JPH10200022A - Heatsink of semiconductor heating element - Google Patents

Abstract

(57) [Problem] To provide a heat radiator of a semiconductor heating element which is small and lightweight, has an appropriate heat radiation effect, and is inexpensive. SOLUTION: A semiconductor heating element mounting plate, a heat radiating part,
Are formed individually, and these are later bonded to form a configuration. Further, the heat radiating portion was constituted by a plurality of thin plate members which are in surface contact with the semiconductor heating element mounting plate. In addition, a configuration is adopted in which the bonding between the semiconductor heat generating element mounting plate and the heat radiating portion is performed by any of caulking, bonding, welding, ultrasonic bonding, or a combination thereof. In addition, a configuration is adopted in which any one of a cut-and-raised portion, a protruding portion, and an extruded portion or a combination thereof is provided on a thin plate material constituting the heat radiating portion. In addition, a configuration is adopted in which the heat radiation surface of the thin plate near the mounting position of the semiconductor heating element is made wider or the number of thin plates near the mounting position of the semiconductor heating element is increased. In addition, a configuration is adopted in which a radiator mounting terminal is provided on a part of the thin plate material constituting the heat radiator.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a radiator for a semiconductor heating element on a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, a semiconductor heating element used for a power supply on a printed circuit board in various electric devices, horizontal / vertical deflection, audio, video, etc. has been made of an aluminum material generally called a heat sink. An extruded product or a radiator processed from an aluminum plate material is attached by fixing means such as screws, springs, or adhesives to prevent the temperature of the semiconductor heating element from rising and prevent thermal runaway or thermal destruction. Was taken.

However, since the conventional radiator as described above is integrally formed, the size and the weight of the radiator are increased, and when the radiator is mounted on a printed circuit board, the printed circuit board may be warped or bent. Then, when installing the radiator,
It was extremely inconvenient. In addition, when mounting the radiator on the printed circuit board, to protect the product from falling, vibration, etc.
It is necessary to attach terminals etc. to the radiator and solder them firmly to the printed circuit board. Also, in response to changes in power consumption of semiconductor heating elements, that is, changes in heating temperature,
It is necessary to reduce the temperature rise by changing the volume of the radiator, but for large radiators with large volumes, not only the soldering pattern of the printed circuit board and the soldering of the radiator terminals, but also It has been necessary to attach it by soldering after performing eyelet or plating. Also, if a large radiator is attached, it is difficult to carry out the work during circuit adjustment and inspection, which increases the number of work steps and further increases the cost.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has a small size, light weight, an appropriate heat radiation effect, and a low-cost radiator of a semiconductor heating element. The purpose is to provide.

[0005]

In order to achieve the above object, according to the first aspect of the present invention, a semiconductor heat generating element mounting plate and a heat radiating portion are separately formed, and these are later joined together. Take the formed configuration.

With such a configuration, the heat radiator can be separately formed into the semiconductor heat generating element mounting plate and the heat radiating portion. Therefore, the area of the thin plate material forming the heat radiating portion by the heat generation temperature of the semiconductor heat generating element can be reduced. Sheet thickness, number of sheets used, fin spacing,
By changing the shape or the like, a heat radiation temperature suitable for the semiconductor heating element to be used can be set, and efficient heat radiation can be performed. Further, since the manufacture of the radiator is easier than in the case of the integral formation, the radiator can be reduced in size, and the cost can be reduced from 1/2 to 1/3 as compared with the conventional case.

According to a second aspect of the present invention, in the radiator of the semiconductor heat generating element according to the first aspect, the heat radiating portion is constituted by a plurality of thin plate members which are in surface contact with the semiconductor heat generating element mounting plate.

[0008] With such a configuration, the contact area between the semiconductor heating element mounting plate and the thin plate material can be increased, so that the thermal conductivity is increased and the heat generation of the semiconductor heating element can be effectively suppressed. Further, since the contact area is large, it is possible to easily attach the semiconductor heating element mounting plate to the thin plate material by caulking or the like. Further, the plurality of thin plate members constituting the heat radiating unit are each independently deformed, and further,
Since the contact area with the air and the convection of the air can be adjusted by changing the interval between the fins, the heat radiation effect can be enhanced. In addition, the surface area of the thin plate material can be appropriately increased or decreased in the vertical and horizontal dimensions as needed, and the number of sheets to be used can be increased or decreased. Therefore, a heat radiation temperature suitable for the semiconductor heating element to be used should be set. Can also be
The area occupied by the radiator on the printed circuit board can be controlled.

