JPH0936367A5 - - Google Patents
Info
- Publication number
- JPH0936367A5 JPH0936367A5 JP1996191409A JP19140996A JPH0936367A5 JP H0936367 A5 JPH0936367 A5 JP H0936367A5 JP 1996191409 A JP1996191409 A JP 1996191409A JP 19140996 A JP19140996 A JP 19140996A JP H0936367 A5 JPH0936367 A5 JP H0936367A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- implanted
- conductivity type
- implanted region
- field effect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Claims (5)
- 安定なしきい値電圧を有する電界効果トランジスタ(20)であって、
第1の導電型の半導体材料のかつ1つの面(22)を有する基板領域(21)、
前記基板領域(21)にかつチャネル領域(39)に隣接して形成された第2の導電型のソース領域(29)、
前記基板領域(21)に配置された第1の注入領域(33)であって、該第1の注入領域(33)は前記面(22)における前記ソース領域(29)と隣接しかつ前記基板領域(21)の前記面(22)の下で前記チャネル領域(39)内へと延在し、前記第1の注入領域(33)は第1の濃度の第1の導電型を有するもの、そして
前記ソース領域(29)と前記面(22)における前記第1の注入領域(33)を超えてかつ前記チャネル領域(39)内へ伸びている第1の注入領域(33)との間に配置された第2の注入領域(36)であって、前記第1の注入領域(33)および前記第2の注入領域(36)はソース領域(29)との交差部および前記ソース領域(29)に隣接する前記基板領域(21)の一部において一定のドーピング量の第1のドーパントプロフィール領域を形成し、前記第2の注入領域(36)は第2の濃度の第1の導電型を有するもの、
を具備することを特徴とする安定なしきい値電圧を有する電界効果トランジスタ(20)。 - 前記第1の濃度はほぼ1×1017アトム/cm3〜1×1018アトム/cm3であることを特徴とする請求項1に記載の安定なしきい値電圧を有する電界効果トランジスタ(20)。
- さらに、前記ソース領域(29)と前記第2の注入領域(36)の間に配置され第2の導電型を有する第3の注入領域(52)を有することを特徴とする請求項1に記載の安定なしきい値電圧を有する電界効果トランジスタ(20)。
- さらに、
前記基板領域に形成された第2の導電型のドレイン領域(31)、
前記ドレイン領域の下に配置されかつ前記ドレイン領域(31)のチャネル側へと延在する第4の注入領域(54)であって、該第4の注入領域(54)は第4の濃度の第1の導電型を有するもの、そして
前記ドレイン領域(31)と前記第4の注入領域(54)との間に配置されかつ前記ドレイン領域(31)のチャネル側へと延在する第5の注入領域(56)であって、前記第4および第5の注入領域(54,56)は前記ドレイン領域との交差部において一定のドーピング量の第2のドーパントプロフィール領域を形成し、前記第5の注入領域(56)は第5の濃度の第1の導電型を有するもの、を具備することを特徴とする請求項3に記載の安定なしきい値電圧を有する電界効果トランジスタ(20)。 - さらに、前記ドレイン領域(31)と前記第5の注入領域(56)の間に配置され第2の導電型を有する第6の注入領域(53)を有することを特徴とする請求項4に記載の安定なしきい値電圧を有する電界効果トランジスタ(20)。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/499,624 US5675166A (en) | 1995-07-07 | 1995-07-07 | FET with stable threshold voltage and method of manufacturing the same |
| US08/499,624 | 1995-07-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0936367A JPH0936367A (ja) | 1997-02-07 |
| JPH0936367A5 true JPH0936367A5 (ja) | 2004-07-15 |
Family
ID=23986023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8191409A Pending JPH0936367A (ja) | 1995-07-07 | 1996-07-01 | 安定なしきい値電圧を有するfetおよびその製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US5675166A (ja) |
| EP (1) | EP0752722B1 (ja) |
| JP (1) | JPH0936367A (ja) |
| CN (1) | CN1141509A (ja) |
| DE (1) | DE69624174T2 (ja) |
| TW (1) | TW303520B (ja) |
Families Citing this family (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0955499A (ja) * | 1995-08-11 | 1997-02-25 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| US5668024A (en) * | 1996-07-17 | 1997-09-16 | Taiwan Semiconductor Manufacturing Company | CMOS device structure with reduced risk of salicide bridging and reduced resistance via use of a ultra shallow, junction extension, ion implantation process |
| JPH1050988A (ja) * | 1996-07-31 | 1998-02-20 | Sharp Corp | 絶縁ゲート型電界効果トランジスタ及びその製造方法 |
| US5834355A (en) * | 1996-12-31 | 1998-11-10 | Intel Corporation | Method for implanting halo structures using removable spacer |
| KR100223846B1 (ko) * | 1997-05-28 | 1999-10-15 | 구본준 | 반도체 소자 및 그의 제조방법 |
| DE19812945A1 (de) * | 1998-03-24 | 1999-09-30 | Siemens Ag | Halbleiterbauelement und Verfahren zu dessen Herstellung |
| US6774001B2 (en) * | 1998-10-13 | 2004-08-10 | Stmicroelectronics, Inc. | Self-aligned gate and method |
| US6232166B1 (en) * | 1998-11-06 | 2001-05-15 | Advanced Micro Devices, Inc. | CMOS processing employing zero degree halo implant for P-channel transistor |
