JPH0922848A - Method of forming outer electrode of electronic component and component holder used for that method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method by which the number of components held by one component holder, i.e., a unit processing quantity, can be increased and the outer electrodes of an electronic component can be formed efficiently. SOLUTION: A number of holding holes 3a are formed in an elastic layer 3 provided on the circumference of the rigid cylindrical unit 2 of a component holder 1. Chip components pushed into the holding holes 3a are elastically held by the inner walls of the holes 3a. The chip components are pushed into the holes of the component holder 1 so as to have the end parts of the chip components protrude from the surface of the elastic layers 3 and, in that holding state, electrode paste is applied to the protruding end parts of the chip components to form outer electrodes on both the end parts of the chip components.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of forming an external electrode of an electronic component for forming an external electrode on a chip component and a component holder used for the method.

[0002]

2. Description of the Related Art As a method of forming external electrodes at both ends of a chip component, a plate having a large number of component storage holes formed in an elastic body is used, and the chip component is pushed into each component storage hole of the plate and is elastic. Of the chip components held in the component storage holes are pressed together against the paste attachment base to attach the electrode paste and dry it. In the component storage hole to project the other end from the plate, and the projecting ends of the chip components held in the component storage hole are collectively pressed against the paste attachment base to attach the electrode paste and dry it. It has been known.

[0003]

In the above-mentioned conventional external electrode forming method, since the paste attachment to the chip parts and the drying of the attached paste are carried out in plate units, it is difficult to improve the efficiency of the external electrode formation. It is necessary to increase the number of parts held per plate, that is, the number of unit processes. However, since the plate itself is a flat plate, an attempt to increase the number of parts to be held inevitably results in an increase in the plate outer diameter, which causes distortion and warpage of the plate itself, making the paste adhesion dimension unstable. In addition, there is a problem that the heating furnace for drying is increased in size.

The present invention has been made in view of the above problems, and an object of the present invention is to increase the number of parts to be held per holder, that is, the number of unit processes, to efficiently form an external electrode. An object of the present invention is to provide a method of forming an external electrode of an electronic component that can be used, and a component holder used for the method.

[0005]

In order to achieve the above object, the invention of claim 1 is a method of forming an external electrode of an electronic component, wherein an electrode paste is attached to a predetermined portion of a chip component to form an external electrode. An elastic layer provided on the body circumferential surface is provided with a large number of holding holes, and a component holder for elastically holding the chip components pushed into the holding holes by the inner wall of the hole is used.
The chip component is pushed into the holding hole of the component holder to hold the chip component in a state in which a part thereof projects from the elastic layer surface, and the electrode paste is attached to the projecting portion of the chip component in the holding state. It is characterized by that.

According to a second aspect of the present invention, there is provided a component holder used for forming an external electrode of an electronic component, wherein the elastic layer provided on the peripheral surface of the cylindrical body is provided with a large number of retaining holes and is pushed into the retaining holes. It is characterized in that the formed chip component is elastically held by the inner wall of the hole.

[0007]

According to the invention of claim 1, the chip component is pushed into the holding hole of the elastic layer provided on the peripheral surface of the component holder to hold the chip component in a state in which a part of the chip component protrudes from the surface of the elastic layer. External electrodes are formed on the chip component by attaching the electrode paste to the protruding portions of the chip component in the same holding state.

According to the second aspect of the present invention, the chip component can be held by the holding hole of the elastic layer provided on the peripheral surface of the component holder.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an overall perspective view of a component holder according to the present invention, and FIG. 2 (a) is a sectional view of the component holder.
The enlarged views of the main parts are shown in FIG.

The component holder 1 comprises a rigid cylindrical body 2 made of metal or the like, an elastic layer 3 made of rubber or the like provided on the circumferential surface of the rigid cylindrical body 2, and a shaft rod 4. .

The rigid cylindrical body 2 has a large number of through holes 2a, which are larger than holding holes 3a, which will be described later, in a peripheral surface portion formed thinly.
Is arranged in a predetermined array, specifically, an array of hole rows arranged at equal intervals in the circumferential direction and continuous at equal intervals in the axial direction. The shaft rod 4 is arranged at the center of the rigid cylindrical body 2, and is connected to the peripheral surface portion of the rigid cylindrical body 2 via a flange 4a.

