JPH1154585A - Article identification device - Google Patents

Abstract

(57) [Summary] [Problem] To control the occupied floor area, tact time, and price. SOLUTION: On one side of a delivery device 21 of a wafer identification device 20, a wafer position detection device 50 for detecting the center of the wafer 1 is provided. The delivery device 21 is configured to match the position of the wafer 1 with the identification code 4 with the reading area 47 of the reading stage 35 of the reading device 40. At the time of reading, the wafer 1 to be identified is transferred to the wafer position detecting device 50 by the transfer device 21, and the center of the wafer 1 of the transfer device 21 is detected. Upon receiving the wafer, the delivery device 21 reads the wafer identification code 4 on the reading stage 35.
Is matched with the reading area 47 of the reading device 40.
At this time, the detection data is used by the wafer position detection device 50. When the identification code 4 matches the reading area 47,
The reading device 40 reads the identification code 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an article identification technique, and more particularly to a technique for identifying an article by reading an identification code attached to the article, and is used, for example, for identifying a semiconductor wafer in a semiconductor manufacturing process. Effective technology.

[0002]

2. Description of the Related Art Generally, in a semiconductor manufacturing process, a plurality of (for example, 25) semiconductor wafers (hereinafter, referred to as "wafers") as works are knitted and handled in one lot. For example, for a product such as a RAM (random access memory) for low-mix high-volume production, there is almost no need to reorganize the lot after the lot organization is performed at the time of wafer line introduction. However, mask ROM (read only memory) and ASIC
For products that require high-mix low-volume production, such as (custom-ordered semiconductor integrated circuit devices), productivity may decrease if the lot organized at the time of wafer line introduction is kept as it is. Occur. Therefore, it is necessary to reorganize the lot after the wafer is charged. Also, in order to manage production information for each wafer due to an increase in added value due to the increase in diameter, one lot is checked for the purpose of confirming each wafer in one lot, rearranging wafers in one lot, and inspecting foreign substances adhering to wafers. It becomes necessary to extract a specified wafer from the inside.

For example, when a lot is formed after a wafer is loaded, a unique mark (hereinafter, referred to as an identification code) is attached to each wafer in advance, the identification code of each wafer is read, and the identification code is read. By using, a desired knitting is performed. Therefore, it is necessary for the wafer lot organization apparatus to include a wafer identification apparatus for reading an identification code of a wafer and identifying each individual wafer.

A conventional wafer identification apparatus of this type includes a reading device for reading an identification code attached to a wafer, and a delivery device for transferring the wafer to a reading stage of the reading device. Is transferred to the reading stage of the reading device by the transfer device, and the position of the identification code is aligned with the reading area of the reading device by the alignment device provided on the reading stage.

Japanese Patent Application Laid-Open No. 4-273115 and Japanese Patent Application Laid-open No.
JP-A-239152 and JP-A-4-260318.

[0006]

However, in the conventional wafer identification device, the transfer device and the reading device are arranged at different places, respectively, and the reading stage is provided with an alignment device. Not only does the occupied floor area increase, but the tact time also increases, and the price of the entire apparatus increases.

An object of the present invention is to provide an article identification device capable of suppressing the occupied floor area, tact time and price.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0009]

The outline of a typical invention among the inventions disclosed in the present application is as follows.

[0010] That is, a reading device that optically reads an identification code attached to an article and a delivery device that transfers the article to a reading stage of the reading device are provided, and the article is read by reading the identification code of each article. In the article identification device for identifying the, an article position detection device that detects the position of the article is arranged on one side of the delivery device, and the delivery device is arranged on a reading stage of the reading device, The apparatus is characterized in that the position where the identification code of the article is attached is matched with the reading area of the reading device based on the detection data of the position of the article by the article position detecting device.

