JPH09212822A - Thin film magnetic head and method of manufacturing the same - Google Patents
Thin film magnetic head and method of manufacturing the sameInfo
- Publication number
- JPH09212822A JPH09212822A JP2091696A JP2091696A JPH09212822A JP H09212822 A JPH09212822 A JP H09212822A JP 2091696 A JP2091696 A JP 2091696A JP 2091696 A JP2091696 A JP 2091696A JP H09212822 A JPH09212822 A JP H09212822A
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- Prior art keywords
- coil
- magnetic
- pattern
- core
- thin film
- Prior art date
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Abstract
(57)【要約】 （修正有）
【課題】バイアススパッタ後のコイル上の絶縁層の平坦
性を連続して得、後工程のパターニング工程の高精度
化、簡易、歩留まりの向上した薄膜磁気ヘッドを提供す
る。
【解決手段】コイル形成時にコイルパターンと略同一
幅、同間隔のダミーコイルパターン６を形成する。また
パターン幅の広くなるコイル接続部１０、ボンディング
パッド１１のパターンをコイルと略同幅、同間隔のパタ
ーン集合で形成する。
(57) [Abstract] (Corrected) [PROBLEMS] Thin film magnetic head in which flatness of an insulating layer on a coil after bias sputtering is continuously obtained, and a patterning process in a post process is highly accurate, simple, and yield is improved. I will provide a. SOLUTION: When forming a coil, a dummy coil pattern 6 having substantially the same width and spacing as the coil pattern is formed. Further, the patterns of the coil connection portion 10 and the bonding pad 11 having a wider pattern width are formed in a pattern set having substantially the same width and the same spacing as the coil.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＶＴＲ等の磁気記
録再生装置に使用する薄膜磁気ヘッドに係り、特にコイ
ル絶縁層を無機材で形成している磁気ヘッドに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film magnetic head used in a magnetic recording / reproducing apparatus such as a VTR, and more particularly to a magnetic head having a coil insulating layer formed of an inorganic material.
【０００２】[0002]
【従来の技術】薄膜磁気ヘッドの基板、磁気コア、絶縁
層、信号コイル、保護膜等の材料は、走行安定性を含め
たヘッド性能、摩耗寿命、信頼性等から、磁気特性、硬
度、耐湿性、膜強度、熱膨張係数、ヘッド作製の面から
は、成膜法、エッチング性等を考慮して選択しなければ
ならない。2. Description of the Related Art Materials such as a substrate, a magnetic core, an insulating layer, a signal coil, and a protective film of a thin film magnetic head are magnetic properties, hardness, moisture resistance, etc. in view of head performance including running stability, wear life, reliability, etc. From the viewpoint of the film forming property, film strength, thermal expansion coefficient, and head fabrication, the film forming method, etching property, etc. must be taken into consideration.
【０００３】従来、層間絶縁層の材料として、導体コイ
ルの凹凸を吸収して平坦化しやすい有機樹脂を用いてい
た。しかし、磁性膜の良好な磁気特性を得るために、４
００℃以上の熱処理を考えると、有機樹脂は、これに耐
えることができない。Conventionally, as a material for the interlayer insulating layer, an organic resin which absorbs irregularities of the conductor coil and is easily flattened has been used. However, in order to obtain good magnetic properties of the magnetic film, 4
Considering the heat treatment at 00 ° C. or higher, the organic resin cannot withstand this.