The elastic layer 3 is provided so as to extend inside and outside the peripheral surface of the rigid cylindrical body 2 and into the through hole 2a, and has holding holes 3a smaller than the through hole 2a in the same arrangement as the through hole 2a. There is. The holding hole 3a is capable of elastically holding a prismatic columnar chip component or a cylindrical columnar chip component pushed into the hole 3a in a vertical posture by its inner wall, and if this is satisfied, its sectional shape is a circle, Any rectangular shape may be used, and the hole length may be longer or shorter than the longitudinal dimension of the chip component. In the illustrated example, the elastic layer 3 is formed on both sides of the peripheral surface of the rigid cylindrical body 2 and in the through hole 2a, but the elastic layer 3 may be formed at least on one side of the peripheral surface and in the through hole 2a.

The procedure for forming external electrodes using the component holder 1 will be described below. FIG. 3 shows a step of pushing the chip component C into the holding hole 3a of the component holder 1 so that one end of the chip component C is projected from the surface of the elastic layer.

The rotary drum 11 and the component pushing pin 12 are used in the same process. The rotary drum 11 is arranged obliquely above the component holder 1 in parallel at a predetermined interval, and has a tapered guide hole 5a for receiving and temporarily holding the chip component C in a vertical posture on its peripheral surface. It has the same arrangement as the holding holes 3a. Chip components C are housed in the rotating drum 11 in a disassembled state, and the chip components C are temporarily held by entering the lowest guide holes 11a during the drum rotation process.

The component push-out pin 12 is arranged inside the rotary drum 11 in a non-contact state with the drum 11, and the chip component C temporarily held in the guide hole 11a at a predetermined angle position is inserted into the guide hole. It plays the role of pushing it out through 11a. The component push-out pins 12 are prepared by the number corresponding to the number of the guide holes 11a arranged in the longitudinal direction of the rotary drum 11, and the guide holes 11 arranged in the longitudinal direction.
The chip components C temporarily held by the respective a are simultaneously pushed out by the movement of the pins.

In the same process, the component holder 1 and the rotary drum 1
1 is intermittently rotated in the direction of the arrow in the drawing at the same speed, and the chip component C temporarily held in the guide hole 11a of the rotary drum 11 is moved outward by the component push-out pin 12 in the process of stopping the rotation, and this is moved to the component. It is pushed into the holding hole 3a of the holder 1.
The pushing of the component into the holding hole 3a is stopped to such an extent that 2/3 of the longitudinal dimension of the chip component C is depressed, and the component pushing pin 12 is restored after the pushing, and thereafter, this is repeated to hold the component holder 1. The chip component C is held in all the holes 3a. At the time of pushing in the component, a component guide for guiding the moving direction of the chip component may be interposed between the rotary drum 11 and the component holder 1.

For pushing the component into the holding hole 3a of the component holder 1, the device shown in FIG. 4, more specifically, a guide plate 21 having a guide hole 21a similar to the above and movable in the left-right direction, and a component push-out pin. 22 may be used. In this device, the guide plate 21 is moved leftward in the drawing, and the chip component C is dropped from a hopper or the like into the guide hole 21a at the moving position to temporarily hold the chip component C, and then the guide plate 21 is held.
Is moved to the position shown in the drawing, and the component push-out pin 22 is lowered there.
The chip component C, which is temporarily held by, can be pushed into the holding hole 3a of the component holder 1 and held.

FIG. 5 shows a step of attaching the electrode paste P to the protruding end of the chip component C held in the holding hole 3a of the component holder 1.

In the same process, the coating roller 32 and the supply roller 3
A paste application device 31 including 3 and a weir 34 is used. The application rollers 32 are arranged in parallel above the component holder 1 at a predetermined interval and have an axial width corresponding to all the guide holes 11 a arranged in the longitudinal direction of the component holder 1. The electrode paste P stored in the weir 34 is supplied to the peripheral surface of the coating roller 32 through the supply roller 33 in a constant thickness.

In the same process, the component holder 1 and the application roller 3
2 is rotated at the same speed in the direction of the arrow in the drawing, and the component holder 1
The projecting end portion of the chip component C held in the holding hole 3a is brought into contact with the peripheral surface of the coating roller 32. Application roller 32
Since the electrode paste P is supplied to the peripheral surface with a constant thickness, the electrode paste P ′ is attached to the protruding end portion of the chip component C in a size according to the supply thickness by the above contact.

FIG. 6 shows a step of drying the electrode paste P ′ attached to the protruding end of the chip component C.

A heating furnace 41 is used in the same process. This heating furnace 41 has a drying passage 4 having inlets and outlets on both sides in the longitudinal direction.
2 has an electric heater (not shown) serving as a dry heat source in the passage 42. Further, on the bottom surface of the drying passage 42, a pair of rails 4 for supporting the shaft rod 4 of the component holder 1 is provided.
3 are provided.

