JPH0922811A - Method of forming external electrode of chip part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for forming an external electrode of chip part where the need for a push member, such as a pin, is eliminated when shifting a chip part element body from a load plate to a carrier plate and the chip part element body can be uniformly shifted to the carrier plate. SOLUTION: When shifting a chip part element body 3 housed in an accommodation space 1a of a load plate 1 to a retention space 2c of a carrier plate 2, the accommodation space 1a of the load plate 1 is arranged oppositely to the carrier plate 2 and either the load plate 2 or the carrier plate 2 is moved toward the other, thus gradually moving the chip part element body 3 to the retention space 2c against the elastic force of the carrier plate 2 and housing it in the retention space 2c.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming external electrodes of a chip component, in which chip components such as resistors and capacitors are inserted into a carrier plate made of an elastic material and external electrodes are formed on the chip component. Is.

[0002]

2. Description of the Related Art Conventionally, as a method for forming external electrodes of this type of chip component, the method disclosed in Japanese Patent Publication No. 62-29888 or Japanese Patent Publication No. 4-70761 is known.

In this method of forming external electrodes of a chip component, a load plate for accommodating a chip component element body (a chip component in which external electrodes are not formed) and a carrier plate formed of an elastic body are prepared in advance, and the carrier is prepared. Place the load plate on top of the plate. Then, the chip component element body is supplied to the accommodation hole of the load plate, and the supplied chip component element body is supported by the peripheral edge of the holding hole of the carrier plate and accommodated in the accommodation hole.

Thereafter, the pushing member, that is, the pin, moves downward from the upper opening of the housing hole to push the component body in the housing hole downward, and the component body moves to the holding hole side. Here, the movement amount of the component body is set so that the upper end portion of the component body is projected above the carrier plate.

Next, the protruding parts of the component body held on the carrier plate are dipped in the conductor paste and dried to form external electrodes on the outer surface of the component body.

[0006]

As described above, in the conventional method of forming the external electrodes of the chip component, when the component body is moved from the load plate to the carrier plate, each pin is inserted into the accommodation hole of the load plate. The component element body is moved to the holding hole of the carrier plate.

However, the upper surface area of the chip component body is very small, and the diameter of the pin for pushing out this chip component body is also small, so that the pin strength cannot be sufficiently secured, and the pin is bent. There was a risk of causing problems.

Further, when the center of the axis of the pin and the center of the upper end surface of the chip component body are displaced, the chip component body is pushed to one side, whereby the chip component body becomes a holding hole of the carrier plate. May be stored in a tilted position. However, when the chip component body is accommodated in a tilted state in this manner, the surface on which the conductive paste is applied is also in a tilted state, which causes a problem that the external electrodes cannot be formed uniformly. .

In view of the above-mentioned conventional problems, an object of the present invention is that a pushing member such as a pin is not required when transferring a chip component body from a load plate to a carrier plate, and
An object of the present invention is to provide a method of forming external electrodes of a chip component, which can uniformly transfer the chip component body to a carrier plate.

[0010]

In order to solve the above-mentioned problems, the present invention provides a load plate having a large number of spaces for accommodating chip component bodies and an elastic force for holding the chip component bodies. And a carrier plate having a holding space for moving the chip component body accommodated in the accommodating space into the retaining space, and thereafter, a conductor for an external electrode is attached to the chip component body moving in the retaining space. In the external electrode forming method of a chip component to be applied, a housing step of housing the chip component body in the housing space, and after the housing step,
A transfer step of moving one of the load plate or the carrier plate toward the other to transfer the chip component element body of the accommodation space to the holding space side, and holding in the holding space after the transfer step. And a conductor applying step of applying the conductor to one end side of the chip component element body protruding from the carrier plate.

According to a second aspect of the present invention, in the method of forming an external electrode of a chip component according to the first aspect, the accommodating space is formed by a recess having a depth smaller than a height dimension of the chip component body. And

According to a third aspect of the present invention, in the method of forming an external electrode for a chip component according to the first aspect, a through hole that penetrates the load space through the load plate, and an upper end surface of a pin inserted into the through hole. And the depth dimension thereof is smaller than the height dimension of the chip component body.

The invention of claim 4 is the invention of claims 1 to 3.
In the external electrode forming method for a chip component according to any one of items 1 to 3, the holding space is formed by a through hole penetrating the carrier plate, and the thickness dimension of the carrier plate is more than the height dimension of the chip component body. It is characterized by being made smaller.