【０００４】かかる技術の欠点を解消した薄膜磁気ヘッ
ドとして、特開昭５８−１１１１１６号公報に記載され
ているように、層間絶縁層を無機絶縁材料で形成する方
法がある。従来技術では、熱処理に耐えられること等か
らＳｉＯ2がよく使われている。層間絶縁層の無機絶縁
層を用いた場合の絶縁層平坦化方法は、機械研磨による
平坦化ラップ、レジスト等の有機材料を塗布して平坦化
した後、無機材と有機材の等速エッチングを行うエッチ
バック法等がある。しかし、これらの方法は一度付けた
膜を再度別工程で取らねばならず、プロセスが煩雑であ
る。これらの方法に対し、絶縁膜を成膜しながら平坦化
エッチングを行うバイアススパッタ法がある。As a thin film magnetic head that has solved the drawbacks of the above technique, there is a method of forming an interlayer insulating layer with an inorganic insulating material, as described in Japanese Patent Laid-Open No. 58-111116. In the prior art, SiO 2 is often used because it can withstand heat treatment. The insulating layer flattening method when the inorganic insulating layer of the interlayer insulating layer is used is a flattening lap by mechanical polishing, an organic material such as a resist is applied and flattened, and then the inorganic material and the organic material are uniformly etched. There is an etch back method to be performed. However, in these methods, the film once applied must be taken again in another step, and the process is complicated. In contrast to these methods, there is a bias sputtering method in which flattening etching is performed while forming an insulating film.
【０００５】[0005]
【発明が解決しようとする課題】上記従来技術によれ
ば、１工程で平坦化された層間絶縁層を形成することが
できる。According to the above prior art, it is possible to form the planarized interlayer insulating layer in one step.
【０００６】しかし、バイアススパッタ法による平坦化
の場合、図７、図８に示すように下地のパターンのパタ
ーン幅、パターン間隔によって、平坦化の程度が異なる
ため、巻線パターンの部分は平坦化されても、パターン
幅の大きくなるコイル接続部、ボンディングパッド部は
充分には平坦化されず、絶縁層の膜厚は巻線部に比べて
厚くなる。また、巻線コイルの存在しない部分、つまり
パターン間隔の広い部分では巻線部分のパターン間隔部
の絶縁層の膜厚より薄くなる。従って素子全体として平
坦化されないため上記パターン上、パターン間隔部分で
の後工程のパターニング工程に悪影響を与える。However, in the case of flattening by the bias sputtering method, as shown in FIGS. 7 and 8, the degree of flattening varies depending on the pattern width and pattern interval of the underlying pattern, so that the winding pattern portion is flattened. However, the coil connection portion and the bonding pad portion having a large pattern width are not sufficiently flattened, and the film thickness of the insulating layer becomes thicker than that of the winding portion. Further, in the portion where the winding coil does not exist, that is, the portion where the pattern interval is wide, the film thickness is thinner than the insulating layer in the pattern interval portion of the winding part. Therefore, since the entire device is not flattened, it adversely affects the patterning process of the subsequent process in the pattern interval portion on the pattern.
【０００７】本発明の目的は、バイアススパッタ法によ
り均一な平坦無機絶縁層を形成し、後の工程の高精度
化、簡易、歩留まりの向上した薄膜磁気ヘッドを提供す
ることにある。It is an object of the present invention to provide a thin film magnetic head in which a uniform flat inorganic insulating layer is formed by the bias sputtering method, and the accuracy of the subsequent steps is improved, the simplicity and the yield are improved.
【０００８】[0008]
【課題を解決するための手段】上記目的は、コイル上の
絶縁層の平坦性を連続させるように、コイル形成時にコ
イルパターンと略同一幅、同間隔のダミーコイルパター
ンを形成する。またパターン幅の広くなるコイル接続
部、ボンディングパッド等のパターンをコイルと略同
幅、同間隔のパターン集合で形成することにより達成さ
れる。The above object is to form a dummy coil pattern having substantially the same width and spacing as the coil pattern when forming the coil so that the flatness of the insulating layer on the coil is continuous. Further, it is achieved by forming patterns such as a coil connecting portion and a bonding pad having a wide pattern width with a set of patterns having substantially the same width and the same interval as the coil.
