JPH10107090A - Tape with adhesive for TAB and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a novel TAB adhesive tape excellent in adhesiveness and insulating properties, and to improve the reliability and economy of a semiconductor device using the same. SOLUTION: A TAB comprising a laminate having an organic insulating film and an adhesive layer, wherein the adhesive layer contains a polyamide resin and an epoxy resin having an alkylene glycol chain in a molecule as essential components. Tape with adhesive and semiconductor device using the same.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape automated bonding (T)
AB) Tape with adhesive (hereinafter referred to as TA)
B) and a semiconductor device using the same.

[0002]

2. Description of the Related Art An ordinary TAB tape has a three-layer structure in which a flexible organic insulating film such as a polyimide film is laminated with a releasing polyester film or the like as an adhesive layer and a protective film layer. It is composed of

[0003] TAB tapes include sprockets and device holes, thermal lamination with copper foil, pattern formation (resist coating, etching, resist removal),
TA through processing process such as tin or gold-plating
Processed into B tape (pattern tape). FIG. 1 shows the shape of the pattern tape. FIG. 2 is a cross-sectional view of one embodiment of the semiconductor device of the present invention. The inner lead portion 6 of the pattern tape is thermocompression-bonded (inner lead bonding) to the gold bump 10 of the semiconductor integrated circuit 8 to mount the semiconductor integrated circuit. Next, a semiconductor device is manufactured through a resin sealing step using a sealing resin 9. In addition, a method in which a conductor of a pattern tape and a gold bump of a semiconductor integrated circuit are connected by wire bonding without using an inner lead portion is also adopted. Such a semiconductor device is generally called a tape carrier package (TCP) type semiconductor device.
Finally, the TCP type semiconductor device is connected to a circuit board or the like on which other components are mounted via outer leads 7 (outer lead bonding), and is mounted on an electronic device.

On the other hand, as electronic devices have become smaller and lighter in recent years, a semiconductor package has a QFP (quad flat flat) in which conventional connection terminals (outer leads) are arranged on the side of the package for the purpose of high-density mounting. Package), S
Instead of an OP (Small Outline Package), a BGA (Ball Grid Array), in which connection terminals are arranged on the back surface of the package, and a CSP (Chip Scale Package) have been partially used. BGA,
The point that the CSP is structurally most different from the QFP and the SOP is that the former requires a substrate called an interposer, whereas the latter does not necessarily require a substrate by using a metal lead frame. On the point. As the interposer referred to here, one obtained by bonding a copper foil to an organic insulating film such as a glass epoxy substrate or polyimide is generally used. Therefore, these BGA,
The tape with an adhesive for TAB of the present invention can be used for a semiconductor device such as a CSP, and the obtained BGA, CS
P is also included in the semiconductor device of the present invention. 3 and 4 are cross-sectional views of one embodiment of the semiconductor device (BGA, CSP) of the present invention.

[0005] In any of the above package forms, the adhesive layer of the TAB tape ultimately remains in the package, so that it is required to have insulation, heat resistance and adhesion. In recent years, as electronic devices have been miniaturized and densified, the conductor width in the TAB method has become extremely narrow, and the need for an adhesive having high adhesive strength and insulating properties has increased.

[0006] From such a viewpoint, a mixed composition of an epoxy resin and / or a phenol resin and a polyamide resin has been mainly used for the adhesive layer of the conventional TAB tape (Japanese Patent Application Laid-Open No. 2-143447; Kaihei 3-
No. 217035).

[0007]

However, conventional TAB tapes are not always satisfactory in the above-mentioned adhesiveness and insulating properties. For example, as the conductor width becomes narrower, the adhesive strength decreases, the conductor may peel off in a later step such as bonding, and it may not be possible to connect to an integrated circuit or a circuit board. This is mainly due to a shortage of the absolute value of the adhesive strength and a decrease in the effective adhesive area due to the penetration of the plating solution between the conductor and the adhesive. In addition, since insulation degradation is rapid in a state of continuous voltage application at high temperature and high humidity, there is a concern about insulation durability if the mounting density increases and the distance between conductors becomes short in the future.