According to a third aspect of the present invention, in the radiator of the semiconductor heating element according to the first or second aspect, the heat radiating portion is formed of a thin plate member having a U-shaped cross section.

[0010] With such a configuration, the contact area between the semiconductor heating element mounting plate and the thin plate material can be increased, so that the thermal conductivity is increased and the heat generation of the semiconductor heating element can be effectively suppressed. Further, since the contact area is large, it is possible to easily attach the semiconductor heating element mounting plate to the thin plate material by caulking or the like. Furthermore, since a thin plate material can be easily formed, mass production is possible, the number of work steps is reduced, and the cost can be reduced.

According to a fourth aspect of the present invention, in the radiator of the semiconductor heating element according to any one of the first to third aspects, the joining of the semiconductor heating element mounting plate and the heat radiating portion is performed by caulking, bonding, and welding. , Ultrasonic bonding, or a combination thereof.

With such a configuration, the heat conductivity can be increased as compared with other joining methods, so that the heat generated by the semiconductor heating element can be more effectively radiated. In addition, since the joining operation is facilitated, mass production of the radiator becomes possible, and the cost can be reduced.

According to a fifth aspect of the present invention, in the radiator of the semiconductor heating element according to the first to fourth aspects, the radiator is located at a position between the radiator and another electronic component adjacent on the printed circuit board. It was composed of a thin plate formed in a shape according to the relationship.

With such a configuration, the radiator can be formed on the printed circuit board on which the radiator is installed in consideration of the positional relationship with other adjacent electronic components. The space taken can be controlled, and the positional relationship with other electronic components can be determined efficiently.

According to a sixth aspect of the present invention, in the radiator of the semiconductor heat generating element according to any one of the first to fifth aspects, any one of a cut-and-raised portion, a protruding portion, and an extruded portion is formed on the thin plate material constituting the radiating portion. Alternatively, a configuration in which these are combined is adopted.

With such a configuration, a surface area several times larger than that of the conventional radiator can be secured, and the weight of the radiator does not increase. Excellent heat sink can be provided.
In addition, since it is not necessary to take measures such as strengthening the attachment of the radiator to the printed circuit board, the number of work steps is reduced, and the cost can be reduced.

According to a seventh aspect of the present invention, in the radiator of the semiconductor heat generating element according to any one of the first to sixth aspects, the heat radiating surface of the thin plate near the mounting position of the semiconductor heat generating element is made wider, or A configuration is adopted in which the number of thin plates near the mounting position of the semiconductor heating element is increased.

With such a configuration, the heat radiation effect is further enhanced, so that the heat generation of the semiconductor heating element can be effectively suppressed.

According to a ninth aspect of the present invention, in the radiator of the semiconductor heating element according to the first to seventh aspects, the radiating portion is formed of a thin plate having a different length or width.

With such a configuration, the position at which the semiconductor heating element is mounted on the radiator can be freely determined according to the size of the semiconductor heating element, the positional relationship with other adjacent electronic components on the printed circuit board, and the like. it can. In addition, the thickness of the thin plate material constituting the heat radiating portion can be increased according to the amount of heat generated by the semiconductor heat generating element, and the interval between the heat radiating fins can be narrowed. Can be.

According to a ninth aspect of the present invention, in the radiator of the semiconductor heat generating element according to the first to eighth aspects, a radiator mounting terminal is provided on a part of the thin plate material constituting the radiator. Take.

With such a configuration, the radiator can be easily mounted on the printed circuit board, so that the mounting accuracy of the radiator can be improved and the mounting operation can be easily performed.

According to a tenth aspect of the present invention, there is provided a method of suppressing heat generation of a semiconductor heating element by attaching a radiator of the semiconductor heating element according to the first to ninth aspects to the semiconductor heating element.