【０００９】コイル形成時にコイルパターンと略同一
幅、同間隔のダミーコイルパターンを形成する。またパ
ターン幅の広くなるコイル接続部、ボンディングパッド
等のパターンをコイルと略同幅、同間隔のパターン集合
で形成することにより、バイアススパッタ後のコイル上
の絶縁層の平坦性を連続して得ることができるので、後
工程のパターニングを平坦部で行うことができるため、
パターンの高精度化、簡易、歩留まりの向上した薄膜磁
気ヘッドを提供することができる。At the time of forming the coil, a dummy coil pattern having substantially the same width as the coil pattern and having the same interval is formed. Further, by forming patterns such as a coil connecting portion and a bonding pad having a wide pattern width with a pattern set having substantially the same width and spacing as the coil, the flatness of the insulating layer on the coil after the bias sputtering can be continuously obtained. Since it is possible to perform the post-process patterning on the flat portion,
It is possible to provide a thin film magnetic head having a highly accurate pattern, simple pattern, and improved yield.
【００１０】[0010]
【発明の実施の形態】以下、本発明の実施例を図面を用
いて説明する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.
【００１１】図１は本発明による薄膜磁気ヘッドの第１
の実施例を示す平面図、図２は図１のＡ−Ａ’断面図で
あって、１は非磁性基板、２は磁気コア、３はコア接続
部、４，４’は信号コイル絶縁層、５，５’は信号コイ
ル、６，６’はダミーコイルパターン、７磁性基板（補
助磁極）、８は非磁性絶縁層、９は主磁極、１０はコイ
ル接続部、１１はコイルボンディングパッドである。FIG. 1 shows a first thin film magnetic head according to the present invention.
2 is a cross-sectional view taken along the line AA ′ of FIG. 1, in which 1 is a non-magnetic substrate, 2 is a magnetic core, 3 is a core connecting portion, and 4 and 4 ′ are signal coil insulating layers. , 5, 5'is a signal coil, 6, 6'is a dummy coil pattern, 7 a magnetic substrate (auxiliary magnetic pole), 8 is a non-magnetic insulating layer, 9 is a main magnetic pole, 10 is a coil connecting portion, 11 is a coil bonding pad. is there.
【００１２】本実施例では磁性基板１にはフェライト基
板を用いている。磁気コア材にはＣｏ−Ｔａ−Ｚｒ系ア
モルファス合金をスパッタリング等により形成してい
る。信号コイルはＣｒを接合層としてＣｕを蒸着等によ
り形成している。コイル絶縁層はＳｉＯ2等をバイアス
スパッタリングにより形成している。保護膜には、フォ
ルステライトをスパッタリングや蒸着等により形成して
いる。In this embodiment, a ferrite substrate is used as the magnetic substrate 1. A Co-Ta-Zr-based amorphous alloy is formed on the magnetic core material by sputtering or the like. The signal coil is formed by depositing Cu with Cr as a bonding layer. The coil insulating layer is formed by bias sputtering of SiO 2 or the like. Forsterite is formed on the protective film by sputtering, vapor deposition, or the like.
【００１３】以下、本発明による薄膜磁気ヘッドの製造
工程を図２によって説明する。The manufacturing process of the thin film magnetic head according to the present invention will be described below with reference to FIG.
【００１４】（１）非磁性基板１にダイシングソーやイ
オンエッチング等により溝を堀り、Ｃｏ−Ｔａ−Ｚｒ系
アモルファス合金をスパッタリング等により成膜、平坦
化して磁気コア２を形成する。(1) A groove is formed on the non-magnetic substrate 1 by a dicing saw, ion etching or the like, a Co-Ta-Zr type amorphous alloy is deposited by sputtering or the like and flattened to form a magnetic core 2.
【００１５】（２）非磁性絶縁材をスパッタリング等に
より成膜した後、Ｃｒ／Ｃｕ／Ｃｒ（Ｃｒ；接合層）か
ら成るコイル導体５及びダミーコイルパターン６を形成
した後、非磁性絶縁材をバイアススパッタリングにより
成膜し、コイル絶縁層４とする。この時、コイルパター
ンの巻線部、ダミーコイルパターンは同幅、同間隔と
し、またコイル接続部及びコイルボンディングパッドは
コイルパターンと同幅、同間隔のパターンの接続集合パ
ターンとする。(2) After depositing a non-magnetic insulating material by sputtering or the like, a coil conductor 5 and a dummy coil pattern 6 made of Cr / Cu / Cr (Cr; bonding layer) are formed, and then the non-magnetic insulating material is applied. A film is formed by bias sputtering to form the coil insulating layer 4. At this time, the winding portion of the coil pattern and the dummy coil pattern have the same width and the same spacing, and the coil connecting portion and the coil bonding pad have a connection set pattern having the same width and the same spacing as the coil pattern.
