JPH09237809A - Tape with adhesive for TAB, semiconductor connection substrate, and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a novel TAB adhesive tape excellent in adhesiveness and insulating properties, and to improve the reliability and economy of a semiconductor device using the same. A laminated body having an adhesive layer and a protective film layer on a flexible insulating film, and the adhesive layer contains at least one kind of a polyamide resin and a heterocyclic aromatic compound. TA characterized by
Tape with adhesive for B, semiconductor connection substrate, and semiconductor device.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape automated bonding (T)
Tape with adhesive used in the AB method (hereinafter, TA
B tape), a semiconductor connection substrate, and a semiconductor device.

[0002]

2. Description of the Related Art An ordinary TAB tape has a three-layer structure in which a flexible organic insulating film such as a polyimide film is laminated with a releasing polyester film or the like as an adhesive layer and a protective film layer. It is composed of

[0003] TAB tapes include (1) perforation of sprocket and device holes, (2) thermal lamination with copper foil, (3)
It is processed into a TAB tape (pattern tape) through patterning (resist coating, etching, resist removal), and (4) tin or gold-plating processing steps. FIG. 1 shows the shape of the pattern tape. FIG. 2 is a cross-sectional view of one embodiment of the semiconductor device of the present invention. The inner lead portion 6 of the pattern tape is thermocompression-bonded (inner lead bonding) to the gold bump 10 of the semiconductor integrated circuit 8 to mount the semiconductor integrated circuit. Next, a semiconductor device is created through a resin sealing process using the sealing resin 9. In addition, a method in which a conductor of a pattern tape and a gold bump of a semiconductor integrated circuit are connected by wire bonding without using an inner lead portion is also adopted. Such a semiconductor device is generally called a tape carrier package (TCP) type semiconductor device. The TCP type semiconductor device is connected (outer lead bonding) to a circuit board or the like on which other components are mounted via outer leads 7 and mounted on an electronic device.

On the other hand, as electronic devices have become smaller and lighter in recent years, a semiconductor package has a QFP (quad flat flat) in which conventional connection terminals (outer leads) are arranged on the side of the package for the purpose of high-density mounting. Package), S
In place of OP (small outline package), BGA (ball grid array) and CSP (chip scale package) in which connection terminals are arranged on the back surface of the package have been partially used.
The biggest structural difference between BGA and CSP from QFP and SOP is that the former requires a substrate called an interposer, while the latter requires a substrate by using a metal lead frame. There is a point that does not. As the interposer referred to here, one obtained by bonding a copper foil to an organic insulating film such as a glass epoxy substrate or polyimide is generally used. Therefore, the TAB of the present invention can be applied to semiconductor devices such as BGA and CSP.
A tape with an adhesive for use can be used, and the obtained B
GA and CSP are also included in the semiconductor device of the present invention. 3 and 4 are cross-sectional views of one embodiment of the semiconductor device (BGA, CSP) of the present invention.

In any of the above-mentioned package forms, the adhesive layer of the TAB tape finally remains in the package, so that the insulating property, heat resistance, and adhesive property are required. In recent years, with the progress of miniaturization and high-density mounting of electronic devices, the conductor width in the TAB method has become extremely narrow, and the need for an adhesive having high insulation reliability is increasing. Recently, especially as an accelerated test of insulation reliability,
At a high temperature of 25 ° C. to 150 ° C., the rate of decrease in insulation under continuous voltage application has become important. Further, when transfer molding, which has a relatively high temperature and pressure, is used for resin encapsulation of the package, or when connection is made by wire bonding, heat deformation resistance is important.

From such a point of view, a mixed composition of an epoxy resin and / or a phenol resin and a polyamide resin has been mainly used for the adhesive layer of the conventional TAB tape (Japanese Patent Laid-Open No. 143447/1990). JP-A-3
-217035, etc.). Further, there is also an example in which inorganic particles are added to a polyamide resin / epoxy resin system for the purpose of improving chemical resistance and insulation (Japanese Patent Publication No. 7-11422).
No. 1).

[0007]

However, conventional TAB tapes are not always satisfactory in the above-mentioned adhesiveness and insulating properties. For example, as the conductor width becomes narrower, the adhesive strength decreases, the conductor may peel off in a later step such as bonding, and it may not be possible to connect to an integrated circuit or a circuit board. This is mainly due to a shortage of the absolute value of the adhesive strength and a decrease in the effective adhesive area due to the penetration of the plating solution between the conductor and the adhesive. In addition, since insulation degradation is rapid in a state of continuous voltage application at high temperature and high humidity, there is a concern about insulation durability if the mounting density increases and the distance between conductors becomes short in the future.

