JPH10275711A - Ptc current limiter provided with backup function - Google Patents
Ptc current limiter provided with backup functionInfo
- Publication number
- JPH10275711A JPH10275711A JP7841097A JP7841097A JPH10275711A JP H10275711 A JPH10275711 A JP H10275711A JP 7841097 A JP7841097 A JP 7841097A JP 7841097 A JP7841097 A JP 7841097A JP H10275711 A JPH10275711 A JP H10275711A
- Authority
- JP
- Japan
- Prior art keywords
- ptc element
- ptc
- plate
- element plate
- current limiter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Landscapes
- Emergency Protection Circuit Devices (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、送配電系統等の電
路に流れる短絡電流あるいは過負荷電流等の過電流から
送配電系統あるいは送配電系統等の電路に配設した電力
機器を保護するための限流器に係わり、特に、抵抗値が
増大する温度が異なる複数のPTC素子を用いて構成し
たバックアップ機能を備えたPTC限流器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to protection of power equipment disposed in a power transmission line such as a transmission / distribution system or a power transmission / distribution system from an overcurrent such as a short-circuit current or an overload current flowing in a power supply line such as a power transmission / distribution system. More particularly, the present invention relates to a PTC current limiter having a backup function and configured using a plurality of PTC elements having different temperatures at which resistance values increase.
【0002】[0002]
【従来の技術】近年、送配電系統に流れる短絡電流など
の過電流から送配電系統あるいは送配電系統等の電路に
配設した電力機器を保護するために、温度が上昇するこ
とにより抵抗値が増大する正の抵抗温度係数を有する素
子(PTC(Positive Temperature Coefficient)サー
ミスタ、以下PTC素子という)を備えた限流器を送配
電系統の電路に用いることが提案されるようになった。
このPTC素子を備えた限流器を送配電系統の電路に遮
断器と併設して用いた場合、例えば、この電路に短絡電
流などの過電流が流れると、PTC素子内にジュール熱
が発生してPTC素子の温度が上昇する。すると、この
PTC素子は正の抵抗温度係数を有するため、PTC素
子の温度が上昇して所定の抵抗転移温度(あるいは相転
移温度)以上になると、その抵抗値が急激に増大して、
この電路に流れる過電流を抑制(限流)するようになる
とともに、その後に遮断器が動作することにより回路が
遮断されることとなる。一方、事故が回復した後、PT
C素子の温度が常温に戻ると、その抵抗値は元の低抵抗
値になるため、PTC素子は自動復帰し、その後、遮断
器が再投入されるとこの電路には通常の所定の電流が流
れるようになる。2. Description of the Related Art In recent years, in order to protect power equipment disposed in an electric circuit such as a power transmission / distribution system or a power transmission / distribution system from an overcurrent such as a short-circuit current flowing in the power transmission / distribution system, a resistance value increases due to an increase in temperature. It has been proposed to use a current limiter including an element having a positive temperature coefficient of resistance (PTC (Positive Temperature Coefficient) thermistor, hereinafter referred to as a PTC element) for an electric circuit of a transmission and distribution system.
When a current limiter equipped with this PTC element is used in conjunction with a circuit breaker on the electric circuit of the power transmission and distribution system, for example, if an overcurrent such as a short-circuit current flows through this electric circuit, Joule heat is generated in the PTC element. As a result, the temperature of the PTC element rises. Then, since the PTC element has a positive temperature coefficient of resistance, when the temperature of the PTC element rises and becomes equal to or higher than a predetermined resistance transition temperature (or phase transition temperature), the resistance value sharply increases,
The overcurrent flowing in the electric circuit is suppressed (current-limited), and the circuit is cut off by operating the circuit breaker thereafter. Meanwhile, after the accident recovered, PT
When the temperature of the C element returns to normal temperature, the resistance value returns to the original low resistance value, so that the PTC element automatically returns. After that, when the circuit breaker is turned on again, a normal predetermined current flows through this circuit. It will flow.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、上記し
た限流器に用いるPTC素子が単独のPTC素子である
と、電路に流れる過電流の増加速度がPTC素子の温度
上昇速度より大きい場合においては、PTC素子は所定
の抵抗増加が得られなくなり、限流動作を行えないとい
う問題を生じた。また、異常な短絡電流が流れると同時
に異常なサージ電圧が発生すると、PTC素子に過大な
ストレスが加わることとなるので、PTC素子が貫通し
たりあるいはフラッシュオーバを生じて、PTC素子が
破壊されるという問題も生じる。However, if the PTC element used for the current limiter is a single PTC element, if the rate of increase of the overcurrent flowing through the electric circuit is higher than the rate of temperature rise of the PTC element, The PTC element has a problem that a predetermined increase in resistance cannot be obtained and a current limiting operation cannot be performed. Further, if an abnormal short-circuit current flows and an abnormal surge voltage is generated at the same time, an excessive stress is applied to the PTC element, so that the PTC element penetrates or flashes over, and the PTC element is destroyed. The problem also arises.