In the above means, the article to be identified is transferred to the article position detecting device by the delivery device, and the position of the article in the delivery device is detected. The object to be identified whose position has been detected is transferred to the reading stage of the reading device by the delivery device. The delivery apparatus that has received the article matches the position where the identification code of the article is attached to the reading area of the reading apparatus on the reading stage where the article is arranged. At this time, the position data of the article detected by the article position detecting device is used. When the identification code matches the reading area, the reading device reads the identification code. When the identification code is read, the delivery device transfers the article from the reading stage to another location and delivers it.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a partially omitted perspective view showing a wafer classification device provided with a wafer identification device according to an embodiment of the present invention. FIG. 2 is a plan view of the same. FIG. 3 et seq. Are explanatory diagrams for explaining the operation of the alignment.

In the present embodiment, the article identification device according to the present invention is configured as a wafer identification device for identifying an individual wafer by reading an identification code unique to each wafer, and is provided in the wafer classification device. . That is, the wafer identification apparatus is configured to sequentially identify individual wafers by reading an identification code given in advance to a wafer as an object to be identified by optical means. Further, the wafer classification device is configured to classify wafers sequentially identified by the wafer identification device as specified in advance.

The wafer 1 is formed in a circular thin plate shape from a semiconductor such as silicon, and a notch 3 is cut in a V-shape in a part of the circumference. A main surface (hereinafter, referred to as a first main surface) 2 of the wafer 1 on which the semiconductor elements are formed.
The identification code 4 for identifying a wafer as an object to be identified is attached to a position on the opposite side of the notch 3 in FIG. The identification code 4 is drawn by numerals and English characters using a method such as an etching method or a laser engraving method. The identification code 4 for identifying each wafer includes a lot code indicating the lot number of the wafer 1 and a wafer code indicating the individual wafer number in the lot.

A plurality of wafers 1 (for example, 25 wafers for one lot) as a work of the wafer sorting apparatus are
It is stored in the cassette 5. That is, the cassette 5 has a large number of holding grooves (hereinafter, referred to as slots) (usually 25 slots).
A plurality of wafers are inserted in the slots, and a plurality of wafers are stored in a regularly aligned state.

The wafer sorting apparatus 11 according to the present embodiment includes a machine base (not shown) formed in a substantially box shape, on which a loading station, an unloading station, and a wafer. An identification device is provided. The loading station 12 and the unloading station 13 are symmetrically arranged on one side (hereinafter referred to as left side) of the machine base. Loading station 12 and unloading station 13 include elevators 14 and 15, respectively, which are controlled by a controller (not shown). The elevators 14 and 15 are configured to raise or lower the cassette 5 mounted thereon one pitch at a time.

The wafer identifying device 20 includes a delivery device 21 for delivering a wafer as an article.
Reference numeral 1 is disposed at the center of the right side portion on the machine base. The delivery device 21 includes an XY table 22, and a rotary actuator 23 is mounted on the XY table 22 in a vertically upward direction. A turning shaft 24 is fixed vertically upward to the output shaft of the rotary actuator 23, and the turning shaft 24 turns 360 degrees or more in a horizontal plane. One end of a horizontally arranged first arm 25 is fixed to the upper end of the turning shaft 24 so as to rotate integrally. One end of a second arm 26 disposed in parallel with the free end of the first arm 25 is rotatably supported by a shaft. The second arm 26 is driven to rotate by a built-in belt transmission device 27. It has become. One end of a horizontally arranged hand 29 is rotatably supported at the other end of the second arm 26, and the hand 29 is driven to rotate by a built-in belt transmission device. .

As shown in FIG. 6, the hand 29 has a mounting block 30 and a main body (hereinafter referred to as a hand main body).
And the hand body 31 is attached to the mounting block 3.
0, the second arm 26 is rotatably attached to the end on the final side. The hand main body 31 is formed of a fork-shaped thin plate having a forked shape in plan view, using industrial sapphire as a transparent material that transmits red LED light that is illumination light of a wafer position detection device described later. The dimension in the longitudinal direction is set to be larger than the radius of the wafer 1, and the dimension in the lateral direction is set to be smaller than the diameter of the wafer 1.

