JPH0922839A - Apparatus for forming outer electrode of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for forming the outer electrode of an electronic component which can prevent the fall-off of a chip component which happens when the chip component is separated from a pasted surface. SOLUTION: Fine unevenness is formed on the upper surface (pasted surface) of a pasting table 1 by the through holes 1c of a mesh plate 1b to reduce the contact area between the end surface of a chip component C and the pasted surface. With this constitution, a tensile force which is produced when the end surface of the chip component C is separated from the pasted surface is reduced and the fall-off of the chip component from a component holding plate can be avoided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an external electrode forming apparatus for electronic parts for forming external electrodes on chip parts.

[0002]

2. Description of the Related Art FIG. 8 shows a conventional external electrode forming apparatus of this kind. In FIG. 8, 11 is a paste attaching base, P is an electrode paste, 12 is a component holding plate, and C is a chip component.

The paste attaching base 11 has a flat upper surface, and the electrode paste P is uniformly applied to the upper surface by a method such as screen printing to have a constant thickness.

The component holding plate 12 is provided so as to cover a rigid plate having a large number of through holes in a predetermined arrangement and the upper and lower surfaces of the plate and the inside of the through holes, and has a diameter smaller than the through holes at the center position of the through holes. It is made of an elastic material having a hole, and elastically holds the columnar or prismatic chip component C pushed into the holding hole in a vertical posture.

To form external electrodes on the chip component C, the component holding plate 12 is lowered from the state shown in FIG. 8 to press the end portion of the chip component C against the upper surface of the paste adhering base 11, and after pressing, the component holding plate. It is carried out by raising 12 and returning (see FIG. 9). Since the electrode paste P is uniformly applied to the upper surface of the paste attaching base 11 with a constant thickness, if the chip component C is lifted and restored after pressing, the electrode paste P should be attached in a dimension according to the applied thickness. You can

[0006]

In the above-mentioned conventional apparatus,
Since the paste is applied by applying the electrode paste P on the flat upper surface of the paste attaching base 11 and pressing the end of the chip component C against the flat upper surface, when the chip component C is lifted and returned from the pressing position, Paste adhesion table 11
There is a problem that a tensile force corresponding to the contact area acts on the end surface of the chip component C substantially in surface contact with the flat upper surface of the chip component C, and the chip component C slips out of the component holding plate 11.
In order to prevent this, when trying to obtain a component holding force superior to the above-mentioned pulling force on the component holding plate 11 side, the component holding plate 11
It becomes extremely difficult to push the chip component C into the holding hole.

The present invention has been made in view of the above problems, and an object of the present invention is to provide an electronic component capable of preventing the chip component from coming out of the component holder when the chip component is separated from the paste adhering surface. An object is to provide an external electrode forming device.

[0008]

In order to achieve the above object, the invention of claim 1 presses a predetermined surface of a chip component held by a component holder against a paste attachment surface coated with an electrode paste. Thus, in the external electrode forming device for an electronic component, which attaches the electrode paste to the chip component, the paste attaching surface is provided with irregularities for preventing surface contact between the paste attaching surface and the chip component surface. .

[0009]

According to the first aspect of the invention, the contact area between the chip component surface and the paste adhesion surface is reduced by providing the paste adhesion surface with irregularities for preventing surface contact between the paste adhesion surface and the chip component surface. This reduces the tensile force generated when the chip component is separated from the paste adhering surface.

[0010]

FIG. 1 shows a first embodiment of a paste adhering base used in the external electrode forming apparatus of the present invention. The paste adhering base 1 is composed of a base plate 1a having a flat upper surface and a mesh plate 1b having a constant thickness arranged on the base plate 1a. The mesh plate 1b has a circular cross section and a size. A large number of matching through holes 1c are formed in a predetermined array. Both the cross-sectional shape and the hole spacing of the through holes 1c are smaller than the end surface shape of the target chip component, and the plurality of through holes 1c face the end surface of the chip component.

