JPH098077A - Wire bonding equipment - Google Patents

Abstract

(57) [Abstract] [PROBLEMS] To provide a wire cut clamper mechanism section having a structure that can always obtain a predetermined gripping force and can effectively use the entire holding surface of a clamp member. A shape of a clamping surface of a clamp member that clamps a bonding wire of a wire cut clamper that constitutes a wire bonding apparatus used in a wire bonding step of a semiconductor device assembling step is defined by a direction of a portion where the bonding wire is clamped. A shape having a peripheral portion with a constant distance along With this configuration, the gripping force when the clamp member cuts the bonding wire is always kept constant, and the bonding wire can be cut at a predetermined portion. Further, when the holding portion of the clamp member is worn out, the life of the clamp member can be extended by horizontally shifting the clamp member.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding apparatus, and more particularly to a wire cut clamper mechanism section in a wire bonding apparatus used in a wire bonding process of a semiconductor device.

[0002]

2. Description of the Related Art In a semiconductor device, a typical method of connecting a pad portion on a pellet and an inner lead of a lead frame for supplying a power source or an electric signal to an integrated circuit formed on a semiconductor pellet. One of the most popular is wire bonding.

There are various causes for the failure of the semiconductor device. Of these, a large proportion is caused by a defective connection portion, and a failure due to a defective bonding is not insignificant. In a highly integrated semiconductor device, most of the manufacturing cost is spent until the bonding process,
If the product is defective in the bonding process, the loss is large, and the bonding requires high reliability.

The wire-cut clamper mechanism for holding and cutting the wire in the wire-bonding apparatus which has been conventionally used in the wire-bonding process will be described below.

FIG. 4 is an explanatory view of the structure of a conventional wire cut clamper mechanism section, and FIG. 5 is a perspective view of the conventional wire cut clamper mechanism section. In the wire cut clamper mechanism portion of FIGS. 4 and 5, two round-shaped clamp members 13 formed of a material such as cermet composed of ceramic and titanium are provided, and a clamping surface of one clamp member and the other clamp member are provided. Of the leaf spring 2 and the back plate 6, respectively. The leaf spring 2 is attached to the tip of the holder 7 with silver paste, and the back plate 6 is attached to the fulcrum block 4 with the leaf spring 2 sandwiched between the leaf plate 2 and the tip of the holder 7. A tension coil spring 3 is inserted and provided in the through hole of the leaf spring 2, and both ends of the tension coil spring 3 are attached to the tip end portion of the holder 7 and the through hole of the back plate 6 with a clasp. FIG. 6 is a perspective view of only the fulcrum block 4, which includes a fulcrum block body 4a, a bearing 4b, and an E-shaped retaining ring 4c. The fulcrum block 4 to which the back plate 6 is attached is rotatably attached to the holder 7 by a pillar,
By connecting / disconnecting the power supply to the solenoid 5, the two round clamp members 13 are opened / closed.
The end portion of the holder 7 is fixed to the body of the wire bonding device.

FIG. 7 is an explanatory view of wire bonding using a conventional wire cut clamper mechanism section. Figure 7
(A) shows the case where wire bonding is normally performed. The gold wire 9 passed through the through hole of the capillary 8 is pressure-bonded to the pad portion of the semiconductor pellet 10 placed on the island 11 by nail head bonding, and is also pressure-bonded to the inner lead 12.

After that, when the capillary 8 rises to a predetermined position, the round clamp member 13 closes and rises together with the capillary 8, and the gold wire 9 is cut off from the crimped portion with the inner lead 12, The wire cutting work is completed.

[0008]

However, since the conventional clamp member 13 has a round shape, the clamp member 13 is formed.
The maximum gripping force is applied to the gold wire 9 only when the gold wire 9 is sandwiched at a position including the center of the sandwiching surface (hereinafter, referred to as “center position”). Therefore, when sandwiched at a position that is slightly deviated from the center position during high-speed operation, a predetermined gripping force cannot be obtained, and the length from the tip of the capillary 8 to the cut portion of the gold wire 9 (hereinafter, referred to as "tail" There is a variation in L (tail length L ′ in FIG. 7B). Also, when one of the two clamp members provided so that the sandwiching surfaces face each other deviates from a predetermined position and their center positions do not face each other, the tail length L also varies.

Further, since the predetermined position where the clamp member 13 sandwiches the gold wire 9 is limited to only the central position, the clamping surface of the clamp member 13 cannot be used in any part other than the part including the central position, and the fixed position is maintained. Wears quickly and has a short service life.

