JPH0959573A - Tape with adhesive for TAB and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a new type tape for tape automated bonding(TAB) excellent in both adhesiveness and electrical insulation properties. SOLUTION: This tape is obtained by laminating a flexible electrical insulation organic film with an adhesive layer and a protective film layer. The adhesive layer essentially comprises (A) 100 pts.wt. of a polyamide resin pref. containing 3-6C dicarboxylic acid unit and (B) 5-100 (pref. 20-600) pts.wt. of an epoxy resin having in one molecule a glycidyl amino group and plural epoxy group (e.g. a diglycidyl ether such as bisphenol A, epoxidized phenol novolak, epoxidized tetraphenylolethane). The glycidyl amino group pref. contains a tertiary nitrogen atom, its amount being pref. 3×10<-3> to 2×10<-1> mol (esp. 1×10<-2> to 1.5×10<-1> mol) based on 100 pts.wt. of the resin in the adhesive.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape with an adhesive used in a tape automated bonding (TAB) system, which is a method for mounting a semiconductor integrated circuit (hereinafter, referred to as a tape).
TAB) and a semiconductor device using the same.

[0002]

2. Description of the Related Art An ordinary TAB tape has a three-layer structure in which a flexible organic insulating film such as a polyimide film is laminated with a releasing polyester film or the like as an adhesive layer and a protective film layer. It is composed of

The TAB tape includes (1) holes for sprocket and device holes, (2) thermal lamination with copper foil, (3) pattern formation (resist coating, etching,
After removing resist), tin or gold-plating, etc., processed into TAB tape (pattern tape),
(5) Mounting of a semiconductor integrated circuit chip (inner lead bonding), (6) Resin encapsulation process to form a tape carrier package (TCP). Thereafter, (7) the outer lead bonding process with a circuit board or the like is performed, and then the electronic device is mounted. Finally, the adhesive layer of the TAB tape remains in the package, so that the insulation, heat resistance,
Adhesiveness is required.

With the recent miniaturization and high density of electronic equipment, the conductor width and the conductor spacing in the TAB system have become very narrow, and it is necessary for the adhesive to have higher adhesive strength and higher insulation. Is increasing. Particularly, due to the increase in heat generation density due to high-density mounting, improvement of these characteristics at high temperature is required.

From such a viewpoint, a mixed composition of an epoxy resin and / or a phenol resin and a polyamide resin has been mainly used for the adhesive layer of the conventional TAB tape. (JP-A-2-143447, JP-A-3
-217035).

[0006]

However, conventional TAB tapes are not always sufficient in terms of the above-mentioned adhesiveness and insulating properties. In some cases, the conductor may be displaced due to insufficient adhesive force, and the conductor may not be connected to the integrated circuit or the circuit board. TCP having a finer circuit pattern such as a high-definition LCD is required to have higher performance adhesiveness and insulation than conventional products.

An object of the present invention is to solve the above problems and provide a novel TAB tape having excellent adhesiveness and insulating properties and a semiconductor device using the same.

[0008]

Means for Solving the Problems In order to achieve the above object, the inventors of the present invention have earnestly studied the relationship between the chemical structure of the adhesive component of the TAB tape and the adhesiveness and insulating property. As a result, glycidylamino The present invention was found to exhibit excellent adhesiveness and insulating properties by using an epoxy resin having a group and two or more epoxy groups.

That is, the present invention comprises a laminate having an adhesive and a protective film layer on a flexible insulating film, the adhesive layer being (a) a polyamide resin,
And (b) a tape with an adhesive for TAB, which comprises an epoxy resin having a glycidylamino group in the molecule and having two or more epoxy groups as an essential component, and a semiconductor device using the same. .

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION As the (a) polyamide resin which is an essential component of the present invention, various known resins can be used. In particular, a material containing a dicarboxylic acid having 36 carbon atoms, which has flexibility in the adhesive layer and is excellent in insulation due to low water absorption, is preferable. Polyamide resin containing dimer acid is obtained by polycondensation of dimer acid and diamine by a conventional method, at this time adipic acid other than dimer acid, azelaic acid, containing dicarboxylic acid such as sebacic acid as a copolymerization component. Is also good. Known diamines such as ethylenediamine, hexamethylenediamine and piperazine can be used, and two or more kinds of diamines may be mixed in view of hygroscopicity and solubility.

The (b) epoxy resin having a glycidylamino group in the molecule, which is an essential component of the present invention, and having two or more epoxy groups is, for example, glycidylated diaminodiphenylmethane, glycidylated aminophenol, glycidylated. Examples thereof include aminocresol and glycidylated xylenediamine. In particular, it is desirable to have two or more epoxy groups in the molecule in order to maintain the heat resistance of the adhesive. These are used alone or as a mixed system of two or more kinds. Also, it may be mixed with other known epoxy resin. The epoxy resin is not particularly limited, but diglycidyl ether such as bisphenol F, bisphenol A, bisphenol S, dihydroxynaphthalene, epoxidized phenol novolac, epoxidized cresol novolac, epoxidized trisphenylol methane, epoxidized tetraphenylol. Examples include ethane.