To form the external electrodes on the chip component, first, the chip component is held on a component holding plate similar to that shown in FIG. 8, and the electrode paste P is applied to the paste attachment base 1 with a constant thickness with reference to the upper surface of the mesh plate 1b. After applying evenly, lower the component holding plate and press the end of the chip component C against it,
This is carried out by raising the component holding plate after pressing and returning (see FIG. 2). Since the electrode paste P is uniformly applied to the upper surface of the paste attaching base 1 with a constant thickness, if the chip component C is lifted and restored after being pressed, the electrode paste P should be attached in a dimension corresponding to the applied thickness. You can

Since fine irregularities are formed on the upper surface of the paste adhering base 1 (paste adhering surface) by the through holes 1c of the mesh plate 1b, the upper surface of the paste adhering base 1 and the chip component C at the time of pressing. The contact area with the end face is much smaller than that of the conventional one, so that even when the chip component C is lifted and returned from the pressing position, a large pulling force does not act on the end face of the chip component C. Therefore, when the chip component C is lifted and returned from the pressing position, the chip component C does not slip out of the component holding plate, and the holding and holding state can be appropriately maintained and desired external electrode formation can be favorably performed. it can.

In the first embodiment, the mesh plate 1b is used.
Although the through holes 1c formed in 1 have the same size, the same action and effect can be obtained by forming through holes having different sizes in a predetermined arrangement. Further, the mesh plate 1b can be excluded by forming a hole corresponding to the through hole 1c on the upper surface of the base plate 1a.

FIG. 3 shows a second embodiment of the paste adhering base used in the external electrode forming apparatus of the present invention. The paste attachment base 2 includes a base plate 2a having a flat upper surface,
The mesh plate 2b is arranged on the base plate 2a and has a constant thickness. The mesh plate 2b is formed with a large number of through holes 2c having a rectangular cross section and different sizes in a predetermined arrangement. Both the cross-sectional shape and the hole spacing of the through holes 2c are smaller than the end surface shape of the target chip component, and the plurality of through holes 2c face the end surface of the chip component.

In forming the external electrodes on the chip component, first, the chip component is held on a component holding plate similar to that shown in FIG. 8, and the electrode paste is uniformly applied to the paste attachment base 2 with a constant thickness with reference to the upper surface of the mesh plate 2b. After the application, the component holding plate is lowered to press the end portion of the chip component against it, and after the pressing, the component holding plate is raised and returned. Since the electrode paste is uniformly applied to the upper surface of the paste attaching base 2 with a constant thickness, if the chip component is lifted and restored after the pressing, the electrode paste can be attached with a dimension according to the applied thickness.

Since fine irregularities are formed on the upper surface (paste adhering surface) of the paste adhering table 2 by the through holes 2c of the mesh plate 2b, the upper surface of the paste adhering table 2 and the end surface of the chip component at the time of pressing. The area of contact with the chip component is much smaller than that of the conventional one, so that even when the chip component is lifted and returned from the pressing position, a great tensile force does not act on the end face of the chip component. Therefore,
Also in this embodiment, the same operation and effect as in the first embodiment can be obtained.

In the second embodiment, the mesh plate 2b is used.
Although the through-holes 2c formed in the above are different in size, the same action and effect can be obtained by forming through-holes having the same size in a predetermined arrangement.
Further, the mesh plate 2b can be excluded by forming a hole corresponding to a through hole on the upper surface of the base plate 2a.

FIG. 4 shows a third embodiment of the paste adhering base used in the external electrode forming apparatus of the present invention. The paste adhering base 3 is formed on a base plate 3a having a flat upper surface,
The long grooves 3b having a predetermined width and depth are formed in parallel with each other. The width and interval of the long grooves 3b are both smaller than the end face shape of the target chip component,
A plurality of long grooves 3b face the end surface of the chip part.

To form the external electrodes on the chip component, first, the chip component is held by a component holding plate similar to that shown in FIG. 8, and the electrode paste is uniformly applied to the paste attachment base 3 with a constant thickness with reference to the upper surface of the base plate 3a. After the application, the component holding plate is lowered to press the end portion of the chip component against it, and after the pressing, the component holding plate is raised and returned.
Since the electrode paste is uniformly applied to the upper surface of the paste attaching table 3 with a constant thickness, if the chip component is lifted and restored after the pressing, the electrode paste can be attached with a dimension corresponding to the applied thickness.

Since the fine grooves are formed by the long grooves 3b on the upper surface (paste adhering surface) of the paste adhering base 3, the contact area between the upper surface of the paste adhering base 3 and the end surface of the chip component at the time of pressing is small. It is much smaller than the conventional one, so that even when the chip component is lifted and returned from the pressing position, a great tensile force does not act on the end surface of the chip component. Therefore, also in this embodiment, the same operation and effect as in the first embodiment can be obtained.