An object of the present invention is to solve such problems and to provide a novel TAB tape having excellent adhesiveness and insulating properties and a semiconductor device using the same.

[0009]

Means for Solving the Problems In order to achieve the above object, the present inventors have conducted intensive studies on the relationship between the chemical structure of the adhesive component of the TAB tape and the adhesiveness to metal and insulation. The present inventors have found that a TAB tape excellent in adhesiveness and insulating properties can be obtained by skillfully combining an epoxy resin containing an alkylene glycol chain and a polyamide resin, and have reached the present invention.

That is, the present invention comprises a laminate having an adhesive layer on an organic insulating film, wherein the adhesive layer contains a polyamide (A) resin and an epoxy resin (B) as essential components. An epoxy resin (B), wherein the epoxy resin (B) has two or more epoxy groups in one molecule and one or more groups represented by the following formula (1). A TAB adhesive tape and a semiconductor device using the same, which are contained as an essential component.

[0011]

Embedded image (Where R is a C ₁ -C ₁₂ hydrocarbon residue, n is 1 to 1)
Indicates a natural number up to 2. )

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The epoxy resin (b) used in the present invention is an epoxy resin having two or more epoxy groups in one molecule and having one or more groups represented by the above formula (1). There is no particular limitation as long as it is included as an essential component. For example, in the above formula (1), an epoxy resin in which R has an ethyl group, a propyl group, a butyl group, an isopropyl group, a phenyl group or the like is included.

In the present invention, the adhesiveness of the adhesive layer can be improved by using an epoxy resin having a flexible alkylene glycol chain in the molecule.

The basic skeleton of the epoxy resin (b) used in the present invention is not particularly limited as long as it is an epoxy resin having two or more epoxy groups in one molecule, but bisphenol F, bisphenol A, bisphenol S, dihydroxy Examples include diglycidyl ethers such as naphthalene, epoxidized phenol novolak, epoxidized cresol novolak, epoxidized trisphenylolmethane, epoxidized tetraphenylolethane, and epoxidized metaxylenediamine.

The epoxy resin (B) used in the present invention
May contain two or more epoxy resins.

The polyamide resin (A) used in the present invention
Can be used. In particular, a material containing a dicarboxylic acid having 36 carbon atoms (so-called dimer acid) as a constituent component is preferable, in which the adhesive layer has flexibility and has excellent insulating properties due to a low water absorption. Polyamide resin containing dimer acid can be obtained by polycondensation of dimer acid and diamine according to a conventional method. Is also good. Known diamine components such as ethylenediamine, hexamethylenediamine, piperazine, etc. can be used,
Two or more kinds may be mixed from the viewpoint of solubility.

In the present invention, the mixing ratio of the epoxy resin (B) to the polyamide resin (A) is usually 5 to 1 for the epoxy resin (B) per 100 parts by weight of the polyamide resin (A).
00 parts by weight, preferably 20 to 70 parts by weight. If the amount of the epoxy resin (B) is less than 5 parts by weight, the adhesiveness is not sufficient. On the other hand, if it exceeds 100 parts by weight, the insulating property is undesirably reduced.

In the present invention, the epoxy resin (b) in the epoxy resin (B) is usually at least 20% by weight, preferably at least 50% by weight, more preferably at least 70% by weight. In the epoxy resin (B), other known epoxy resins can also be added together as long as the adhesiveness and the insulating property are not impaired. The addition amount of other known epoxy resins is less than 80% by weight in the epoxy resin (B).

Further, the adhesive layer may contain a phenol resin such as a novolak type phenol resin or a resol type phenol resin, which is effective in improving insulation and heat resistance such as thermal deformation. The added amount of the phenol resin is preferably 5 to 100 parts by weight based on 100 parts by weight of the polyamide resin.

The addition of a curing agent and a curing accelerator for epoxy resin and phenolic resin to the adhesive layer of the present invention is not limited at all. For example, aromatic polyamines, amine complexes of boron trifluoride such as boron trifluoride triethylamine complex, imidazole derivatives such as 2-alkyl-4-methylimidazole and 2-phenyl-4-alkylimidazole, phthalic anhydride, trianhydride Organic acids such as melitic acid, dicyandiamide, and known compounds such as triphenylphosphine can be used. The addition amount is preferably 0.1 to 10 parts by weight based on 100 parts by weight of the polyamide resin.

