JPH09281178A - Electrical property inspection method - Google Patents

Abstract

(57) [Abstract] [PROBLEMS] Checking the electrical characteristics of surface-mounted board circuits where it has become difficult to artificially make probe contact with the electrodes or conductor circuits of mounted parts due to the miniaturization of mounted parts and the higher density of mounting. Make the soldering check easy and quick. SOLUTION: The shape of a contact probe device 1 for electric characteristic inspection is made to follow the shape of a mounted component. Further, the contact probe 3 for contacting with the electrode 6 of the mounted component or the electrode 6 of the mounting substrate 9 is provided in the contact probe device 1 for electric characteristic inspection.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board which is capable of easily measuring constants of resistors, capacitors, ICs and the like mounted on a surface mount board, erroneous mounting ticks, and determining whether soldering is good or bad. Regarding inspection technology.

[0002]

2. Description of the Related Art A circuit board for surface mounting is placed by placing a resistor, a capacitor, an IC and the like at a predetermined position on a conductor circuit formed on a synthetic resin substrate such as glass epoxy or phenol by using a mounter device. Then, a soldering process is performed by passing through the temperature furnace. Conventionally, the check of the surface mount circuit board after the soldering process is disclosed in JP-A-4-39.
As described in Japanese Patent Laid-Open No. 35-35, a method of irradiating a surface-mounted circuit board with light and converting the amount of reflected light into an electric signal to obtain lead floating, a visual inspection, or an artificial simple continuity tester (tester), a test point The used electricity check is done.

[0003]

However, due to the miniaturization of mounted parts and the high density of mounting, the optical method is different in the amount of reflected light due to the difference in the material of the substrate surface and the variation in the amount of reflected light due to the fluctuation of reflectance. Due to the increase, the lead floating may be erroneously determined, and it is impossible to determine the reverse polarity mounting by an optical method. The artificial method using a simple continuity tester makes it difficult to contact the parts with electrodes or conductor circuits (pads for electrodes, etc.) with the probe, making it difficult to electrically mount parts such as erroneous mounting and reverse polarity mounting. In fact, the method that uses the test points causes problems such as the inability to directly determine the abnormal portion. An object of the present invention is to enable a soldering check or inspection in addition to a check for erroneous mounting of components and a reverse polarity mounting by using a contact probe device for electrical characteristic inspection following the shape of mounted components. is there.

[0004]

In order to achieve the above object, the present invention provides a contact probe device for inspecting electrical characteristics in the shape of a mounted component, the tip of which contacts the electrode of the mounted component. A probe is installed, and the probe device for inspecting electrical characteristics is mounted and operated on a positioning device that can be positioned automatically or manually to fit with a mounting component, and the contact probe is mounted on the mounting component electrode or surface mounting circuit board. The electrode pad can be contacted.

That is, since the electric characteristic inspection probe device follows the shapes of various mounted parts and is provided with an electric characteristic inspection probe, that is, a contact probe, the shape of the electric characteristic inspection probe device and the shape of the inspected component are matched. If you look at it, you can see that the mounted components are erroneously mounted or mounted with reverse polarity.
The electrical characteristics between electrodes can be easily measured, and the continuity and disconnection of soldering can be checked.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to FIG.
This will be described with reference to FIGS. 2, 3, 4, 5, and 6.

1, FIG. 2, FIG. 3, FIG. 4, FIG. 5, and FIG. 6 are explanatory views showing an embodiment of the inspection of the surface mount circuit board of the present invention.

FIG. 1 shows a state in which a probe for electric characteristic inspection is fitted to a resistor or a capacitor arranged on a surface mount circuit board. Reference numeral 1 is a probe device for electrical characteristic inspection, the tip portion of which is made to have the same shape as the shape of the component to be inspected, 2 is a casing of the probe device 1 for electrical characteristic inspection made of an insulator, 3
Reference numerals 3 and 3'represent a contact probe capable of electrically conducting. Reference numerals 4 and 4'represent measurement leads connecting the contact probe 3 and 3'to an external measuring device. Reference numeral 5 represents a resistance or a capacitor of a component to be inspected. And 6'are electrodes, 7 and 7'are solder joints, 8
And 8'electrode pads of the surface mount circuit board, 9 is a board formed of resin such as glass epoxy, and 10 is a nozzle for connecting and fixing the electric characteristic inspection probe device 1 to an external device such as a positioning device. . For checking and inspecting the surface mount circuit board, the nozzle 10 is installed in an externally installed device capable of automatically or manually positioning the electric characteristic inspection probe device 1.
Then, the external installation device is operated, and the component to be inspected 5 and the electrical characteristic inspection probe device 1 are fitted together. FIG.
Then, the electric characteristic inspection probe device 1 has a tip portion inspected component 5
Since it is formed in conformity with the shape of (1), it is possible to determine the erroneous mounting of the component based on the consistency between the inspected component 5 and the electric characteristic inspection probe device 1. Also, from the observation of the input / output voltage of the contact probes 3 and 3 ', it is possible to check the conductive state of the solder joints 7 and 7'or mount the reverse polarity.