An object of the present invention is to solve the above problems and to provide a novel TAB tape, a semiconductor connection substrate and a semiconductor device which are excellent in adhesiveness and insulation.

[0009]

Means for Solving the Problems In order to achieve the above-mentioned object, the present inventors have made earnest studies on the relationship between the chemical structure of the adhesive component of the TAB tape and the adhesiveness and insulating property to metal. It has been found that a TAB tape having excellent adhesiveness and insulation can be obtained by skillfully combining a heterocyclic aromatic compound and a polyamide resin,
This has led to the present invention.

That is, the present invention comprises a laminate having an adhesive layer and a protective film layer on a flexible insulating film, the adhesive layer comprising a polyamide resin and the following (1) to (2). (2) A tape with an adhesive for TAB, which comprises at least one heterocyclic aromatic compound satisfying any one of the conditions (1) and (2), and a semiconductor device using the same.

(1) It has a 5-membered ring or 6-membered ring containing 3 or more nitrogen atoms in the heterocycle in the molecule.

(2) A 5-membered or 6-membered ring containing at least one nitrogen atom and at least one oxygen atom or sulfur atom in the heterocycle is present in the molecule.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION The heterocyclic aromatic compound used in the present invention is not particularly limited as long as it satisfies the above condition (1) or (2). For example, 1,2,3-triazole, Examples include triazole compounds represented by 1,2,4-triazole and 1,2,3-benzotriazole, tetrazole compounds, triazine compounds, thiazole compounds, mercaptothiazole compounds, oxazolidone compounds, and the like (1) to ( Either of the conditions of 2) is satisfied,
A polymer having the structure of a heterocyclic aromatic compound in its main chain or side chain is also included in the scope of the heterocyclic aromatic compound of the present invention. As such, poly (vinyl-1,2,
3-benzotriazole) is exemplified. Further, the heterocyclic aromatic compound in the present invention may contain one or more of the above heterocyclic aromatic compounds.

As the polyamide resin used in the present invention, various known ones can be used. In particular, it is preferable to use a dicarboxylic acid having 36 carbon atoms (so-called dimer acid) as an essential constituent component, which has flexibility in the adhesive layer and is excellent in insulation due to low water absorption. Polyamide resin containing dimer acid is obtained by polycondensation of dimer acid and diamine by a conventional method, at this time adipic acid other than dimer acid, azelaic acid, containing dicarboxylic acid such as sebacic acid as a copolymerization component. Good. As the diamine, known ones such as ethylenediamine, hexamethylenediamine and piperazine can be used, and two or more kinds thereof may be mixed in view of hygroscopicity and solubility.

The compounding ratio of the above heterocyclic aromatic compound and the polyamide resin is usually 0.05 to 20.0 parts by weight, preferably 0.5 to 100 parts by weight of the polyamide resin. ˜10.0 parts by weight. If the amount of the heterocyclic aromatic compound is less than 0.05 parts by weight, the adhesiveness and insulating property will be insufficient. Further, if it exceeds 20.0 parts by weight, the insulating property is deteriorated, which is not preferable.

In the present invention, by adding a known epoxy resin to the adhesive layer, the adhesiveness and insulating property can be further improved. The epoxy resin is not particularly limited as long as it has two or more epoxy groups in one molecule, but diglycidyl ethers such as bisphenol F, bisphenol A, bisphenol S, and dihydroxynaphthalene, epoxidized phenol novolac, epoxidized cresol novolac. , Epoxidized trisphenylol methane, epoxidized tetraphenylol ethane, epoxidized meta-xylene diamine, and the like. The addition amount of the epoxy resin is 5 to 100 parts by weight, preferably 20 to 70 parts by weight, based on 100 parts by weight of the polyamide resin.

Further, the adhesive layer may contain a known phenol resin such as a novolac type phenol resin or a resol type phenol resin, which is effective in improving the insulating property and heat resistance such as thermal deformation. The added amount of the phenol resin is preferably 5 to 100 parts by weight based on 100 parts by weight of the polyamide resin.

Addition of a curing agent and a curing accelerator for epoxy resin and phenol resin to the adhesive layer of the present invention is not limited in any way. For example, aromatic polyamines, amine complexes of boron trifluoride such as boron trifluoride triethylamine complex, imidazole derivatives such as 2-alkyl-4-methylimidazole and 2-phenyl-4-alkylimidazole, phthalic anhydride, trianhydride Organic acids such as melitic acid, dicyandiamide, and known compounds such as triphenylphosphine can be used. The addition amount is preferably 0.1 to 10 parts by weight based on 100 parts by weight of the polyamide resin.

