JPH0896694A - Chip type current fuse - Google Patents
Chip type current fuseInfo
- Publication number
- JPH0896694A JPH0896694A JP25749694A JP25749694A JPH0896694A JP H0896694 A JPH0896694 A JP H0896694A JP 25749694 A JP25749694 A JP 25749694A JP 25749694 A JP25749694 A JP 25749694A JP H0896694 A JPH0896694 A JP H0896694A
- Authority
- JP
- Japan
- Prior art keywords
- fuse element
- fuse
- electrode
- cover member
- joining portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012212 insulator Substances 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 abstract description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000020169 heat generation Effects 0.000 abstract description 3
- 230000004927 fusion Effects 0.000 abstract 1
- 210000001503 joint Anatomy 0.000 description 4
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Fuses (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はチップ形電流ヒューズに
係り、特にプリント配線基板等に表面実装等の可能な超
小型のチップ形のヒューズに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type current fuse, and more particularly to a microminiature chip type fuse which can be surface-mounted on a printed wiring board or the like.
【0002】[0002]
【従来の技術】実開平5−69847号、実公平1−3
0779号公報等には、上述のチップ形のヒューズの一
例が開示されている。このヒューズは、角型の絶縁基体
の上面に凹所を設け、該凹所に低融点の有機絶縁材を充
填するとともに、有機絶縁材に沿って幅広のヒューズエ
レメントを配設して構成されている。係るヒューズによ
れば、エンドキャップの無いチップ形のヒューズが実現
される。しかしながら、幅広の金属抵抗被膜層を有機絶
縁材層の表面に連続的に設けるため、その構造がやや複
雑であり、その溶断特性も金属抵抗被膜が関与するため
複雑となる。2. Description of the Related Art Actual Kaihei No. 5-69847, Actual Fair 1-3
Japanese Patent Publication No. 0779 discloses an example of the above-mentioned chip-type fuse. This fuse is configured by forming a recess in the upper surface of a rectangular insulating base, filling the recess with an organic insulating material having a low melting point, and disposing a wide fuse element along the organic insulating material. There is. According to such a fuse, a chip-type fuse without an end cap is realized. However, since a wide metal resistance coating layer is continuously provided on the surface of the organic insulating material layer, its structure is slightly complicated, and its fusing property is complicated because the metal resistance coating is involved.
【0003】一方で、本出願人により、図5に示す構造
のチップ形ヒューズが提案されている(実願平5−40
258号、実願平5−40259号実用新案登録出願
等)。図5(A)は縦断面図、(B)は側断面図であ
る。絶縁基体1は凹部6を有する超小型の角型の例えば
アルミナ碍子等の耐熱性絶縁物である。該凹部6の縦方
向の両端部7,7には、上面電極10、下面電極13及
び側面電極11が形成されている。On the other hand, the applicant of the present invention has proposed a chip-type fuse having the structure shown in FIG.
No. 258, Japanese Utility Model Application No. 5-40259, utility model registration application, etc.). 5A is a vertical sectional view, and FIG. 5B is a side sectional view. The insulating substrate 1 is a heat-resistant insulator such as an alumina insulator having a small size and having a recess 6. An upper surface electrode 10, a lower surface electrode 13, and a side surface electrode 11 are formed on both ends 7, 7 of the recess 6 in the vertical direction.
【0004】ヒューズエレメント4は、絶縁基体1の中
空の凹部6上の両端部7の上面電極10,10間に懸架
されている。ヒューズエレメント4を配置した絶縁基体
1の上面には、絶縁基体1のカバー部材15が嵌着され
ている。このようにヒューズエレメント4は、従来の管
型ヒューズと同様の中空部分に懸架された金属細線であ
るため、それぞれの直径に応じた一定の電流が流れると
大気中で溶断し、その溶断容量、溶断特性は管型ヒュー
ズと同様である。The fuse element 4 is suspended between the upper surface electrodes 10 at both ends 7 on the hollow recess 6 of the insulating base 1. The cover member 15 of the insulating base 1 is fitted on the upper surface of the insulating base 1 on which the fuse element 4 is arranged. As described above, since the fuse element 4 is a thin metal wire suspended in the hollow portion similar to the conventional tubular fuse, when a constant current corresponding to each diameter flows, the fuse element 4 is melted in the atmosphere and its melting capacity, The fusing characteristic is similar to that of the tubular fuse.
