JPH10209371A - Icメモリ - Google Patents

Icメモリ

Info

Publication number
JPH10209371A
JPH10209371A JP9006219A JP621997A JPH10209371A JP H10209371 A JPH10209371 A JP H10209371A JP 9006219 A JP9006219 A JP 9006219A JP 621997 A JP621997 A JP 621997A JP H10209371 A JPH10209371 A JP H10209371A
Authority
JP
Japan
Prior art keywords
chip
memory
circuit
input
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9006219A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10209371A5 (de
Inventor
Tomio Suzuki
富夫 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9006219A priority Critical patent/JPH10209371A/ja
Publication of JPH10209371A publication Critical patent/JPH10209371A/ja
Publication of JPH10209371A5 publication Critical patent/JPH10209371A5/ja
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/02Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/025Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device

Landscapes

  • Dram (AREA)
JP9006219A 1997-01-17 1997-01-17 Icメモリ Pending JPH10209371A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9006219A JPH10209371A (ja) 1997-01-17 1997-01-17 Icメモリ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9006219A JPH10209371A (ja) 1997-01-17 1997-01-17 Icメモリ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006342342A Division JP2007110155A (ja) 2006-12-20 2006-12-20 Icメモリ及び半導体装置

Publications (2)

Publication Number Publication Date
JPH10209371A true JPH10209371A (ja) 1998-08-07
JPH10209371A5 JPH10209371A5 (de) 2004-12-16

Family

ID=11632420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9006219A Pending JPH10209371A (ja) 1997-01-17 1997-01-17 Icメモリ

Country Status (1)

Country Link
JP (1) JPH10209371A (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002516033A (ja) * 1997-04-04 2002-05-28 グレン ジェイ リーディ 三次元構造メモリ
JP2003503855A (ja) * 1999-06-28 2003-01-28 インテル・コーポレーション インターポーザおよびその製造方法
US7385835B2 (en) 1992-04-08 2008-06-10 Elm Technology Corporation Membrane 3D IC fabrication
US7474004B2 (en) 1997-04-04 2009-01-06 Elm Technology Corporation Three dimensional structure memory

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7479694B2 (en) 1992-04-08 2009-01-20 Elm Technology Corporation Membrane 3D IC fabrication
US7615837B2 (en) 1992-04-08 2009-11-10 Taiwan Semiconductor Manufacturing Company Lithography device for semiconductor circuit pattern generation
US7385835B2 (en) 1992-04-08 2008-06-10 Elm Technology Corporation Membrane 3D IC fabrication
US7485571B2 (en) 1992-04-08 2009-02-03 Elm Technology Corporation Method of making an integrated circuit
US7504732B2 (en) 1997-04-04 2009-03-17 Elm Technology Corporation Three dimensional structure memory
US7474004B2 (en) 1997-04-04 2009-01-06 Elm Technology Corporation Three dimensional structure memory
JP2002516033A (ja) * 1997-04-04 2002-05-28 グレン ジェイ リーディ 三次元構造メモリ
US8841778B2 (en) 1997-04-04 2014-09-23 Glenn J Leedy Three dimensional memory structure
US8907499B2 (en) 1997-04-04 2014-12-09 Glenn J Leedy Three dimensional structure memory
US8928119B2 (en) 1997-04-04 2015-01-06 Glenn J. Leedy Three dimensional structure memory
US8933570B2 (en) 1997-04-04 2015-01-13 Elm Technology Corp. Three dimensional structure memory
US9401183B2 (en) 1997-04-04 2016-07-26 Glenn J. Leedy Stacked integrated memory device
JP2003503855A (ja) * 1999-06-28 2003-01-28 インテル・コーポレーション インターポーザおよびその製造方法

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