| US6211023B1 (en) * | 1998-11-12 | 2001-04-03 | United Microelectronics Corp. | Method for fabricating a metal-oxide semiconductor transistor |
| US6198131B1 (en) * | 1998-12-07 | 2001-03-06 | United Microelectronics Corp. | High-voltage metal-oxide semiconductor |
| FR2794898B1 (fr) | 1999-06-11 | 2001-09-14 | France Telecom | Dispositif semi-conducteur a tension de seuil compensee et procede de fabrication |
| FR2796204B1 (fr) * | 1999-07-07 | 2003-08-08 | St Microelectronics Sa | Transistor mosfet a canal court |
| US6168999B1 (en) * | 1999-09-07 | 2001-01-02 | Advanced Micro Devices, Inc. | Method for fabricating high-performance submicron mosfet with lateral asymmetric channel and a lightly doped drain |
| US6426278B1 (en) * | 1999-10-07 | 2002-07-30 | International Business Machines Corporation | Projection gas immersion laser dopant process (PGILD) fabrication of diffusion halos |
| US7192836B1 (en) * | 1999-11-29 | 2007-03-20 | Advanced Micro Devices, Inc. | Method and system for providing halo implant to a semiconductor device with minimal impact to the junction capacitance |
| US6624035B1 (en) * | 2000-03-13 | 2003-09-23 | Advanced Micro Devices, Inc. | Method of forming a hard mask for halo implants |
| US6433372B1 (en) | 2000-03-17 | 2002-08-13 | International Business Machines Corporation | Dense multi-gated device design |
| US6344405B1 (en) * | 2000-04-11 | 2002-02-05 | Philips Electronics North America Corp. | Transistors having optimized source-drain structures and methods for making the same |
| JP3831598B2 (ja) * | 2000-10-19 | 2006-10-11 | 三洋電機株式会社 | 半導体装置とその製造方法 |
| US6509241B2 (en) | 2000-12-12 | 2003-01-21 | International Business Machines Corporation | Process for fabricating an MOS device having highly-localized halo regions |
| DE10148794B4 (de) * | 2001-10-02 | 2005-11-17 | Infineon Technologies Ag | Verfahren zum Herstellen eines MOS-Transistors und MOS-Transistor |
| US20030062571A1 (en) * | 2001-10-03 | 2003-04-03 | Franca-Neto Luiz M. | Low noise microwave transistor based on low carrier velocity dispersion control |
| US6756276B1 (en) * | 2002-09-30 | 2004-06-29 | Advanced Micro Devices, Inc. | Strained silicon MOSFET having improved source/drain extension dopant diffusion resistance and method for its fabrication |
| KR100953332B1 (ko) * | 2002-12-31 | 2010-04-20 | 동부일렉트로닉스 주식회사 | 반도체 장치의 제조 방법 |
| KR100981674B1 (ko) * | 2003-04-29 | 2010-09-13 | 매그나칩 반도체 유한회사 | 반도체 소자 및 그의 제조방법 |
| KR100487927B1 (ko) * | 2003-07-21 | 2005-05-09 | 주식회사 하이닉스반도체 | 마그네틱 램의 형성방법 |
| US7071069B2 (en) * | 2003-12-22 | 2006-07-04 | Chartered Semiconductor Manufacturing, Ltd | Shallow amorphizing implant for gettering of deep secondary end of range defects |
| KR100574172B1 (ko) * | 2003-12-23 | 2006-04-27 | 동부일렉트로닉스 주식회사 | 반도체 소자의 제조방법 |
| KR100552808B1 (ko) * | 2003-12-24 | 2006-02-20 | 동부아남반도체 주식회사 | 확산 소스/드레인 구조를 갖는 반도체 소자 및 그 제조 방법 |
| US7397081B2 (en) | 2004-12-13 | 2008-07-08 | International Business Machines Corporation | Sidewall semiconductor transistors |
| DE102005004355B4 (de) * | 2005-01-31 | 2008-12-18 | Infineon Technologies Ag | Halbleitereinrichtung und Verfahren zu deren Herstellung |
| EP1717850A1 (en) * | 2005-04-29 | 2006-11-02 | STMicroelectronics S.r.l. | Method of manufacturing a lateral power MOS transistor |