The invention according to claim 5 is any one of claims 1 to 3.
In the method of forming an external electrode of a chip part according to any one of the above 1 to 3, the holding space is formed by a recess having a depth smaller than a height dimension of the chip part body.

The invention of claim 6 is the first to fifth aspects of the present invention.
The external electrode forming method for a chip component according to any one of claims 1 to 3, wherein a guide plate having a guide hole for guiding the chip component body into the accommodation space is prepared, and the chip component body is accommodated in the accommodation space. The guide plate is placed on the load plate.

[0016]

According to the inventions of claims 1 to 5, when the chip component body accommodated in the accommodation space of the load plate is transferred to the holding space of the carrier plate, the accommodation space of the load plate and the carrier plate are By disposing the holding space facing each other and moving one of the load plate or the carrier plate toward the other, the chip component body gradually moves to the holding space against the elastic force of the carrier plate, and the holding space is moved to the holding space. Be accommodated.

According to the invention of claim 6, when the chip component body is accommodated in the accommodating space of the load plate, the chip component body is guided into the accommodating space by the guide hole of the guide plate, and is smoothly accommodated in the accommodating space. Be accommodated.

[0018]

1 to 5 show a first embodiment of a method for forming external electrodes of a chip component according to the present invention. FIG. 1 is a perspective view of a load plate and a carrier plate, and FIGS. It is sectional drawing which shows each process of an electrode formation method.

As members used in this external electrode forming method, a load plate 1 and a carrier plate 2 are used as shown in FIG. Here, the load plate 1 is formed of metal or hard resin, and the load plate 1 is provided with a large number of accommodation spaces 1a for accommodating chip component bodies (hereinafter referred to as component bodies) 3 therein. There is. The housing space 1a has a vertical area which is slightly larger than the cross-sectional area of the component body 3, and is formed by a recess whose depth dimension is approximately half the height dimension of the component body 3. When the component body 3 is housed in 1a,
The component body 3 is configured to project above the load plate 1 from the center to the upper end.

The carrier plate 2 is an elastic member, for example, a plate body 2a formed of silicone rubber or the like, surrounded by a metal frame 2b. The plate body 2a is located at a position corresponding to the accommodating space 1a of the load plate 1. A large number of holding spaces 2c in which the component body 3 is transported are formed.
The holding space 2c is formed by a through hole penetrating the carrier plate 2, and the vertical area of the holding space 2c is made slightly smaller than the cross-sectional area of the component body 3, so that the component body 3 conveyed into the holding space 2c is carried by the carrier plate. It is designed to be held by the elastic force of 2. The thickness of the carrier plate 2 is smaller than the height of the component body 3.

External electrodes are formed using the load plate 1 and the carrier plate 2 as shown in FIGS. 2 to 5. The method of forming the external electrodes will be described below.

First, as shown in FIG. 2, the component body 3 is inserted into each accommodation space 1a of the load plate 1. Then
As shown in FIG. 3, the holding space 2c of the carrier plate 2
And the component element bodies 3 accommodated in the respective accommodation spaces 1a are arranged to face each other, and the carrier plate 2 is lowered toward the load plate 1. As a result, the component element body 3 is inserted into the holding space 2c against the elastic force of the carrier plate 2 during the downward movement, and is held in the holding space 2c with the lower end side of the component element body 3 protruding downward. Alternatively, the load plate 1 may be moved upward to insert and hold the component body 3 in the holding space 2c.

When the transfer process of the chip component body 3 is completed, the carrier plate 2 is moved upward to remove the entire component body 3 from the load plate 1,
As shown in FIG. 5, the lower projecting portion of the component body 3 is dipped in the conductor paste 5 on the base 4, and then the carrier plate 2 is pulled up as shown in FIG. As a result, the conductor paste adheres to the end of the component body 3.

When the conductor attaching step is completed, the conductor paste attached to the component body 3 is dried by a heater (not shown) to form the external electrodes 6. In this way, when the external electrode 6 is formed, a pin or the like (not shown) is inserted through the holding space 2c of the carrier plate 2, the component element body 3 is removed from the carrier plate 2, and the component element body 3 is fired. To do. As a result, a chip component with external electrodes is formed.

