JPH0436029Y2 - - Google Patents
Info
- Publication number
- JPH0436029Y2 JPH0436029Y2 JP9288486U JP9288486U JPH0436029Y2 JP H0436029 Y2 JPH0436029 Y2 JP H0436029Y2 JP 9288486 U JP9288486 U JP 9288486U JP 9288486 U JP9288486 U JP 9288486U JP H0436029 Y2 JPH0436029 Y2 JP H0436029Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal material
- melting point
- point metal
- electrode
- low melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007769 metal material Substances 0.000 claims description 23
- 238000002844 melting Methods 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 12
- 230000008018 melting Effects 0.000 description 16
- 239000007772 electrode material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Fuses (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は基板型温度ヒユーズの改良に関するも
のである。[Detailed Description of the Invention] (Field of Industrial Application) The present invention relates to an improvement of a substrate type temperature fuse.
（先行技術と問題点）
基板型温度ヒユーズは、第２図に示す様に絶縁
基板１′の片面上に一対の層状電極２′，２′を設
け、電極間に低融点金属材３′を溶接し、当該低
融点金属材上にフラツクス層４′を設け、基板の
片面上に絶縁樹脂をモールドした構成である。(Prior Art and Problems) As shown in Figure 2, the substrate type temperature fuse has a pair of layered electrodes 2', 2' on one side of an insulating substrate 1', and a low melting point metal material 3' between the electrodes. The structure is such that a flux layer 4' is provided on the low melting point metal material by welding, and an insulating resin is molded on one side of the substrate.
温度ヒユーズにおいては、ヒユーズ作動までに
多数回のヒートサイクルを受け、このヒートサイ
クル中に、電極の金属材が低融点金属材に移行
し、この移行量が多量になれば、低融点金属材の
融点に変動が生じ、温度ヒユーズの作動温度に狂
いが生じるおそれがある。従つて、係る不利を解
消するには、電極と低融点金属材との接触面積を
小さくすることが有効であり、このために上記電
極の巾を細くすることが考えられる。 Temperature fuses undergo many heat cycles before the fuse is activated. During these heat cycles, the metal material of the electrode transfers to a low melting point metal material, and if this amount of transfer becomes large, the low melting point metal material changes. Fluctuations may occur in the melting point, which may cause deviations in the operating temperature of the temperature fuse. Therefore, in order to eliminate such disadvantages, it is effective to reduce the contact area between the electrode and the low-melting point metal material, and it is conceivable to reduce the width of the electrode for this purpose.
しかし、温度ヒユーズ作動時での低融点金属材
の溶断においては、溶融低融点金属材が電極に大
なる表面張力で引張られることが必要であり、こ
の引張力は溶融低融点金属材の電極への接触面積
が大なるほど大となるから、上記電極巾の細巾化
は低融点金属材の迅速なる溶断に不利である。 However, when blowing a low melting point metal material when a temperature fuse is activated, it is necessary for the molten low melting point metal material to be pulled by the electrode with a large surface tension, and this tensile force is applied to the electrode of the molten low melting point metal material. The larger the contact area becomes, the narrower the electrode width is, which is disadvantageous for rapid melting of low-melting metal materials.
このように、電極の細巾化は一長一短を招来す
る。 In this way, making the electrode narrower brings both advantages and disadvantages.
（考案の目的）
本考案の目的は、電極材の移行による低融点金
属材の特性変動を防止でき、かつ低融点金属材の
溶断迅速性をも充分に確保できる基板型温度ヒユ
ーズを提供することにある。(Purpose of the invention) The purpose of the invention is to provide a substrate-type temperature fuse that can prevent changes in the characteristics of a low-melting point metal material due to migration of electrode materials, and can sufficiently ensure rapid blowout of the low-melting point metal material. It is in.
（考案の構成）
本考案に係る基板型温度ヒユーズは、くびれ部
を有する一対の層状電極を絶縁基板上に設け、低
融点金属材両端のそれぞれを上記各電極のくびれ
部に溶接したことを特徴とする構成である。(Structure of the invention) The substrate-type temperature fuse according to the invention is characterized in that a pair of layered electrodes each having a constricted portion are provided on an insulated substrate, and both ends of a low-melting metal material are welded to the constricted portion of each electrode. The configuration is as follows.