A pair of support projections 32 are provided on the upper surface of the bifurcated tip of the hand main body 31, respectively. In order to reduce the contact area with the wafer 1 as much as possible and to prevent the attachment of foreign matter and metal contamination, the two support projections 32, 32
Is set such that the wafer 1 can be received and supported with a minimum area in a state where the wafer 1 is floated. Vacuum suction ports 33 are respectively opened in both support projections 32, 32, and suction path 3 for supplying a negative pressure to vacuum suction ports 33 is provided in hand body 31 and mounting block 30.
4 have been established. Incidentally, as means for opening the vacuum suction port 33 and the suction path 34 in the industrial sapphire hand body 31, as shown in FIG.
The hand body 31 can be formed by dividing the hand body 31 in the thickness direction and then attaching the hand body 31 at the mating surface.

Above the wafer identification device 20, an identification code reader (hereinafter, referred to as a reader) 40 is installed and supported by a stand (not shown) erected on the right end of the machine base. . That is, the reading device 40 includes a lighting device and a television camera as an image capturing device. The illuminating device 41 is supported vertically downward by the stand, and is configured to illuminate a reading area 47 set on a part of the reading stage 35 of the transfer device 21 with vertical visible light. TV camera 4
Numeral 2 is supported vertically downward by the stand, and is configured to capture the identification code 4 in the reading area 47 on the reading stage 35 illuminated by the illumination device 41.

An identification code recognizing device 43 is electrically connected to the television camera 42. The identification code recognizing device 43 comprises an image processing device and the like.
The configuration is such that the identification code 4 attached to the wafer 1 can be recognized based on the imaging signal from the camera 2. A monitor 44 is connected to the identification code recognizing device 43, and the monitor 44 monitors the shooting situation of the television camera 42. Further, a memory 45 is connected to the identification code recognizing device 43 as recording means for sequentially recording the identification code, and the memory 45 sequentially records the identification code 4 recognized by the identification code recognizing device 43. Is configured. The memory 45 is connected to a data processing device 46 constructed from a computer or the like. The data processing device 46 is configured to generate data for wafer classification by calling data recorded in the memory 45 as needed. Have been. The memory 45 may be provided on the data processing device 46 side.

On one side of the delivery device 21, a wafer position detecting device 50 as an article position detecting device is provided.
The wafer position detection device 50 includes an illumination device (hereinafter, referred to as a back illumination device) 51 for illuminating the wafer 1 from below, and a television camera (hereinafter, referred to as a wafer position detection television camera) 59 for photographing the wafer 1 from above. There are facilities.

As shown in FIG. 7, the backlight unit 51 includes a support plate 52 formed in a rectangular plate shape, and a light source formed on the support plate 52 in a circular plate shape. A printed wiring board 54 provided with a large number of LEDs (light emitting diodes) 53 and a reflector 55 formed in a circular ring shape are arranged concentrically and supported by a plurality of columns 56. The LEDs 53 are of red emission and of high luminance, and are arranged in a ring shape around the circle of the printed wiring board 54 and are installed so as to emit light outward and horizontally in the radial direction.
The upper surface of the reflection plate 55 is inclined so as to reflect the horizontal light emission of the LED 53 in the vertical direction, and a diffusion plate 57 formed in a circular thin plate shape is provided on the upper end side of the reflection plate 55. It is covered so as to entirely cover the group and the printed wiring board 54. Diffuser 57
Is formed of a reflector or the like, and scatters the light reflected from the reflection plate 55 over the entire surface to illuminate the wafer 1 as illumination light 58 from below (back surface).

The television camera 59 for wafer position detection is supported vertically downward by the stand, and is configured to photograph the wafer 1 illuminated by the backlight unit 51. A wafer position recognizing device 60 is electrically connected to the wafer position detecting television camera 59. The wafer position recognizing device 60 includes an image processing device and the like. The circumference and the notch 3 cut in the circumference are configured to be recognized. The monitor 6 is provided on the wafer position recognizing device 60.
1 is connected, and the monitor 61 monitors the shooting state of the television camera 59 for wafer position detection. Further, a memory 62 for temporarily storing the circumference of the wafer 1 and the notch 3 is connected to the wafer position recognizing device 60. (Not shown). The identification code recognition device 43 and the controller use the circumference of the wafer 1 and the position of the notch 3 by calling the data stored in the memory 62 as needed.

