JPH09237808A - Tape with adhesive for TAB, semiconductor connection substrate, and semiconductor device - Google Patents

Abstract

(57) Abstract: A novel adhesive tape for TAB having excellent adhesiveness is obtained, and a highly reliable semiconductor device using the same is economically provided. SOLUTION: The laminate comprises a laminate having an adhesive layer and a protective film layer on a flexible insulating film, and the adhesive layer contains crosslinked polymer particles and a polyamide resin as essential components. Adhesive tape for TAB, semiconductor connection substrate, and semiconductor device.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape automated bonding (T)
Tape with adhesive used in the AB method (hereinafter, TA
B tape), a semiconductor connection substrate, and a semiconductor device.

[0002]

2. Description of the Related Art An ordinary TAB tape has a three-layer structure in which a flexible organic insulating film such as a polyimide film is laminated with a releasing polyester film or the like as an adhesive layer and a protective film layer. It is composed of

[0003] TAB tapes include (1) perforation of sprocket and device holes, (2) thermal lamination with copper foil, (3)
It is processed into a TAB tape (pattern tape) through patterning (resist coating, etching, resist removal), and (4) tin or gold-plating processing steps. FIG. 1 shows the shape of the pattern tape. FIG. 2 is a cross-sectional view of one embodiment of the semiconductor device of the present invention. The inner lead portion 6 of the pattern tape is thermocompression-bonded (inner lead bonding) to the gold bump 10 of the semiconductor integrated circuit 8 to mount the semiconductor integrated circuit. Next, a semiconductor device is created through a resin sealing process using the sealing resin 9. Further, there is also adopted a method of connecting the conductor of the pattern tape and the gold bump of the semiconductor integrated circuit by wire bonding without having the inner lead portion. Such a semiconductor device is called a tape carrier package (TCP) type semiconductor device. T
The CP type semiconductor device is connected (outer lead bonding) to a circuit board or the like on which other components are mounted via outer leads 7 and mounted on an electronic device.

On the other hand, as electronic devices have become smaller and lighter in recent years, a semiconductor package has a QFP (quad flat flat) in which conventional connection terminals (outer leads) are arranged on the side of the package for the purpose of high-density mounting. Package), S
In place of OP (small outline package), BGA (ball grid array) and CSP (chip scale package) in which connection terminals are arranged on the back surface of the package have been partially used.
The biggest structural difference between BGA and CSP from QFP and SOP is that the former requires a substrate called an interposer, while the latter requires a substrate by using a metal lead frame. There is a point that does not. As the interposer referred to here, one obtained by bonding a copper foil to an organic insulating film such as a glass epoxy substrate or polyimide is generally used. Therefore, the TAB of the present invention can be applied to these semiconductor devices such as BGA and CSP.
A tape with an adhesive for use can be used, and the obtained B
GA and CSP are also included in the semiconductor device of the present invention. 3 and 4 are cross-sectional views of one embodiment of the semiconductor device (BGA, CSP) of the present invention.

In any of the above-mentioned package forms, the adhesive layer of the TAB tape finally remains in the package, so that the insulating property, heat resistance, and adhesive property are required. In recent years, with the progress of miniaturization and high-density mounting of electronic devices, the conductor width in the TAB method has become extremely narrow, and the need for an adhesive having high insulation reliability is increasing. Recently, especially as an accelerated test of insulation reliability,
At a high temperature of 25 ° C. to 150 ° C., the rate of decrease in insulation under continuous voltage application has become important. Further, when transfer molding, which has a relatively high temperature and pressure, is used for resin encapsulation of the package, or when connection is made by wire bonding, heat deformation resistance is important.

From such a viewpoint, a mixed composition of an epoxy resin and / or a phenol resin and a polyamide resin has been mainly used for the adhesive layer of the conventional TAB tape (Japanese Patent Laid-Open No. 143447/1990). JP-A-3
-217035, etc.). Further, there is also an example in which inorganic particles are added to a polyamide resin / epoxy resin system for the purpose of improving chemical resistance and insulation (Japanese Patent Publication No. 7-11422).
No. 1).

