JPH0969477A - Semiconductor wafer sorter - Google Patents

Abstract

(57) [Summary] [Purpose] To provide a wafer sorting device that can reduce the occupied area, work time, and price. A loading station 12 for delivering a wafer 1, a wafer identification device 20 having a wafer identification code reading device 40 and a wafer delivery device 21, and an unloading station 13 for storing the identified wafer 1 at a designated position. There is. The reading device 40 has a television camera that images the pair of reading areas 47A and 47B. The delivery device 21 is arranged on the reading stage 31 and is configured to match the identification code 4 with either of the reading areas 47A and 47B. [Effect] The delivered wafer is transferred to the reading stage arranged by the delivery device. The delivery device matches the identification code position with one reading area on the reading stage. The reading device reads the identification code. That is, since the delivery device itself constitutes the alignment device, the occupied area, working time, and price can be suppressed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer classifying technique, and more particularly to identifying individual semiconductor wafers by reading an identification code attached to the semiconductor wafers, and performing classification, sampling, knitting, etc. based on the identification. Regarding the technology to perform work,
For example, the present invention relates to a technique effectively used for classifying semiconductor wafers in a semiconductor manufacturing process.

[0002]

2. Description of the Related Art Generally, in a semiconductor manufacturing process, a plurality of semiconductor wafers (hereinafter referred to as "wafers") as works are organized into one lot and handled. For example, for a product for mass production of a small variety of products such as a RAM (random access memory), there is almost no need to reorganize the lot after the lot organization is performed at the time of loading the wafer into the line. However, mask ROM (Read Only Memory) and ASIC
For products that require high-mix low-volume production such as (custom-ordered semiconductor integrated circuit devices), productivity may decrease if the lots organized when the wafers are loaded into the line are maintained. appear. Therefore, it is necessary to reorganize the lot after the wafer is loaded.

When the lots are organized after the wafers are loaded in this way, a unique mark (hereinafter referred to as an identification code) is attached to each wafer in advance, the identification code of each wafer is read, and the identification code is assigned. By using the wafers, the classification of each wafer will be carried out. Therefore, in order to organize lots of wafer groups, it is necessary to provide a wafer classifying device for reading the wafer identification code, identifying the individual wafers, and classifying the individual wafers. Further, the wafer classification device needs to include a wafer identification device for identifying the wafer.

This type of conventional wafer identifying apparatus is provided with a reading device for reading an identification code attached to a wafer and a delivery device for delivering the wafer to a reading stage of the reading device. After being transferred to the reading stage of the reading device by the device, the position of the identification code is aligned with the reading area of the reading device by the alignment device provided on the reading stage.

As an example in which the wafer lot organization technique is described, Japanese Patent Laid-Open No. 4-273115 and Japanese Patent Laid-Open No. 4-311515 are cited.
There are JP-A-239152 and JP-A-4-260318.

[0006]

However, in the conventional wafer classifying device, the delivery device and the reading device of the wafer identification device are arranged in different places, and the reading stage is provided with the alignment device. There is a problem that not only the occupied floor area of the entire wafer sorting apparatus becomes large, but also the takt time becomes long and the price of the entire wafer sorting apparatus becomes high.

An object of the present invention is to provide a semiconductor wafer sorter capable of suppressing the occupied floor area, takt time and price.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0009]

The outline of a typical invention among the inventions disclosed in the present application is as follows.

That is, a loading station for dispensing a semiconductor wafer, a semiconductor wafer identification device for optically reading the identification code attached to the dispensed semiconductor wafer to identify the semiconductor wafer, and receiving the identified wafer. In a semiconductor wafer sorter including an unloading station that is stored in a designated position, the semiconductor wafer identification device includes a reader that optically reads an identification code and a delivery device that delivers the semiconductor wafer. The reading device has a pair of image capturing devices for respectively imaging the reading areas set at two different positions of the reading stage, and the delivery device is arranged on the reading stage of the reading device. Set the position where the identification code of the semiconductor wafer is attached to the both reading areas. Characterized in that it is configured to conform to or Re.