FIGS. 2 and 3 show an embodiment of a method for inspecting a surface-mounted circuit board on which a component (transistor or the like) having a downward lead and a shadow of the component is mounted according to the present invention. FIG. 2 is a plan view of the mounted component 5, and FIG. 3 is a cross-sectional view of a state in which the electric characteristic inspection probe device 1 and the component 5 to be inspected are fitted. FIG.
5 and 6 show a method of inspecting a surface mount circuit board on which a flat package semiconductor integrated circuit is mounted. FIG.
In FIG. 6 as well, as in the case of FIG. 1, since the tip portion of the electric characteristic inspection probe device 1 is made to follow the shape of the inspection target component 5, the inspection target device 5 and the electrical characteristic inspection probe device 1 are aligned. The erroneous mounting of parts can be determined from the characteristics, and the conduction state of the solder joints 7 and 7'or the check of reverse polarity mounting is also possible by observing the input / output voltage of the contact probes 3 and 3 '. The above-described electrical characteristic inspection probe 1 is dedicated for the component to be inspected mounted on the surface mount circuit board, and therefore, it is replaced every time of checking / inspection. If this exchange is performed with an automatic machine, automatic inspection becomes possible.

[0010]

According to the present invention, it is possible to obtain a low-cost mounting circuit board by eliminating erroneous mounting of components mounted on the surface mounting circuit board and mounting with reverse polarity.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of an electrical characteristic inspection of a resistor or a capacitor arranged on a surface mount circuit board.

FIG. 2 is a plan view of transistors arranged on a surface mount circuit board.

FIG. 3 is an explanatory diagram of an electrical characteristic inspection of a transistor arranged on a surface mount circuit board.

FIG. 4 is a perspective view of a probe device for electric characteristic inspection for semiconductor integrated circuits in a flat package.

FIG. 5 is an explanatory diagram of a flat package semiconductor integrated circuit mounted on a surface mount circuit board.

FIG. 6 is an explanatory diagram of electric characteristic inspection of a semiconductor integrated circuit arranged on a surface mount circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Probe device for electrical characteristic inspection, 2 ... Housing of probe device for electrical characteristic inspection, 3 ... Contact terminal, 4 ... Measuring lead, 5 ... Inspected part, 6 ... Electrode of inspected part, 7 ... Solder Joint part, 8 ... Electrode pad of surface mounting circuit board, 9 ... Mounting circuit board, 10 ... Nozzle.

Front page continued (72) Inventor Tasao Soga 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa, Ltd.Inside the Research Institute of Industrial Science, Hitachi, Ltd. Video Information Media Division

Claims (3)

[Claims] 1. An electronic component, LS, mounted on a surface mount substrate.
In the electrical check or continuity inspection of I, or the electrical check or continuity inspection method after soldering of the electronic component or LSI, the contact probe for inspecting the electrical characteristics between the electrodes follows the shape of the electronic component, LSI, or the like. A method for inspecting electrical characteristics, characterized in that the contact probe has a shape and can contact an electrode portion provided on the electronic component, LSI or the like. 2. The contact probe device for inspecting electrical characteristics, wherein the probe has a shape following the shape of a mounting component, and the probe can contact an electrode portion formed on a surface mounting circuit board. An electrical characteristic inspection method comprising: 3. The contact probe device according to claim 1 or 2 is installed on a jig in which a horizontal axis, a vertical axis, and a rotation axis can be freely set, and the probe device is mounted on the electronic component or the surface mount device. A method for inspecting electrical characteristics, which enables automatic contact with the electrode portion formed on a circuit board.