| US7282406B2 (en) * | 2006-03-06 | 2007-10-16 | Semiconductor Companents Industries, L.L.C. | Method of forming an MOS transistor and structure therefor |
| SG136058A1 (en) * | 2006-03-10 | 2007-10-29 | Chartered Semiconductor Mfg | Integrated circuit system with double doped drain transistor |
| US8354718B2 (en) * | 2007-05-22 | 2013-01-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device including an arrangement for suppressing short channel effects |
| US8163619B2 (en) * | 2009-03-27 | 2012-04-24 | National Semiconductor Corporation | Fabrication of semiconductor structure having asymmetric field-effect transistor with tailored pocket portion along source/drain zone |
| KR101700572B1 (ko) * | 2010-10-20 | 2017-02-01 | 삼성전자주식회사 | 저농도 채널 불순물 영역을 갖는 반도체 소자 |
| KR101714613B1 (ko) * | 2010-10-28 | 2017-03-10 | 삼성전자 주식회사 | 반도체 소자 및 이의 제조 방법 |
| JP2014036082A (ja) * | 2012-08-08 | 2014-02-24 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
| CN104078360B (zh) * | 2013-03-28 | 2016-11-23 | 中芯国际集成电路制造(上海)有限公司 | Mos晶体管的形成方法 |
| US11488871B2 (en) * | 2013-09-24 | 2022-11-01 | Samar K. Saha | Transistor structure with multiple halo implants having epitaxial layer over semiconductor-on-insulator substrate |
| US9847233B2 (en) | 2014-07-29 | 2017-12-19 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor device and formation thereof |
| US9484417B1 (en) * | 2015-07-22 | 2016-11-01 | Globalfoundries Inc. | Methods of forming doped transition regions of transistor structures |
| CN113410139B (zh) * | 2020-07-02 | 2025-06-03 | 台积电(中国)有限公司 | 半导体结构及其形成方法 |
| CN113871451B (zh) * | 2021-09-24 | 2024-06-18 | 华虹半导体(无锡)有限公司 | Dmos器件及其形成方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5736862A (en) * | 1980-08-13 | 1982-02-27 | Toshiba Corp | Semiconductor device |
| US5171700A (en) * | 1991-04-01 | 1992-12-15 | Sgs-Thomson Microelectronics, Inc. | Field effect transistor structure and method |
| US5894158A (en) * | 1991-09-30 | 1999-04-13 | Stmicroelectronics, Inc. | Having halo regions integrated circuit device structure |
| US5583067A (en) * | 1993-01-22 | 1996-12-10 | Intel Corporation | Inverse T-gate semiconductor device with self-aligned punchthrough stops and method of fabrication |
| JPH0799315A (ja) * | 1993-06-22 | 1995-04-11 | Motorola Inc | 半導体デバイスの対向するドープ領域のインターフェースにおけるキャリア濃度を制御する方法 |
| US5371394A (en) * | 1993-11-15 | 1994-12-06 | Motorola, Inc. | Double implanted laterally diffused MOS device and method thereof |
| US5372960A (en) * | 1994-01-04 | 1994-12-13 | Motorola, Inc. | Method of fabricating an insulated gate semiconductor device |
| US5668024A (en) * | 1996-07-17 | 1997-09-16 | Taiwan Semiconductor Manufacturing Company | CMOS device structure with reduced risk of salicide bridging and reduced resistance via use of a ultra shallow, junction extension, ion implantation process |
| KR100205320B1 (ko) * | 1996-10-25 | 1999-07-01 | 구본준 | 모스펫 및 그 제조방법 |
-
1995
- 1995-07-07 US US08/499,624 patent/US5675166A/en not_active Expired - Lifetime
-
1996
- 1996-05-29 TW TW085106352A patent/TW303520B/zh not_active IP Right Cessation
- 1996-07-01 EP EP96110587A patent/EP0752722B1/en not_active Expired - Lifetime
- 1996-07-01 JP JP8191409A patent/JPH0936367A/ja active Pending
- 1996-07-01 DE DE69624174T patent/DE69624174T2/de not_active Expired - Fee Related
- 1996-07-02 CN CN96108193A patent/CN1141509A/zh active Pending
-
1997
- 1997-06-02 US US08/865,846 patent/US6017798A/en not_active Expired - Lifetime
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