According to such a method, it is possible to more effectively dissipate heat from the semiconductor heating element as compared with the related art. Further, since the radiator of the semiconductor heating element according to the first to ninth aspects is small and lightweight, when the radiator is mounted on a printed circuit board, the printed circuit board does not warp or bend, and strong soldering is performed. It is not necessary, and inconveniences such as an increase in the number of work steps and an increase in cost can be avoided.

The invention according to claim 11 employs a configuration in which the printed circuit board has a semiconductor heating element and a radiator of the semiconductor heating element according to claims 1 to 9.

With this configuration, it is possible to more effectively dissipate heat from the semiconductor heating element as compared with the related art. Further, since the radiator of the semiconductor heating element according to the first to ninth aspects is small and lightweight, when the radiator is mounted on a printed circuit board, the printed circuit board does not warp or bend, and strong soldering is performed. It is not necessary, and inconveniences such as an increase in the number of work steps and an increase in cost can be avoided.

The twelfth aspect of the present invention employs a method of simultaneously fitting a radiator mounting terminal and a lead leg of a semiconductor heating element to a radiator mounting portion provided on a printed circuit board.

According to such a method, the radiator mounting terminal and the lead leg of the semiconductor heating element can be simultaneously mounted on the printed circuit board, so that the mounting accuracy of the radiator can be improved and the mounting work can be performed. Can also be easily performed.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described more specifically with reference to FIGS.

(Embodiment 1) FIG. 1 is a perspective view showing Embodiment 1 of a radiator of a semiconductor heating element according to the present invention. In FIG. 1, a radiator 1 for a semiconductor heating element according to the present invention includes a semiconductor heating element mounting plate 2 and a radiating section 3.
The heat radiating section 3 includes a plurality of thin plate members 4 for suppressing a temperature rise of the semiconductor heating element. Further, the semiconductor heating element mounting plate 2 and the thin plate member 4 are joined by caulking. This is because caulking enhances the thermal conductivity, and the joining operation is easy and reliable.
Similar effects can be obtained by using bonding means such as bonding, welding, ultrasonic bonding, or a combination of these other than caulking. In FIG. 1, S indicates a caulking hole.

The heat radiating section 3 is formed by using a plurality of thin plate members 4 each having a U-shaped cross section. By making the cross section of the thin plate member 4 into a U-shape, the thin plate member 4 can be brought into surface contact with the semiconductor heating element mounting plate.
Thermal conductivity is increased, and efficient heat radiation can be performed. Also, the work of joining the semiconductor heating element mounting plate 2 and the thin plate member 4 by caulking or the like can be performed reliably and easily. Further, by making the cross section of the thin plate member 4 into a U-shape, the fin portion of the thin plate member 4 serving as a heat dissipation surface can be made two pieces. Therefore, when one thin plate member 4 is attached, two fins are formed. Has been installed.
Cost can be reduced. Further, since it is easy to form the thin plate member 4 into a U-shaped cross section, it becomes possible to mass-produce the thin plate member 4 having the same shape, which also leads to a cost reduction.

Although the cross section of the thin plate member 4 has a U-shape, effective heat radiation can be performed even if the cross-section is made into an L-shape, a square-shape, or a cam-shape. However, in consideration of the process and labor for forming the thin plate material 4 and the bonding with the semiconductor heating element mounting plate 2, the cross section is desirably a U-shape. The thickness of the thin plate member 4 is preferably about 0.3 mm to 0.5 mm in consideration of the strength of the heat radiating portion 3 and the heat radiating effect. It varies depending on conditions and is not limited to this range.

The semiconductor heat generating element 5 is mounted on the heat radiator 1 of such a semiconductor heat generating element by a heat generating element mounting screw 6. In the first embodiment, the heat radiating portion 3 is provided on one surface of the semiconductor heat generating element mounting plate 2 and the semiconductor heat generating element 5 is mounted on the other surface. The heat radiating portions 3 may be provided on both surfaces of the semiconductor heating element mounting plate 2.

Further, in the first embodiment, the radiator mounting terminals 7 are provided at both lower ends of the radiator 3. By simultaneously fitting the radiator mounting terminal 7 and the lead leg 8 of the semiconductor heating element 5 to a radiator mounting portion provided on a printed board (not shown), the radiator can be easily and reliably mounted on the printed board. . The radiator mounting terminal 7 may be formed integrally with the thin plate member 4 as shown in FIG. 1 or may be attached later.