（実施例の説明） 以下、図面により本考案を説明する。(Explanation of Examples) The present invention will be explained below with reference to the drawings.
第１図において、１は絶縁基板であり、例え
ば、セラミツクス板を用いることができる。２，
２は一対の層状電極であり、くびれ部２０，２０
を備えている。この層状電極は、例えば、銀系、
銅系、または金系導電性ペーストの印刷・焼付け
によつて形成できる。３は低融点金属材であり、
線状または箔状であり、くびれ部において上記電
極に溶接してある。４は低融点金属材上に設けた
フラツクス層、５は絶縁基板上に設けたモールド
樹脂層である。 In FIG. 1, reference numeral 1 denotes an insulating substrate, and for example, a ceramic plate can be used. 2,
2 is a pair of layered electrodes, with constricted portions 20, 20
It is equipped with This layered electrode is made of, for example, silver-based,
It can be formed by printing and baking a copper-based or gold-based conductive paste. 3 is a low melting point metal material,
It has a wire or foil shape, and is welded to the electrode at the constriction. 4 is a flux layer provided on a low melting point metal material, and 5 is a molded resin layer provided on an insulating substrate.
（考案の効果）
本考案に係る基板型温度ヒユーズは上述した通
りの構成であり、電極にくびれ部を設け、このく
びれ部に低融点金属材を溶接してあるから、低融
点金属材と電極との接触面積を小さくでき、ヒー
トサイクル中での電極材の低融点金属材への移行
を充分に防止できる。従つて、温度特性の安定化
を図り得る。(Effects of the invention) The substrate type temperature fuse according to the invention has the configuration as described above, and the electrode has a constriction and a low melting point metal material is welded to this constriction. The contact area with the electrode material can be reduced, and migration of the electrode material to a low melting point metal material during heat cycles can be sufficiently prevented. Therefore, it is possible to stabilize the temperature characteristics.
又、低融点金属材が溶融すれば、その溶融金属
材が流動によりくびれ部の電極表面に充分な線端
長さで接触するから、溶融金属材の電極への引張
表面張力を大にでき、低融点金属材の溶断を迅速
に行わせ得る。 In addition, when the low melting point metal material melts, the molten metal material flows and comes into contact with the electrode surface at the constriction part with a sufficient wire end length, so the tensile surface tension of the molten metal material to the electrode can be increased. Low melting point metal materials can be quickly fused.
従つて、本考案によれば、安定な温度作動特
性、迅速な溶断特性を有する基板型温度ヒユーズ
を提供できる。 Therefore, according to the present invention, it is possible to provide a substrate type temperature fuse having stable temperature operation characteristics and rapid blowout characteristics.
第１図は本考案に係る基板型温度ヒユーズを示
す説明図、第２図は従来例を示す説明図である。
図において、１は絶縁基板、２，２は電極、２
０，２０はくびれ部、３は低融点金属材である。
FIG. 1 is an explanatory diagram showing a substrate type temperature fuse according to the present invention, and FIG. 2 is an explanatory diagram showing a conventional example. In the figure, 1 is an insulating substrate, 2, 2 are electrodes, 2
0 and 20 are constrictions, and 3 is a low melting point metal material.
Claims (1)
に設け、低融点金属材両端のそれぞれを上記各電
極のくびれ部に溶接したことを特徴とする基板型
温度ヒユーズ。 1. A substrate-type temperature fuse, characterized in that a pair of layered electrodes having constricted portions are provided on an insulating substrate, and both ends of a low-melting point metal material are welded to the constricted portions of each of the electrodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9288486U JPH0436029Y2 (en) | 1986-06-17 | 1986-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9288486U JPH0436029Y2 (en) | 1986-06-17 | 1986-06-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63436U JPS63436U (en) | 1988-01-05 |
| JPH0436029Y2 true JPH0436029Y2 (en) | 1992-08-26 |
Family
ID=30954971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9288486U Expired JPH0436029Y2 (en) | 1986-06-17 | 1986-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436029Y2 (en) |
-
1986
- 1986-06-17 JP JP9288486U patent/JPH0436029Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63436U (en) | 1988-01-05 |
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