6 to 8 show a second embodiment of the external electrode forming method for a chip component according to the present invention, and each drawing is a sectional view showing each step of the external electrode forming method.

The holding space 2c according to the first embodiment penetrates the carrier plate 2, but the holding space 21a according to the present embodiment has a hole (recess) in which the upper end is closed in the carrier plate 21. It is composed of. Further, the vertical dimension of the holding space 21a is smaller than the vertical dimension of the component body 3, and when the component body 3 in the accommodation space 1a of the load plate 1 is moved to the holding space 21a, As shown in FIG. 6, the upper surface of the component body 3 and the holding space 2
It is set so that a play space is formed between the ceiling surface of 1a and the ceiling surface. In addition, as shown in FIG. 6, after moving the component body 3 to the holding space 21a, as shown in FIG. 7, the level adjusting plate 7 is used to adjust the projecting dimension of each component body 3, and then, as shown in FIG. The component element body 3 is immersed in the conductor paste 5 as shown in FIG.

According to this embodiment, the component body 3 can be transferred from the load plate 1 to the carrier plate 21 without using pins or the like as in the first embodiment. When the conductor paste is applied to the level adjusting plate 7 in this embodiment, the conductor paste for external electrodes adheres to the component body 3 during the level adjustment, and the conductor paste attaching step of FIG. 8 becomes unnecessary. Become.

9 to 13 show a third embodiment of the external electrode forming method for a chip component according to the present invention, and each drawing is a sectional view showing each step of the external electrode forming method.

The height dimension of the accommodating space 1a according to the first and second embodiments is about half of that of the component body 3, but the accommodating space 11a of the load plate 11 according to the present embodiment. The height dimension is 1/4 of the component body 3 in the figure.
The depth of the accommodation space 11a is shallow.

In this embodiment, when the carrier plate 2 is lowered and transferred to the holding space 2c as shown in FIG. 10, the size of the portion of the component element body 3 projecting from above the carrier plate 2 is the carrier plate 2. It is larger than the size of the part protruding from below.

Therefore, the component element body 3 protruding above the carrier plate 2 is inverted as shown in FIG. 11 so that the portion having a large protrusion size is directed downward, and thereafter, the conductor paste is formed as shown in FIG. 5 and further pulled up as shown in FIG. 13 to attach the conductor paste 5 to one end of the component body 3.

According to this embodiment, the external electrode 6 can be formed on the end opposite to the end housed in the housing space 11a by the component body 3.

14 and 15 show a fourth embodiment of the external electrode forming method for a chip component according to the present invention. In this fourth embodiment, the storage space 1 for the load plates 1 and 11 is shown.
The guide plates 8 and 81 are arranged on the upper surfaces of the load plates 1 and 11 when the component bodies 3 are housed in the a and 11a.

Here, the guide plate 8 corresponds to the load plate 1, and the guide plate 81 corresponds to the load plate 11, which are opposed to the accommodating spaces 1a and 11a, respectively, and the upper part of which has a large diameter. It has holes 8a and 81a.

According to this embodiment, the guide holes 8a, 8a
The component body 3 is smoothly transported to the accommodation spaces 1a and 11a through the 1a. In addition, as shown in FIG.
When 1a is shallow, it is also effective as a space for housing the component body 3.

FIG. 16 shows another example of the accommodating spaces 1a and 11a of the load plates 1 and 11. In each of the above embodiments, the load plates 1 and 11 are formed with a recess. In the embodiment, the load plate 111 is provided with a through hole 111b penetrating vertically, and a pin 111c is inserted from below the through hole 111b.
A housing space 111a for the component body 3 is formed between the upper end surface of 11c and the through hole 111b.

According to this embodiment, the accommodating space for the component body 3 can be formed by using the existing load plate and pin mechanism.

[0038]

As described above, according to the first to fifth aspects of the present invention, by moving one of the load plate and the carrier plate toward the other, the chip component element housed in the housing space. Since the body can be transferred to the holding space of the carrier plate and the pin for transferring the chip component body is not required as in the past, the number of components is reduced, and the chip component body is evenly mounted on the carrier plate. Can be transferred to.

According to the invention of claim 6, when the chip component element body is accommodated in the accommodating space of the load plate, the chip component element body is guided into the accommodating space by the guide hole of the guide plate. The body is smoothly accommodated in the accommodation space.