[0011]

In the above-mentioned means, the semiconductor wafer delivered from the loading station is transferred to the reading stage of the reading device in the identification device by the delivery device. At this time, the delivery device that has received the semiconductor wafer determines the position where the identification code of the semiconductor wafer is attached on the reading stage arranged in itself as the reading area of one of the reading areas of both image capturing devices in the reading device. To match. That is, the delivery device itself also serves as the alignment device. The image capturing device whose identification code matches the reading area captures the image of the identification code, and the reading device reads the identification code by this image. When the identification code is read, the delivery device transfers the semiconductor wafer from the reading stage to the unloading station and delivers it.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a partially omitted perspective view showing a wafer sorter according to an embodiment of the present invention. FIG. 2 is a plan view of the same. 3A and 3B show a wafer identification device used in the wafer classification device, where FIG. 3A is a front view and FIG.
It is a top view which follows the bb line of. FIG. 4 is an explanatory view for explaining the operation of the alignment. FIG. 5 is an explanatory diagram for explaining the holding action.

In the present embodiment, the semiconductor wafer classifying apparatus according to the present invention is configured to classify each wafer as specified in advance by using the identification code attached to the wafer as an index in the manufacturing process of the semiconductor device. And is equipped with a wafer identification device. The wafer identification device is configured to sequentially identify individual wafers by reading an identification code attached to each wafer as an identification target article in advance by optical means.

The wafer 1 is formed of a semiconductor such as silicon into a circular thin plate shape, and an orientation flat (hereinafter referred to as an orientation flat) 3 is linearly cut in a part of the circumference. An identification code 4 for identifying a wafer as an identification target article is provided at a position opposite to the orientation flat 3 on a main surface 2 of the wafer 1 on which a semiconductor element is formed (hereinafter referred to as a first main surface) 2. It is attached to each wafer uniquely. The identification code 4 is drawn by numbers and English letters by using an appropriate means such as an etching method or a laser engraving method. The identification code 4 for identifying each wafer is composed of a lot code indicating the lot number of the wafer 1 and a wafer code indicating each wafer number in the lot.

A plurality of wafers 1 (for example, 25 wafers for one lot) as works of the wafer sorting apparatus are
It is stored in the cassette 5. That is, the cassette 5 has a large number of holding grooves (hereinafter referred to as slots) (typically 25 slots).
A plurality of wafers are housed in a regularly aligned state by inserting the wafers into the slots.

The wafer sorter 11 according to the present embodiment is provided with a machine base (not shown) formed in a substantially box shape, and a loading station, an unloading station, and wafers are mounted on the machine base. And an identification device. The loading station 12 and the unloading station 13 are arranged symmetrically in the front-rear direction on one side (hereinafter, left side) of the machine base. The loading station 12 and the unloading station 13 include elevators 14 and 15 controlled by a controller (not shown), respectively. The elevators 14 and 15 are configured to raise or lower the cassette 5 placed thereon by one pitch at a time.

The wafer identification device 20 is provided with a delivery device 21 for delivering the wafer, and the delivery device 21 is arranged at the center position of the right side portion on the machine base. Delivery device 21
Is equipped with an elevator 22, on which a rotary actuator 23 is mounted vertically upward. A swivel shaft 24 is fixed vertically upward to the output shaft of the rotary actuator 23, and the swivel shaft 24 is configured to be reciprocally swiveled in a horizontal plane at 180 degrees or more and less than 360 degrees (for example, about 270 degrees). . One end of a horizontally arranged first arm 25 is fixed to the upper end of the turning shaft 24 so as to rotate integrally.
One end of a second arm 26 arranged in parallel is rotatably supported by the free end of the first arm 25, and the second arm 26 is rotationally driven by a belt transmission device 27 incorporated therein. It has become. One end of a horizontally arranged hand 29 is rotatably supported by the other end of the second arm 26, and the hand 29 is rotationally driven by a built-in belt transmission device 28. .

