JPH0922812A - Method of forming external electrode of chip part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for forming an external electrode of chip part where the need for a push member, such as a pin, is eliminated when shifting a chip part element body from a load plate to a carrier plate and the chip part element body can be uniformly shifted to the carrier plate. SOLUTION: When shifting a chip part element body 3 housed in an accommodation space 1a of a load plate 1 to a retention space 2c of a carrier plate 2, the accommodation space 1a of the load plate 1 is arranged oppositely to the carrier plate 2 and either the load plate 2 or the carrier plate 2 is moved toward the other, thus shrinking a stretching plate part 1a, gradually moving the chip part element body 3 to the retention space 2c against the elastic force of the carrier plate 2, and housing the chip part element body 3 in the retention space 2c.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming external electrodes of a chip component, in which chip components such as resistors and capacitors are inserted into a carrier plate made of an elastic material and external electrodes are formed on the chip component. Is.

[0002]

2. Description of the Related Art Conventionally, as a method for forming external electrodes of this type of chip component, the method disclosed in Japanese Patent Publication No. 62-29888 or Japanese Patent Publication No. 4-70761 is known.

In this method of forming external electrodes of a chip component, a load plate for accommodating a chip component element body (a chip component in which external electrodes are not formed) and a carrier plate formed of an elastic body are prepared in advance, and the carrier is prepared. Place the load plate on top of the plate. Then, the chip component element body is supplied to the accommodation hole of the load plate, and the supplied chip component element body is supported by the peripheral edge of the holding hole of the carrier plate and accommodated in the accommodation hole.

Thereafter, the pushing member, that is, the pin, moves downward from the upper opening of the housing hole to push the component body in the housing hole downward, and the component body moves to the holding hole side. Here, the movement amount of the component body is set so that the upper end portion of the component body is projected above the carrier plate.

Next, the protruding parts of the component body held on the carrier plate are dipped in the conductor paste and dried to form external electrodes on the outer surface of the component body.

[0006]

As described above, in the conventional method of forming the external electrodes of the chip component, when the component body is moved from the load plate to the carrier plate, each pin is inserted into the accommodation hole of the load plate. The component element body is moved to the holding hole of the carrier plate.

However, the upper surface area of the chip component body is very small, and the diameter of the pin for pushing out this chip component body is also small, so that the pin strength cannot be sufficiently secured, and the pin is bent. There was a risk of causing problems.

Further, when the center of the axis of the pin and the center of the upper end surface of the chip component body are displaced, the chip component body is pushed to one side, whereby the chip component body becomes a holding hole of the carrier plate. May be stored in a tilted position. However, when the chip component body is accommodated in a tilted state in this manner, the surface on which the conductive paste is applied is also in a tilted state, which causes a problem that the external electrodes cannot be formed uniformly. .

In view of the above-mentioned conventional problems, an object of the present invention is that a pushing member such as a pin is not required when transferring a chip component body from a load plate to a carrier plate, and
An object of the present invention is to provide a method of forming external electrodes of a chip component, which can uniformly transfer the chip component body to a carrier plate.

[0010]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a load plate having a plurality of accommodating spaces for accommodating the chip component element bodies and the chip component element bodies. A carrier plate having a holding space for holding the body with elastic force is prepared, and the chip component body housed in the housing space is moved to the holding space, and then, the chip component body moved to the holding space. In the method of forming an external electrode of a chip component for providing a conductor for an external electrode, the load plate is disposed on the insertion side of the chip component body, and is expandable and contractible in the thickness direction, and is inserted from the elastic plate part side. And a support plate portion for supporting the chip component body, the accommodating step of arranging the expandable plate and the support plate vertically and accommodating the chip component body in the accommodating space, After the accommodating step, one of the load plate or the carrier plate is moved toward the other to move the chip component body of the accommodating space to the holding space side, and after the transferring step, A conductor applying step of applying the conductor to one end side of the chip component body held in the holding space, the one end side protruding from the carrier plate.

According to a second aspect of the invention, in the method of forming an external electrode for a chip component according to the first aspect, the elastic plate portion is formed of an elastic resin sponge.

According to a third aspect of the present invention, in the method of forming an external electrode for a chip component according to the first aspect, the elastic plate portion includes a spring means.

The invention of claim 4 is the invention of claims 1 to 3.
In the method of forming an external electrode of a chip component according to any one of the above items, the accommodation space has a depth dimension smaller than a height dimension of the chip component body when the expansion plate portion contracts. .