In addition to the above components, addition of organic and inorganic components such as an antioxidant and an ion scavenger is not limited as long as the properties of the adhesive are not impaired.

The insulating film referred to in the present invention is, for example,
Polyimide, polyester, polyphenylene sulfide, polyether sulfone, polyether ether ketone, aramid, polycarbonate, a film made of a composite material such as plastic or epoxy resin impregnated glass cloth such as polyarylate, preferably a thickness of 25 to 125 μm A flexible film,
A plurality of films selected from these may be laminated and used. Also, if necessary, hydrolysis,
Surface treatment such as corona discharge, low-temperature plasma, physical roughening, and easy adhesion coating treatment can be performed.

In the present invention, a protective film is usually laminated on the adhesive layer. This protective film layer is not particularly limited as long as it can be peeled from the adhesive surface without damaging the form of the TAB tape before the copper foil is thermally laminated.
For example, a polyester film or a polyolefin film coated with a silicone or fluorine compound, and a paper obtained by laminating the same.

Next, a normal method for producing a tape with an adhesive for TAB will be described.

A coating material obtained by dissolving the above adhesive composition in a solvent is applied to a flexible insulating film and dried. It is preferable to apply the adhesive layer so that the film thickness is 10 to 25 μm. Drying conditions are 100-200 ° C, 1-5
Minutes. The solvent is not particularly limited, but a mixture of an aromatic compound such as toluene, xylene, and chlorobenzene and an alcohol compound such as methanol, ethanol, and propanol is preferable. A protective film is laminated on the thus obtained laminate, and finally slit into a width of about 35 to 158 mm.

[0026]

EXAMPLES The present invention will be described below with reference to examples.
The present invention is not limited to these examples. Before starting the description of the embodiments, an evaluation method will be described.

Evaluation method (1) Method for preparing evaluation sample An 18 μm electrolytic copper foil was laminated on a tape sample with an adhesive for TAB at 140 ° C. and 0.1 MPa. Then, in an air oven at 80 ° C for 3 hours, 100
C., 5 hours, 150.degree. C., 5 hours in order to prepare a TAB tape with copper foil. Photoresist film formation, etching, and resist peeling were performed on the copper foil surface of the obtained TAB tape with copper foil by a conventional method, and samples for evaluation of adhesive strength and insulating property were prepared.

(2) Tin plating treatment The sample obtained by the above method (1) was immersed in a borofluoric acid-based electroless tin plating solution at 70 ° C for 5 minutes.
5 μm thick plating was applied.

(3) Peeling Strength Using the evaluation sample having a conductor width of 50 μm obtained by the above methods (1) and (2), the conductor was moved 50 mm in the 90 ° direction.
/ Min, and the peeling force at that time was measured.

Reference Example (Synthesis of Polyamide Resin) Using an acid / amine shown in Table 1, an acid / amine reactant, an antifoaming agent and a phosphoric acid catalyst of 1% or less were added to prepare a reactant. The reactants were stirred and heated at 140 ° C. for 1 hour, and then heated for 2 hours.
The temperature was raised to 05 ° C., and the mixture was stirred for about 1.5 hours. About 15mm
Hold under Hg vacuum for 0.5 hour to reduce temperature. Finally, an antioxidant is added, and the polyamide resin (A
1) was taken out.