The present invention has been made in view of the above problems, and an object thereof is to obtain a predetermined gripping force and to effectively use the entire holding surface of the clamp member 13 as a wire cut clamper mechanism. Is to provide the department.

[0011]

According to the present invention, a wire bonding apparatus having a holding mechanism for sandwiching the bonding wire between the opposing surfaces of the two clamp members when cutting the bonding wire used for connecting the semiconductor device. In the above, each clamp member is characterized by having a peripheral portion in which the distance of the sandwiching portion of the sandwiching surface along the bonding wire is constant.

In a wire bonding apparatus having a holding mechanism for sandwiching a bonding wire between opposing surfaces of two clamp members when cutting a bonding wire used for connecting a semiconductor device, each clamp member has a bonding wire on its sandwiching surface. Is characterized by having at least one set of two sides with a constant distance of the sandwiched portion along.

In a wire bonding apparatus having a holding mechanism for holding the bonding wire between the opposing surfaces of the two clamp members when cutting the bonding wire used for connecting the semiconductor device, each clamp member has a bonding wire on the holding surface. Characterized in that it has at least one set of two sides which are parallel to each other and which intersect the sandwiching portion along.

In a wire bonding apparatus having a holding mechanism for holding the bonding wire between the opposing surfaces of the two clamp members when cutting the bonding wire used for connecting the semiconductor device, each clamp member has a bonding wire on its holding surface. 1 orthogonal to the sandwiched part along
It is characterized by having two parallel sides of a set.

It is preferable that the holding surface has a substantially trapezoidal shape.

It is preferable that the holding surface has a substantially rectangular shape.

It is preferable that the holding surface has a substantially square shape.

It is preferable that the holding mechanism includes an adjusting mechanism that is movable in the vertical direction with respect to the bonding wire while maintaining the holding surfaces on the same plane.

It is preferable that the holding mechanism includes an adjusting mechanism that can move in the horizontal direction while maintaining the sandwiching surfaces on the same plane.

[0020]

Since each clamp member has a peripheral portion where the distance of the sandwiching portion of the sandwiching surface along the bonding wire is constant, even if the clamp member shifts in the horizontal direction, it is sandwiched by the clamping member of the bonding wire. The length of the part to be held is always constant, the clamping force when the clamp member cuts the bonding wire is always maintained constant,
The bonding wire can be cut at a predetermined portion. In addition, even if one of the two clamp members provided so that the sandwiching surfaces face each other is displaced from the predetermined position and their center positions do not face each other, the tail length should always be constant. You can Further, when the holding part of the clamp member is worn out, the holding part of the clamp member can be shifted in the horizontal direction to extend the life of the clamp member.

Since each clamp member has at least one set of two sides where the distance of the sandwiching portion of the sandwiching surface along the bonding wire is constant, even if the clamp member is displaced in the horizontal direction, the bonding wire The length of the portion clamped by the clamp member is always constant, the holding force when the clamp member cuts the bonding wire is always kept constant, and the bonding wire can be cut at a predetermined portion. In addition, even if one of the two clamp members provided so that the sandwiching surfaces face each other is displaced from the predetermined position and their center positions do not face each other, the tail length should always be constant. You can
Further, when the holding part of the clamp member is worn out, the holding part of the clamp member can be shifted in the horizontal direction to extend the life of the clamp member.

Since each clamp member has at least one set of two parallel sides which intersect the sandwiching portion of the sandwiching surface along the bonding wire, even if the clamp member is displaced in the horizontal direction, The length of the portion clamped by the clamp member is always constant, the holding force when the clamp member cuts the bonding wire is always kept constant, and the bonding wire can be cut at a predetermined portion. In addition, even if one of the two clamp members provided so that the sandwiching surfaces face each other is displaced from the predetermined position and their center positions do not face each other, the tail length should always be constant. You can Further, when the holding part of the clamp member is worn out, the holding part of the clamp member can be shifted in the horizontal direction to extend the life of the clamp member.

Since each clamp member has a set of two parallel sides orthogonal to the sandwiching portion of the sandwiching surface along the bonding wire, even if the clamp member is displaced in the horizontal direction, the clamp of the bonding wire is performed. The length of the portion sandwiched by the members is always constant, the gripping force when the clamp member cuts the bonding wire is always maintained constant, and the bonding wire can be cut at a predetermined portion. In addition, even when one of the two clamp members provided so that the sandwiching surfaces face each other is displaced from the predetermined position and their center positions do not face each other,
Similarly, the tail length can always be constant. Furthermore, when the holding part of the clamp member is worn,
By horizontally shifting the holding portion of the clamp member, the life of the clamp member can be extended.