[0007]

However, the conventional TAB tape is not always sufficient in terms of the adhesiveness among the above-mentioned characteristics. For example, as the conductor width becomes narrower, the adhesive strength decreases, the conductor may peel off in a later step such as bonding, and it may not be possible to connect to an integrated circuit or a circuit board. This is mainly due to a shortage of the absolute value of the adhesive strength and a decrease in the effective adhesive area due to the penetration of the plating solution between the conductor and the adhesive.

It is an object of the present invention to solve the above problems and provide a novel TAB tape, a semiconductor connecting board and a semiconductor device which are excellent in adhesiveness.

[0009]

DISCLOSURE OF THE INVENTION In order to achieve the above object, the inventors of the present invention have earnestly studied the relationship between the chemical structure of the adhesive component of the TAB tape and the adhesiveness to metal, and as a result, crosslinked polymer particles have been obtained. TAB with excellent adhesiveness and insulation due to the skillful combination of polyamide and polyamide resin
It was found that a tape for use was obtained and the present invention was achieved.

That is, the present invention comprises a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, the adhesive layer comprising a polyamide resin and at least one or more cross-linking groups. A tape with an adhesive for TAB, a semiconductor connection substrate, and a semiconductor device, which contain polymer particles as an essential component.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The crosslinked polymer particles used in the present invention are required to be insoluble in a solvent and maintain the particle shape in a state of being contained in the adhesive of the final TAB tape. is there.

Conventionally, a method of blending a polymer has been used for modifying an adhesive. In this case, however, the phase separation structure changes depending on the addition amount and the addition method, and it is not always easy to obtain the desired characteristics. Absent. On the other hand, the size of cross-linked polymer particles has already been determined, so there is little effect from the type, amount, and method of addition of other adhesive components, making it easy to control physical properties and ensuring stable product quality. Can be obtained.

The method for crosslinking the crosslinked polymer particles is not particularly limited, and any of covalent bond and ionic bond may be used. For example, a method in which a polymer having a double bond in a main chain or a side chain, which is dispersed in a fine particle state by emulsion polymerization, is further crosslinked with a peroxide is exemplified.

The average particle diameter of the crosslinked polymer particles is 0.0
It is 2 to 20 μm, preferably 0.1 to 5 μm. 0.
If it is less than 02 μm, the effect of addition cannot be obtained and the adhesive force cannot be improved. On the other hand, when it is 20 μm or more, separation from other adhesive components is remarkable, not only other properties such as insulating property are impaired, but also surface irregularities are remarkable and the adhesion with the copper foil is deteriorated, which is not preferable.

The polymer constituting the crosslinked polymer particles is not particularly limited, but the polymer which is the main constituent of the crosslinked polymer particles is preferably one having a glass transition temperature of 50 ° C. or lower.
More preferably, it is 0 ° C. or lower. Glass transition temperature is 50
When the temperature is not higher than 0 ° C, the crosslinked polymer particles have flexibility and the elastic modulus of the entire adhesive decreases, so that the adhesiveness can be further improved.

Examples of such polymers include polybutadiene, polyisoprene, acrylonitrile-butadiene copolymer, acrylonitrile-butadiene-styrene copolymer, ethylene-styrene-butadiene copolymer, polydimethylsiloxane, polybutyl acrylate, polyvinyl butyral. , Etc. as the main chain, and double bond, carboxyl group, amino group, epoxy group, mercapto group, hydroxyl group,
Examples include those into which a functional group for crosslinking such as an isocyanate group has been introduced.

In this case, a crosslinked polymer particle using a polymer having a glass transition temperature of 50 ° C. or lower is coated with another material, or a composite crosslinked polymer containing another material in the form of fine particles smaller than the crosslinked polymer particle. Particles are also included in the crosslinked polymer particles of the present invention. Specifically, core-shell particles having polybutyl acrylate particles as a core and polymethyl methacrylate as an outer layer, F351.
(Nippon Zeon Co., Ltd.) and the like correspond to this.