The hand 29 is formed in the shape of a rod having a substantially rectangular cross section, and its longitudinal dimension is set to be larger than the diameter of the wafer 1. A vacuum suction head (hereinafter, referred to as a suction head) 30 is installed at an end portion on the upper surface of the hand 29 on the side opposite to the center of rotation so as to face upward in a right angle direction. The suction head 30 contacts the main surface of the wafer 1. The wafer 1 can be vacuum-sucked and held in the peeled state. That is, a vacuum suction port is opened on the upper surface of the hand 29, and a negative pressure supply path (not shown) is fluidly connected to the vacuum suction port through the inside of the hand 29. The delivery device 21 configured as described above constitutes the reading stage 31 by the upper surface of the hand 29 and also constitutes an alignment device for aligning the identification code 4 of the wafer 1 with the reading area of the reading device which will be described later. There is.

A temporary wafer placing device 35 is disposed above the delivery device 21 coaxially with the turning shaft 24, and is supported by a stand (not shown) provided upright at the right end portion on the machine base. . That is, the temporary wafer placing device 35 is provided with a pair of support plates 36, 36 symmetrically arranged on an extension line of the center of the turning shaft 24. The support plates 36, 36 have pins 37, 37
Is configured to be rotationally driven by the rotary actuators 38, 38. The distance between the inner ends of the support plates 36, 36 is smaller than the diameter of the wafer 1 when the support plates 36, 36 are stopped close to each other. It is configured to be larger than the diameter.

In order to reduce the contact area with the wafer 1 as much as possible to prevent the adhesion of foreign matter and metal contamination, the suction head 30 of the hand 29 and the temporary wafer placing device 35.
It is desirable that the support plate 36 of 1 is configured to support the wafer 1 in a floating state.

An identification code reading device (hereinafter referred to as a reading device) 40 is supported above the temporary wafer placing device 35 of the identification device 20 by a stand (not shown) provided upright at the right end portion of the machine base. Has been and is equipped. That is, the reading device 40 includes a pair of left and right television cameras as an illuminating device and an image capturing device. The left and right illumination devices 41A and 41B are supported vertically downward on a stand, respectively, and a pair of left and right reading areas 47A and 47B that are set at symmetrical positions of the reading stage 31 of the delivery device 21 are provided with parallel visible light. Configured to illuminate. The left and right TV cameras 42A and 42B are supported vertically downward on the stand, and the identification codes 4 in the left and right reading areas 47A and 47B on the reading stage 31 illuminated by the left and right illumination devices 41A and 41B are displayed. Each is configured to be filmed.

1 for each of the left and right TV cameras 42A and 42B.
Identification code recognition device (hereinafter referred to as recognition device) 4
3 is also electrically connected so that the recognition device 43 is composed of an image processing device and the like, and an identification code attached to the wafer 1 based on the image pickup signals from the left and right television cameras 42A and 42B. 4 is recognizable. A monitor 44 is connected to the recognition device 43, and the monitor 44 allows the television cameras 42A and 42B to be connected.
The filming situation of is being monitored. Further, a memory 45 as a recording means for sequentially recording the identification code is connected to the recognition device 43, and the memory 45 is configured to sequentially record the identification code 4 recognized by the recognition device 43. There is. The memory 45 is connected to a data processing device 46 constructed from a computer or the like, and the data processing device 46 is configured to create data for wafer classification by calling the data recorded in the memory 45 as needed. Has been done. The memory 45 may be equipped on the data processing device 46 side. In addition, it is desirable that each of the above-described components is configured to be integrally controlled by a controller (not shown) constructed from a computer or the like.