The invention according to claim 5 is any one of claims 1 to 3.
9. The external electrode forming method for a chip component according to claim 1, wherein the accommodation space is formed between a through hole penetrating the load plate and an upper end surface of a pin inserted in the through hole, and the expansion and contraction is performed. When the plate portion contracts, the depth dimension is smaller than the height dimension of the chip component body.

The invention of claim 6 is the first to fifth aspects of the present invention.
In the method of forming an external electrode of a chip component according to any one of claims 1 to 3, the holding space is formed by a through hole that penetrates the carrier plate, and the thickness dimension of the carrier plate is the height dimension of the chip component body. It is characterized by being made smaller.

The invention of claim 7 is from claim 1 to claim 5.
In the method of forming an external electrode of a chip part according to any one of the above 1 to 3, the holding space is formed by a recess having a depth smaller than a height dimension of the chip part body.

The invention according to claim 8 is the invention according to claims 1 to 7.
The external electrode forming method for a chip component according to any one of claims 1 to 3, wherein a guide plate having a guide hole for guiding the chip component body into the accommodation space is prepared, and the chip component body is accommodated in the accommodation space. The guide plate is placed on the load plate.

[0018]

According to the inventions of claims 1 to 7, when the chip component body accommodated in the accommodation space of the load plate is transferred to the holding space of the carrier plate, the accommodation space of the load plate and the carrier plate are The holding space is arranged to face each other, and one of the load plate and the carrier plate is moved toward the other. As a result, the expandable plate portion of the load plate contracts, and the chip component body gradually moves into the holding space against the elastic force of the carrier plate and is accommodated in the holding space.

According to the invention of claim 8, when the chip component element body is accommodated in the accommodating space of the load plate, the chip component element body is guided into the accommodating space by the guide hole of the guide plate, and smoothly enters the accommodating space. Be accommodated.

[0020]

1 to 5 show a first embodiment of a method for forming external electrodes of a chip component according to the present invention. FIG. 1 is a perspective view of a load plate and a carrier plate, and FIGS. It is sectional drawing which shows each process of an electrode formation method.

As members used in this external electrode forming method, a load plate 1 and a carrier plate 2 are used as shown in FIG.

The load plate 1 comprises a telescopic plate portion 1a which is made of a resin sponge and can be expanded and contracted, and a support plate portion 1b which is made of a metal or a hard resin and are integrally formed vertically. Further, as shown in FIG. 2, a large number of through holes 1c into which a chip component body (hereinafter referred to as component body) 3 is inserted are formed in the expandable plate portion 1a, while the support plate portion is formed. A support recess 1d for supporting the component body 3 is formed on the upper surface of 1b so as to face the through hole 1c, and a housing space in which the component body 3 is accommodated through the through hole 1c and the support recess 1d. 1e is configured.

The carrier plate 2 is an elastic member, for example, a plate body 2a made of silicone rubber or the like surrounded by a metal frame 2b. The plate body 2a is provided with a component at a position corresponding to the accommodating space 1a of the load plate 1. A large number of holding spaces 2c in which the element body 3 is transported are formed. The holding space 2c is formed by a through hole penetrating the carrier plate 2, and the vertical area of the holding space 2c is made slightly smaller than the cross-sectional area of the component body 3, so that the component body 3 conveyed into the holding space 2c is carried by the carrier plate. It is designed to be held by the elastic force of 2. The thickness of the carrier plate 2 is smaller than the height of the component body 3.

External electrodes are formed using the load plate 1 and the carrier plate 2 as shown in FIGS. 2 to 5. The method of forming the external electrodes will be described below.

First, as shown in FIG. 2, the component body 3 is inserted into the accommodation space 1e through the through hole 1c of the expandable plate portion 1a of the load plate 1. The inserted component body 3 is supported by the support recess 1d and is accommodated in the accommodation space 1e.

Next, as shown in FIG. 3, the holding space 2c of the carrier plate 2 and the component body 3 housed in each housing space 1e are arranged facing each other, and the carrier plate 2 is lowered toward the telescopic plate portion 1e. Let As a result, the telescopic plate portion 1a is pressed by the carrier plate 2,
The component element body 3 surrounded by the elastic plate portion 1a is projected above the elastic plate portion 1a, and the protruding portion of this component element body 3 is inserted into the holding space 2c against the elastic force of the carrier plate 2. To be done.