【0005】[0005]
【発明が解決しようとする課題】しかしながら、このよ
うなヒューズエレメントとその端子接合部が同一平面上
にある構造では、短絡遮断等の電流により、接合部で発
熱を生じ、短絡遮断、定格溶断等で安定した特性が得ら
れない場合がある。However, in such a structure in which the fuse element and the terminal joint portion thereof are on the same plane, heat is generated at the joint portion due to a current such as short circuit interruption, short circuit interruption, rated fusing, etc. In some cases, stable characteristics may not be obtained.
【0006】本発明は上記事情に鑑みて為されたもので
あり、ヒューズエレメントとその端子接合部が同一平面
上にあるチップ形ヒューズで、端子接合部の放熱を改善
することにより、溶断特性及び製造歩留を良好なものと
することのできるチップ形ヒューズを提供することを目
的とする。The present invention has been made in view of the above circumstances, and is a chip-type fuse in which a fuse element and its terminal joint portion are on the same plane, and by improving the heat dissipation of the terminal joint portion, the fusing characteristics and An object of the present invention is to provide a chip-type fuse that can improve the manufacturing yield.
【0007】[0007]
【課題を解決するための手段】本発明のチップ形電流ヒ
ューズは、角型の絶縁基体の中間部分に凹部を設け、該
凹部の両端部には端子電極に連通した電極を設け、該凹
部の両端部の電極間には金属細線からなるヒューズエレ
メントが懸架され、該ヒューズエレメントの両端部は前
記電極と接合部を形成し、前記ヒューズエレメントの接
合部に接触もしくは近接するように耐熱性絶縁物からな
るカバー部材を配置したことを特徴とする。In the chip-type current fuse of the present invention, a recess is provided in an intermediate portion of a rectangular insulating base, and electrodes communicating with terminal electrodes are provided at both ends of the recess. A fuse element made of a thin metal wire is suspended between the electrodes at both ends, and both ends of the fuse element form a joint with the electrode, and a heat-resistant insulator so as to come into contact with or come close to the joint of the fuse element. A cover member made of is arranged.
【0008】[0008]
【作用】ヒューズエレメントの接合部に耐熱性絶縁物か
らなるカバー部材を接触もしくは近接するように配置し
たことから、接合部で発生する熱を有効にカバー部材に
逃がすことができる。従って、溶断電流を流した時の接
合部での温度上昇が抑えられ、ヒューズエレメント中央
部分の本来溶断すべき部分で確実に溶断するようにな
る。Since the cover member made of a heat-resistant insulator is arranged in contact with or close to the joint portion of the fuse element, the heat generated at the joint portion can be effectively released to the cover member. Therefore, the temperature rise at the joint portion when the fusing current is applied is suppressed, and the fuse element is surely blown at the central portion which should be blown.
【0009】[0009]
【実施例】本発明の実施例を以下に添付の図面を参照し
ながら説明する。Embodiments of the present invention will be described below with reference to the accompanying drawings.
【0010】図1(A)は、本発明の第1実施例の絶縁
基体本体部分の縦断面図、(B)はその側断面図であ
る。絶縁基体1は凹部6を有する超小型の角型のセラミ
ック等の耐熱性絶縁物であり、本実施例ではアルミナ碍
子を用いている。該凹部6の縦方向の両端部7には、予
備電極10A、下面電極13及び側面電極11が金属キ
ャップにより形成されている。FIG. 1A is a vertical sectional view of an insulating base body portion of a first embodiment of the present invention, and FIG. 1B is a side sectional view thereof. The insulating substrate 1 is a heat-resistant insulating material such as a microminiature rectangular ceramic having a concave portion 6, and an alumina insulator is used in this embodiment. A preliminary electrode 10A, a lower surface electrode 13, and a side surface electrode 11 are formed on both ends 7 of the recess 6 in the vertical direction by metal caps.