Next, the operation of the wafer sorting apparatus according to the above configuration will be described. First, as shown in FIG. 2, an actual cassette 5A containing a plurality of wafers 1 is set on an elevator 14 of a loading station 12, and an actual cassette 5A is stored on an elevator 15 of an unloading station 13. An empty cassette 5 is set. The first arm 25 and the second arm 26 of the transfer device 21 include the rotary actuator 23 and the belt transmission 2.
The hand 29 is inserted into the actual cassette 5A by the extension operation by 7, 28. At this time, the pitch of the elevator 14 of the loading station 12 causes the wafer 1 specified by the controller to face directly above the hand 29. In this state, when the wafer 1 descends,
Since the wafer 1 is vacuum-sucked by the two vacuum suction ports 33, 33 of the hand 29, the wafer 29 is held by the hand 29 under vacuum suction.

As shown in FIG. 2, when the hand 29 holds the wafer 1 by vacuum suction, the hand 29
Center O of a line connecting the pair of vacuum suction ports 33, 33
₂₉ does not always coincide with the center O _{1 of the} wafer 1. That is, the hand 29 on the circumference of the wafer 1
The positional relationship with respect to is unknown. Also, the positional relationship of the notch 3 of the wafer 1 with respect to the hand 29 is unknown. Therefore, in the present embodiment, the position of the wafer 1 is detected by the wafer position detection device 50 with respect to the relationship with the hand 29.

That is, when the wafer 1 is held by vacuum suction by the hand 29, the first arm 2
5 and the second arm 26 are the rotary actuator 2
3, after the wafer 1 is pulled out of the actual cassette 5A by the hand 29 by the shortening operation by the belt transmission devices 27 and 28, as shown in FIG. It is transported directly above. The wafer 1 transferred to the wafer position detection device 50 is illuminated from below by the illumination light 58 of the backlight unit 51 and is photographed from above by a wafer camera 59 for wafer position detection.

At this time, since the hand 29 is formed of sapphire, the LED 5 that emits high-brightness red light is used.
The illumination light 58 composed of red light 3 passes through the hand 29 but does not transmit the wafer 1 composed of silicon. Therefore, the television camera 59 for detecting the wafer position is in a state in which an external image (a so-called shadow picture) of the wafer 1 is photographed. The photographed outer shape image of the wafer 1 is transmitted to the wafer position recognition device 60. Wafer position recognition device 60 recognizes the Notch3 which are circumferentially and Setsu設the circumference of the wafer 1 from the external image of the wafer 1, to recognize the center O ₁ of the wafer 1 from the circumference, previously knows The positional relationship between the center O _{29 of the} hand 29 and the recognized center O ₁ and notch 3 of the wafer 1 is specified.

The hand 2 is operated by the wafer position recognizing device 60.
The positional relationship between the center O ₂₉ and the center O ₁ and notch 3 of the wafer 1 in 9 is specified, the first arm 25 and second arm 26 of the transfer device 21 by the rotary actuator 23 and the belt drive 27, 28 It is moved to a position just above the pivot 24 of the transfer device 21 as shown in FIG. At this time, the positional relationship between the center O ₁ of the center O ₂₉ and the wafer 1 of the hand 29, the center O ₁ of the wafer 1 is matched to the center O ₂₄ of the pivot shaft 24.

The center O _{1 of the} wafer 1 is the center O of the pivot 24
_When the position matches ₂₄ , the outer peripheral edge of the wafer 1 is included in the reading area 47 as the reading position of the reading device 40, as shown in FIG. However, the identification code 4 attached to the wafer 1 is out of the reading area 47. That is, the TV camera 4 of the reading device 40
2, the image of the reading area 47 is in a state where the identification code 4 is not displayed.