In the same step, the inside of the drying passage 42 is maintained at a temperature suitable for drying, and the component holder 1 for holding the chip component C after the paste is attached is provided in the drying passage 42 with the shaft rod 4 thereof.
While passing around while passing. Parts holder 1
As a method for moving the shaft holder 4 while rotating it, a heat-resistant conveyor belt is arranged on the guide rail 43 with the shaft rod 4 interposed therebetween, and a rotational force is applied to the shaft rod 4 by the movement of the conveyor belt so that the component holder 1 It is possible to employ a method of self-propelling, a method of tilting the guide rail 43 from the entrance to the exit, and moving the component holder 4 while rolling.

FIG. 7 shows the chip component C after the paste is dried.
Is shown to hold another component supporter 1.

In the same process, the same component extruding pin 51 as described above is used.
Is used. The component push-out pin 51 is arranged inside the component support 1 for holding the chip component C after the paste is dried, in a non-contact state with the support 1, and is held in the holding hole 3a which has come to a predetermined angle position. It plays the role of pushing out the existing chip component C to the outside. The component push-out pins 51 are prepared by the number corresponding to the number of holding holes 3a arranged in the longitudinal direction of the component holder, and the chip parts C held in the holding holes 3a arranged in the longitudinal direction are simultaneously extruded by the pin movement. Be done.

In the same step, the component holder 1 that holds the chip component C after the paste is dried and the component holder 1 that does not hold the chip component C are arranged in parallel at a predetermined interval, and both support members 1 Is intermittently rotated in the direction of the arrow in the figure at the same speed, and the chip component C held in the holding hole 3a of the upper component support 1 is moved outward by the component push-out pin 51 during the rotation stop process, and this is moved. It is pushed into the holding hole 3a of the lower component holder 1. The pushing of the component into the holding hole 3a is stopped to such an extent that 2/3 of the longitudinal dimension of the chip component C is recessed, the component pushing pin 51 is restored after the pushing, and thereafter, this is repeated to repeat the above process. The chip component C held by is transferred to and held in all the holding holes 3a of the lower component holder 1. At the time of pushing in the component, a component guide for guiding the moving direction of the chip component may be interposed between the rotary drum 11 and the component holder 1.

Although not shown, the electrode paste P is attached to the projecting end portion (end portion to which the paste is not attached) of the chip component C which is transferred to another component holder 1 and held, in the same manner as in FIG. The applied paste is dried in the same manner as in FIG.

FIG. 8 shows a process of taking out the chip component C after the electrode formation from the component support 1.

In the same process, the same component extruding pin 61 as described above is used.
Is used. The component push-out pin 61 is used for the component support tool 1.
Is disposed inside the support 1 in a non-contact state with the support tool 1 and serves to push out the chip component C held in the holding hole 3a that has come to a predetermined angle position to the outside. The component push-out pins 61 are prepared in the number corresponding to the number of the holding holes 3a arranged in the longitudinal direction of the component holder, and the holding holes 3 arranged in the longitudinal direction.
The chip components C held by the respective a are simultaneously pushed out by the pin movement.

In the same step, the component holder 1 for holding the chip component C after the paste is dried is intermittently rotated in the direction of the arrow in the figure, and the chip component held in the holding hole 3a of the component support 1 in the process of stopping the rotation. C is moved outward by the component push-out pin 61 and pushed out from the holding hole 3a. After the extrusion, the component push-out pin 61 is returned, and thereafter, this is repeated to store the chip component C held by the upper component support 1 in the lower container 62. The chip components C after the external electrodes are formed, which are housed in the container 62, are subjected to baking treatment if necessary, and are then barrel-polished collectively.

As described above, according to the above-mentioned embodiment, since the holding hole 3a is formed in the elastic layer 3 provided on the peripheral surface of the rigid cylindrical body 2 and the chip component C is held therein,
A large number of chip components can be held in a compact shape as compared with the conventional one in which the chip components are held on a flat plate. As a result, the number of parts to be held per holder, that is, the number of unit treatments can be increased to efficiently form the external electrodes in terms of time and cost.

In the above embodiment, the component holder has the shaft rod, but the shaft rod can be eliminated by using the end portion of the rigid cylindrical body as the shaft. Also,
If a gear-shaped groove is formed on the shaft rod peripheral surface or the peripheral surface of the end portion of the rigid cylinder, the component holder can be easily rotated using the groove, and the mark can be formed along the row of holes. If the mark is provided, the position can be positioned by optically detecting the mark.

