JPH09205276A - Component mounting structure - Google Patents

Component mounting structure

Info

Publication number
JPH09205276A
JPH09205276A JP3013496A JP3013496A JPH09205276A JP H09205276 A JPH09205276 A JP H09205276A JP 3013496 A JP3013496 A JP 3013496A JP 3013496 A JP3013496 A JP 3013496A JP H09205276 A JPH09205276 A JP H09205276A
Authority
JP
Japan
Prior art keywords
component
mounting structure
bonding
board
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3013496A
Other languages
Japanese (ja)
Other versions
JP3413746B2 (en
Inventor
Takehiro Itou
丈浩 伊藤
Kazushi Sakai
一志 酒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kenwood KK
Original Assignee
Kenwood KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kenwood KK filed Critical Kenwood KK
Priority to JP03013496A priority Critical patent/JP3413746B2/en
Publication of JPH09205276A publication Critical patent/JPH09205276A/en
Application granted granted Critical
Publication of JP3413746B2 publication Critical patent/JP3413746B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting structure by which a removal operation is easy by a method in which the bonding piece of a component to be mounted is installed in a position separated at a prescribed interval from the surface of a board. SOLUTION: A shielding case 1 is provided with bonding pieces 1b which are cut and erected from upper edges of cutout parts 1a formed in proper places in the bottom part. The bonding pieces 1b are arranged so as to be aligned with positions of grounding patterns 2a on the surface of a printed-wiring board 2, and they are soldered and bonded. The bonding pieces 1b are designed to be bent in such a way that they are separated and levitated by a prescribed interval D from the surface when the shielding case 1 is placed on the surface of the board 2. When they are soldered and bonded, solder bridges the bonding pieces 1b and grounding patterns 2a. Thereby, when it is required to remove the shielding case 1 from the printed-wiring board 3 for a later repair operation or the like after a face mounting operation by a soldering and bonding operation, the solder can be removed by using a solder gobbler or the like, and the shielding case 1 can be removed easily.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、実装部品を基板に
面実装する部品取付構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting structure for surface-mounting mounted components on a board.

【０００２】[0002]

【従来の技術】従来、実装部品例えばシールドケースを
基板に面実装する場合、図３に示すように、シールドケ
ース１の接合片１ｂは底部より切り起こされており、基
板２の接地パターン（銅箔）２ａ面にぴったりと接触し
ていたため、一度半田付けをしてしまうと、シールドケ
ースを取り外す必要が生じた場合に吸い取り器等で半田
を除去しきれなかった。そのため、シールドケースの取
り外し作業に非常に多大な労力がかかるという問題があ
った。2. Description of the Related Art Conventionally, when a mounting component such as a shield case is surface-mounted on a substrate, a joining piece 1b of the shield case 1 is cut and raised from the bottom as shown in FIG. Since it was in close contact with the surface of the foil 2a, once soldered, the solder could not be completely removed by a suction device or the like when the shield case had to be removed. Therefore, there has been a problem that a great deal of labor is required to remove the shield case.

【０００３】[0003]

【発明が解決しようとする課題】本発明の目的は、上記
従来の問題点を解消し、取り外し作業の容易な部品取付
構造を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to solve the above problems of the prior art and to provide a parts mounting structure which is easy to remove.

【０００４】[0004]

【課題を解決するための手段】本発明に係る部品取付構
造は、基板の表面に実装部品の接合片を半田付接合する
ことにより基板に実装部品を面実装する部品取付装置に
おいて、前記実装部品の接合片は前記基板の表面から所
定の間隔だけ離れた位置に設けられているものである。
また、実装部品はシールドケースである。また、接合片
はシールドケースの下部に形成された切り欠き部の上縁
から切り起こされているものである。また、実装部品は
フラットパッケージＩＣであり、接合片は接続ピンであ
る。A component mounting structure according to the present invention is a component mounting device for surface mounting a mounted component on a substrate by soldering a joining piece of the mounted component to the surface of the substrate. The joining piece of is provided at a position separated from the surface of the substrate by a predetermined distance.
The mounted component is a shield case. Further, the joining piece is cut and raised from the upper edge of the notch formed in the lower part of the shield case. Further, the mounted component is a flat package IC, and the joint piece is a connection pin.