Next, the operation will be described. First, as shown in FIG. 2, an actual cassette 5A in which a plurality of wafers 1 are stored is set on the elevator 14 of the loading station 12, and an actual cassette 5A is placed on the elevator 15 of the unloading station 13. An empty cassette 5 is set. First arm 25 and second of delivery device 21
The arm 26 is extended by the rotary actuator 23 and the belt transmission devices 27 and 28, and the hand 29 is inserted into the actual cassette 5A. At this time, the elevator 14 of the loading station 12 is pitch-operated so that the wafer 1 designated by the controller faces directly above the hand 29.

As shown in FIG. 4A, the suction head 30 of the hand 29 is aligned with the center O _{1 of the} wafer 1 in a state where the hand 29 faces directly below the wafer 1. The coincidence operation between the head 30 and the center O _{1 of the} wafer is executed by the teaching / reproducing function of the transfer device 21. That is, the suction head 30 is placed at the center O ₁ of the wafer 1 in the actual cassette 5A of the loading station 12.
So that they coincide with each other, the control regarding the extension operation of the first arm 25 and the second arm 26 in the delivery device 21 is taught and stored in advance, and the stored control is reproduced for each loading operation of each wafer 1. To be done.

When the hand 29 holds the wafer 1 by the suction head 30, the first arm 25 and the second arm 26 of the delivery device 21 are shortened by the rotary actuator 23 and the belt transmission devices 27 and 28, and the wafer 1 is handed. It is pulled out from the actual cassette 5A by 29. Subsequently, as shown in FIG. 4B, the suction head 30 of the hand 29 is moved right above the center O ₂₄ of the turning shaft 24 of the delivery device 21, and the wafer 1 is substantially moved to the reading stage 31. Will be transferred. At this time, the coincidence operation of the suction head 30 with the center O ₂₄ of the turning shaft 24 is also executed by the teaching / reproducing function of the delivery device 21. The suction head 30 holding the wafer 1 by suction holds the center O of the rotary shaft 24.
By matching ₂₄ , the suction head 30 has a center O ₁
The center O ₁ of the wafer 1 on which is adsorbed is aligned with the center O ₂₄ of the turning shaft 24.

The center O _{1 of the} wafer 1 is the center O of the rotary shaft 24.
_When matched with ₂₄ , as shown in FIG. 4 (c),
The outer peripheral edge of the wafer 1 is included in the left and right reading areas 47A and 47B as the reading position of the reading device 40. That is, the wafer 1 is transferred to the hand 29 of the delivery device 21.
It means that it has been transferred to the reading stage 31 set above. However, the identification code 4 attached to the wafer 1 is out of the reading areas 47A and 47B.
That is, for example, the image of the reading area 47B captured by the television camera 42B on the right side of the reading device 40 is
As shown in FIG. 4E, the identification code 4 is not displayed.

Therefore, as shown in FIG. 4 (d), the rotary shaft 23 of the transfer device 21 is rotated in one direction by the rotary actuator 23, so that the wafer 1 is rotated about the center O _1. Then, the identification code 4 of the wafer 1 is moved to the reading area 47B. That is,
As shown in FIG. 4F, when the identification code 4 is properly projected in the image of the reading area 47B taken by the television camera 42B of the reading device 40, the turning shaft 24 turns. Be stopped. At this time, the wafer 1
After the orientation flat 3 is recognized by the recognition device 43, the delivery device 21 may be controlled so that the identification code 4 of the wafer 1 is placed in the reading area 47A.

By the above operation, the display position of the identification code 4 of the wafer 1 on the reading stage 31 set on the hand 29 is in a state of being aligned with the reading area 47B of the reading device 40. In this state, the reading operation of the identification code 4 on the wafer 1 is executed by the reading device 40. That is, the image signal of the identification code 4 photographed by the television camera 42B is transmitted to the recognition device 43 and is subjected to image processing by the recognition device 43, whereby the identification code 4 is obtained.
Is read.

The read identification code 4 is recognized by the recognition device 43.
It is recorded in the memory 45 connected to. And
The data processing device 46 calls the recorded identification code 4 to specify the position of the slot to be unloaded in the empty cassette 5, and sends a predetermined command signal to the controller of the delivery device 21. By the way, since the image captured by the television camera 42B or 42A can be appropriately displayed on the monitor 44, the operator can monitor the identification code 4 as necessary.