Therefore, as shown in FIG. 5, the turning shaft 24 of the delivery device 21 is
By being pivoted in one direction by 3, the wafer 1 is pivoted about the center O _1, the identification code 4 of the wafer 1
Is moved to the reading area 47. That is, the reading device 4
Reading area 4 imaged by the TV camera 42
When the identification code 4 is properly displayed on the image 7, the turning of the turning shaft 24 is stopped. At this time, after the notch 3 of the wafer 1 is recognized by the identification code recognition device 43, the transfer device 21 is controlled so that the rotation code 24 is rotated by 180 degrees so that the identification code 4 of the wafer 1 is arranged in the reading area 47. May be.

With the above operation, the display position of the identification code 4 of the wafer 1 on the reading stage 35 set on the hand 29 matches the reading area 47 of the reading device 40. In this state, the reading device 40 reads the identification code 4 of the wafer 1. That is, the image signal of the identification code 4 captured by the television camera 42 is transmitted to the identification code recognition device 43 and subjected to image processing, and the actual image of the identification code obtained by the image processing is compared with the dictionary image registered in advance. Are identified, the identification code 4 captured by the television camera 42 is read.

The read identification code 4 is recorded in the memory 45 connected to the identification code recognition device 43. Then, the data processing device 46 calls the recorded identification code 4, specifies the position of the slot to be unloaded in the empty cassette 5, and transmits a predetermined command signal to the controller of the transfer device 21. By the way,
Since the image from the television camera 42 can be appropriately displayed on the monitor 44, the operator can monitor the identification code 4 as necessary.

Next, the wafer 1 from which the identification code 4 has been read is transferred to the unloading station 13 by the transfer device 21 and is unloaded into the designated slot of the empty cassette 5.

Now, for example, when the number of the wafer code of the identification code 4 read by the reading device 40 is “NO.
1 ", the unloading station 13
The elevator 15 is fed by one pitch in accordance with a command from the controller of (1), and the first slot in the empty cassette 5 is set to the insertion operation position. Then, when the first slot is set at the insertion operation position, the NO. One wafer 1 is inserted into the first slot.

When the wafer code number of the identification code 4 read by the reading device 40 for the next wafer 1 is "NO.
In the case of "3", the elevator 15 is further fed two pitches by a command of the controller of the unloading station 13, and the third slot in the empty cassette 5 is set to the insertion operation position. Subsequently, the NO. The third wafer 1 is inserted into the third slot.

Further, when the number of the wafer code of the next wafer 1 is “NO. 2”, the elevator 1 is controlled by the instruction of the controller of the unloading station 13.
5 is returned by one pitch, and the empty cassette 5
Is set to the insertion operation position.
Subsequently, the NO. 2
Is inserted into the second slot.

By repeating the above operation, the group of wafers 1 is stored in the empty cassette 5 of the unloading station 13 in the order of the slot number according to the order of each wafer code. In this case, the first slot has a wafer code number. 1 in the second slot, and a wafer code No. in the second slot. The wafer code No. 2 is placed in the N-th slot. This means that n wafers have been inserted. In addition, the orientation of each wafer 1 accommodated in each slot is in the original state.

The identification code reading operation and the wafer classification operation are performed by the above operation. At the same time, based on the data read by the reading device 40, the processing of each wafer and the wafer history are performed in the memory 45. Files can be created.

According to the above embodiment, the following effects can be obtained. (1) By setting the reading stage in the transfer device itself that transfers the wafer to the reading stage of the wafer identification code reading device, and by providing an alignment function for matching the identification code display position of the wafer to the reading area of the reading stage, Since it is not necessary to attach a reading stage and an alignment device separately from the reading device and the transfer device, it is possible to suppress the occupied floor area, the tact time, and the price of the entire wafer identification device.

(2) A first arm that is rotated by a pivot, a second arm that is pivotally supported by the free end of the first arm, and a pivot that is distant from the center of rotation of the second arm. By configuring the delivery device with the hand that is rotated after being rotated, the portion that moves linearly can be omitted, so that the occupied floor area, tact time, and price of the entire wafer identification device can be further suppressed. .

(3) Since the transfer device can recognize the position of the wafer by installing the wafer position detecting device on one side of the transfer device, the display position of the identification code of the wafer can be quickly displayed on the reading area of the reading stage. And can be matched exactly.