Since the shape of the sandwiching surface is substantially trapezoidal, even if the clamp member is displaced in the horizontal direction, the length of the portion of the bonding wire sandwiched by the clamp member is always constant, and the clamp member is bonded. The gripping force at the time of cutting the wire is always kept constant, and the bonding wire can be cut at a predetermined portion. In addition, even if one of the two clamp members provided so that the sandwiching surfaces face each other is displaced from the predetermined position and their center positions do not face each other, the tail length should always be constant. You can Further, when the holding part of the clamp member is worn out, the holding part of the clamp member can be shifted in the horizontal direction to extend the life of the clamp member.

Since the shape of the holding surface is substantially rectangular, even if the clamp member is displaced in the horizontal direction, the length of the portion of the bonding wire held by the clamp member is always constant, and the clamp member is bonded. The gripping force at the time of cutting the wire is always kept constant, and the bonding wire can be cut at a predetermined portion. In addition, even if one of the two clamp members provided so that the sandwiching surfaces face each other is displaced from the predetermined position and their center positions do not face each other, the tail length should always be constant. You can Further, when the holding part of the clamp member is worn out, the holding part of the clamp member can be shifted in the horizontal direction to extend the life of the clamp member.

Since the shape of the sandwiching surface is substantially square, even if the clamp member is displaced in the horizontal direction, the length of the portion of the bonding wire sandwiched by the clamp member is always constant, and the clamp member is bonded. The gripping force at the time of cutting the wire is always kept constant, and the bonding wire can be cut at a predetermined portion. In addition, even if one of the two clamp members provided so that the sandwiching surfaces face each other is displaced from the predetermined position and their center positions do not face each other, the tail length should always be constant. You can Further, when the holding part of the clamp member is worn out, the holding part of the clamp member can be shifted in the horizontal direction to extend the life of the clamp member.

Since the holding mechanism is provided with an adjusting mechanism which is movable in the vertical direction with respect to the bonding wire while keeping each holding surface on the same plane, when the holding portion of the clamp member is worn out. The life of the clamp member can be extended by horizontally shifting the holding portion of the clamp member.

Since the holding mechanism is provided with an adjusting mechanism that is movable in the direction connecting the front end portion and the end portion of the holding mechanism with respect to the bonding wire, when the holding portion of the clamp member is worn, the clamp mechanism is used. By horizontally shifting the holding portion of the member, the life of the clamp member can be extended.

Since the holding mechanism is provided with an adjusting mechanism capable of moving in the horizontal direction while keeping the holding surfaces on the same plane, when the holding portion of the clamp member is worn out, The life of the clamp member can be extended by shifting the holding portion in the horizontal direction.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described below with reference to the drawings.

FIG. 1 is an explanatory view of the structure of a wire cut clamper mechanism section according to one embodiment of the present invention, and FIG. 2 is a perspective view of the wire cut clamper mechanism section according to one embodiment of the present invention. In the wire cut clamper mechanism portion shown in FIGS. 1 and 2, two rectangular clamp members 1 formed of a material such as cermet made of ceramic and titanium are used. Of the leaf spring 2 and the back plate 6, respectively. The leaf spring 2 is attached to the tip of the holder 7 with silver paste, and the back plate 6 is attached to the fulcrum block 4 with the leaf spring 2 sandwiched between the leaf plate 2 and the tip of the holder 7. A tension coil spring 3 is inserted and provided in the through hole of the leaf spring 2, and both ends of the tension coil spring 3 are attached to the tip end portion of the holder 7 and the through hole of the back plate 6 with a clasp.
The fulcrum block 4 is the same as that shown in FIG. 6, and the fulcrum block 4 to which the back plate 6 is attached is rotatably pivotally attached to the holder 7 by a column to supply power to the solenoid 5. By connecting / disconnecting, the two rectangular clamp members 1 are opened / closed. Although the end portion of the holder 7 is fixed to the body of the wire bonding apparatus, the holder 7
The end portion of the holder is provided with a through hole that is not a round hole but a long hole so that the entire holder 7 can be moved in the horizontal direction.