(Embodiment 2) Next, Embodiment 2 will be described with reference to FIG. FIG. 2A shows a radiator in which a plurality of thin plate members 4 constituting the heat radiating portion 3 are attached to both surfaces of the semiconductor heat generating element mounting plate 2 to further enhance the heat radiation effect. In this case, the semiconductor heating element 5 is
Can be mounted in the space on the semiconductor heating element mounting plate 2 obtained by shortening the length of the heating element. Also in the second embodiment, the same effect as in the first embodiment is produced because the thin plate member 4 is formed in a U-shaped cross section.
Further, when the semiconductor heat generating element 5 having a larger heat generation is mounted, it is possible to further increase the number of the thin plate members 4 or to use a larger heat radiation fin serving as a heat radiation surface.

(Embodiment 3) Next, Embodiment 3 will be described with reference to FIG. In FIG. 2B,
Although the cross-sectional shape of the thin plate member 4 is a U-shape, the radiator 1 of the semiconductor heating element has a substantially triangular shape in which the shape of the radiating fins serving as the radiating surface becomes narrower downward. With such a configuration, the radiator mounting position can be appropriately determined without the radiator blocking other electronic components adjacent on the printed circuit board. Further, in the third embodiment, the thin plate members 4 are attached to both surfaces except for the mounting position of the semiconductor heating element. Because of the high density, the heat generation of the semiconductor heating element can be more effectively suppressed. Further, in the case of mounting a semiconductor heat generating element having a large amount of heat generation, it is possible to further increase the number of thin plate members 4 or to form and use a heat radiating fin serving as a heat radiating surface with a larger area.

(Embodiment 4) Next, Embodiment 4 will be described with reference to FIG. In FIG. 2C,
The radiator of the semiconductor heating element in which the area of the radiating fin of the thin plate material 4 near the back side of the mounting position of the semiconductor heating element which is likely to generate high heat is increased. Since the area of the heat dissipating fins in the portion where heat tends to be high is large, the heat dissipating effect can be further enhanced. In the fourth embodiment, the heat radiating portion 3 is provided only on one surface of the semiconductor heat generating element mounting plate 2. However, when mounting a semiconductor heat generating element having a large amount of heat generation, the number of the thin plate members 4 may be increased or the heat radiating surface may be increased. The thickness of the radiation fin may be increased, or the thin plate member 4 may be provided on both surfaces of the semiconductor heating element mounting plate 2.

Next, a fifth embodiment and a sixth embodiment will be described with reference to FIGS. 3 (a) and 3 (b). FIG.
(A) shows Embodiment 5 in which a cut-and-raised portion 9 is provided on a heat radiation fin serving as a heat radiation surface of the thin plate material 4. By providing such cut-and-raised portions 9, the flow of air is improved, and the heat radiation effect can be enhanced without increasing the weight of the radiator. The number, shape, size, interval, and the like of the cut-and-raised portions 9 are not limited to those shown in the drawings, and may be any.

FIG. 3B shows a sixth embodiment in which a push-out portion 10 is provided on a radiating fin serving as a radiating surface of the thin plate material 4.
Is shown. By providing such an extruded portion 10, the surface area of the heat radiating portion 3 is further increased, the air flow is improved, and the heat radiating effect can be enhanced without increasing the weight of the radiator. It is to be noted that the number, shape, size, interval, and the like of the extruded portions 10 are not limited to those shown in the drawing, and may be any as in the case of the fifth embodiment.

In addition to the cut-and-raised portion 9 and the extruded portion 10 as in the fifth and sixth embodiments, a projection or a groove is provided on the radiating fin of the thin plate material 4 to increase the surface area of the radiating fin. May be applied.