Next, the wafer 1 from which the identification code 4 is read is transferred to the unloading station 13 by the delivery device 21 and is unloaded into the designated slot of the empty cassette 5. Here, when the wafer 1 is unloaded into the empty cassette 5, it is desirable to store the wafer 1 in the empty cassette 5 with the orientation of the orientation flat 3 aligned for the convenience of the subsequent work.
However, since the identification code 4 of the wafer 1 is aligned with the reading area 47B by the turning of the turning shaft 24 of the delivery device 21, the orientation relationship between the orientation flat 3 of the wafer 1 and the hand 29 is not constant.

Therefore, when it is necessary to unload the wafer 1 in the empty cassette 5 with the orientation of the orientation flat 3 aligned, as shown in FIG.
The holding operation of the wafer 1 is performed using the. First of all, the orientation flat 3 is moved to the designated holding position by turning the turning shaft 24 by 90 degrees. Then, the delivery device 21 is lifted by the elevator 22 and the wafer 1 is lifted above the temporary placement device 35. continue,
After the support plates 36, 36 of the temporary placement device 35 are rotated 180 degrees about the pins 37, 37 by the rotary actuators 38, 38, the elevator 22 is lowered. By this operation, as shown in FIGS. 5A and 5B, the wafer 1 of the delivery device 21 is transferred to the temporary placement device 35 with the orientation flat 3 placed at the holding position.

Next, the hand 29 is moved to the holding position by turning the turning shaft 24. Then
The delivery device 21 is lifted by the elevator 22, and the hand 29 sucks and holds the wafer 1 by the suction head 30, and lifts and receives the wafer 1 from both the support plates 36, 36. At this time, the suction head 30 of the hand 29 is in a state of holding the center O _{1 of the} wafer ₁ by suction. When the wafer 1 is received by the hand 29, the temporary placement device 3
The support plates 36, 36 of FIG.
After being rotated 0 degrees, the elevator 22 is lowered. By this operation, as shown in FIGS. 5 (c) and 5 (d), the wafer 1 is held by the hand 29 of the delivery device 21 so that the orientation flat 3 is held in a state where the orientation flat 3 is matched with a predetermined holding position. .

When the wafer 1 is held by the hand 29 in the predetermined direction as described above, the wafer 1 held by the hand 29 is transferred to the first arm 25 and the second arm 25.
When the arm 26 is extended, it is transferred to the unloading station 13 and is unloaded into the designated slot of the empty cassette 5. At this time, since the wafer 1 is held by the hand 29 in a predetermined direction,
The wafer 1 is transferred to the slot of the empty cassette 5 in a predetermined direction.

Now, for example, the wafer code number of the identification code 4 read by the reading device 40 is "N0.
If it is 1 ”, the unloading station 13
In response to a command from the controller, the elevator 15 is fed by one pitch and the first slot in the empty cassette 5 is set to the insertion operation position. Then, when the first slot is set to the insertion operation position, the NO. One wafer 1 is inserted into this first slot.

The wafer code number of the identification code 4 read by the next wafer 1 reading device 40 is "N0.
In the case of "3", the elevator 15 is further fed by two pitches according to a command from the controller of the unloading station 13, and the third slot in the empty cassette 5 is set to the insertion operation position. Then, the N0.3 wafer 1 carried by the delivery device 21 is inserted into the third slot.

Further, when the wafer code number of the next wafer 1 is "NO. 2", the elevator 1 is instructed by the controller of the unloading station 13.
5 is sent back by 1 pitch and empty cassette 5
The second slot at is set to the insertion actuated position.
Then, N0.2 conveyed by the delivery device 21.
Wafer 1 is inserted into this second slot.

