JPH10209371A5 - - Google Patents
Info
- Publication number
- JPH10209371A5 JPH10209371A5 JP1997006219A JP621997A JPH10209371A5 JP H10209371 A5 JPH10209371 A5 JP H10209371A5 JP 1997006219 A JP1997006219 A JP 1997006219A JP 621997 A JP621997 A JP 621997A JP H10209371 A5 JPH10209371 A5 JP H10209371A5
- Authority
- JP
- Japan
- Prior art keywords
- chip
- thickness
- memory
- circuit section
- oxide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9006219A JPH10209371A (ja) | 1997-01-17 | 1997-01-17 | Ｉｃメモリ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9006219A JPH10209371A (ja) | 1997-01-17 | 1997-01-17 | Ｉｃメモリ |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006342342A Division JP2007110155A (ja) | 2006-12-20 | 2006-12-20 | Ｉｃメモリ及び半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10209371A JPH10209371A (ja) | 1998-08-07 |
| JPH10209371A5 true JPH10209371A5 (de) | 2004-12-16 |
Family
ID=11632420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9006219A Pending JPH10209371A (ja) | 1997-01-17 | 1997-01-17 | Ｉｃメモリ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10209371A (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5354695A (en) | 1992-04-08 | 1994-10-11 | Leedy Glenn J | Membrane dielectric isolation IC fabrication |
| US5915167A (en) * | 1997-04-04 | 1999-06-22 | Elm Technology Corporation | Three dimensional structure memory |
| US6551857B2 (en) | 1997-04-04 | 2003-04-22 | Elm Technology Corporation | Three dimensional structure integrated circuits |
| US6617681B1 (en) * | 1999-06-28 | 2003-09-09 | Intel Corporation | Interposer and method of making same |
-
1997
- 1997-01-17 JP JP9006219A patent/JPH10209371A/ja active Pending
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