JPH0922850A - Method of forming outer electrode of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method by which electrode paste can be stably applied to chip electronic components to form the outer electrodes of the components. SOLUTION: Electrode paste P is applied to the one side end parts of chip components while the chip components C are supported by a component supporter 1 and, further, the chip components C are taken out in the same postures by a component transfer unit to apply the electrode paste to the other side end parts of the chip components C. With this constitution, it is not necessary to move the chip component C in a component fitting hole like a conventional constitution, so that the inclination of the component which is caused by the movement can be avoided and the paste can be stably applied to the chip component.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming an external electrode of an electronic component, in which an external electrode is formed at each of opposing portions of a chip component.

[0002]

2. Description of the Related Art As a method of forming external electrodes at both ends of a chip component, a plate having a large number of component storage holes formed in an elastic body is used, and the chip component is pushed into each component storage hole of the plate and is elastic. Of the chip components protruding from the plate is pressed together against the paste attachment base to attach the electrode paste and dry it, and then the chip components are stored in the storage holes. There is known a method in which the other end of the chip component protruding from the plate is moved by pressing and the other end of the chip component protruding from the plate is collectively pressed against the paste adhering base to adhere the electrode paste to dry it.

[0003]

In the above-mentioned conventional external electrode forming method, it is necessary to move the component held in the component storage hole in the component storage hole before the paste is attached and to project the end portion thereof. Therefore, the chip component is likely to tilt due to the resistance received during the movement. That is, the desired paste attachment size and shape cannot be obtained for the chip component in a tilted state, and the chip component becomes a defective product.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method of forming an external electrode of an electronic component, which enables stable paste attachment to a chip component.

[0005]

In order to achieve the above object, the invention of claim 1 provides an external electrode forming method for an electronic component, wherein an electrode paste is adhered to each of opposing portions of a chip component to form an external electrode. Using a component support having a large number of recesses capable of supporting the chip component in a state in which one part is protruding, the chip component is inserted into the recess of the component support and supported in a state in which one part is protruding, After the electrode paste is adhered to one part of the chip part in a supported state and dried, the chip part supported by the part support is taken out in the same posture by the part transfer body and the electrode is applied to the other part of the chip part. The feature is that the paste is attached and dried.

[0006]

According to the first aspect of the invention, the chip component is inserted into the recess of the component support so as to be supported in a state in which one portion is projected, and the electrode paste is attached to one portion of the chip component in the supported state. Then, the chip component supported by the component support is taken out by the component transfer body in the same posture, and the electrode paste is adhered to the other part of the chip component and dried, so that each of the opposing parts of the chip component is Form external electrodes.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 shows a step of inserting and supporting a chip component in a recess of a component support. In FIG. 1, 1 is a component support and C is a chip component.

The component support 1 is formed of an elastic material such as rubber in the shape of a band having a constant width and a constant thickness, as shown in FIGS.
As shown in FIG. 2, the recesses 1a capable of supporting the chip component C in a state where the end portions thereof project are arranged in a predetermined arrangement, specifically, FIG.
As shown in (3), three pieces are arranged at equal intervals in the width direction, and these are arranged in a continuous array at equal intervals in the length direction. The recess 1a has a circular cross-sectional shape, and when the chip component C has a columnar shape, the inner diameter R thereof is equal to or slightly larger than the component diameter, and when the chip component C has a square columnar shape. The inner diameter R is set to be equal to or slightly larger than the diagonal length of the end face of the component. The depth D of the recess 1a is set to about half the longitudinal dimension of the chip component C so that the chip component C can be maintained in the upright state.

The chip component C in the recess 1a of the component support 1
The insertion support of the chip component C is performed from above the component support 1 while advancing the component support 1 in the longitudinal direction thereof.
It is carried out by inserting into a. The lower part of the chip component C inserted into the recess 1a is supported by the bottom surface and the inner surface of the recess, and the upper part thereof projects from the upper surface of the support. For this component insertion, a manipulator capable of moving the chip components C one by one in a predetermined posture by a suction head, a chute capable of cutting out the chip components C one by one in a predetermined posture, and the like can be used. The chip parts C can be inserted into the three recesses 1a at the same time by arranging the chip parts C corresponding to the recesses 1a arranged in line.

FIG. 3 shows a step of attaching the electrode paste to one end of the chip component. In FIG. 3, 2 is a coating roller, 3 is a supply roller, 4 is a weir, and P is an electrode paste.

The coating roller 5 is a concave portion 1a of the component support 1.
It has an axial width corresponding to the three chip parts C in the width direction inserted in the. The electrode paste P stored in the weir 4 is supplied to the peripheral surface of the coating roller 5 through the supply roller 3 in a constant thickness.