Here, the contracted thickness of the expansion / contraction plate portion 1a becomes large when the non-contracted thickness is large, and conversely becomes small when the non-contracted thickness is small. The amount of downward movement of the carrier plate 2 is determined by the size of the thickness of the telescopic plate portion 1a when it does not contract.

In this embodiment, since the thickness of the telescopic plate portion 1a is large, the amount of movement of the carrier plate 2 is small, so that the lower side of the component body 3 largely projects from the carrier plate 2. The component body 3 has been transferred to the carrier plate 2. When the load plate 1 is moved toward the carrier plate 2 side, the component body 3 is similarly inserted and held in the holding space 2c.

When the transfer process of the component body 3 is completed, the carrier plate 2 is moved upward to remove the entire component body 3 from the load plate 1,
As shown in FIG. 5, the lower projecting portion of the component body 3 is dipped in the conductor paste 5 on the base 4, and then the carrier plate 2 is pulled up as shown in FIG. As a result, the conductor paste adheres to the end of the component body 3.

When the conductor attaching step is completed, the conductor paste attached to the component body 3 is dried by a heater (not shown) to form the external electrodes 6.

When the external electrode 6 is formed in this way, a pin or the like (not shown) is inserted through the holding space 2c of the carrier plate 2, the component body 3 is removed from the carrier plate 2, and the component body 3 is formed. To bake. As a result, a chip component with external electrodes is formed.

6 to 8 show a second embodiment of the external electrode forming method for a chip component according to the present invention, and each drawing is a sectional view showing each step of the external electrode forming method.

Although the holding space 2c according to the first embodiment penetrates the carrier plate 2, the holding space 20a according to the present embodiment has a hole (recess) in which the upper end is closed in the carrier plate 20. It is composed of. Further, the vertical dimension of the holding space 20a is smaller than the vertical dimension of the component body 3, and when the component body 3 in the accommodation space 1e of the load plate 1 is moved to the holding space 20a, As shown in FIG. 6, the upper surface of the component body 3 and the holding space 2
It is set so that a play space is formed between the ceiling surface 0a and the ceiling surface 0a. After moving the component element body 3 to the holding space 20a as shown in FIG. 6, the projecting dimension of each component element body 3 is adjusted by the level adjusting plate 7 as shown in FIG. The component element body 3 is immersed in the conductor paste 5 as shown in FIG.

According to this embodiment, the component body 3 can be transferred from the load plate 1 to the carrier plate 20 without using pins or the like as in the first embodiment. When the conductor paste is applied to the level adjusting plate 7 in this embodiment, the conductor paste for external electrodes adheres to the component body 3 during the level adjustment, and the conductor paste attaching step of FIG. 8 becomes unnecessary. Become.

9 to 13 show a third embodiment of the external electrode forming method for a chip component according to the present invention, and each drawing is a sectional view showing each step of the external electrode forming method.

The height dimension of the accommodation space 1e according to the first embodiment and the second embodiment is about half of that of the component body 3 in the contracted state of the telescopic plate portion 1a. In the load plate 30 according to the above, the elastic plate portion 30a arranged on the upper surface of the support plate portion 30b is thinly formed, and the component base body 3 is contracted in the contracted state of the elastic plate portion 30a.
Approximately one fourth of that, and the depth of the accommodation space 30c is shallow.

In this embodiment, when the component element body 3 is transferred to the holding space 2c as shown in FIG. 10, since the telescopic plate portion 30a is thin, the movement amount of the carrier plate 2 is large. Of these, the size of the part projecting from above the carrier plate 2 is larger than the size of the part projecting from below the carrier plate 2.

Therefore, as shown in FIG. 11, the component element body 3 projecting upward from the carrier plate 2 is inverted and the part having a large projecting dimension is directed downward. After that, the conductor paste 5 is dipped in the conductor paste 5 as shown in FIG. 12, and further pulled up as shown in FIG.
To adhere.

According to this embodiment, the external electrode 6 can be formed at the end of the component body 3 opposite to the end accommodated in the accommodation space 30c.

14 and 15 show a fourth embodiment of the method for forming external electrodes of a chip component according to the present invention. In this fourth embodiment, the accommodation space 1 for the load plates 1 and 30 is shown.
The guide plates 8 are arranged on the upper surfaces of the load plates 1 and 30 when the component body 3 is housed in the e and 30c. The guide plate 8 has a guide hole 8a whose upper portion has a large diameter.

According to this embodiment, the component body 3 is smoothly conveyed to the accommodation spaces 1e and 30c through the guide hole 8a. Further, as shown in FIG. 15, when the accommodation space 30c is shallow, it is also effective as a space for accommodating the component body 3.