【0011】ヒューズエレメント4は、絶縁基体1の中
空の凹部6上の両端部7の予備電極10A,10A間に
仮止めされ懸架されている。ヒューズエレメント4は、
例えば直径数十μmのオーダーの極細線であり、例え
ば、Cu線の表面上にAgメッキ膜を被覆したもの、あ
るいはAg線単独等から構成されている。このようにヒ
ューズエレメント4は、従来の管型ヒューズと同様の中
空部分に懸架された金属細線であるため、それぞれの直
径に応じた一定の電流が流れると大気中で溶断し、その
溶断容量、溶断特性は管型ヒューズと同様である。The fuse element 4 is temporarily fixed and suspended between the preliminary electrodes 10A, 10A at both ends 7 on the hollow recess 6 of the insulating substrate 1. The fuse element 4 is
For example, it is an ultrafine wire with a diameter of several tens of μm, and is composed of, for example, a Cu wire whose surface is coated with an Ag plating film, or an Ag wire alone. As described above, since the fuse element 4 is a thin metal wire suspended in the hollow portion similar to the conventional tubular fuse, when a constant current corresponding to each diameter flows, the fuse element 4 is melted in the atmosphere and its melting capacity, The fusing characteristic is similar to that of the tubular fuse.
【0012】図2(A)は、絶縁基体1に耐熱性絶縁物
からなるカバー部材15を嵌着した図であり、(B)
は、(A)のBB線に沿った断面図である。カバー部材
15は、絶縁基体1と同様な例えばアルミナ碍子の角型
の部材であり、凹部6を備えており、その両端部17は
それぞれ本体の両端部7と接合するようになっている。
ヒューズエレメント4の予備電極10Aとの接合部上
に、カバー部材15の表面が電極に接触するように配置
される。尚、チップ形電流ヒューズのカバー部材15を
絶縁基体1に嵌着することにより、図示するような箱型
(チップ形)の電流ヒューズが形成される。FIG. 2A is a view in which a cover member 15 made of a heat resistant insulator is fitted on the insulating substrate 1, and FIG.
[Fig. 4] is a sectional view taken along line BB in (A). The cover member 15 is, for example, an alumina insulator rectangular member similar to the insulating base 1, and is provided with a recess 6, and both ends 17 thereof are respectively joined to both ends 7 of the main body.
The fuse element 4 is arranged on the joint with the preliminary electrode 10A so that the surface of the cover member 15 contacts the electrode. By fitting the cover member 15 of the chip-type current fuse on the insulating substrate 1, a box-type (chip-type) current fuse as shown in the drawing is formed.
【0013】図3(A)は、本発明の第2実施例の縦断
面図、(B)はBB線に沿った側断面図である。図4
(A)、(B)はそれぞれカバー部材を嵌着した状態を
示す。本実施例においても、角型の絶縁基体1の中間部
分に凹部6が設けられ、凹部6の両端部7の上面には、
下面電極13、側面電極11に連通した上面電極10が
金属キャップにより形成されている。上面電極10,1
0間には金属細線からなるヒューズエレメント4が懸架
され、ヒューズエレメント4の両端は、上面電極10,
10に例えばスポット溶接により接合され、接合部を形
成している。FIG. 3A is a vertical sectional view of the second embodiment of the present invention, and FIG. 3B is a side sectional view taken along the line BB. Figure 4
(A) and (B) show the state in which the cover member is fitted. Also in this embodiment, the concave portion 6 is provided in the middle portion of the rectangular insulating substrate 1, and the upper surfaces of both end portions 7 of the concave portion 6 are
The upper surface electrode 10 communicating with the lower surface electrode 13 and the side surface electrode 11 is formed by a metal cap. Top electrodes 10, 1
A fuse element 4 made of a thin metal wire is suspended between 0, and both ends of the fuse element 4 are connected to the upper surface electrodes 10,
10 is joined by, for example, spot welding to form a joint.