In addition to the above components, addition of organic and inorganic components such as an antioxidant and an ion scavenger is not limited as long as the properties of the adhesive are not impaired.

The flexible insulating film referred to in the present invention is a plastic such as polyimide, polyester, polyphenylene sulfide, polyether sulfone, polyether ether ketone, aramid, polycarbonate, polyarylate, or epoxy resin impregnated glass cloth. A film having a thickness of 25 to 125 μm, which is made of the above composite material, and a plurality of films selected from these may be laminated and used. If necessary, a surface treatment such as hydrolysis, corona discharge, low-temperature plasma, physical surface roughening, and easy adhesion coating treatment can be performed.

The protective film layer referred to in the present invention is not particularly limited as long as it can be peeled from the adhesive surface without damaging the form of the TAB tape before heat-laminating the copper foil,
For example, a polyester film or a polyolefin film coated with a silicone or fluorine compound, and a paper obtained by laminating the same.

Next, a method of manufacturing the adhesive tape for TAB will be described.

A coating having the adhesive composition dissolved in a solvent is applied to a flexible insulating film and dried. It is preferable to apply the adhesive layer so that the film thickness is 10 to 25 μm. Drying conditions are 100-200 ° C, 1-5
Minutes. The solvent is not particularly limited, but a mixture of an aromatic solvent such as toluene, xylene and chlorobenzene and an alcohol solvent such as methanol, ethanol and propanol is preferable. A protective film is laminated on the film thus obtained, and finally slit into a width of about 35 to 158 mm.

[0024]

The present invention will be described below with reference to examples.
The present invention is not limited to these examples. The evaluation method will be described before the description of the examples.

Evaluation Method (1) Evaluation Sample Preparation Method An 18 μm electrolytic copper foil was laminated on a tape sample with an adhesive for TAB under the conditions of 140 ° C. and 0.1 MPa. Then, in an air oven at 80 ° C for 3 hours, 100
C., 5 hours, 150.degree. C., 5 hours in order to prepare a TAB tape with copper foil. Photoresist film formation, etching, and resist peeling were performed on the copper foil surface of the obtained TAB tape with copper foil by a conventional method, and samples for evaluation of adhesive strength and insulating property were prepared.

(2) Tin Plating Treatment The sample obtained by the above method (1) was immersed in a borofluoric acid-based electroless tin plating solution at 70 ° C. for 5 minutes, and then subjected to a 0.1.
5 μm thick plating was applied.

(3) Peel strength Using the evaluation sample having a conductor width of 50 μm obtained by the above methods (1) and (2), the conductor was 50 mm in the 90 ° direction.
/ Min, and the peeling force at that time was measured.

(4) High-temperature, high-humidity insulation property Conductor width 200 μ obtained by the above method (1) and (2)
m in the unsaturated pressure cooker using a comb-shaped evaluation sample having a distance between conductors of 50 μm.
The time at which the resistance value was 1/10 or less of the initial value was measured in the state where the voltage of 85 ° C., 85% RH, and 100 V was continuously applied.

(5) High Temperature Insulation Property Using the same sample as the above (4), the resistance value was 1 of the initial value in a state where a voltage of 150 V and 100 V was continuously applied in an air oven. The time to be / 10 or less was measured.

(6) Storage life A tape sample with adhesive for TAB before lamination, which was stored in a temperature control room at 30 ° C., was extracted with time, and for TAB with copper foil under the same conditions as in (1) above. After making the tape, the peel strength was measured according to the above (3). The adhesive strength retention rate is 90 compared to the peel strength when the TAB tape with copper foil is prepared from the tape sample with adhesive for TAB before storage.
The storage life up to that point was defined as the time when the content fell below%.

Reference Example (Synthesis of Polyamide Resin) The acid / amine ratio was changed in the range of 1.1 to 0.9 as shown in Table 1, and the acid / amine reaction product, antifoaming agent and phosphorus of 1% or less were used. An acid catalyst was added to prepare a reactant. This reactant
After stirring and heating at 140 ° C. for 1 hour, the temperature was raised to 205 ° C. and the mixture was stirred for about 1.5 hours. Under vacuum of about 15 mmHg,
Hold for 5 hours to reduce temperature. Finally, an antioxidant was added and the polyamide resin was taken out.