【００１６】（３）コイル接続部を形成した後、上層コ
イル５’及びダミーコイルパターン６’を形成した後、
非磁性絶縁材をバイアススパッタリングにより成膜し、
コイル絶縁層４’とする。この時も、コイルパターンの
巻線部、ダミーコイルパターンは同幅、同間隔とし、ま
たコイル接続部１０及びコイルボンディングパッド１１
はコイルパターンと同幅、同間隔のパターンの接続集合
パターンとする。(3) After forming the coil connection portion, after forming the upper layer coil 5'and the dummy coil pattern 6 ',
Non-magnetic insulating material is deposited by bias sputtering,
The coil insulating layer 4 ′ is used. Also at this time, the winding portion of the coil pattern and the dummy coil pattern have the same width and the same spacing, and the coil connecting portion 10 and the coil bonding pad 11 are also provided.
Is a connection set pattern having the same width and the same spacing as the coil pattern.
【００１７】（４）コア接続用のスルーホールを形成し
た後、Ｃｏ−Ｔａ−Ｚｒ系アモルファス合金をスパッタ
リング等により成膜、埋込平坦平滑化してコア接続部３
を形成する。また、コイルボンディングパッド１１上の
絶縁膜を除去する。(4) After forming a through hole for connecting the core, a Co-Ta-Zr type amorphous alloy is deposited by sputtering or the like, and the embedded flat surface is smoothed to form the core connecting portion 3.
To form Further, the insulating film on the coil bonding pad 11 is removed.
【００１８】（５）磁性基板７に非磁性絶縁層８を形成
した後、非磁性絶縁層にダイサーやイオンエッチング等
によりコア埋込用の溝を形成し、Ｃｏ−Ｔａ−Ｚｒ系ア
モルファス合金をスパッタリング等により成膜し、埋め
込み平坦化した後、主磁極用磁性膜をスパッタリング等
により成膜、パターニングして主磁極９を形成する。(5) After forming the non-magnetic insulating layer 8 on the magnetic substrate 7, a groove for embedding the core is formed in the non-magnetic insulating layer by dicer or ion etching, and a Co--Ta--Zr type amorphous alloy is formed. After the film is formed by sputtering or the like and buried and flattened, the magnetic film for the main magnetic pole is formed by sputtering or the like and patterned to form the main magnetic pole 9.
【００１９】（６）主磁極９および補助磁極となる磁性
基板７を磁気的に結合されかつ連動されるように接着す
る。(6) The main magnetic pole 9 and the magnetic substrate 7 serving as the auxiliary magnetic pole are bonded so as to be magnetically coupled and interlocked.
【００２０】チップ化、組立て工程等をへて、ヘッドが
完成する。The head is completed through the steps of chip formation and assembly.
【００２１】以上の製法によれば、コイル形成時にダミ
ーコイルパターンを形成、かつコイル接続部１０および
コイルボンディングパッド部１１をコイルと略同幅、同
間隔のパターンの接続集合体で形成することにより、バ
イアススパッタ後のコイル上の絶縁層の平坦性を連続し
て得ることができるので、（４）で述べたコア接続用ス
ルーホールのパターニング工程、および（３）で述べた
コイル接続部１０，（４）で述べたコイルボンディング
パッド１１上の絶縁層除去工程の高精度化、簡易化、歩
留まりの向上を図ることができる。また、コイルボンデ
ィングパッド部をコイルと略同幅のパターンの連続集合
体とすることにより、ボンディグパッド部のスルーホー
ル形成をイオンミリング等で行えば、コイル材と絶縁材
のエッチング速度の差により適度な凹凸が生じるためリ
ード線と接続する際のボンディング強度を増すことが出
来る。According to the above-mentioned manufacturing method, the dummy coil pattern is formed at the time of forming the coil, and the coil connecting portion 10 and the coil bonding pad portion 11 are formed by the connection assembly having the pattern having substantially the same width and the same interval as the coil. Since the flatness of the insulating layer on the coil after the bias sputtering can be continuously obtained, the patterning step of the through hole for core connection described in (4), and the coil connection portion 10 described in (3), The process of removing the insulating layer on the coil bonding pad 11 described in (4) can be performed with higher accuracy, simplification, and improved yield. Also, by forming the coil bonding pad section as a continuous assembly of patterns having substantially the same width as the coil, if the through holes are formed in the bonding pad section by ion milling or the like, the difference in the etching rate between the coil material and the insulating material Since appropriate unevenness is generated, the bonding strength when connecting to the lead wire can be increased.