In the above embodiment, the component holding hole is formed through the inside of the through hole of the rigid cylindrical body.
As shown in FIG. 9, even if the holding hole forming portion of the rigid cylindrical body is composed of only the relatively hard elastic layer 3 ′ and the holding hole 3′a with a bottom is formed in the elastic layer 3 ′, Holding hole 3'a
With this, it is possible to hold the chip component in a protruding state. In this case, the holding hole 3'a is formed on the bottom surface of the holding hole 3'a.
If the pin insertion hole 3'b smaller than a is formed, the same component movement and component removal as described above can be performed.

Further, in the above embodiment, the component holder has one
Although only one holding hole corresponding to one chip component is formed, a plurality of types of holding holes of different sizes are provided in the same pattern respectively, and one component holder can handle a plurality of types of chips. Parts can be selectively retained.

Furthermore, in the above embodiment, the paste is attached to the chip component by bringing the projecting end of the chip component held by the component holder into contact with the peripheral surface of the coating roller. As shown in 10, even if the component holder 1 holding the chip component in a protruding state is rolled on the paste application table 71 on which the electrode paste P is applied in a predetermined thickness, the height position thereof is regulated. It is possible to perform similar paste attachment.

Furthermore, in the above-mentioned embodiment, the electrode paste is attached to the longitudinal end portion of the chip component, but if the shape of the holding hole is changed to change the holding direction of the chip component, the end portion can be changed. Similarly, the electrode paste can be attached to the side surface other than the portion to form the external electrode.

[0037]

As described above in detail, according to the invention of claim 1, the number of parts held per holder, that is, the number of unit treatments is increased to form the external electrode in terms of time and cost. It can be done efficiently.

According to the second aspect of the present invention, a large number of chip components can be held in a compact shape as compared with the conventional one in which the flat plate plate holds the chip components.

[Brief description of drawings]

FIG. 1 is an overall perspective view of a component holder according to the present invention.

FIG. 2 is a cross-sectional view of a component holder and an enlarged view of its main part.

FIG. 3 is a diagram showing a process of pushing a chip component into a holding hole of a component holder to project one end of the chip component from the surface of an elastic layer.

FIG. 4 is a diagram showing another example of the component pushing device.

FIG. 5 is a diagram showing a process of attaching an electrode paste to a protruding end of a chip component held in a holding hole of a component holder.

FIG. 6 is a diagram showing a step of drying the electrode paste attached to the protruding end portion of the chip component.

FIG. 7 is a diagram showing a process of holding the chip component after the paste is dried on another component supporter.

FIG. 8 is a diagram showing a process of taking out a chip component after electrode formation from a component supporter.

FIG. 9 is a diagram showing another example of the component holding hole.

FIG. 10 is a diagram showing another method of depositing paste.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Component holder, 2 ... Rigid cylindrical body, 2a ... Through hole, 3 ...
Elastic layer, 3a ... Holding hole, 4 ... Shaft rod, 4a ... Flange, C
... Chip parts, 11 ... Rotating drum, 11a ... Guide hole, 1
2 ... Component extrusion pin, 21 ... Guide plate, 21a ... Guide hole, 22 ... Component extrusion pin, 31 ... Paste coating device,
32 ... Coating roller, 33 ... Supply roller, 34 ... Dam, P ...
Electrode paste, P '... Adhesive paste, 41 ... Heating furnace, 4
2 ... Drying passage, 43 ... Guide rail, 51 ... Component extrusion pin, 61 ... Component extrusion pin, 62 ... Container, 3 '... Elastic layer,
3'a ... holding hole, 3'b ... pin insertion hole, 71 ... paste application table.

Claims (2)

[Claims] 1. A method of forming an external electrode of an electronic component, comprising forming an external electrode by adhering an electrode paste to a predetermined portion of a chip component, the elastic layer provided on a peripheral surface of a cylindrical body having a large number of holding holes.
A component holder that elastically retains the chip component pushed into the holding hole by the inner wall of the hole is used, and the chip component is pushed into the holding hole of the component holder so that the part of the chip component is an elastic layer surface. A method of forming an external electrode for an electronic component, comprising: holding the electrode component in a state of protruding from the electrode component; 2. The elastic layer provided on the peripheral surface of the cylindrical body is provided with a large number of holding holes, and the chip component pushed into the holding holes is elastically held by the inner wall of the hole. Component holder used for forming external electrodes of electronic components.