FIG. 16 shows another example of the accommodating spaces 1e and 30c of the load plates 1 and 30. In each of the above-mentioned embodiments, the load plates 1 and 30 are formed with a recess. In the embodiment, the expandable plate portion 40a and the support plate portion 40b of the load plate 40 are provided with through-holes 40c that penetrate vertically, and a pin 40d is inserted from below the through-hole 40c to penetrate the upper end surface of the pin 40d. A housing space 40e for the component body 3 is formed between the hole 40c and the hole 40c.

According to this embodiment, the accommodating space for the component body 3 can be formed by using the existing load plate and pin mechanism.

17 and 18 show a fifth embodiment of a method of forming external electrodes of a chip part according to the present invention.
Although resin sponges are used as the elastic plate portions 1a, 30a, 40a of the load plates 1, 30, 40 in each of the above-described embodiments, in the present embodiment, they are placed on the support plate portion 50b of the load plate 50. Telescopic plate part 5
0a is made elastic by spring means.

That is, the expandable plate portion 50a has the upper and lower plates 50c and 50d facing each other with a space therebetween, and the insertion hole 50e for inserting the component body 3 into each of them is supported in the recess 50.
A large number of holes are formed facing the f, and the upper and lower insertion holes 5
The accommodation space 50g is configured through the 0e and the support recess 50f. A coil spring 50h is interposed between the upper and lower plates 50a and 50b.

According to this embodiment, as shown in FIG.
When the carrier plate 2 is moved to the load plate 50 side, the carrier plate 2 presses the upper plate 50c, and the pressing force causes the coil spring 50h to contract and the upper plate 50c to move downward. This top plate 50
The carrier plate 2 moves downward as c moves, and the component body 3 is inserted into the holding space 2c of the carrier plate 2.

As described above, the component element body 3 can be transferred to the carrier plate 2 without using the pin pushing mechanism or the like by the elastic plate portion 50a with the coil spring 50h interposed.

In each of the above-mentioned embodiments, the telescopic plate portion 1
a, 30a, 40a, 50a and support plate portions 1b, 3
Although 0b, 40b, and 50b are formed integrally, each of these parts may be formed separately, and they may be arranged vertically during the step of accommodating the component body 3.

FIG. 19 shows a sixth embodiment of the chip component supplying apparatus, which is the chip component supplying apparatus 1 of the first embodiment.
This is an improvement of the elastic plate portion 1a. This seventh
In the embodiment, the elastic plate portion 1a has a cover body 1f made of a film of polyethylene phthalanol resin, aluminum or the like adhered to the upper surface thereof.

According to this embodiment, the sponge of the expansion / contraction plate 1a is protected by the cover body 1f and does not come into direct contact with the carrier plate 2, so that abrasion of the sponge can be prevented. Further, since the cover body 1f is bonded to the upper surface of the flexible sponge, the deformation of the sponge portion is suppressed by the cover body 1f, and the adjacent accommodation space 1
The pitch of a becomes constant, and the component body 3 is smoothly accommodated in the accommodation space 1e. Others are the same as the first embodiment.

FIG. 20 shows a seventh embodiment of the chip component supplying apparatus, in which the interposing position of the coil spring 50h of the chip component supplying apparatus 50 according to the fifth embodiment is changed. That is, the coil spring 50h is arranged so as to cover the accommodation space 50g.

According to this embodiment, the accommodation space 50g is formed inside the coil spring 50h.
h exhibits the function of guiding the component body to the accommodation space 50g.
It is similar to the other fifth embodiment.

[0053]

As described above, according to the first to seventh aspects of the present invention, by moving one of the load plate and the carrier plate toward the other, the telescopic plate portion contracts to accommodate the accommodation space. It is possible to transfer the chip component body housed in the carrier plate to the holding space of the carrier plate. Therefore, unlike the conventional case, the pin for transferring the chip component body is not required, and the number of components is reduced,
Moreover, the chip component body can be uniformly transferred to the carrier plate.

According to the invention of claim 8, when the chip component element body is accommodated in the accommodation space of the load plate, the chip component element body is guided to the accommodation space by the guide hole of the guide plate. The body is smoothly accommodated in the accommodation space.

[Brief description of drawings]

FIG. 1 is a perspective view of a load plate and a carrier plate according to a first embodiment.

FIG. 2 is a cross-sectional view showing a state where the chip component body is housed in the load plate according to the first embodiment.