【0004】そこで、本発明は上記した問題点に鑑みて
なされたものであって、その抵抗値が増大する温度が異
なり、過電流に対して常時動作するPTC素子とこのP
TC素子が故障した場合に動作するPTC素子を組み合
わせて用いれば、常時動作するPTC素子が破壊されて
も、もう一方のPTC素子が動作すれば、過電流防止機
能が発揮できるという知見に基づいてなされたものであ
って、バックアップ機能に優れたPTC限流器を得るこ
とにある。Therefore, the present invention has been made in view of the above-mentioned problems, and a PTC element which operates at an overcurrent at different temperatures at which the resistance value increases, and a PTC element which constantly operates in response to an overcurrent.
Based on the knowledge that if a PTC element that operates when a TC element fails is used in combination, an overcurrent prevention function can be exerted if the other PTC element operates even if the constantly operating PTC element is destroyed. An object of the present invention is to provide a PTC current limiter having an excellent backup function.
【0005】[0005]
【課題を解決するための手段およびその作用・効果】本
発明は、抵抗値が増大する温度が異なる複数のPTC素
子を用いて構成したバックアップ機能を備えたPTC限
流器であって、上記課題を解決するために、請求項1に
記載の発明においては、所定の温度になるとその抵抗値
が急激に増大する板状の第1PTC素子板と同第1PT
C素子板より抵抗値が増大する温度が高くかつ抵抗増加
に至るエネルギー量および電流量が大きい板状の第2P
TC素子板との少なくとも2つのPTC素子板を電気的
に直列接続して構成した複合PTC素子体と、この複合
PTC素子体の両表面にそれぞれ電気的に接続される金
属電極板とを備えるようにしている。SUMMARY OF THE INVENTION The present invention relates to a PTC current limiter having a backup function and configured using a plurality of PTC elements having different temperatures at which the resistance value increases. In order to solve the problem, according to the first aspect of the present invention, the first PTC element plate and the first PTC element plate whose resistance value rapidly increases at a predetermined temperature are increased.
A plate-like second P having a higher temperature at which the resistance value increases than the C element plate and a large amount of energy and current leading to an increase in resistance.
A composite PTC element formed by electrically connecting at least two PTC element plates with a TC element plate in series, and metal electrode plates electrically connected to both surfaces of the composite PTC element, respectively. I have to.
【0006】このような複合PTC素子体とすることに
より、定常時においては、第1PTC素子板および第2
PTC素子板の常温での抵抗値は小さいため、電路に給
電される電流は第1PTC素子板および第2PTC素子
板を通して流れる。一方、短絡等の事故によりこの電路
に短絡電流のような過電流が流れると、第2PTC素子
板より抵抗値が増大する温度が低い第1PTC素子板の
抵抗値が増大して限流動作を行う。With such a composite PTC element body, the first PTC element plate and the second
Since the resistance value of the PTC element plate at room temperature is small, the current supplied to the electric circuit flows through the first PTC element plate and the second PTC element plate. On the other hand, when an overcurrent such as a short-circuit current flows through this electric circuit due to an accident such as a short circuit, the resistance value of the first PTC element plate having a lower temperature at which the resistance value increases than the second PTC element plate increases, and current limiting operation is performed. .