【0014】本実施例においては、ヒューズエレメント
4の両端を包み込むように、耐熱性絶縁物(例えばアル
ミナ碍子)からなるキャップ15が嵌着されている。キ
ャップ15もその中間部分に凹部6を備え、その両端部
17は、ヒューズエレメント4の接合部に接触もしくは
近接するように配置されている。In this embodiment, caps 15 made of a heat resistant insulator (eg, alumina insulator) are fitted so as to wrap both ends of the fuse element 4. The cap 15 also has a recess 6 in the middle thereof, and both ends 17 thereof are arranged so as to come into contact with or be close to the joint of the fuse element 4.
【0015】このように、角型の絶縁基体の中間部分に
凹部を設け、該凹部の両端部間の電極部分にヒューズエ
レメントを懸架したことから、ヒューズエレメントは気
中で溶断することとなる。従って、ヒューズエレメント
の溶断特性は、通常の管型ヒューズと同等の溶断特性が
得られる。絶縁基体の両端の端子部には接合部に連通し
た端子電極を設けることから、チップ形の表面実装可能
な超小型の回路用遮断素子となる。As described above, since the concave portion is provided in the intermediate portion of the rectangular insulating substrate and the fuse element is suspended on the electrode portion between both ends of the concave portion, the fuse element is blown in the air. Therefore, the fusing characteristic of the fuse element is the same as that of a normal tubular fuse. Since the terminal electrodes at both ends of the insulating base are provided with the terminal electrodes communicating with the joints, the chip-type surface-mountable ultra-small circuit breaker element is obtained.
【0016】次に上述の各実施例のチップ形電流ヒュー
ズの動作について説明する。一定値以上の電流が流れる
とヒューズエレメントが溶断するのであるが、ヒューズ
エレメントとその接合部が同一平面上にあり、その接合
部の上に接触もしくは近接して例えばセラミック等の耐
熱性絶縁物を配置すると、接合部で生じる発熱を耐熱性
絶縁物に拡散される。この拡散熱量は、耐熱性絶縁物の
熱伝導率が通常のプラスチックケース等と比較して高い
ことにより生じるもので、近接させるよりも接触させた
方がより大きくなる。又、図2の第1実施例のように、
接合部に金属電極を介して耐熱性絶縁物のカバーを接触
させることにより、より効果的である。Next, the operation of the chip-type current fuse of each of the above-mentioned embodiments will be described. The fuse element melts when a current of a certain value or more flows.However, the fuse element and its joint are on the same plane, and a heat-resistant insulator such as ceramic should be placed in contact with or close to the joint. When arranged, the heat generated at the joint is diffused into the heat resistant insulator. This amount of heat of diffusion is caused by the fact that the heat conductivity of the heat-resistant insulator is higher than that of an ordinary plastic case or the like. Also, as in the first embodiment of FIG.
It is more effective to bring the cover of the heat-resistant insulator into contact with the joint via the metal electrode.