The crosslinked polymer particles may have functional groups such as double bond, carboxyl group, amino group, epoxy group, mercapto group, hydroxyl group, isocyanate group and the like.
In particular, the presence of a functional group capable of reacting with the epoxy resin or the phenol resin is preferable because the strength of the adhesive is further improved. The method of introducing such a functional group is not particularly limited, and examples thereof include a method of excessively introducing the functional group for crosslinking the above-mentioned polymer, a method of introducing by a graft reaction after the formation of the crosslinked polymer, and the like. Specifically, acrylonitrile-butadiene-acrylic acid copolymer particles, X
ER-91 (manufactured by Nippon Synthetic Rubber Co., Ltd.) and the like correspond to this.

As the polyamide resin used in the present invention, various known ones can be used. In particular, those containing a dicarboxylic acid having 36 carbon atoms (so-called dimer acid), which has flexibility in the adhesive layer and has excellent insulating property due to low water absorption, are preferable. Polyamide resin containing dimer acid as an essential constituent component is obtained by polycondensation of dimer acid and diamine by a conventional method, but at this time, adipic acid other than dimer acid, azelaic acid, dicarboxylic acid such as sebacic acid is a copolymerization component. You may contain as. As the diamine, known ones such as ethylenediamine, hexamethylenediamine and piperazine can be used, and two or more kinds thereof may be mixed in view of hygroscopicity and solubility.

The mixing ratio of the crosslinked polymer particles and the polyamide resin is usually 5 to 50 parts by weight, preferably 10 to 3 parts by weight with respect to 100 parts by weight of the polyamide resin.
0 parts by weight. If the amount of the crosslinked polymer particles is less than 5 parts by weight, the effect of improving the adhesiveness is not sufficient. Further, if it exceeds 50 parts by weight, the insulating property is deteriorated, which is not preferable.

In the present invention, by adding a known epoxy resin to the adhesive layer, the adhesiveness and insulating property can be further improved. The epoxy resin is not particularly limited as long as it has two or more epoxy groups in one molecule, but diglycidyl ethers such as bisphenol F, bisphenol A, bisphenol S, and dihydroxynaphthalene, epoxidized phenol novolac, epoxidized cresol novolac. , Epoxidized trisphenylol methane, epoxidized tetraphenylol ethane, epoxidized meta-xylene diamine and the like. The addition amount of the epoxy resin is 5 to 100 parts by weight, preferably 20 to 70 parts by weight, based on 100 parts by weight of the polyamide resin.

Further, the adhesive layer may contain a known phenol resin such as a novolac type phenol resin or a resol type phenol resin, which is effective in improving the insulating property and heat resistance such as thermal deformation. The added amount of the phenol resin is preferably 5 to 100 parts by weight based on 100 parts by weight of the polyamide resin.

Addition of a curing agent and a curing accelerator for epoxy resin and phenol resin to the adhesive layer of the present invention is not limited at all. For example, aromatic polyamines, amine complexes of boron trifluoride such as boron trifluoride triethylamine complex, imidazole derivatives such as 2-alkyl-4-methylimidazole and 2-phenyl-4-alkylimidazole, phthalic anhydride, trianhydride Organic acids such as melitic acid, dicyandiamide, and known compounds such as triphenylphosphine can be used. The addition amount is preferably 0.1 to 10 parts by weight based on 100 parts by weight of the polyamide resin.

In addition to the above components, addition of organic or inorganic components such as antioxidants and ion scavengers is not limited to the extent that the characteristics of the adhesive are not impaired.

The flexible insulating film referred to in the present invention is plastic such as polyimide, polyester, polyphenylene sulfide, polyether sulfone, polyether ether ketone, aramid, polycarbonate, polyarylate, or epoxy resin impregnated glass cloth. A film having a thickness of 25 to 125 μm, which is made of the above composite material, and a plurality of films selected from these may be laminated and used. If necessary, a surface treatment such as hydrolysis, corona discharge, low-temperature plasma, physical surface roughening, and easy adhesion coating treatment can be performed.