By repeating the above operation, the group of wafers 1 is accommodated in the empty cassette 5 of the unloading station 13 arranged in the slot numbers according to the order of each wafer code. In this case, a wafer with wafer code N0.1 is in the first slot, a wafer with wafer code N0.2 is in the second slot, and a wafer code N0. That is, n wafers have been inserted. Moreover, the wafers 1 housed in the respective slots are in a state in which the orientations thereof are aligned, that is, the orientation flats 3 are all aligned.

With the above operation, the identification code reading work and the wafer sorting work are carried out. At the same time as these works, the processing of each wafer and the wafer history in the memory 45 are performed based on the read data of the reading device 40. You can create files etc.

According to the above embodiment, the following effects can be obtained. (1) By setting the reading stage in the delivery device itself for delivering the wafer to the reading stage of the wafer identification code reading device and providing an alignment function for matching the identification code display position of the wafer with the reading area of the reading stage, Since it is not necessary to attach a reading stage and an alignment device separately from the reading device and the delivery device, it is possible to suppress the occupied floor area, takt time and price of the entire wafer sorting device.

(2) The first arm rotated by the turning shaft, the second arm pivotally supported by the free end of the first arm, and the second arm pivotally supported at a position away from the center of rotation of the second arm. It is possible to omit a linearly moving part by configuring the delivery device by a hand that is rotated by rotation and a suction head that is disposed at a position distant from the center of the hand and is vacuum-sucked to the central portion of the lower surface of the wafer. Therefore, the occupied floor area, takt time and price of the entire wafer sorting apparatus can be further suppressed.

(3) By providing a temporary placement device for temporarily placing an article above the delivery device, the delivery device can hold the wafer, so that the wafers can be unloaded in the same direction.

(4) Since the identification code of the loaded wafer can be read and unloaded in the wafer cassette, the identification code is used as an index to sort the wafer group, rearrangement work, lot formation work, and wafer removal work. It is possible to automatically carry out wafer identification code confirmation work and the like.

(5) By storing the wafer identification code in the memory, it is possible to perform a special work such as re-division / re-synthesis of lots, and to create the history of each wafer using the identification code as an index. You can

FIG. 6 shows a wafer identifying device used in a wafer classifying device according to another embodiment of the present invention.
(A) is a front view, (b) is a top view which follows the bb line of (a).

The difference between the second embodiment and the first embodiment is that
The point is that a rectilinear arm (hereinafter referred to as a rectilinear arm) 26A is mounted as a second arm on the first arm 25 so as to reciprocate linearly. That is, when the suction head 30 of the hand 29 is applied to the center O _{1 of the} wafer 1 by the extension operation of the rectilinear arm 26A as the second arm, the hand 29 is moved by the suction head 30 to the wafer 1.
Hold by vacuum suction. Then, the rectilinear arm 26A is shortened to move the center O _{1 of the} wafer 1 to the swivel axis 2.
Aligned with center O ₂₄ of 4. After that, as in the first embodiment, the identification code 4 of the wafer 1 is read by the turning shaft 24 of the delivery device 21 and the reading area 47A of the reading device 40.
Or it is aligned with 47B and the identification code 4 is read. The wafer 1 from which the identification code 4 is read is unloaded at a predetermined position by the turning operation of the turning shaft 24 and the extension operation of the rectilinear arm 26A.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the elevators of the loading station and the unloading station in the wafer sorting apparatus may be omitted, and the delivery apparatus of the wafer identification apparatus may be provided with elevators for loading work and unloading work in addition to elevators for holding work. Good. Further, the elevator for the holding work may be configured to serve as the elevator for the loading work and the unloading work.

Further, the loading station and the unloading station in the wafer sorting apparatus may each be constituted by a table on which a wafer is placed.
Further, the loading station and the unloading station in the wafer sorter are each 1
It is not limited to install each group, but two or more groups may be installed respectively.

The wafer sorter can be used for wafer lot organization work, wafer extraction work, wafer rearrangement work, wafer identification code confirmation work, etc. The point is that the wafer handling before and after reading the identification code is not limited. .