The paste is attached to one end of the chip component C by advancing the component support 1 after component insertion under the coating roller 2 and rotating the rollers 2 and 3 accordingly. The protruding end of the chip component C inserted into the recess 1a of the component support 1 comes into contact with the roller peripheral surface when passing under the coating roller 2. Since the electrode paste P is supplied to the peripheral surface of the coating roller 2 with a constant thickness, the electrode paste P is attached to one end of the chip component C in a size according to the supply thickness due to the above contact (P ′ in the figure). See).

FIG. 4 shows a step of drying the electrode paste attached to one end of the chip component. In FIG. 4, 5 is a heating furnace.

The heating furnace 5 has an inlet and an outlet on both sides in the longitudinal direction, and has an electric heater 5a serving as a dry heat source inside.

The electrode paste P'attached to one end of the chip component C is dried by passing the component support 1 into which the chip component C after the paste attachment is inserted into the heating furnace 5. If the temperature inside the heating furnace 5 is maintained at a temperature suitable for paste drying and the length of the heating furnace 5 is set in consideration of the passage time, the attached paste P ′ can be sufficiently dried in the above passage process.

FIG. 5 shows a step of transferring the chip component after the paste is dried from the component support to the component transfer body, and attaching the electrode paste to the other end thereof. In FIG. 5, 6 is the component transfer body.

The component transfer body 6 can be moved in the vertical and horizontal directions by a drive mechanism (not shown), and a recess 6a capable of supporting the chip component C with its end projecting is supported on the lower surface of the component carrier. An array corresponding to the concave portion 1a of the body 1,
Specifically, the component support 1 has a 3 × 4 arrangement in the width direction and the length direction. The recess 6a has a circular cross-sectional shape, and when the chip component C has a cylindrical shape, its inner diameter R
Is equal to or slightly larger than the component diameter, and when the chip component C is a quadrangular prism, its inner diameter R is set equal to or slightly larger than the diagonal length of the component end face. An air hole 6b communicating with an air compressor (not shown) is formed at the center of the upper surface of each recess 6a.
Further, an annular elastic layer (not shown) made of rubber or the like is attached to the upper surface of each recess 6a.

Transfer of parts to the parts transfer body 6 and chip parts C
To attach the paste to the other end of the component, first, as shown in FIG. 5A, the component transfer body 6 is moved onto the component support 1 so that the concave portion 6a corresponds to the chip component C after the paste is dried. Then, the component transfer body 6 is lowered here to insert the protruding portion of the chip component C into each recess 6a, and the component transfer body 6 is raised while applying a negative pressure by air suction. As a result, the chip component C is transferred from the component support 1 to the component transfer body 6, and the lower part of the chip component C held in the recess 6 a projects from the lower surface of the component transfer body 6.

Next, as shown in FIG. 5B, the component transfer body 6 supporting the chip component C is moved onto the paste adhering table 7 on which the electrode paste P is applied, and the component transfer is carried out here. The body 6 is lowered and the protruding end of the chip component C is pressed against the paste attachment base 7. Since the electrode paste P is supplied to the upper surface of the paste adhering table 7 with a constant thickness, if the component support head 6 is lifted after the above-mentioned pressing, the electrode paste P is supplied to the other end of the chip component C with a constant thickness. It is attached with the size according to.

FIG. 6 shows a step of drying the electrode paste attached to the other end of the chip component. In FIG. 6, 8 is a heating furnace.

The heating furnace 8 has an inlet and an outlet on both sides in the longitudinal direction, and has an electric heater 8a serving as a dry heat source inside. Although the upper wall of the heating furnace 8 is omitted in the illustrated example, a slit that allows passage of the support shaft portion of the component transfer body 6 is formed in the longitudinal direction at the center of the upper wall.

The electrode paste P'attached to the other end of the chip component C is dried by passing the component support head 6 which supports the chip component C after the paste attachment into the heating furnace 8. If the temperature inside the heating furnace 8 is maintained at a temperature suitable for paste drying and the length of the heating furnace 8 is set in consideration of the passage time, the attached paste P ′ can be sufficiently dried during the above passage process.

FIG. 7 shows a step of taking out the chip component after the external electrodes are formed from the component transfer body.

The removal of the chip component after the external electrodes are formed by stopping the air suction in the component transfer body 6 after passing through the heating furnace 8 and forcibly discharging the chip component C in the recess 6a by the positive pressure. Be implemented. Of course, if the chip component C can be expected to drop by its own weight, it can be discharged by simply stopping the air suction.

The chip components C discharged from the recess 6a of the component transfer body 6 are once stored in a container or the like arranged below the chip components C, and if a baking process is required, they are collectively processed after the baking process. Barrel is polished.

As described above, according to the above-mentioned external electrode forming method, the electrode paste P is attached to one end of the chip component C while being supported by the component support 1, and the chip component C is attached to the component. Since the electrode paste P is attached to the other end of the chip component C by the transfer body 6 in the same posture, there is no need to move the chip component C in the component storage hole as in the conventional case. It is possible to prevent the component from tilting due to the movement and to stably attach the paste to the chip component C.