【００２２】図３は本発明による薄膜磁気ヘッドの第２
の実施例を示す平面図、図４は図３のＢ−Ｂ’断面図で
あって、１は非磁性基板、２は磁気コア、３はコア接続
部、４，４’は信号コイル絶縁層、５，５’は信号コイ
ル、６，６’はダミーコイルパターン、７磁性基板（補
助磁極）、８は非磁性絶縁層、９は主磁極、１０はコイ
ル接続部、１１はコイルボンディングパッドである。FIG. 3 shows a second thin film magnetic head according to the present invention.
FIG. 4 is a cross-sectional view taken along the line BB ′ of FIG. 3, in which 1 is a non-magnetic substrate, 2 is a magnetic core, 3 is a core connecting portion, and 4 and 4 ′ are signal coil insulating layers. , 5, 5'is a signal coil, 6, 6'is a dummy coil pattern, 7 a magnetic substrate (auxiliary magnetic pole), 8 is a non-magnetic insulating layer, 9 is a main magnetic pole, 10 is a coil connecting portion, 11 is a coil bonding pad. is there.
【００２３】本実施例では磁性基板１にはフェライト基
板を用いている。磁気コア材にはＣｏ−Ｔａ−Ｚｒ系ア
モルファス合金をスパッタリング等により形成してい
る。信号コイルはＣｒを接合層としてＣｕを蒸着等によ
り形成している。コイル絶縁層はＳｉＯ2等をバイアス
スパッタリングにより形成している。保護膜には、フォ
ルステライトをスパッタリングや蒸着等により形成して
いる。In this embodiment, a ferrite substrate is used as the magnetic substrate 1. A Co-Ta-Zr-based amorphous alloy is formed on the magnetic core material by sputtering or the like. The signal coil is formed by depositing Cu with Cr as a bonding layer. The coil insulating layer is formed by bias sputtering of SiO 2 or the like. Forsterite is formed on the protective film by sputtering, vapor deposition, or the like.
【００２４】本実施例では図２で示した実施例に対し、
コイル接続部及びコイルボンディングパッド部は従来通
りコイルパターンに比べて幅の広いパターンで形成して
いるので、一層目コイルと２層目コイルのオーミックコ
ンタクトを考慮する必要が無い。コア接続用のスルーホ
ールを形成する部分にはコイルと略同幅、同間隔ダミー
コイルパターンを形成するためコア接続用スルーホール
形成を平坦部で良好に行うことができる。In this embodiment, as compared with the embodiment shown in FIG.
Since the coil connecting portion and the coil bonding pad portion are formed in a pattern wider than the coil pattern as in the conventional case, it is not necessary to consider the ohmic contact between the first layer coil and the second layer coil. Since a dummy coil pattern having substantially the same width and spacing as the coil is formed in the portion where the through hole for core connection is formed, the through hole for core connection can be favorably formed in the flat portion.