(4) Since the identification code of the loaded wafer can be read and unloaded into the wafer cassette, the sorting operation of the wafer group, the sorting operation, the lot organization operation, the wafer extracting operation, and the wafer identification code can be performed. Confirmation work and the like can be performed.

(5) By storing the identification code of the wafer in the memory, it is possible to perform a special operation such as re-dividing and re-synthesizing a lot, and to create the history of each wafer using the identification code as an index. Can be.

FIGS. 8A and 8B show a main part of a wafer identification apparatus according to another embodiment of the present invention, wherein FIG. 8A is a front view, and FIG.
FIG. 3A is a plan view along the line bb in FIG. FIG. 9 is an explanatory diagram for explaining the operation.

The second embodiment is different from the first embodiment in that a linear arm (hereinafter, referred to as a linear arm) 26 is used.
A is that the hand 29 is used for A. That is,
The hand 29 is inserted just below the wafer 1 by the extension operation of the rectilinear arm 26A as the second arm, and holds the wafer 1 by vacuum suction. Then it is further extended working straight arm 26A is supplied to the wafer position detecting device 50, the center O ₁ and notch 3 of the wafer 1 is detected. Thereafter, the center O ₁ of the wafer 1 is aligned with the center O ₂₄ of the pivot shaft 24 by the shortening operation of the rectilinear arm 26A. Thereafter, as in the first embodiment, the rotation of the rotation shaft 24 causes the identification code 4 of the wafer 1 to be aligned with the reading area 47 of the reading device 40, and the identification code 4 is read. The wafer 1 having read the identification code 4 is unloaded to a predetermined position by the turning operation of the turning shaft 24 and the extending operation of the rectilinear arm 26A.

Although the invention made by the inventor has been specifically described based on the embodiment, the invention is not limited to the embodiment, and various changes can be made without departing from the gist of the invention. Needless to say.

For example, the elevators for the loading station and the unloading station in the wafer sorting apparatus may be omitted, and an elevator for the loading operation and the unloading operation may be provided in the transfer device of the wafer identification device.

Further, the loading station and the unloading station in the wafer sorting apparatus may be respectively constituted by a table on which a wafer is placed.
Further, the loading station and the unloading station in the wafer sorter are each one.
The equipment is not limited to be provided one by one, but may be provided two or more each.

The wafer identification device can be used not only for the wafer classification device but also for a lot organization device, a wafer extraction device, a wafer rearranging device, a wafer identification code confirmation device, and the like. The handling of the wafer is not limited.

In the above description, the case where the invention made by the present inventor is mainly applied to the wafer identification technique which is the field of application as the background has been described. However, the present invention is not limited to this. The present invention can be applied to a data storage medium such as a compact disk or the like, and other types of identification technology for articles in general where an identification code is displayed.

[0052]

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

By setting the reading stage in the delivery device itself for transferring the article to the reading stage of the identification code reading apparatus and providing an alignment function for matching the display position of the identification code of the article with the reading area of the reading stage, In addition, since it is not necessary to attach a reading stage and an alignment device separately from the delivery device, it is possible to suppress the occupied floor area, the tact time, and the price of the entire article identification device.

[Brief description of the drawings]

FIG. 1 is a partially omitted perspective view showing a wafer classification device provided with a wafer identification device according to an embodiment of the present invention.

FIG. 2 is a plan view thereof.

3A and 3B show the wafer identification device, wherein FIG. 3A is a front view, and FIG. 3B is a plan view along the line bb in FIG.

FIG. 4 is a diagram for explaining a reading operation;
(A) is a plan view and (b) is a front view.

5A is a plan view, and FIG. 5B is a front view.

6A and 6B show a hand, wherein FIG. 6A is a partially omitted plan view, FIG. 6B is a partially omitted front sectional view, and FIG. 6C is an exploded perspective view of the hand body.

FIGS. 7A and 7B show a backlight device, wherein FIG. 7A is a partially cut plan view, FIG. 7B is a partially cut front view, and FIG. 7C is a side view.