The protective film layer referred to in the present invention is not particularly limited as long as it can be peeled from the adhesive surface without impairing the form of the TAB tape before heat-laminating the copper foil,
Examples thereof include polyester films and polyolefin films coated with silicone or a fluorine compound, and papers laminated with these.

Next, a method of manufacturing the adhesive tape for TAB will be described.

A coating material prepared by dissolving the above adhesive composition in a solvent is applied to a flexible insulating film and dried. It is preferable to apply the adhesive layer so that the film thickness is 10 to 25 μm. Drying conditions are usually 100 to 200 ° C. and 1
~ 5 minutes. The solvent is not particularly limited, but toluene,
Aromatic systems such as xylene and chlorobenzene, and methanol,
Alcohol-based mixtures such as ethanol and propanol are suitable. Usually, a protective film is laminated on the film thus obtained, and finally slit into a width of about 35 to 158 mm.

[0029]

The present invention will be described below with reference to examples.
The present invention is not limited to these examples. The evaluation method will be described before the description of the examples.

Evaluation Method (1) Evaluation Sample Preparation Method An 18 μm electrolytic copper foil was laminated on a tape sample with an adhesive for TAB under the conditions of 140 ° C. and 0.1 MPa. Then, in an air oven at 80 ° C for 3 hours, 100
C., 5 hours, 150.degree. C., 5 hours in order to prepare a TAB tape with copper foil. Photoresist film formation, etching, and resist peeling were performed on the copper foil surface of the obtained TAB tape with copper foil by a conventional method, and samples for evaluation of adhesive strength and insulating property were prepared.

(2) Tin Plating Treatment The sample obtained by the above method (1) was immersed in a borofluoric acid-based electroless tin plating solution at 70 ° C. for 5 minutes, and then subjected to a 0.
5 μm thick plating was applied.

(3) Peel strength Using the evaluation sample having a conductor width of 50 μm obtained by the methods (1) and (2) above, the conductor was 50 mm in the 90 ° direction.
/ Min, and the peeling force at that time was measured.

(4) Insulation reliability Conductor width of 200 μ obtained by the above methods (1) and (2)
m, the distance between the conductors was 50 μm, and a comb-shaped evaluation sample was used at 130 ° C. in an unsaturated pressure cooker.
In the state where the voltage of 85% RH and 100 V was continuously applied, the time when the resistance value was 1/10 or less of the initial value was measured.

Reference Example (Synthesis of Polyamide Resin) The acid / amine ratio was changed in the range of 1.1 to 0.9 as shown in Table 1, and the acid / amine reaction product, antifoaming agent and phosphorus of 1% or less were used. An acid catalyst was added to prepare a reactant. This reactant
After stirring and heating at 140 ° C. for 1 hour, the temperature was raised to 205 ° C. and the mixture was stirred for about 1.5 hours. Under a vacuum of about 2 kPa, the temperature was lowered for 0.5 hour. Finally, an antioxidant was added and the polyamide resin was taken out.

Example 1 Polyamide resin A (amine value: 8.5) shown in Table 1 obtained in Reference Example, epoxy resin (Yukaka Shell Epoxy Co., Ltd.)
"Epicoat" 828, epoxy equivalent 186), phenol resin (Showa Polymer Co., Ltd., CKM128)
2) and the cross-linked polymer A shown in Table 2 were blended so as to have the composition ratios shown in Table 3, respectively, and the mixture was stirred and mixed in a mixed solvent of methanol / monochlorobenzene at 30 ° C. so that the concentration was 20% by weight, and an adhesive was prepared. A solution was made. This adhesive was applied with a bar coater to a polyethylene terephthalate film having a thickness of 25 μm (“Lumirror” manufactured by Toray Industries, Inc.) so as to have a dry thickness of about 18 μm.
An adhesive sheet was prepared by drying at 60 ° C for 5 minutes. Further, the obtained adhesive sheet was laminated on a 75 μm thick polyimide film (“UPILEX” 75S manufactured by Ube Industries, Ltd.) under the conditions of 120 ° C. and 0.1 MPa to prepare an adhesive tape for TAB. Table 3 shows the characteristics.