【００２５】また、図５、図６に示すように、バイアス
スパッタ後に最も段差の大きくなるパターン幅の大きく
なるコイル接続部、ボンディングパッド部をコイルと略
同幅のパターンの連続集合体で形成するだけでも後工程
のパターニングを良好に行える。Further, as shown in FIGS. 5 and 6, the coil connection portion and the bonding pad portion, which have the largest step difference and the largest pattern width after the bias sputtering, are formed by a continuous assembly of patterns having substantially the same width as the coil. Only by itself, patterning in the subsequent process can be favorably performed.
【００２６】また、コイルボンディングパッド部をコイ
ルと略同幅のパターンの連続集合体とすることにより、
ボンディグパッド部のスルーホール形成をイオンミリン
グ等で行えば、コイル材と絶縁材のエッチング速度の差
により適度な凹凸が生じるためリード線と接続する際の
ボンディング強度を増すことが出来る。Further, by forming the coil bonding pad portion into a continuous aggregate of patterns having substantially the same width as the coil,
If the through hole is formed in the bonding pad portion by ion milling or the like, appropriate unevenness is generated due to the difference in etching rate between the coil material and the insulating material, so that the bonding strength when connecting to the lead wire can be increased.
【００２７】本発明の実施例の説明は、単磁極型垂直磁
気記録ヘッドで説明したが、薄膜コイルにバイアススパ
ッタ法によりコイル絶縁層を形成するヘッドであれば、
同様の効果を得られる。Although the embodiments of the present invention have been described with reference to the single magnetic pole type perpendicular magnetic recording head, any head can be used as long as the coil insulating layer is formed on the thin film coil by the bias sputtering method.
Similar effects can be obtained.
【００２８】[0028]
【発明の効果】本発明によれば、コイル形成時にコイル
パターンと略同一幅、同間隔のダミーコイルパターンを
形成する。またパターン幅の広くなるコイル接続部、ボ
ンディングパッド等のパターンをコイルと略同幅、同間
隔のパターン集合で形成することにより、バイアススパ
ッタ後のコイル上の絶縁層の平坦性を連続して得ること
ができるので、後工程のパターニング工程の高精度化、
簡易、歩留まりの向上した薄膜磁気ヘッドを提供するこ
とができる。また、コイルボンディングパッド部をコイ
ルと略同幅のパターンの連続集合体とすることにより、
ボンディグパッド部のスルーホール形成をイオンミリン
グ等で行えば、コイル材と絶縁材のエッチング速度の差
により適度な凹凸が生じるためリード線と接続する際の
ボンディング強度を増すことが出来る。According to the present invention, a dummy coil pattern having substantially the same width and spacing as the coil pattern is formed during coil formation. Further, by forming patterns such as a coil connecting portion and a bonding pad having a wide pattern width with a pattern set having substantially the same width and spacing as the coil, the flatness of the insulating layer on the coil after the bias sputtering can be continuously obtained. Since it is possible to improve the accuracy of the patterning process in the post process,
It is possible to provide a thin film magnetic head that is simple and has an improved yield. Further, by forming the coil bonding pad portion into a continuous aggregate of patterns having substantially the same width as the coil,
If the through hole is formed in the bonding pad portion by ion milling or the like, appropriate unevenness is generated due to the difference in etching rate between the coil material and the insulating material, so that the bonding strength when connecting to the lead wire can be increased.
【図１】本発明による薄膜磁気ヘッドの第１の実施例を
示す平面図。FIG. 1 is a plan view showing a first embodiment of a thin film magnetic head according to the present invention.
【図２】図１におけるＡ−Ａ’断面図。FIG. 2 is a sectional view taken along the line A-A ′ in FIG.
【図３】本発明による薄膜磁気ヘッドの第２の実施例を
示す平面図。FIG. 3 is a plan view showing a second embodiment of the thin film magnetic head according to the present invention.
【図４】図３におけるＢ−Ｂ’断面図。FIG. 4 is a sectional view taken along the line B-B ′ in FIG.
【図５】本発明による薄膜磁気ヘッドの第３の実施例を
示す平面図。FIG. 5 is a plan view showing a third embodiment of the thin film magnetic head according to the present invention.
【図６】図５におけるＣ−Ｃ’断面図。6 is a cross-sectional view taken along the line C-C ′ in FIG.