FIG. 3 is an explanatory view of wire bonding using a wire cut clamper mechanism section according to an embodiment of the present invention. FIG. 3A shows the operation of the wire cut clamper mechanism section during wire bonding. The gold wire 9 passed through the through hole of the capillary 8 is pressure-bonded to the pad portion of the semiconductor pellet 10 placed on the island 11 by nail head bonding, and is also pressure-bonded to the inner lead 12.

After that, when the capillary 8 rises to a predetermined position, the rectangular clamp member 1 is closed and the capillary 8 is closed.
Along with this, the gold wire 9 is cut, and the wire cutting work is completed.

In the wire cut clamper mechanism section according to the embodiment of the present invention, since the shape of the clamp member is substantially rectangular, as shown in FIG. Even if the center position is displaced in the horizontal direction, the length of the portion of the bonding wire that is clamped by the clamp member is always constant, and the clamping force when the clamp member cuts the bonding wire is always maintained constant. Therefore, the bonding wire can be cut at a predetermined portion, and the tail length L from the tip portion of the capillary 8 to the cut portion of the gold wire 9 can be always constant. In addition, even when one of the two clamp members provided so that the sandwiching surfaces face each other is displaced from the predetermined position and their center positions do not face each other,
Similarly, the tail length L can always be constant. Furthermore, when the holding part of the clamp member is worn,
By horizontally shifting the holding portion of the clamp member, the life of the clamp member can be extended.

The shape of the clamp member may be substantially trapezoidal or substantially square so that the length of the portion of the bonding wire held by the clamp member is always constant. Or
A shape having a pair of mutually parallel two sides orthogonal to the direction of the sandwiched portion of the bonding wire, a shape having at least one pair of mutually parallel two sides intersecting the sandwiched portion of the bonding wire, Either a shape having at least one pair of two sides having a constant distance along the direction of the sandwiched portion or a shape having a peripheral portion having a constant distance along the direction of the sandwiched portion of the bonding wire. However, the same effect can be obtained.

[0036]

As described above, according to the present invention,
Since each clamp member has a peripheral portion in which the distance of the sandwiching portion of the sandwiching surface along the bonding wire is constant, the bonding wire can be cut at a predetermined portion even if the clamp member is displaced in the horizontal direction. You can In addition, even if one of the two clamp members provided so that the sandwiching surfaces face each other is displaced from the predetermined position and their center positions do not face each other, the tail length should always be constant. You can Further, when the holding part of the clamp member is worn out, the holding part of the clamp member can be shifted in the horizontal direction to extend the life of the clamp member.

Since each clamp member has at least one set of two sides where the distance of the sandwiching portion of the sandwiching surface along the bonding wire is constant, even if the clamp member is displaced in the horizontal direction, the bonding wire is not removed. It can be cut at a predetermined site. In addition, even if one of the two clamp members provided so that the sandwiching surfaces face each other is displaced from the predetermined position and their center positions do not face each other, the tail length should always be constant. You can Further, when the holding part of the clamp member is worn out, the holding part of the clamp member can be shifted in the horizontal direction to extend the life of the clamp member.

Since each clamp member has at least one set of two parallel sides that intersect the sandwiching portion of the sandwiching surface along the bonding wire, even if the clamp member is displaced in the horizontal direction, the bonding wire can be removed. It can be cut at a predetermined site. In addition, even if one of the two clamp members provided so that the sandwiching surfaces face each other is displaced from the predetermined position and their center positions do not face each other, the tail length should always be constant. You can Further, when the holding part of the clamp member is worn out, the holding part of the clamp member can be shifted in the horizontal direction to extend the life of the clamp member.

Since each clamp member has a pair of two parallel sides orthogonal to the sandwiching portion of the sandwiching surface along the bonding wire, even if the clamp member is displaced in the horizontal direction, the bonding wire is fixed. Can be cut at the site. In addition, even if one of the two clamp members provided so that the sandwiching surfaces face each other is displaced from the predetermined position and their center positions do not face each other, the tail length should always be constant. You can Further, when the holding part of the clamp member is worn out, the holding part of the clamp member can be shifted in the horizontal direction to extend the life of the clamp member.

Since the holding surface has a substantially trapezoidal shape, the bonding wire can be cut at a predetermined portion even if the clamp member is displaced in the horizontal direction. Also,
Even if one of the two clamp members provided so that the sandwiching surfaces face each other is displaced from the predetermined position and the center positions of the two clamp members do not face each other, the tail length can always be constant. . Further, when the holding part of the clamp member is worn out, the holding part of the clamp member can be shifted in the horizontal direction to extend the life of the clamp member.