【0017】ヒューズエレメントの溶断電流を流した時
に、接合部で発生する熱を、カバーに逃がすことができ
ると、接合部の発熱、即ち温度上昇を抑えることができ
る。従って、ヒューズエレメント4の中央部分での発熱
が大きくなり、その部分で確実に溶断させることができ
るようになる。このため、短絡遮断、定格溶断等で安定
した溶断特性が得られる。また、ヒューズエレメント4
に過電流が流れた場合には、ヒューズエレメント4は基
体1及びカバーの中空部6,6の気中で溶断するので、
その溶断特性は通常の管型ヒューズと全く同じであり、
極めて安定した溶断特性が得られる。If the heat generated in the joint portion when the fusing current of the fuse element is passed can be released to the cover, heat generation of the joint portion, that is, temperature rise can be suppressed. Therefore, the heat generated in the central portion of the fuse element 4 becomes large, and the fuse element 4 can be surely blown. Therefore, stable fusing characteristics can be obtained by short-circuit breaking, rated fusing, and the like. In addition, the fuse element 4
When an overcurrent flows to the fuse element 4, the fuse element 4 is blown in the air of the base body 1 and the hollow portions 6 and 6 of the cover.
Its fusing characteristics are exactly the same as a normal tube fuse,
Very stable fusing characteristics can be obtained.
【0018】[0018]
【発明の効果】以上に説明したように、本発明のチップ
形電流ヒューズは、凹部を有する角型の絶縁基体の、凹
部上に細線状のヒューズエレメントを懸架し、耐熱性を
有する絶縁物からなるカバー部材をヒューズエレメント
接合部に接触もしくは近接するように配置したものであ
る。従って、ヒューズエレメント接合部の発熱がカバー
部材に逃げるようになり、接合部の発熱を抑え、短絡遮
断、定格溶断等で安定した特性が得られる。従って、本
発明により、超小型のチップ形のヒューズの溶断特性を
安定化することができ、且つ量産における不良率を低減
し、製造歩留を向上させることができた。As described above, according to the chip type current fuse of the present invention, a thin wire-shaped fuse element is suspended above a concave portion of a rectangular insulating base having a concave portion and is made of an insulating material having heat resistance. The cover member is arranged so as to be in contact with or close to the fuse element joint portion. Therefore, the heat generated at the fuse element joint portion escapes to the cover member, the heat generated at the joint portion is suppressed, and stable characteristics such as short circuit interruption and rated fusing can be obtained. Therefore, according to the present invention, it is possible to stabilize the fusing characteristics of the microminiature chip-type fuse, reduce the defective rate in mass production, and improve the manufacturing yield.
【図1】本発明の第1実施例のチップ形電流ヒューズの
絶縁基体の(A)縦断面図、(B)そのBB線に沿った
側断面図。FIG. 1A is a vertical sectional view of an insulating substrate of a chip type current fuse according to a first embodiment of the present invention, and FIG. 1B is a side sectional view taken along the line BB.
【図2】上図においてカバー部材を嵌着した状態を示す
(A)縦断面図、(B)その側断面図。2A is a vertical sectional view showing a state in which a cover member is fitted in the upper diagram, and FIG. 2B is a side sectional view thereof.
【図3】本発明の第2実施例のチップ形電流ヒューズの
絶縁基体の(A)縦断面図、(B)そのBB線に沿った
側断面図。FIG. 3A is a vertical sectional view of an insulating substrate of a chip-type current fuse according to a second embodiment of the present invention, and FIG. 3B is a side sectional view taken along the line BB.
【図4】上図においてカバー部材を嵌着した状態を示す
(A)縦断面図、(B)その側断面図。4A is a vertical sectional view showing a state in which a cover member is fitted in the upper diagram, and FIG. 4B is a side sectional view thereof.
【図5】従来のチップ形電流ヒューズの絶縁基体の
(A)縦断面図、(B)その側断面図。5A is a longitudinal sectional view of an insulating substrate of a conventional chip-type current fuse, and FIG. 5B is a side sectional view thereof.