【０００５】[0005]

【作用】実装部品の接合片が基板の表面から所定の間隔
だけ離れた位置に設けられているため、この実装部品を
基板に半田付けした後、修理等のために実装部品を取り
外す必要が生じたとき、半田除去が容易になり取り外し
が簡単にできる。[Operation] Since the joining piece of the mounting component is provided at a position separated from the surface of the substrate by a predetermined distance, it is necessary to remove the mounting component for repair or the like after soldering the mounting component to the substrate. In this case, the solder can be easily removed and easily removed.

【０００６】[0006]

【発明の実施の形態】図１（Ａ）、（Ｂ）及び（Ｃ）は
本発明に係る部品取付装置の一実施例の概略斜視図、部
分拡大斜視図及び部分拡大断面図である。図において、
シールドケース１は、底部の適当な場所に形成された切
り欠き部１ａの上縁より切り起こされた接合片１ｂを備
えており、この接合片１ｂをプリント基板２の表面上の
接地パターン２ａの位置に合わせて配置した後、半田付
接合する。接合片１ｂは、シールドケース１を基板２の
表面に置いたときに該表面から所定の間隔Ｄ（例えば
０. ５ｍｍ）だけ離れて浮くように曲げて設計してあ
り、半田付接合する際、半田が接合片１ｂと接地パター
ン２ａ間を橋絡する形になる。このような構造にするこ
とにより、半田付接合による面実装後、後修理等のため
にシールドケース１をプリント基板２から取り外す必要
が生じたとき、半田吸い取り器等での半田の除去が容易
になり、したがってシールドケース１を容易に取り外す
ことができる。それにより、従来のものとほぼ同じコス
トで実現することができる。なお、上記のシールドケー
スは一体構成のものであるが、上部が蓋式の２体構成の
シールドケースでも良い。1 (A), 1 (B) and 1 (C) are a schematic perspective view, a partially enlarged perspective view and a partially enlarged sectional view of an embodiment of a component mounting apparatus according to the present invention. In the figure,
The shield case 1 includes a joining piece 1b cut and raised from the upper edge of the cutout portion 1a formed at an appropriate position on the bottom portion, and the joining piece 1b is connected to the ground pattern 2a on the surface of the printed circuit board 2. After arranging according to the position, soldering is performed. The joint piece 1b is designed to be bent so as to be spaced apart from the surface of the substrate 2 by a predetermined distance D (for example, 0.5 mm) when the shield case 1 is placed on the surface of the board 2. The solder bridges between the joining piece 1b and the ground pattern 2a. With such a structure, when it becomes necessary to remove the shield case 1 from the printed circuit board 2 for post-repair or the like after surface mounting by soldering, it is easy to remove the solder with a desoldering device or the like. Therefore, the shield case 1 can be easily removed. As a result, it can be realized at almost the same cost as the conventional one. Although the shield case described above has a one-piece construction, it may be a two-piece shield case having an upper lid.

【０００７】[0007]

【実施例】上記の説明は実装部品がシールドケースの場
合について行なったが、これに限らずプリント基板に面
で半田付することにより実装される他の実装部品にも適
用可能である。例えば図２に示すように、実装部品が３
で示すフラットパッケージＩＣの場合、その接合片とし
ての接続ピン３ａを基板２の実装表面から所定の間隔Ｄ
だけ離れた位置になるように設けることができる。な
お、３ｂは３ａと２ａとの間に所定の間隔を持たせるた
めに３ａの下側に一体形成した突起部である。また、実
装部品の接合片と基板表面の間隔Ｄは、接合片の大きさ
によって異なり適宜（例えば０. ４ｍｍ〜２. ０ｍｍ）
選択することができる。なお、前記の間隔が０. ４ｍｍ
以下だと浮かした効果がなくまた寸法誤差からも難し
い。一方、２ｍｍ以上になると半田付けが困難になる。[Embodiment] Although the above description has been made for the case where the mounting component is a shield case, the present invention is not limited to this, and it is also applicable to other mounting components mounted by soldering the printed circuit board on the surface. For example, as shown in FIG.
In the case of the flat package IC shown by, the connecting pin 3a as the joining piece is separated from the mounting surface of the substrate 2 by a predetermined distance D.
Can be provided so as to be separated from each other. Reference numeral 3b is a projection portion integrally formed on the lower side of 3a in order to provide a predetermined space between 3a and 2a. Further, the distance D between the joining piece of the mounted component and the surface of the substrate varies depending on the size of the joining piece and is appropriately (for example, 0.4 mm to 2.0 mm).
You can choose. The distance is 0.4mm.
Below this, there is no floating effect and it is difficult due to dimensional errors. On the other hand, if it is 2 mm or more, soldering becomes difficult.