[0050]

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

An alignment function of setting the reading stage in the delivery device itself for delivering the semiconductor wafer to the reading stage of the identification code reading device in the semiconductor wafer sorting device and matching the identification code display position of the semiconductor wafer with the reading area of the reading stage. By providing
Since it is not necessary to attach a reading stage and an alignment device separately from the reading device and the delivery device, it is possible to suppress the occupied floor area, takt time and price of the entire semiconductor wafer sorting device.

[Brief description of drawings]

FIG. 1 is a partially omitted perspective view showing a wafer sorter including a wafer identification device according to an embodiment of the present invention.

FIG. 2 is a plan view thereof.

3A and 3B show the wafer identification device, wherein FIG. 3A is a front view and FIG. 3B is a plan view taken along the line bb of FIG.

FIG. 4 is a diagram for explaining a reading operation,
(A), (b), (c) and (d) are partial plan views,
(E) and (f) are screen diagrams.

FIG. 5 is a diagram for explaining a holding operation.
(A), (c) is each partial front view, (b), (d) is each partial top view.

6A and 6B show a wafer identification device used in a wafer sorting device according to another embodiment of the present invention, in which FIG. 6A is a front view and FIG. 6B is a plan view taken along line bb of FIG. It is a figure.

[Explanation of symbols]

1 ... Wafer (workpiece), 2 ... First main surface, 3 ... Orientation flat (orientation flat), 4 ... Identification code, 5 ...
Cassette, 5A ... actual cassette, 11 ... wafer sorter,
12 ... Loading station, 13 ... Unloading station, 14, 15 ... Elevator, 20 ... Wafer identification device, 21 ... Delivery device, 22 ... Elevator,
23 ... Rotary actuator, 24 ... Swivel axis, 25
... first arm, 26 ... second arm, 27, 28 ... belt transmission device, 29 ... hand, 30 ... suction head, 31 ... reading stage, 35 ... wafer temporary placement device, 36 ... support plate, 37 ... pin, 38 … Rotary actuators,
40 ... Identification code reading device, 41A, 41B ... Illumination device, 42A, 42B ... Television camera (image capturing device), 43 ... Identification code recognition device, 44 ... Monitor, 45
... Memory, 46 ... Data processing device, 47A, 47B ...
Reading area, 26A ... Straight arm type second arm.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Haruo Iizuka, 3-3 Fujibashi, Ome-shi, Tokyo 2 3 Hitachi Hitachi Electronics Co., Ltd. (72) Kazuhiko Matsuoka, 5-20-1, Mizumizuhonmachi, Kodaira-shi, Tokyo Hitachi, Ltd. Semiconductor Business Division

Claims (4)

[Claims] 1. A loading station for dispensing a semiconductor wafer, a semiconductor wafer identifying device for optically reading the identification code attached to the dispensed semiconductor wafer to identify the semiconductor wafer, and receiving the identified wafer. A semiconductor wafer sorter including an unloading station that is housed at a designated position, wherein the semiconductor wafer identifier includes a reader that optically reads an identification code and a delivery device that delivers the semiconductor wafer. The reading device has a pair of image capturing devices for respectively imaging the reading areas set at two different positions of the reading stage, and the delivery device is arranged on the reading stage of the reading device. At the same time, place the position where the identification code of the semiconductor wafer is attached to either of the reading areas. Semiconductor wafer classification device characterized in that it is configured to Itasa. 2. The delivery device includes a first arm that is swung by a swivel shaft, a second arm that is supported and moved by the first arm, and a semiconductor wafer that is regularly supported by the second arm and holds the semiconductor wafer. The semiconductor wafer sorting apparatus according to claim 1, further comprising a hand. 3. The semiconductor wafer sorting device according to claim 2, wherein the delivery device is configured to hold the central position of the semiconductor wafer by vacuum suction with a hand by a teaching / reproducing function. 4. The semiconductor wafer sorting apparatus according to claim 1, wherein a temporary placing device for temporarily placing articles is provided above the delivery device.