1 絶縁基体(アルミナ碍子) 4 ヒューズエレメント 6 凹部 7,17 両端部 10 上面電極 10A 予備電極 11,12,13 電極 15 カバー部材 1 Insulating Substrate (Alumina Insulator) 4 Fuse Element 6 Recesses 7, 17 Both Ends 10 Top Surface Electrode 10A Spare Electrode 11, 12, 13 Electrode 15 Cover Member
Claims (1)
け、該凹部の両端部には端子電極に連通した電極を設
け、該凹部の両端部の電極間には金属細線からなるヒュ
ーズエレメントが懸架され、該ヒューズエレメントの両
端部は前記電極と接合部を形成し、前記ヒューズエレメ
ントの接合部に接触もしくは近接するように耐熱性絶縁
物からなるカバー部材を配置したことを特徴とするチッ
プ形電流ヒューズ。1. A fuse element comprising a rectangular insulating substrate provided with a concave portion at an intermediate portion thereof, electrodes provided at both ends of the concave portion communicating with terminal electrodes, and a metal thin wire provided between electrodes at both ends of the concave portion. A chip, wherein both ends of the fuse element form a joint with the electrode, and a cover member made of a heat-resistant insulator is arranged so as to come into contact with or close to the joint of the fuse element. Type current fuse.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25749694A JPH0896694A (en) | 1994-09-27 | 1994-09-27 | Chip type current fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25749694A JPH0896694A (en) | 1994-09-27 | 1994-09-27 | Chip type current fuse |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0896694A true JPH0896694A (en) | 1996-04-12 |
Family
ID=17307102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25749694A Pending JPH0896694A (en) | 1994-09-27 | 1994-09-27 | Chip type current fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0896694A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007119358A1 (en) * | 2006-03-16 | 2007-10-25 | Matsushita Electric Industrial Co., Ltd. | Surface-mount current fuse |
| JP2007280919A (en) * | 2006-03-16 | 2007-10-25 | Matsushita Electric Ind Co Ltd | Surface mount type current fuse and manufacturing method thereof |
| JP2010186639A (en) * | 2009-02-12 | 2010-08-26 | Chin-Chi Yang | Fuse unit and high-density conductive alloy wire used for the same |
| DE102010015629A1 (en) * | 2010-04-20 | 2011-10-20 | Conquer Electronics Co., Ltd. | Method for manufacturing fuse element, involves transversely passing sections of electrical connectors to plate through conductive pieces, where fuse elements are formed at ends of electrical connectors, respectively |
| KR20220040299A (en) * | 2020-09-23 | 2022-03-30 | 주식회사 유라코퍼레이션 | Installation Structure of Flexible Printed Circuit Board |
| KR20220040300A (en) * | 2020-09-23 | 2022-03-30 | 주식회사 유라코퍼레이션 | Flexible Printed Circuit Board and Manufacturing Method thereof |
-
1994
- 1994-09-27 JP JP25749694A patent/JPH0896694A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007119358A1 (en) * | 2006-03-16 | 2007-10-25 | Matsushita Electric Industrial Co., Ltd. | Surface-mount current fuse |
| JP2007280919A (en) * | 2006-03-16 | 2007-10-25 | Matsushita Electric Ind Co Ltd | Surface mount type current fuse and manufacturing method thereof |
| US8368502B2 (en) | 2006-03-16 | 2013-02-05 | Panasonic Corporation | Surface-mount current fuse |
| JP2010186639A (en) * | 2009-02-12 | 2010-08-26 | Chin-Chi Yang | Fuse unit and high-density conductive alloy wire used for the same |
| DE102010015629A1 (en) * | 2010-04-20 | 2011-10-20 | Conquer Electronics Co., Ltd. | Method for manufacturing fuse element, involves transversely passing sections of electrical connectors to plate through conductive pieces, where fuse elements are formed at ends of electrical connectors, respectively |
| DE102010015629B4 (en) * | 2010-04-20 | 2020-11-12 | Conquer Electronics Co., Ltd. | Fuse element |
| KR20220040299A (en) * | 2020-09-23 | 2022-03-30 | 주식회사 유라코퍼레이션 | Installation Structure of Flexible Printed Circuit Board |
| KR20220040300A (en) * | 2020-09-23 | 2022-03-30 | 주식회사 유라코퍼레이션 | Flexible Printed Circuit Board and Manufacturing Method thereof |
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