【図７】従来例を示す平面図。FIG. 7 is a plan view showing a conventional example.
【図８】図７のＤ−Ｄ’断面図。8 is a cross-sectional view taken along the line D-D ′ of FIG. 7.
１…非磁性基板、 ２…磁気コア、 ３…コア接続部、 ４，４’…信号コイル絶縁層、 ５，５’…信号コイル、 ６，６’…ダミーコイルパターン、 ７…磁性基板、 ８…非磁性絶縁層、 ９…主磁極、 １０…コイル接続部、 １１…コイルボンディングパッド。 DESCRIPTION OF SYMBOLS 1 ... Non-magnetic substrate, 2 ... Magnetic core, 3 ... Core connection part, 4, 4 '... Signal coil insulating layer, 5, 5' ... Signal coil, 6, 6 '... Dummy coil pattern, 7 ... Magnetic substrate, 8 ... Non-magnetic insulating layer, 9 ... Main magnetic pole, 10 ... Coil connecting portion, 11 ... Coil bonding pad.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 小西 捷雄 神奈川県横浜市戸塚区吉田町292番地株式 会社日立製作所マルチメディアシステム開 発本部内 (72)発明者 柳原 仁 神奈川県横浜市戸塚区吉田町292番地株式 会社日立製作所マルチメディアシステム開 発本部内 (72)発明者 土屋 敏雄 神奈川県横浜市戸塚区吉田町292番地株式 会社日立製作所マルチメディアシステム開 発本部内 (72)発明者 長友 浩之 神奈川県横浜市戸塚区吉田町292番地株式 会社日立製作所マルチメディアシステム開 発本部内 (72)発明者 植村 典夫 東京都千代田区丸の内二丁目１番２号日立 金属株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yoshio Konishi, 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa, Ltd. Multimedia system development headquarters, Hitachi, Ltd. (72) Hitoshi Yanagihara Yoshida-cho, Totsuka-ku, Yokohama, Kanagawa 292 Hitachi Ltd. Multimedia System Development Headquarters (72) Inventor Toshio Tsuchiya Yoshida-cho, Totsuka-ku, Yokohama, Kanagawa 292 Hitachi Ltd. Multimedia System Development Headquarters (72) Inventor Hirotomo Nagato Kanagawa 292 Yoshida-cho, Totsuka-ku, Yokohama-shi Stock company Hitachi, Ltd. Multimedia system development headquarters (72) Inventor Norio Uemura 2-1-2 Marunouchi, Chiyoda-ku, Tokyo Inside Hitachi Metals, Ltd.
Claims (4)
絶縁膜、上部磁気コアを順次積層し、上記上、下部磁気
コアはコア接続部で接し、磁気回路もしくは磁気回路の
一部を形成する薄膜磁気ヘッドにおいて、上記コイルの
巻線部のコイルパターン幅、巻線間隔がそれぞれ最初か
ら最後まで等しく上記コア接続部、上記コイル巻線部と
ボンディングパッド部との間及び素子周辺部にコイルと
略同幅、同間隔のコイルダミーパターンを形成し、上層
コイルと下層コイルを接続するコイル接続部部分及び上
記ボンディングパッド部をコイルと略同幅、同間隔のパ
ターンの接続集合体として形成することを特徴とする薄
膜磁気ヘッド。1. A lower magnetic core, a coil, a coil insulating film, and an upper magnetic core are sequentially laminated on a substrate, and the upper and lower magnetic cores are in contact with each other at a core connecting portion to form a magnetic circuit or a part of a magnetic circuit. In the thin film magnetic head, the coil pattern width and the winding interval of the winding portion of the coil are equal from the beginning to the end, and the coil is provided between the core connection portion, the coil winding portion and the bonding pad portion, and the element peripheral portion. And a coil dummy pattern having substantially the same width and spacing as that of the coil connecting portion for connecting the upper coil and the lower coil and the bonding pad portion are formed as a connection assembly having a pattern having substantially the same width and spacing as the coil. A thin film magnetic head characterized in that
絶縁膜、上部磁気コアを順次積層し、上記上、下部磁気
コアはコア接続部で接し、磁気回路もしくは磁気回路の
一部を形成する薄膜磁気ヘッドにおいて、上記コイルの
巻線部のコイルパターン幅、巻線間隔がそれぞれ最初か
ら最後まで等しく、上記コア接続部、上記コイル巻線部
とボンディングパッド部との間及び素子周辺部にコイル
と略同幅、同間隔のコイルダミーパターンを形成するこ
とを特徴とする薄膜磁気ヘッドの製造方法。2. A lower magnetic core, a coil, a coil insulating film, and an upper magnetic core are sequentially laminated on a substrate, and the upper and lower magnetic cores are in contact with each other at a core connecting portion to form a magnetic circuit or a part of a magnetic circuit. In the thin film magnetic head, the coil pattern width and the winding interval of the coil winding portion are equal from the beginning to the end, and the core connecting portion, the coil winding portion and the bonding pad portion, and the element peripheral portion are provided. A method for manufacturing a thin film magnetic head, comprising forming a coil dummy pattern having substantially the same width and spacing as a coil.
