ring portion 6 substrate 8 presser ring

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display location H01L 21/265 21/3065

Claims (1)

[Scope of utility model registration request] 1. A base for supporting a substrate, a disk-shaped rubber-like elastic body provided on a surface of a substrate mounting seat of the base, and a pressing ring for pressing a peripheral portion of the substrate toward the base. In a substrate holding device comprising: a rubber-like elastic body, an O-ring-shaped portion is integrally formed on an outer peripheral portion of the rubber-like elastic body; The substrate holding device is characterized in that the O-ring portion is pushed into the dovetail groove of the base to be fixed.