JPH09320948A - 基板の受け渡し方法及び露光装置 - Google Patents

基板の受け渡し方法及び露光装置

Info

Publication number
JPH09320948A
JPH09320948A JP8154931A JP15493196A JPH09320948A JP H09320948 A JPH09320948 A JP H09320948A JP 8154931 A JP8154931 A JP 8154931A JP 15493196 A JP15493196 A JP 15493196A JP H09320948 A JPH09320948 A JP H09320948A
Authority
JP
Japan
Prior art keywords
substrate
wafer
holder
inclination
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP8154931A
Other languages
English (en)
Japanese (ja)
Inventor
Hideaki Sakamoto
英昭 坂本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to JP8154931A priority Critical patent/JPH09320948A/ja
Priority to KR1019970020697A priority patent/KR970077122A/ko
Publication of JPH09320948A publication Critical patent/JPH09320948A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7034—Leveling

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP8154931A 1996-05-27 1996-05-27 基板の受け渡し方法及び露光装置 Withdrawn JPH09320948A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP8154931A JPH09320948A (ja) 1996-05-27 1996-05-27 基板の受け渡し方法及び露光装置
KR1019970020697A KR970077122A (ko) 1996-05-27 1997-05-26 기판의 인도 방법 및 노광 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8154931A JPH09320948A (ja) 1996-05-27 1996-05-27 基板の受け渡し方法及び露光装置

Publications (1)

Publication Number Publication Date
JPH09320948A true JPH09320948A (ja) 1997-12-12

Family

ID=15595079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8154931A Withdrawn JPH09320948A (ja) 1996-05-27 1996-05-27 基板の受け渡し方法及び露光装置

Country Status (2)

Country Link
JP (1) JPH09320948A (ko)
KR (1) KR970077122A (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009117568A (ja) * 2007-11-06 2009-05-28 Tokyo Electron Ltd 載置台、処理装置および処理システム
JP2014042048A (ja) * 2006-12-18 2014-03-06 Kla-Tencor Corp 基板プロセス装置および方法
CN119910566A (zh) * 2025-04-01 2025-05-02 浙江求是半导体设备有限公司 研磨盘倾角自调节方法、装置和晶圆减薄设备

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116974152A (zh) * 2023-07-31 2023-10-31 苏州天准科技股份有限公司 多自由度调平的物料输送装置及非接触式曝光设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4845530A (en) * 1986-12-26 1989-07-04 Kabushiki Kaisha Toshiba Reduced projection type step- and repeat-exposure apparatus
AT393925B (de) * 1987-06-02 1992-01-10 Ims Ionen Mikrofab Syst Anordnung zur durchfuehrung eines verfahrens zum positionieren der abbildung der auf einer maske befindlichen struktur auf ein substrat, und verfahren zum ausrichten von auf einer maske angeordneten markierungen auf markierungen, die auf einem traeger angeordnet sind
KR970004476B1 (ko) * 1993-12-03 1997-03-28 재단법인 한국전자통신연구소 웨이퍼 정렬시스템의 웨이퍼 수평상태 자동측정장치
KR100360554B1 (ko) * 1993-12-08 2003-01-29 가부시키가이샤 니콘 스캐닝노출방법및이러한스캐닝노출방법을사용하여반도체장치를제조하는방법
JP3401769B2 (ja) * 1993-12-28 2003-04-28 株式会社ニコン 露光方法、ステージ装置、及び露光装置
KR0160544B1 (ko) * 1994-12-09 1999-02-01 양승택 웨이퍼 스텝퍼에서 정렬광의 경사조명에 의한 웨이퍼 정렬방법과 그 장치

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014042048A (ja) * 2006-12-18 2014-03-06 Kla-Tencor Corp 基板プロセス装置および方法
JP2009117568A (ja) * 2007-11-06 2009-05-28 Tokyo Electron Ltd 載置台、処理装置および処理システム
CN119910566A (zh) * 2025-04-01 2025-05-02 浙江求是半导体设备有限公司 研磨盘倾角自调节方法、装置和晶圆减薄设备

Also Published As

Publication number Publication date
KR970077122A (ko) 1997-12-12

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