The radiator 1 of the semiconductor heating element according to the present invention as described above is mainly used by being installed on a printed circuit board. The conventional radiator causes warpage or bending of the printed circuit board or inconvenience in installation such as an increase in the number of work steps.However, the radiator of the semiconductor heating element according to the present invention is small and lightweight, Since the heat dissipation effect is also high, the printed circuit board on which the heat radiator of the semiconductor heating element according to the present invention is installed does not warp or bend, impairing the positional relationship with other adjacent electronic components, or preventing other electronic components from being bent. There is no problem that has an adverse effect, and there is no inconvenience when installing a radiator on a printed circuit board, which has conventionally occurred, and the heat generation of the semiconductor heating element can be effectively suppressed.

[0041]

As is apparent from the above description, according to the first aspect of the present invention, since the heat radiator can be configured separately to the semiconductor heat-generating element mounting plate and the heat radiating portion, the semiconductor heat radiator can be formed. Efficiency can be set by changing the area, plate thickness, number of sheets used, number of fins, spacing, shape, etc. of the thin plate material constituting the heat radiating part according to the heat generation temperature of the element, and the heat radiation temperature suitable for the semiconductor heating element used. Good heat dissipation can be performed. Further, since the manufacture of the radiator is easier than in the case of the integral formation, the radiator can be reduced in size, and the cost can be reduced from 1/2 to 1/3 as compared with the conventional case.

According to the second aspect of the present invention, since the contact area between the semiconductor heating element mounting plate and the thin plate can be increased, the heat conductivity is increased, and the heat generation of the semiconductor heating element is effectively reduced. Can be suppressed. Further, since the contact area is large, it is possible to easily attach the semiconductor heating element mounting plate to the thin plate material by caulking or the like. Furthermore, since the plurality of thin plate members constituting the heat radiating portion can be independently and independently deformed, and further, the interval between the fins can be changed to adjust the contact area with air and the convection of air, thereby enhancing the heat radiation effect. be able to. Also, the surface area of the sheet material is
The vertical and horizontal dimensions can be increased or decreased as needed, and the number of sheets used can be increased or decreased, so that the heat radiation temperature suitable for the semiconductor heating element used can be set, and the printed circuit board of the radiator The area occupied above can also be controlled.

According to the third aspect of the present invention, since the contact area between the semiconductor heating element mounting plate and the thin plate can be increased, the heat conductivity is increased, and the heat generation of the semiconductor heating element is effectively reduced. Can be suppressed. Further, since the contact area is large, it is possible to easily attach the semiconductor heating element mounting plate to the thin plate material by caulking or the like. Furthermore, since a thin plate material can be easily formed, mass production is possible, the number of work steps is reduced, and the cost can be reduced.

According to the fourth aspect of the present invention, since the heat conductivity can be increased as compared with other joining methods, the heat generated by the semiconductor heating element can be more effectively radiated. Can be. In addition, since the joining operation is facilitated, mass production of the radiator becomes possible, and the cost can be reduced.

According to the fifth aspect of the present invention, the radiator can be used on the printed circuit board on which the radiator is installed in consideration of the positional relationship with other adjacent electronic components. The space taken by the radiator on the printed circuit board can be controlled, and the positional relationship with other electronic components can be efficiently determined.

According to the sixth aspect of the present invention, it is possible to secure a surface area several times as large as that of a conventional radiator.
In addition, since the weight of the radiator can be significantly reduced, a radiator that is small and lightweight and has an excellent heat radiation effect can be provided. In addition, since it is not necessary to take measures such as strengthening the attachment of the radiator to the printed circuit board, the number of work steps is reduced, and the cost can be reduced.

According to the seventh aspect of the present invention, since the heat radiation effect is further enhanced, the heat generation of the semiconductor heat generating element can be more effectively suppressed, and a radiator having an excellent heat radiation effect can be provided. it can.

According to the eighth aspect of the present invention, the position at which the semiconductor heating element is attached to the radiator depends on the size of the semiconductor heating element, the positional relationship with other adjacent electronic components on the printed circuit board, and the like. You can decide freely. Further, the thickness of the thin plate material constituting the heat radiating portion can be made longer or narrower in accordance with the amount of heat generated by the semiconductor heat generating element, so that the heat generated by the semiconductor heat generating element can be more effectively radiated.

According to the ninth aspect of the present invention, the radiator can be easily attached to the printed circuit board.
The mounting accuracy of the radiator can be improved, and the mounting operation can be easily performed.