Using the tape with adhesive for TAB obtained by the above procedure, a conductor circuit for connecting a semiconductor integrated circuit was formed by the same method as the above-described evaluation methods (1) and (2), and FIG. The pattern tape shown in was obtained.

Further, using this pattern tape, 45
Inner lead bonding was performed at 0 ° C. for 1 minute to connect a semiconductor integrated circuit. After that, an epoxy-based liquid sealant ("Hitariku Paint Co., Ltd." Chipcoat "1
320-617), resin sealing was performed to obtain a semiconductor device. 2, 3 and 4 are sectional views of the obtained semiconductor device.

Examples 2 to 4 and Comparative Example 1 In the same manner as in Example 1, tapes with an adhesive for TAB were obtained by using the adhesives prepared with the raw materials and the composition ratios shown in Tables 1 to 3, respectively. . Table 3 shows the characteristics.

[0039]

[Table 1]

[0040]

[Table 2]

[0041]

[Table 3]

From the examples and comparative examples in Table 3, it is understood that the adhesive tape for TAB obtained by the present invention is excellent in adhesiveness and insulation reliability.

[0043]

INDUSTRIAL APPLICABILITY The present invention industrially provides a novel adhesive tape for TAB having excellent adhesiveness and a semiconductor device using the same. The tape with adhesive for TAB of the present invention provides high density. The reliability and cost efficiency of the semiconductor device for mounting can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view of one embodiment of a pattern tape before mounting a semiconductor integrated circuit, obtained by processing a tape with an adhesive for TAB of the present invention.

FIG. 2 is a cross-sectional view of one embodiment of a semiconductor device using the tape with an adhesive for TAB of the present invention.

FIG. 3 is a cross-sectional view of one embodiment of a semiconductor device (BGA) using a tape with an adhesive for TAB of the present invention.

FIG. 4 is a cross-sectional view of one embodiment of a semiconductor device (CSP) using a tape with an adhesive for TAB of the present invention.

[Explanation of symbols]

 1,12,20 Insulating film having flexibility 2,13,21 Adhesive 3 Sprocket hole 4 Device hole 5,14,22 Conductor for connecting semiconductor integrated circuit 6 Inner lead portion 7 Outer lead portion 8,15, Reference Signs List 23 semiconductor integrated circuit 9, 16, 24 sealing resin 10, 17, 25 gold bump 11 protective film 18, 26 solder ball 19 reinforcing plate 27 solder resist

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location C09J 7/02 JKE C09J 7/02 JKE JLE JLE

Claims (9)

[Claims] 1. An organic insulating film having flexibility,
An adhesive tape for TAB comprising a laminate having an adhesive layer and a protective film layer, wherein the adhesive layer contains a polyamide resin and at least one or more crosslinked polymer particles as essential components. 2. The crosslinked polymer particles having an average particle diameter of 0.0
2 to 20 μm, T according to claim 1 characterized in that
Tape with adhesive for AB. 3. The crosslinked polymer particles have a glass transition temperature of 50.
The adhesive tape for TAB according to claim 1, which is composed of a polymer having a temperature of ℃ or less. 4. The adhesive tape for TAB according to claim 1, wherein the content of the crosslinked polymer particles is 5 to 50 parts by weight with respect to 100 parts by weight of the polyamide resin. 5. The adhesive tape for TAB according to claim 1, wherein the adhesive layer contains an epoxy resin. 6. The polyamide resin contains a dicarboxylic acid having 36 carbon atoms as an essential component.
The adhesive tape for TAB according to the above. 7. The adhesive tape for TAB according to claim 1, wherein the adhesive layer contains a phenol resin. 8. A semiconductor connection board using the tape with an adhesive for TAB according to claim 1. 9. A semiconductor device using the tape with an adhesive for TAB according to claim 1.