【０００８】[0008]

【発明の効果】本発明に係る部品取付構造によれば、実
装部品の接合片が基板の実装表面から所定の間隔だけ離
れているので、半田付接合後の取り外しが容易になり、
生産性や修理性の大幅な改善を実現することができる。According to the component mounting structure of the present invention, since the joint piece of the mounted component is separated from the mounting surface of the substrate by a predetermined distance, it is easy to remove after soldering and joining.
Significant improvements in productivity and repairability can be realized.

【図面の簡単な説明】[Brief description of drawings]

【図１】（Ａ）、（Ｂ）及び（Ｃ）は本発明に係る部品
取付構造の一実施例の概略斜視図、部分拡大斜視図及び
部分拡大断面図である。1A, 1B, and 1C are a schematic perspective view, a partially enlarged perspective view, and a partially enlarged cross-sectional view of an embodiment of a component mounting structure according to the present invention.

【図２】本発明に係る部品取付構造の他の実施例の概略
図である。FIG. 2 is a schematic view of another embodiment of the component mounting structure according to the present invention.

【図３】（Ａ）、（Ｂ）及び（Ｃ）は従来の部品取付構
造の一実施例の概略斜視図、部分拡大斜視図及び部分拡
大断面図である。3 (A), (B) and (C) are a schematic perspective view, a partially enlarged perspective view and a partially enlarged sectional view of an example of a conventional component mounting structure.

【符号の説明】 １ シールドケース １ａ 切り欠き部 １ｂ 接合片 ２ プリント基板 ２ａ 接地パターン ３ フラットパッケージＩＣ ３ａ 接続ピン ３ｂ 突起部[Explanation of reference numerals] 1 shield case 1a cutout 1b joining piece 2 printed board 2a ground pattern 3 flat package IC 3a connection pin 3b protrusion

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】 基板に実装部品の接合片を半田付接合す
ることにより面実装する部品取付構造において、前記実
装部品の接合片は前記基板の表面から所定の間隔だけ離
れた位置に設けられていることを特徴とする部品取付構
造。1. In a component mounting structure for surface mounting by mounting a joining piece of a mounting component to a board by soldering, the joining piece of the mounting component is provided at a position separated from the surface of the board by a predetermined distance. Part mounting structure characterized by being 【請求項２】 請求項１記載の部品取付構造において、
実装部品はシールドケースである部品取付構造。2. The component mounting structure according to claim 1,
Mounted component is a shield case. 【請求項３】 請求項１記載の部品取付構造において、
実装部品はフラットパッケージＩＣであり、接合片は接
続ピンである部品取付構造。3. The component mounting structure according to claim 1,
The component mounting structure where the mounted component is a flat package IC and the joint piece is a connection pin. 【請求項４】 請求項２記載の部品取付構造において、
接合片はシールドケースの下部に形成された切り欠き部
の上縁から切り起こされている部品取付構造。4. The component mounting structure according to claim 2,
The joining piece is a component mounting structure that is cut and raised from the upper edge of the notch formed in the lower part of the shield case.
JP03013496A 1996-01-25 1996-01-25 Component mounting structure and mounting components Expired - Fee Related JP3413746B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP03013496A JP3413746B2 (en) 1996-01-25 1996-01-25 Component mounting structure and mounting components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03013496A JP3413746B2 (en) 1996-01-25 1996-01-25 Component mounting structure and mounting components

Publications (2)

Publication Number Publication Date
JPH09205276A true JPH09205276A (en) 1997-08-05
JP3413746B2 JP3413746B2 (en) 2003-06-09

Family

ID=12295313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP03013496A Expired - Fee Related JP3413746B2 (en) 1996-01-25 1996-01-25 Component mounting structure and mounting components

Country Status (1)

Country Link
JP (1) JP3413746B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001144487A (en) * 1999-11-12 2001-05-25 Kenwood Corp Shield case

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001144487A (en) * 1999-11-12 2001-05-25 Kenwood Corp Shield case

Also Published As

Publication number Publication date
JP3413746B2 (en) 2003-06-09

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