In the third embodiment, the long grooves 3b formed on the base plate 3a have the same width, but the same operation can be achieved by forming the long grooves having different widths in parallel. The effect can be obtained. The longitudinal length of the long groove 3b may extend over the entire upper surface of the base plate 3.

FIG. 5 shows a fourth embodiment of the paste adhering table used in the external electrode forming apparatus of the present invention. The paste adhering base 4 is formed on a base plate 4a having a flat upper surface,
The ridges 4b having a predetermined width and height are formed in parallel with each other. The width and spacing of the ridges 4b are both smaller than the end face shape of the target chip component,
A plurality of ridges 4b face the end surface of the chip component.

To form the external electrodes on the chip component, first, the chip component is held on a component holding plate similar to that shown in FIG. 8, and the electrode paste is uniformly applied to the paste attaching base 4 with a constant thickness with reference to the upper surface of the convex stripe 4b. After the application, the component holding plate is lowered to press the end portion of the chip component against it, and after the pressing, the component holding plate is raised and returned.
Since the electrode paste is uniformly applied to the upper surface of the paste attaching table 4 with a constant thickness, if the chip component is lifted and restored after the pressing, the electrode paste can be attached in a size corresponding to the applied thickness.

Since fine irregularities are formed on the upper surface (paste adhering surface) of the paste adhering table 4 by the projections 4b, the contact area between the upper surface of the paste adhering table 4 and the end surface of the chip component at the time of pressing. Is much smaller than the conventional one, so that even when the chip component is lifted and returned from the pressing position, a great tensile force does not act on the end face of the chip component. Therefore, also in this embodiment, the same operation and effect as in the first embodiment can be obtained.

In the fourth embodiment described above, the protrusions 4b formed on the base plate 4a have the same width, but the protrusions having different widths may be formed in parallel. The action and effect can be obtained. Further, as the ridges 4b, those having a long length extending over the entire upper surface of the base plate 4 are shown.
A plurality of ridges shorter than this may be linearly continuous.

FIG. 6 shows a fifth embodiment of the paste adhering table used in the external electrode forming apparatus of the present invention. The paste attaching table 5 has a flat upper surface, and a base plate 5 having a large number of pin press-fitting holes 5b formed in a predetermined arrangement on the upper surface.
a and a plurality of pins 5c that are press-fitted into the pin press-fitting holes 5b such that the protrusion amounts thereof are the same. Pin 5
The cross-sectional shape and spacing of c are both smaller than the end surface shape of the target chip component, and a plurality of pins 5 are provided on the end surface of the chip component.
c faces each other.

To form external electrodes on the chip component, first, the chip component is held on a component holding plate similar to that shown in FIG. 8, and the electrode paste is uniformly applied to the paste attaching table 5 with a constant thickness with reference to the upper surface of the pin 5c. After the application, the component holding plate is lowered to press the end portion of the chip component against this, and after the pressing, the component holding plate is raised and returned.
Since the electrode paste P is uniformly applied to the upper surface of the paste attaching table 5 with a constant thickness, if the chip component is lifted and restored after pressing, the electrode paste can be attached in a dimension according to the applied thickness. .

Since fine irregularities are formed on the upper surface (paste adhering surface) of the paste adhering table 5 by the pins 5c, the contact area between the upper surface of the paste adhering table 5 and the end surface of the chip component during pressing is small. It is much smaller than the conventional one, so that even when the chip component is lifted and returned from the pressing position, a great tensile force does not act on the end surface of the chip component. Therefore, also in this embodiment, the same operation and effect as in the first embodiment can be obtained.

In the fifth embodiment described above, the pins 5c press-fitted into the base plate 5a have the same cross-sectional shape. However, the pins having different cross-sectional shapes may be provided in a predetermined arrangement in the same manner. The action and effect can be obtained. Also, the base plate 5
The pin 5c can be excluded by forming a projection corresponding to the pin 5c on the upper surface of a. Further, the pins and projections may be formed in a sharp shape, for example, a cone shape, a pyramid shape, a needle shape, or the like. In this case, if at least three pins or projections contact the chip component. Stable paste attachment is possible.