The blending ratio of the above-mentioned polyamide resin and epoxy resin is usually 5 to 100 parts by weight, preferably 20 to 60 parts by weight, based on 100 parts by weight of the polyamide resin. The epoxy resin content is preferably 5 parts by weight or more from the viewpoint of heat resistance, while the epoxy resin content is preferably 100 parts by weight or less from the viewpoint of adhesiveness. The glycidylamino group contained in the adhesive preferably contains a tertiary nitrogen, and the amount of the tertiary nitrogen is preferably 3 × 10 ⁻³ to 2 with respect to 100 parts by weight of the resin in the adhesive.
× 10 ^-1 mol, more preferably 1 × 10 ^{-2 to} 1.5 × 1
It is 0 ^-1 mol. 3 × 10 in terms of adhesiveness and insulation
It is preferably ⁻³ mol or more, and is preferably 2 × 10 ⁻¹ mol or less from the viewpoint of the degree of curing of the cured product, the adhesiveness, and the life of the adhesive.

In the present invention, by adding a phenol resin to the adhesive layer, the adhesiveness and insulating property can be further improved. The phenol resin is not particularly limited, and commonly used resins can be widely used regardless of whether they are novolac type or resol type.

The compounding ratio of the phenol resin is usually 0.5 to 1 of the phenolic hydroxyl group per equivalent of the epoxy resin.
It is desirable that the amount is within the range of 0.0 equivalent, and more preferably 0.7 to 7.0 equivalent.

There is no limitation on the addition of epoxy resin and phenol resin curing agents and curing accelerators to the adhesive layer of the present invention. For example, aromatic polyamine, amine complex of boron trifluoride such as boron trifluoride triethylamine complex, 2-alkyl-4-methylimidazole, 2-
Known compounds such as imidazole derivatives such as phenyl-4-alkylimidazole, organic acids such as phthalic anhydride and trimellitic anhydride, dicyandiamide, triphenylphosphine and the like can be used. Polyamide resin 100 is added
It is preferably 0.1 to 10 parts by weight with respect to parts by weight.

The flexible insulating film referred to in the present invention is a plastic such as polyimide, polyester, polyphenylene sulfide, polyether sulfone, polyether ether ketone, aramid, polycarbonate, polyarylate, or epoxy resin impregnated glass cloth. The film having a thickness of 25 to 125 μm, which is made of the composite material of, and a plurality of films selected from these may be laminated. If necessary, hydrolysis, corona discharge,
Surface treatment such as low temperature plasma, physical surface treatment, and easy adhesion coating treatment can be applied.

The protective film layer referred to in the present invention is not particularly limited as long as it is peeled from the adhesive surface without damaging the form of the TAB tape before heat-laminating the copper foil,
For example, a polyester film, a polyolefin film, and a paper obtained by laminating these with a coating treatment of silicone or a fluorine compound can be mentioned.

Next, a method of manufacturing the adhesive tape for TAB will be described.

A coating prepared by dissolving the above adhesive composition in a solvent is applied to a flexible insulating film and dried. The adhesive is preferably applied so that the film thickness will be 10 to 20 μ after solvent removal and drying. Drying conditions are usually 100-
200 ° C., 1 to 5 minutes. The solvent is not particularly limited, but a mixture of an aromatic solvent such as toluene, xylene and chlorobenzene and an alcohol solvent such as methanol, ethanol and propanol is preferable. A protective film is laminated on the film thus obtained, and finally 35 to 15
Slit to about 8 mm.

[0020]

The present invention will be described below with reference to examples.
The present invention is not limited to these examples. The evaluation method will be described before the description of the examples.

Evaluation method (1) Method for preparing evaluation sample A tape sample with an adhesive for TAB was laminated with an electrolytic copper foil of 18 μ under the conditions of 140 ° C. and 1 kg / cm ² . Then, in an air oven at 80 ° C for 3 hours, 100
C., 5 hours, 150.degree. C., 5 hours of sequential heat treatment,
A TAB tape with a copper foil was prepared. On the copper foil surface of the obtained TAB tape with copper foil, a photoresist film was formed, etching and resist peeling were performed by a conventional method to form a predetermined pattern.

(2) Tin Plating The sample obtained by the above method (1) was dipped in a borofluoric acid-based electrolytic tin plating solution at 70 ° C. for 5 minutes,
A 0.5 μ thick plating was applied.

(3) Adhesive force Using the measurement pattern having a conductor width of 50 μ obtained by the above methods (1) and (2), the conductor is 50 mm / in 90 ° direction.
Peeling was performed at a speed of min, and the peeling force at that time was measured.

(4) High Temperature Bias Insulation Test Conductor width 200 μ obtained by the above method (1) and (2),
Using a comb-shaped measuring pattern with a conductor-to-conductor distance of 50 μm, a voltage of 100 V was applied under heating at 150 ° C., and the time taken for the insulation resistance value to fall to 1/10 or less of the initial value was measured.