8A and 8B show a main part of a wafer identification apparatus according to another embodiment of the present invention, wherein FIG. 8A is a front view, and FIG. 8B is a plan view along line bb of FIG.

FIGS. 9A and 9B are diagrams for explaining a reading operation, wherein FIG. 9A is a front view, and FIG. 9B is a plan view along the line bb in FIG. 9A.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Wafer (article), 2 ... 1st main surface, 3 ... Notch, 4 ...
Identification code, 5 ... cassette, 5A ... real cassette, 11 ...
Wafer sorter, 12 ... Loading station, 1
3 ... Unloading station, 14, 15 ... Elevator, 20 ... Wafer identification device (article identification device), 21
... Transfer device, 22 ... XY table, 23 ... Rotary actuator, 24 ... Rotating axis, 25 ... First arm, 2
6 ... second arm, 27, 28 ... belt transmission, 29 ...
Hand, 30: mounting block, 31: hand body, 32
... Supporting projection, 33. Vacuum suction port, 34. Suction path, 35.
Reading stage, 40: identification code reader, 41: illumination device, 42: television camera, 43: identification code recognition device, 44: monitor, 45: memory, 46: data processing device, 47: reading area, 50: wafer position Detecting device (article position detecting device), 51: backlighting device, 52: support plate, 53: LED, 54: printed wiring board, 55:
Reflecting plate, 56 ... pillar, 57 ... diffusion plate, 58 ... illumination light, 5
9: TV camera for wafer position detection, 60: Wafer position recognition device, 61: Monitor, 62: Memory, 26A: Straight arm.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Seigo Nakamura 3-3-2 Fujibashi, Ome-shi, Tokyo Within Hitachi Tokyo Electronics Co., Ltd. (72) Inventor Yasuyuki Meguro 3-2-2 Fujibashi, Ome-shi, Tokyo Hitachi East Within Hitachi Electronics Co., Ltd. (72) Inventor Hajime Noda 3-3-2 Fujibashi, Ome-shi, Tokyo Hitachi-Tokyo Electronics Corporation

Claims (10)

[Claims] 1. An apparatus comprising: a reading device for optically reading an identification code attached to an article; and a delivery device for transferring the article to a reading stage of the reading apparatus, wherein the article is read by reading the identification code of each article. In an article identification device for identifying, an article position detection device that detects the position of the article is provided on one side of the delivery device, and the delivery device is arranged on a reading stage of the reading device, An article identification apparatus characterized in that a position to which an identification code of an article is attached is matched with a reading area of the reading apparatus based on detection data of an article position by the article position detection apparatus. 2. The article identification device according to claim 1, wherein the article position detection device includes an illumination device for illuminating the article from the back side, and an imaging apparatus for imaging the article from the front side. apparatus. 3. The backlight unit according to claim 2, further comprising: a light source that emits light outward in a radiation direction; and a reflector that reflects light from the light source toward the article. An article identification device according to claim 1. 4. The article identification device according to claim 3, wherein the light source is configured by arranging a plurality of light emitting diodes on a circumference. 5. The article identification device according to claim 3, wherein a diffuser for diffusing the reflected light over the entire surface is provided on an end of the reflector near the article. 6. The apparatus according to claim 2, wherein said imaging device is configured to image an article illuminated by said lighting device and recognize a position of the article from an outer shape of the article. Or the article identification device according to 5. 7. The delivery device, wherein the first arm is pivoted by a pivot, the second arm is pivotally supported by a free end of the first arm, and is separated from a rotation center of the second arm. The article identification device according to claim 2, further comprising: a hand rotatably supported at a position, wherein the hand is formed of a transparent material. 8. A delivery device, comprising: a first arm pivoted by a pivot, a second arm slidably supported by the first arm and reciprocated, and a hand supported by the second arm. And the hand is formed of a transparent material.
7. The article identification device according to 5 or 6. 9. The article identification device according to claim 7, wherein the hand is formed of industrial sapphire. 10. The hand is formed in a bifurcated fork-like thin plate shape, and a pair of supporting projections are respectively protruded from an upper surface of a tip portion of the bifurcation. , 8 or 9.