According to the tenth aspect of the present invention, it is possible to more effectively dissipate heat from the semiconductor heating element as compared with the related art. Further, since the radiator of the semiconductor heating element according to the first to ninth aspects is small and lightweight, when the radiator is mounted on a printed circuit board, the printed circuit board does not warp or bend, and strong soldering is performed. It is not necessary, and inconveniences such as an increase in the number of work steps and an increase in cost can be avoided.

Further, according to the eleventh aspect of the present invention, it is possible to more effectively dissipate heat from the semiconductor heating element as compared with the related art. Further, since the radiator of the semiconductor heating element according to the first to ninth aspects is small and lightweight, when the radiator is mounted on a printed circuit board, the printed circuit board does not warp or bend, and strong soldering is performed. It is not necessary, and inconveniences such as an increase in the number of work steps and an increase in cost can be avoided.

According to the twelfth aspect of the present invention,
Since the radiator mounting terminal and the lead leg of the semiconductor heating element can be mounted on the printed circuit board at the same time, the mounting accuracy of the radiator can be increased, and the mounting operation can be easily performed. Since the semiconductor heat generating element and the radiator can be separated, the radiator can be reduced in size and weight. Also, since it is a separate body, the area, plate thickness, number of sheets used,
By changing the spacing, shape, and the like of the fins, it is possible to set a heat radiation temperature suitable for the semiconductor heating element used.

[Brief description of the drawings]

FIG. 1 is an overall perspective view of a radiator of a semiconductor heating element according to the present invention.

FIG. 2 is an overall perspective view of a radiator of the semiconductor heating element of the present invention.

FIG. 3 is a perspective view showing a thin plate material constituting a radiator of the semiconductor heating element of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat radiator of semiconductor heat generating element 2 Semiconductor heat generating element mounting plate 3 Heat radiating part 4 Thin plate material 5 Semiconductor heat generating element 6 Heat generating element mounting screw 7 Heat radiator mounting terminal 8 Lead leg 9 Cut-and-raised part 10 Push-out part

Claims (12)

[Claims] A semiconductor heat generating element mounting plate, a heat radiating portion,
Characterized in that they are individually formed and then bonded together to form a heat radiator for a semiconductor heating element. 2. A radiator for a semiconductor heat generating element according to claim 1, wherein said heat radiating portion is constituted by a plurality of thin plates which are in surface contact with said semiconductor heat generating element mounting plate. 3. The heat radiating portion is made of a thin plate having a U-shaped cross section.
A radiator for the semiconductor heating element according to the above. 4. The semiconductor heating element mounting plate and the heat radiating portion are joined by any one of crimping, bonding, welding, and ultrasonic bonding, or a combination thereof.
A radiator for a semiconductor heating element according to claim 3. 5. The heat radiator is made of a thin plate material in which a heat radiator is formed in a shape corresponding to a positional relationship with another electronic component adjacent on the printed circuit board. A radiator for the semiconductor heating element according to the above. 6. The semiconductor heating device according to claim 1, wherein any one of a cut-and-raised portion, a protruding portion, and an extruded portion or a combination thereof is provided on the thin plate material constituting the heat radiating portion. Element radiator. 7. The heat-dissipating surface of a thin plate near the mounting position of the semiconductor heating element, or the number of thin plates near the mounting position of the semiconductor heating element is increased. A radiator for a semiconductor heating element according to claim 6. 8. The heat radiating portion is formed by combining and arranging thin plate members having different lengths or widths.
A radiator for a semiconductor heating element according to claim 7. 9. A radiator for a semiconductor heating element according to claim 1, wherein a radiator mounting terminal is provided on a part of the thin plate material constituting the radiator. 10. A method of radiating heat of a semiconductor heating element, comprising: attaching a heat radiator of the semiconductor heating element according to claim 1 to the semiconductor heating element to suppress heat generation of the semiconductor heating element. 11. A printed circuit board comprising: a semiconductor heating element; and a radiator of the semiconductor heating element according to claim 1. 12. The semiconductor heating element according to claim 9, wherein the radiator mounting terminal and the lead leg of the semiconductor heating element are simultaneously fitted into the radiator mounting portion provided on the printed circuit board. How to install the radiator.