FIG. 3 is a cross-sectional view showing a transferred state of the chip component body according to the first embodiment.

FIG. 4 is a sectional view showing a state where the chip component body according to the first embodiment is immersed in a conductor paste.

FIG. 5 is a cross-sectional view showing a state in which a conductor paste is attached to the chip component body according to the first embodiment.

FIG. 6 is a cross-sectional view showing a transferred state of the chip component body according to the second embodiment.

FIG. 7 is a cross-sectional view showing a level adjustment state of a chip component body according to a second embodiment.

FIG. 8 is a cross-sectional view showing a state where the chip component body according to the second embodiment is immersed in a conductor paste.

FIG. 9 is a cross-sectional view showing a state where a chip component body is housed in a load plate according to a third embodiment.

FIG. 10 is a cross-sectional view showing a transferred state of the chip component body according to the third embodiment.

FIG. 11 is a cross-sectional view showing an inverted state of a chip component body according to a third embodiment.

FIG. 12 is a sectional view showing a state in which the chip component body according to the third embodiment is immersed in a conductor paste.

FIG. 13 is a cross-sectional view showing a state in which a conductor paste is attached to a chip component body according to a third embodiment.

FIG. 14 is a cross-sectional view showing a state in which an example of a guide plate is arranged.

FIG. 15 is a cross-sectional view showing a state in which another example of the guide plate is arranged.

FIG. 16 is a sectional view showing another example of the accommodation space.

FIG. 17 is a cross-sectional view showing a state where the chip component body is housed in the load plate according to the fifth embodiment.

FIG. 18 is a cross-sectional view showing a transferred state of the chip component body according to the fifth embodiment.

FIG. 19 is a sectional view showing a chip component supply device according to a sixth embodiment.

FIG. 20 is a sectional view showing a chip component supply device according to a seventh embodiment.

[Explanation of symbols]

1, 30, 40, 50 ... Load plate, 1a, 30
a, 40a, 50a ... Telescopic plate portion, 1b, 30b,
40b, 50b ... Support plate portion 1e, 30c, 40
e, 50g ... accommodation space, 2,20 ... carrier plate,
2c, 20a ... Holding space, 3 ... Chip component body, 6 ... External electrode, 8 ... Guide plate.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical indication H01G 13/00 391 7922-5E H01G 13/00 391B

Claims (8)

[Claims] 1. A load plate having a large number of accommodating spaces for accommodating chip element bodies and accommodating the same, and a carrier plate having a retaining space for elastically retaining the chip component elements are prepared, and the accommodating space is prepared. In the external electrode forming method of the chip component, wherein the chip component body housed in the holding component is moved to the holding space, and thereafter, the conductor for external electrode is applied to the chip component body moved to the holding space. An expandable plate portion arranged on the insertion side of the chip component body and capable of expanding and contracting in the thickness direction, and a support plate portion supporting the chip component body inserted from the expandable plate portion side. An accommodating step of arranging the support plate portions vertically and accommodating a chip component element body in the accommodating space; And a transfer step of moving one toward the other to transfer the chip component body of the accommodation space to the holding space side, and the chip component body held in the holding space after the transfer step. And a conductor applying step of applying the conductor to one end side protruding from the carrier plate. 2. The external electrode forming method for a chip part according to claim 1, wherein the elastic plate portion is formed of an elastic resin sponge. 3. The method for forming an external electrode of a chip component according to claim 1, wherein the elastic plate portion has a spring means interposed. 4. The depth dimension of the accommodation space is smaller than the height dimension of the chip component body when the expansion plate portion is contracted.
The external electrode forming method for a chip component according to any one of 1. 5. The accommodation space is formed between a through hole penetrating the load plate and an upper end surface of a pin inserted into the through hole, and when the expandable plate portion contracts,
4. The external electrode forming method for a chip component according to claim 1, wherein the depth dimension is smaller than the height dimension of the chip component body. 6. The holding space is formed by a through hole penetrating the carrier plate, and the thickness dimension of the carrier plate is smaller than the height dimension of the chip component body. A method for forming external electrodes of a chip component according to claim 5. 7. The chip part according to claim 1, wherein the holding space is formed by a recess having a depth smaller than a height dimension of the chip part body. External electrode formation method. 8. A guide plate having a guide hole for guiding the chip component body into the accommodation space is prepared, and when the chip component body is accommodated in the accommodation space, the guide plate is mounted on the load plate. The method for forming an external electrode of a chip component according to claim 1, wherein the external electrode is formed.