FIG. 7 shows a sixth embodiment of the paste adhering table used in the external electrode forming apparatus of the present invention. The paste adhering base 6 has a flat upper surface and a base plate 6a having ribs 6b on the periphery of the upper surface, and a large number of linear bodies 6c, for example, wires arranged inside the ribs on the upper surface of the base plate 6a without gaps. It consists of and. The width of each of the linear members 6c is smaller than the end face shape of the target chip component, and the plurality of linear members 6c face the end face of the chip component.

In forming the external electrodes on the chip component, first, the chip component is held on a component holding plate similar to that shown in FIG. 8, and the paste attaching table 6 is fixed to a certain thickness of the electrode paste with reference to the upper edge of the linear body 6c. After uniform application, the component holding plate is lowered to press the end portion of the chip component against this, and after the pressing, the component holding plate is raised and returned. Since the electrode paste is uniformly applied to the upper surface of the paste attaching table 6 with a constant thickness, the electrode paste P can be attached in a dimension according to the applied thickness by raising and returning the chip component after pressing. .

Since fine irregularities are formed on the upper surface (paste adhering surface) of the paste adhering table 6 by the linear members 6c, the upper surface of the paste adhering table 6 and the end surface of the chip component are brought into contact with each other during pressing. The area is much smaller than that of the conventional one, so that even when the chip component is lifted and returned from the pressing position, a great tensile force does not act on the end face of the chip component. Therefore, the first embodiment also
The same action and effect as those of the embodiment can be obtained.

In the sixth embodiment described above, the linear bodies 6c arranged side by side on the base plate 6a have the same width, but the same is true even if linear bodies having different widths are arranged. The action and effect of can be obtained. Further, although the linear body 6c has a circular cross section as an example, a semicircular or triangular cross section may be used as the linear body.

As described above, in each of the embodiments, the one in which the electrode paste is attached to the end portion in the longitudinal direction of the chip component has been exemplified.
The same effect can be obtained when the holding direction is changed to the chip component and the electrode paste is attached to the side surface or the like.

[0035]

As described in detail above, according to the invention of claim 1, the contact area between the chip component surface and the paste adhering surface is reduced, so that the tensile force generated when the chip component is separated from the paste adhering surface. It is possible to reduce the force, which reliably prevents the chip component from slipping out of the component holder when separating the chip component from the paste adhering surface, and maintains the component holding state properly. External electrodes can be formed well.

[Brief description of drawings]

FIG. 1 is a partial perspective view showing a first embodiment of a paste adhering table according to the present invention.

FIG. 2 is a diagram showing a state in which a chip part is pressed against a paste attachment base.

FIG. 3 is a partial perspective view showing a second embodiment of the paste adhering table according to the present invention.

FIG. 4 is a partial perspective view showing a third embodiment of the paste adhering table according to the present invention.

FIG. 5 is a partial perspective view showing a fourth embodiment of the paste adhering table according to the present invention.

FIG. 6 is a partial perspective view showing a fifth embodiment of the paste adhering table according to the present invention.

FIG. 7 is a partial perspective view showing a sixth embodiment of the paste adhering table according to the present invention.

FIG. 8 is a view showing a conventional external electrode forming device.

FIG. 9 is a diagram showing a state in which a chip part is pressed against a paste attachment base.

[Explanation of symbols]

1 ... Paste adhesion base, 1a ... Base plate, 1b ... Mesh plate,
1c ... through hole, C ... chip component, P ... electrode paste, 2
... Paste adhering base, 2a ... Base plate, 2b ... Mesh plate, 2
c ... through-hole, 3 ... paste attachment base, 3a ... base plate, 3b ...
Long groove, 4 ... Paste attachment base, 4a ... Base plate, 4b ... Convex strip,
5 ... Paste adhering base, 5a ... Base plate, 5b ... Pin press-fitting hole,
5c ... Pins, 6 ... Paste adhering table, 6a ... Base plate, 6b ...
Rib, 6c ... Linear body.

Claims (1)

[Claims] 1. An external electrode forming apparatus for an electronic component, wherein an electrode paste is adhered to a chip component held by a component holder by pressing a predetermined surface of the chip component against the paste-adhered face coated with the electrode paste. The external electrode forming apparatus for an electronic component according to claim 1, wherein the paste adhering surface is provided with unevenness for preventing surface contact between the paste adhering surface and the chip component surface.