[Brief description of drawings]

FIG. 1 is a perspective view of a load plate and a carrier plate according to a first embodiment.

FIG. 2 is a cross-sectional view showing a state where the chip component body is housed in the load plate according to the first embodiment.

FIG. 3 is a cross-sectional view showing a transferred state of the chip component body according to the first embodiment.

FIG. 4 is a sectional view showing a state where the chip component body according to the first embodiment is immersed in a conductor paste.

FIG. 5 is a cross-sectional view showing a state in which a conductor paste is attached to the chip component body according to the first embodiment.

FIG. 6 is a cross-sectional view showing a transferred state of the chip component body according to the second embodiment.

FIG. 7 is a cross-sectional view showing a level adjustment state of a chip component body according to a second embodiment.

FIG. 8 is a cross-sectional view showing a state where the chip component body according to the second embodiment is immersed in a conductor paste.

FIG. 9 is a cross-sectional view showing a state where a chip component body is housed in a load plate according to a third embodiment.

FIG. 10 is a cross-sectional view showing a transferred state of the chip component body according to the third embodiment.

FIG. 11 is a cross-sectional view showing an inverted state of a chip component body according to a third embodiment.

FIG. 12 is a sectional view showing a state in which the chip component body according to the third embodiment is immersed in a conductor paste.

FIG. 13 is a cross-sectional view showing a state in which a conductor paste is attached to a chip component body according to a third embodiment.

FIG. 14 is a cross-sectional view showing a state in which an example of a guide plate is arranged.

FIG. 15 is a cross-sectional view showing a state in which another example of the guide plate is arranged.

FIG. 16 is a sectional view showing another example of the accommodation space.

[Explanation of symbols]

1, 11, 111 ... Load plates 1a, 11a, 1
11a ... accommodation space, 2, 21 ... carrier plate, 2
c, 21a ... Holding space, 3 ... Chip component body, 6 ... External electrode, 8, 81 ... Guide plate.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical indication location H01G 13/00 391 7922-5E H01G 13/00 391B (72) Inventor Kenshi Doi Ueno, Taito-ku, Tokyo 6-16-20 Taiyo Electric Co., Ltd. (72) Inventor Toshiya Nakamura 6-16, Ueno, Taito-ku, Tokyo 6-16-20 Solar Electric Co., Ltd. (72) Inventor Tetsuya Urano 6-Ueno, Taito-ku, Tokyo 16-20 No. 20 Taiyo Induction Co., Ltd. (72) Inventor Hiroyuki Matsui No. 16-20 Ueno, Taito-ku, Tokyo Tokyo Induction Co., Ltd.

Claims (6)

[Claims] 1. A load plate having a large number of spaces for accommodating chip component bodies, and a carrier plate having a holding space for retaining the chip component bodies with elastic force are prepared, and the chip components accommodated in the accommodating space. A method of forming an external electrode of a chip component, wherein an element body is moved to a holding space, and then a conductor for an external electrode is applied to the chip component body moved to the holding space, wherein the chip component element body is provided in the accommodation space. An accommodating step of accommodating and, after the accommodating step, a transfer step of moving one of the load plate or the carrier plate toward the other to transfer the chip component element body of the accommodating space to the holding space side, After the transferring step, a conductor applying process for applying the conductor to the one end side of the chip component body held in the holding space, which is protruding from the carrier plate. A method for forming an external electrode for a chip component, comprising: 2. The method for forming an external electrode of a chip component according to claim 1, wherein the accommodation space is formed by a recess having a depth smaller than a height dimension of the chip component body. 3. The accommodation space is formed between a through hole penetrating the load plate and an upper end surface of a pin inserted into the through hole, and a depth dimension thereof is a height dimension of a chip component body. The external electrode forming method for a chip component according to claim 1, wherein the external electrode is formed smaller. 4. The holding space is formed by a through hole penetrating the carrier plate, and the thickness dimension of the carrier plate is smaller than the height dimension of the chip component body. The external electrode forming method for a chip component according to claim 3. 5. The chip part according to claim 1, wherein the holding space is formed by a recess having a depth smaller than a height dimension of the chip part body. External electrode formation method. 6. A guide plate having a guide hole for guiding the chip component body to the accommodation space is prepared, and when the chip component body is accommodated in the accommodation space, the guide plate is mounted on the load plate. The external electrode forming method for a chip component according to claim 1, wherein the external electrode is formed.