Since the sandwiching surface has a substantially rectangular shape, the bonding wire can be cut at a predetermined portion even if the clamp member is displaced in the horizontal direction. In addition, even if one of the two clamp members provided so that the sandwiching surfaces face each other is displaced from the predetermined position and their center positions do not face each other, the tail length should always be constant. You can Further, when the holding part of the clamp member is worn out, the holding part of the clamp member can be shifted in the horizontal direction to extend the life of the clamp member.

Since the holding surface has a substantially square shape, the bonding wire can be cut at a predetermined portion even if the clamp member is displaced in the horizontal direction. In addition, even if one of the two clamp members provided so that the sandwiching surfaces face each other is displaced from the predetermined position and their center positions do not face each other, the tail length should always be constant. You can Further, when the holding part of the clamp member is worn out, the holding part of the clamp member can be shifted in the horizontal direction to extend the life of the clamp member.

Since the holding mechanism is provided with an adjusting mechanism which can move in the vertical direction with respect to the bonding wire while maintaining the respective clamping surfaces on the same plane, when the clamping portion of the clamp member is worn out. The life of the clamp member can be extended by horizontally shifting the holding portion of the clamp member.

Since the holding mechanism is provided with an adjusting mechanism that can move in the horizontal direction while maintaining the holding surfaces on the same plane, when the holding portion of the clamp member is worn out, The life of the clamp member can be extended by shifting the holding portion in the horizontal direction.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a structure of a wire cut clamper mechanism portion of a wire bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a wire cut clamper mechanism portion of the wire bonding apparatus according to the embodiment of the present invention.

FIG. 3 is an explanatory diagram of wire bonding using a wire cut clamper mechanism unit according to an embodiment of the present invention.

FIG. 4 is an explanatory view of a structure of a conventional wire cut clamper mechanism section.

FIG. 5 is a perspective view of a conventional wire cut clamper mechanism section.

FIG. 6 is a configuration diagram of parts of a fulcrum block 4.

FIG. 7 is an explanatory diagram of wire bonding using a conventional wire cut clamper mechanism unit.

[Explanation of symbols]

 1 Clamp member according to the present invention 2 Leaf spring 3 Tension coil spring 4 Support point block 5 Solenoid 6 Back plate 7 Holder 8 Capillary 9 Gold wire 10 Semiconductor pellet 11 Island 12 Inner lead 13 Conventional clamp member

Claims (9)

[Claims] 1. A wire bonding apparatus having a holding mechanism for holding the bonding wire between opposing surfaces of two clamp members when cutting a bonding wire used for connecting a semiconductor device, wherein each clamp member holds the holding wire. A wire bonding apparatus having a peripheral portion in which a distance of a sandwiching portion along a bonding wire of the surface is constant. 2. A wire bonding apparatus having a holding mechanism for holding the bonding wire between opposing surfaces of two clamp members when cutting a bonding wire used for connecting a semiconductor device, wherein each clamp member holds the holding wire. A wire bonding apparatus having at least one set of two sides in which a distance of a sandwiching portion along a bonding wire of a surface is constant. 3. A wire bonding apparatus having a holding mechanism for holding the bonding wire between opposing surfaces of two clamp members when cutting a bonding wire used for connecting a semiconductor device, wherein each clamp member holds the holding wire. A wire bonding apparatus having at least one set of two parallel sides intersecting a sandwiching portion along a bonding wire of the surface. 4. A wire bonding apparatus having a holding mechanism for holding the bonding wire between opposing surfaces of two clamp members when cutting a bonding wire used for connecting a semiconductor device, wherein each clamp member holds the holding wire. A wire bonding apparatus having a set of two parallel sides orthogonal to a sandwiching portion along a bonding wire of the surface. 5. The wire bonding apparatus according to claim 1, wherein the sandwiching surface has a substantially trapezoidal shape. 6. The wire bonding apparatus according to claim 1, wherein the holding surface has a substantially rectangular shape. 7. The wire bonding apparatus according to claim 1, wherein the sandwiching surface has a substantially square shape. 8. The wire bonding apparatus according to claim 1, wherein the holding mechanism is movable in a vertical direction with respect to the bonding wire while maintaining the holding surfaces on the same plane. A wire bonding apparatus, which is equipped with various adjustment mechanisms. 9. The wire bonding apparatus according to claim 1, wherein the holding mechanism includes an adjusting mechanism that can move in the horizontal direction while maintaining the sandwiching surfaces on the same plane. A wire bonding apparatus characterized by being a thing.