絶縁膜、上部磁気コアを順次積層し、上記上、下部磁気
コアはコア接続部で接し、磁気回路もしくは磁気回路の
一部を形成する薄膜磁気ヘッドにおいて、上記コイルの
巻線部のコイルパターン幅、巻線間隔がそれぞれ最初か
ら最後まで等しく、上層コイルと下層コイルを接続する
コイル接続部部分及びボンディングパッド部をコイルと
略同幅、同間隔のパターンの接続集合体として形成する
ことを特徴とする薄膜磁気ヘッド。3. A lower magnetic core, a coil, a coil insulating film, and an upper magnetic core are sequentially laminated on a substrate, and the upper and lower magnetic cores are in contact with each other at a core connecting portion to form a magnetic circuit or a part of a magnetic circuit. In the thin film magnetic head, the coil pattern width and the winding interval of the coil portion of the coil are equal from the beginning to the end, and the coil connecting portion and the bonding pad portion for connecting the upper coil and the lower coil have substantially the same width as the coil. A thin film magnetic head formed as a connection assembly having patterns of equal intervals.
絶縁膜、上部磁気コアを順次積層し、上記上、下部磁気
コアはコア接続部で接し、磁気回路もしくは磁気回路の
一部を形成する薄膜磁気ヘッドにおいて、上記コア接続
部、上記コイル巻線部とボンディングパッド部との間及
び素子周辺部にコイルと略同幅、同間隔のコイルダミー
パターンを形成し、上層コイルと下層コイルを接続する
コイル接続部部分及びボンディングパッド部をコイルと
略同幅、同間隔のパターンの接続集合体として形成する
ことを特徴とする薄膜磁気ヘッド。4. A lower magnetic core, a coil, a coil insulating film, and an upper magnetic core are sequentially laminated on a substrate, and the upper and lower magnetic cores are in contact with each other at a core connecting portion to form a magnetic circuit or a part of a magnetic circuit. In the thin-film magnetic head, a coil dummy pattern having substantially the same width and spacing as the coil is formed between the core connecting portion, the coil winding portion and the bonding pad portion, and the element peripheral portion to form an upper layer coil and a lower layer coil. A thin film magnetic head characterized in that a coil connection portion and a bonding pad portion to be connected are formed as a connection assembly having a pattern having substantially the same width and spacing as the coil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2091696A JPH09212822A (en) | 1996-02-07 | 1996-02-07 | Thin film magnetic head and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2091696A JPH09212822A (en) | 1996-02-07 | 1996-02-07 | Thin film magnetic head and method of manufacturing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09212822A true JPH09212822A (en) | 1997-08-15 |
Family
ID=12040557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2091696A Pending JPH09212822A (en) | 1996-02-07 | 1996-02-07 | Thin film magnetic head and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09212822A (en) |
-
1996
- 1996-02-07 JP JP2091696A patent/JPH09212822A/en active Pending
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