Example 1 A polyamide resin (A1) (acid value 10.0) shown in Table 1 and a phenol resin (manufactured by Showa Polymer Co., Ltd.)
CKM1282) and an epoxy resin (b1) containing an alkylene glycol chain shown in Table 2 were blended so as to have the composition ratios shown in Table 3, and after adding dicyandiamide (DICY), methanol was added so that the concentration became 20% by weight. /
The mixture was stirred and mixed with a monochlorobenzene mixed solvent at 30 ° C. to prepare an adhesive solution. This adhesive was applied to a 25 μm-thick polyethylene terephthalate film (“Lumirror” manufactured by Toray Industries, Ltd.) using a bar coater to a dry thickness of about 18 μm, and dried at 100 ° C., 1 minute, and 160 ° C. for 5 minutes. Was performed to produce an adhesive sheet. further,
The obtained adhesive sheet was laminated on a 75 μm-thick polyimide film (“UPILEX” 75S manufactured by Ube Industries, Ltd.) at 120 ° C. and 0.1 MPa, and TAB was applied.
A tape with an adhesive was prepared. Table 3 shows the characteristics.

Using the TAB adhesive tape obtained by the above procedure, a conductor circuit for connecting a semiconductor integrated circuit was formed in the same manner as in the above evaluation methods (1) and (2). Was obtained.

Further, using this pattern tape, 45
Inner lead bonding was performed at 0 ° C. for 1 minute to connect a semiconductor integrated circuit. After that, an epoxy-based liquid sealant ("Hitariku Paint Co., Ltd." Chipcoat "1
320-617), resin sealing was performed to obtain a semiconductor device. FIG. 2 shows a cross section of the obtained semiconductor device.

Examples 2 to 4 and Comparative Examples 1 and 2 Tapes with an adhesive for TAB were prepared in the same manner as in Example 1 by using the raw materials and adhesives prepared according to the composition ratios shown in Tables 1 to 3, respectively. Obtained. Table 3 shows the characteristics.

[0035]

[Table 1]

[0036]

[Table 2]

[0037]

[Table 3]

From the examples and comparative examples in Table 3, it can be seen that the TAB adhesive tape obtained according to the present invention is excellent in adhesiveness and therefore excellent in insulation.

[0039]

The present invention is to industrially provide a novel TAB adhesive tape having excellent adhesiveness and insulating properties and a semiconductor device using the same.
The reliability and economy of the semiconductor device for high-density mounting can be improved by the adhesive tape.

[Brief description of the drawings]

FIG. 1 is a perspective view of one embodiment of a pattern tape before mounting a semiconductor integrated circuit, obtained by processing a tape with an adhesive for TAB of the present invention.

FIG. 2 is a cross-sectional view of one embodiment of a semiconductor device using the tape with an adhesive for TAB of the present invention.

FIG. 3 is a cross-sectional view of one embodiment of a semiconductor device (BGA) using a tape with an adhesive for TAB of the present invention.

FIG. 4 is a cross-sectional view of one embodiment of a semiconductor device (CSP) using a tape with an adhesive for TAB of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating film which has flexibility 2,13,21 Adhesive 3 Sprocket hole 4 Device hole 5,14,22 Conductor for connecting a semiconductor integrated circuit 6 Inner lead part 7 Outer lead part 8,15,23 Semiconductor integrated circuit 9, 16, 24 Sealing resin 10, 17, 25 Gold bump 11 Protective film 18, 26 Solder ball 19 Reinforcement plate 27 Solder resist

Claims (5)

[Claims] 1. A laminated body having an adhesive layer on an organic insulating film, wherein the adhesive layer is made of a polyamide resin (A).
Containing epoxy resin and epoxy resin (B) as an essential component
AB adhesive tape, wherein the epoxy resin (B) has two or more epoxy groups in one molecule and one or more groups represented by the following formula (1): TAB characterized by containing b) as an essential component
Tape with adhesive. Embedded image (Where R is a C ₁ -C ₁₂ hydrocarbon residue, n is 1 to 1)
Indicates a natural number up to 2. ) 2. The TAB adhesive tape according to claim 1, wherein the content of the epoxy resin (B) is 5 to 100 parts by weight based on 100 parts by weight of the polyamide resin. 3. The tape with an adhesive for TAB according to claim 1, wherein the polyamide resin (A) contains a dicarboxylic acid having 36 carbon atoms as an essential component. 4. The tape with an adhesive for TAB according to claim 1, wherein the adhesive layer contains a phenol resin. 5. A semiconductor device using the tape with an adhesive for TAB according to claim 1.