Since elastic deformation can be expected in each of the bottom surface of the recess 1a of the first component support 1 and the top surface of the recess 6a of the component transfer body 6, even when the projection amount of the chip component C varies. By using the elastic deformation, the chip component C can be pushed into the concave portion by using the peripheral surface of the coating roller 2 and the upper surface of the paste adhering base 7 as a reference, and the amount of protrusion thereof can be made uniform to make the paste adhering dimension uniform.

FIG. 8 shows another example of the component support and the component transfer body. The component transfer body 9 is movable in the vertical direction and the horizontal direction by a drive mechanism (not shown), and a recess 9a capable of holding the chip component C in a state where its end portion is projected is provided on the lower surface thereof. The concave portion 1a has an array corresponding to the concave portion 1a. The recess 9a has a circular cross-sectional shape, the inner diameter R is slightly smaller than the component diameter when the chip component C is cylindrical, and the inner diameter R is the square column when the chip component C is quadrangular. R is set to be slightly smaller than the diagonal length of the end face of the component. On the other hand, the component support 1 has the same basic configuration as that of the above embodiment, and the recess 1
The bottom surface of a has a pin insertion hole 1b. Into the pin insertion hole 1b, a plurality of component moving pins 10 arranged in the same arrangement as the concave portions 9a of the component transfer body 9 are inserted from below.

To transfer the component to the component transfer body 9, first, the component transfer body 9 is moved onto the component support 1 so that the recess 9a thereof corresponds to the chip component C after the paste is dried. It is carried out by inserting 10 into the pin insertion hole 1b of the component support 1 from below, moving the chip component C upward, and inserting the protruding portion thereof into the recess 9a of the component transfer body 9 with a slight press fit. The chip component C transferred from the component support 1 to the component transfer body 9 has its lower portion projected from the lower surface of the component transfer body 9. The procedure other than the component transfer is the same as that of the above-described embodiment, and the description thereof is omitted here.

In the above-mentioned embodiment, the component support is formed in the shape of a strip, but the component support may be formed in the shape of a plate.

Although the concave portion of the component support has a circular cross section, it may have a rectangular or elliptical cross section as long as it can support the chip component in a predetermined posture. By the way, when making the recess shape of the component support larger than the chip component, it is preferable to position the chip component in the recess by air suction or external force application.

Although the component support is made of an elastic material in the above description, only the surface forming the recess may be made of an elastic material and the other portions may be made of metal, resin or the like.

Further, although the chip component is supported in the longitudinal direction by way of example, if the shape of the recess is changed so that the chip component can be supported in another direction, the side face other than the end portion can be similarly exposed to the outside. Electrodes can be formed.

[0035]

As described in detail above, according to the invention of claim 1, the electrode paste is attached to one end of the chip component while being supported by the component support, and the chip component is attached to the component. Since the electrode paste is adhered to the other end of the chip part by the transfer body in the same posture, it is not necessary to move the chip part within the part accommodating hole as in the conventional case. It is possible to prevent the component from tilting and to stably attach the paste to the chip component.

[Brief description of drawings]

FIG. 1 is a diagram showing a process of inserting and supporting a chip component in a recess of a component support.

FIG. 2 is a partial top view of a component support and a cross-sectional view of its main part.

FIG. 3 is a diagram showing a process of attaching an electrode paste to one end of a chip component.

FIG. 4 is a diagram showing a process of drying an electrode paste attached to one end of a chip component.

FIG. 5 is a diagram showing a process of transferring a chip component after paste drying from a component support to a component transfer body and attaching an electrode paste to the other end.

FIG. 6 is a diagram showing a process of drying the electrode paste attached to the other end of the chip component.

FIG. 7 is a diagram showing a process of taking out a chip component after formation of external electrodes from a component transfer body.

FIG. 8 is a diagram showing another example of the component support and the component transfer body.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Component support, 1a ... Recessed part, C ... Chip part, 2 ... Coating roller, 3 ... Supply roller, 4 ... Weir, P ... Electrode paste, P '... Adhesive paste, 5 ... Heating furnace, 5a ... Electric heater, 6 ... Component transfer body, 6a ... Recessed portion, 6b ... Air hole, 7 ...
Paste attachment table, 8 ... Heating furnace, 9 ... Parts transfer body, 10 ...
Parts movement pin.

Claims (1)

[Claims] 1. A method for forming an external electrode of an electronic component, comprising forming an external electrode by depositing an electrode paste on each of the facing portions of the chip component, wherein a plurality of recesses capable of supporting the chip component in a state in which one portion is projected are provided. Using the provided component support, insert the chip component into the recess of the component support to support it with one part projecting, and then attach the electrode paste to one part of the chip component in the supported state and dry it. After that, the chip component supported by the component support is taken out by the component transporter in the same posture, and the electrode paste is attached to the other part of the chip component and dried, whereby the external electrode of the electronic component is formed. Method.