Example 1 Polyamide resin (manufactured by Henkel Hakusui Co., Ltd., "Macromelt" 6900, acid component: dimer acid, amine component: hexamethylenediamine, acid value: 2, amine value: 0), the following formula (I )

Embedded image A trifunctional epoxy resin (produced by Yuka Shell Epoxy Co., Ltd., "Epicoat" 630, epoxy equivalent: 186) whose starting material is para-aminophenol represented by: Were mixed so as to have the composition ratios shown in Table 1, and the mixture was stirred and mixed in a mixed solvent of methanol / monochlorobenzene at 30 ° C. so as to have a concentration of 20% by weight to prepare an adhesive solution. This adhesive was applied with a bar coater to a polyethylene terephthalate film (“Lumirror” manufactured by Toray Industries, Inc.) having a thickness of 25 μm so as to have a dry thickness of about 18 μm, and then 100 ° C., 1
Minutes and drying at 160 ° C. for 5 minutes to prepare an adhesive sheet. Further, the obtained adhesive sheet is made to have a thickness of 75
A TAB adhesive tape was prepared by laminating a μ polyimide film (“UPILEX” 75S manufactured by Ube Industries, Ltd.) under the conditions of 120 ° C. and 1 kg / cm ² . Table 1 shows the characteristics.

Using the adhesive tape for TAB obtained by the above procedure, a conductor circuit for connecting a semiconductor integrated circuit was formed by the same method as the above-described evaluation methods (1) and (2), and FIG. The pattern tape shown in was obtained.

Further, using this pattern tape, 450
Inner lead bonding is performed under the condition of ℃ for 1 minute,
A semiconductor integrated circuit was connected. After that, an epoxy liquid encapsulant (“Chip coat” 132 manufactured by Hokuriku Paint Co., Ltd.)
0-617) was used for resin encapsulation to obtain a semiconductor device. FIG. 2 shows a cross section of the obtained semiconductor device.

Examples 2 and 3 and Comparative Example 1 In the same manner as in Example 1, the following formula (II) was used.

Embedded image A tetrafunctional epoxy resin starting from a para-aminophenol derivative represented by (Mitsubishi Gas Chemical Co., Ltd. “TET
RAD-X ") or the following formula (III)

Embedded image A tetra-functional epoxy resin starting from a para-aminophenol derivative represented by (Shell Chemical Co., Ltd. “HPT1
071 ″) and a phenol resin are mixed so as to have the composition ratios shown in Table 1, and the adhesive is prepared in the same manner as in Example 1,
Further, a tape with an adhesive for TAB was obtained. Table 1 shows the characteristics.

From the examples and comparative examples in Table 1, it is understood that the adhesive tape for TAB obtained by the present invention is excellent in adhesiveness and insulation.

[0030]

[Table 1]

[0031]

INDUSTRIAL APPLICABILITY The present invention industrially provides a novel tape with an adhesive agent for TAB, which is excellent in adhesiveness and insulating property. The tape with an adhesive agent for TAB of the present invention enables semiconductors for high-density mounting. The reliability and economy of the package can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view of a pattern tape before being mounted with a semiconductor integrated circuit, which is obtained by processing a tape with an adhesive for TAB of the present invention.

FIG. 2 is a sectional view of a semiconductor device using the adhesive tape for TAB of the present invention.

[Explanation of symbols]

 1 Flexible Insulating Film 2 Adhesive 3 Sprocket Hole 4 Device Hole 5 Conductor for Connecting Semiconductor Integrated Circuit 6 Inner Lead Part 7 Outer Lead Part 8 Semiconductor Integrated Circuit 9 Sealing Resin 10 Gold Bump 11 Protective Film

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location C09J 7/02 JKQ C09J 7/02 JKQ JLE JLE H01L 21/60 311 H01L 21/60 311W 311R 23 / 29 23/30 B 23/31

Claims (5)

[Claims] 1. An organic insulating film having flexibility,
It is composed of a laminate having an adhesive layer and a protective film layer, and the adhesive layer has (a) a polyamide resin and (b) a glycidylamino group in the molecule and at least two epoxy groups. A tape with an adhesive for TAB, which contains an epoxy resin as an essential component. 2. The glycidylamino group contained in the adhesive contains a tertiary nitrogen atom, and the amount of the tertiary nitrogen atom is 3 × 10 ^{−3 with respect} to 100 parts by weight of the resin component in the adhesive. ~ 2x
TA according to claim 1, characterized in that it is 10 ^-1 mol.
Tape with adhesive for B. 3. The adhesive tape for TAB according to claim 1, wherein the polyamide resin contains a dicarboxylic acid having 36 carbon atoms as an essential component. 4. The tape with an adhesive for TAB according to claim 1, wherein the adhesive layer contains a phenol resin. 5. A semiconductor device using the tape with an adhesive for TAB according to claim 1.