Example 1 Polyamide resin A (amine value: 5.7) shown in Table 1 obtained in Reference Example, epoxy resin (Yukaka Shell Epoxy Co., Ltd.)
"Epicoat" 828, epoxy equivalent 186), phenol resin (Showa Polymer Co., Ltd., CKM128)
2) and the heterocyclic aromatic compound A shown in Table 2 were blended so as to have the composition ratios shown in Table 3, respectively, and mixed in a methanol / monochlorobenzene mixed solvent at a concentration of 20% by weight.
The mixture was stirred and mixed at 0 ° C. to prepare an adhesive solution. Using a bar coater, apply this adhesive to a polyethylene terephthalate film (“Lumirror” manufactured by Toray Industries, Inc.) with a thickness of 25 μm.
It was applied so as to have a dry thickness of 8 μm, and dried at 100 ° C. for 1 minute and 160 ° C. for 5 minutes to prepare an adhesive sheet. Further, the obtained adhesive sheet is made to have a thickness of 75
A tape with an adhesive for TAB was prepared by laminating a polyimide film of μm (“UPILEX” 75S manufactured by Ube Industries, Ltd.) under the conditions of 120 ° C. and 0.1 MPa.
Table 3 shows the characteristics.

Using the adhesive tape for TAB obtained by the above procedure, a conductor circuit for connecting a semiconductor integrated circuit was formed by the same method as the above-described evaluation methods (1) and (2), and FIG. The pattern tape shown in was obtained.

Further, using this pattern tape, 45
Inner lead bonding was performed at 0 ° C. for 1 minute to connect a semiconductor integrated circuit. After that, an epoxy-based liquid sealant ("Hitariku Paint Co., Ltd." Chipcoat "1
320-617), resin sealing was performed to obtain a semiconductor device. 2, 3 and 4 are sectional views of the obtained semiconductor device.

Examples 2 to 4 and Comparative Examples 1 and 2 Tapes with an adhesive for TAB were prepared in the same manner as in Example 1 using the adhesives prepared with the raw materials and the composition ratios shown in Tables 1 to 3, respectively. Obtained. Table 3 shows the characteristics.

[0036]

[Table 1]

[0037]

[Table 2]

[0038]

[Table 3]

From the examples and comparative examples in Table 3, it is understood that the adhesive tape for TAB obtained by the present invention is excellent in adhesiveness and insulation.

[0040]

The present invention is to industrially provide a novel TAB adhesive tape having excellent adhesiveness and insulating properties and a semiconductor device using the same.
The reliability and economy of the semiconductor device for high-density mounting can be improved by the adhesive tape.

[Brief description of drawings]

FIG. 1 is a perspective view of one embodiment of a pattern tape before mounting a semiconductor integrated circuit, obtained by processing a tape with an adhesive for TAB of the present invention.

FIG. 2 is a cross-sectional view of one embodiment of a semiconductor device using the tape with an adhesive for TAB of the present invention.

FIG. 3 is a cross-sectional view of one embodiment of a semiconductor device (BGA) using a tape with an adhesive for TAB of the present invention.

FIG. 4 is a cross-sectional view of one embodiment of a semiconductor device (CSP) using a tape with an adhesive for TAB of the present invention.

[Explanation of symbols]

 1,12,20 Insulating film having flexibility 2,13,21 Adhesive 3 Sprocket hole 4 Device hole 5,14,22 Conductor for connecting semiconductor integrated circuit 6 Inner lead portion 7 Outer lead portion 8,15, Reference Signs List 23 semiconductor integrated circuit 9, 16, 24 sealing resin 10, 17, 25 gold bump 11 protective film 18, 26 solder ball 19 reinforcing plate 27 solder resist

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI Technical display location C09J 7/02 JKD C09J 7/02 JKD JKK JKK JLE JLE 177/06 JGA 177/06 JGA

Claims (7)

[Claims] 1. An organic insulating film having flexibility,
It is composed of a laminate having an adhesive layer and a protective film layer, and the adhesive layer comprises a polyamide resin and the following (1):
An adhesive tape for TAB, comprising at least one heterocyclic aromatic compound satisfying any one of the conditions (2) to (2). (1) The molecule has a 5-membered ring or 6-membered ring containing three or more nitrogen atoms in the heterocycle. (2) It has in the molecule a 5-membered ring or 6-membered ring containing at least one nitrogen atom and at least one oxygen atom or sulfur atom in the heterocycle. 2. The adhesive tape for TAB according to claim 1, wherein the adhesive layer contains an epoxy resin. 3. The adhesive tape for TAB according to claim 1, wherein the content of the heterocyclic aromatic compound is 0.05 to 20 parts by weight with respect to 100 parts by weight of the polyamide resin. 4. The polyamide resin contains a dicarboxylic acid having 36 carbon atoms as an essential constituent component.
The adhesive tape for TAB according to the above. 5. The adhesive tape for TAB according to claim 1, wherein the adhesive layer contains a phenol resin. 6. A semiconductor connection board using the tape with an adhesive for TAB according to claim 1. 7. A semiconductor device using the tape with an adhesive for TAB according to claim 1.