【0007】そして、事故が解消して電路への給電が再
開されるようになると、第1PTC素子板および第2P
TC素子板を通して電流が流れるようになるとともに、
第1PTC素子板および第2PTC素子板の温度が徐々
に低下し、第1PTC素子板および第2PTC素子板の
温度が常温になると通常の負荷電流が電路に流れるよう
になる。When the accident is resolved and the power supply to the electric circuit is resumed, the first PTC element plate and the second PTC
As the current flows through the TC element plate,
When the temperatures of the first PTC element plate and the second PTC element plate gradually decrease, and the temperatures of the first PTC element plate and the second PTC element plate reach normal temperature, a normal load current flows through the electric circuit.
【0008】さらに、何らかの理由により第1PTC素
子板が損傷してPTC素子として機能しない場合は、第
2PTC素子板の抵抗値が増大して限流動作を行うよう
になる。このため、バックアップ機能を備えた複合PT
C素子体として動作することが可能になり、この種の限
流器の信頼性が向上するとともに、このPTC限流器を
備えた送配電系統の信頼性が向上する。Further, when the first PTC element plate is damaged and does not function as a PTC element for some reason, the resistance value of the second PTC element plate increases to perform a current limiting operation. For this reason, a composite PT with a backup function
It is possible to operate as a C element body, and the reliability of this type of current limiter is improved, and the reliability of a power transmission and distribution system including this PTC current limiter is improved.
【0009】このようなバックアップ機能を備えたPT
C限流器において重要な点は、第1PTC素子板が損傷
した場合に、この損傷を容易に知ることができるように
することにある。そこで、請求項2に記載の発明におい
ては、第1PTC素子板の損傷時、即ち、第1PTC素
子板自身の絶縁破壊によってその後に生じるアーク熱、
あるいは部分的な電流集中等によって生じる偏熱等の熱
量により溶融して蒸発する低熱量融点金属箔を第1PT
C素子の表面に配設し、第1PTC素子板が損傷して蒸
発した金属により第1PTC素子板の損傷を表示できる
ようにしている。A PT having such a backup function
An important point of the C current limiter is that if the first PTC element plate is damaged, the damage can be easily known. Therefore, in the invention described in claim 2, when the first PTC element plate is damaged, that is, arc heat generated thereafter due to dielectric breakdown of the first PTC element plate itself,
Alternatively, a low-calorie melting point metal foil that melts and evaporates due to the amount of heat such as partial heat generated by partial current concentration or the like may be used as the first PT.
The first PTC element plate is disposed on the surface of the C element so that the first PTC element plate is damaged by the evaporated metal and the damage of the first PTC element plate can be displayed.
【0010】このような低熱量融点金属箔を設けること
により、第1PTC素子板が何らかの理由により損傷し
て破壊されるときに大量の熱が発生すると、低熱量融点
金属箔は溶融して蒸発する。この低熱量融点金属箔の蒸
発により、再固化する際に生じる煤等によりPTC限流
器の周囲が変色したり、異常な臭いが発生したりするよ
うになる。これにより、遮断器投入時に、第1PTC素
子板が故障したことを容易に検知することが可能にな
る。By providing such a low-calorie metal foil, when a large amount of heat is generated when the first PTC element plate is damaged and destroyed for some reason, the low-calorie metal foil melts and evaporates. . Due to the evaporation of the low-calorie melting point metal foil, the surroundings of the PTC current limiter may be discolored or an abnormal odor may be generated due to soot or the like generated when the metal foil is re-solidified. Thus, when the circuit breaker is turned on, it is possible to easily detect that the first PTC element plate has failed.
【0011】請求項3に記載の発明においては、低熱量
融点金属箔としては、溶解、蒸発して固化すると煤とな
る金属、溶解、蒸発してガスが吹き出す金属、あるいは
溶解、蒸発して変色する金属から形成するようにしてい
る。According to the third aspect of the present invention, the low-calorie metal foil may be a metal that melts, evaporates and solidifies to become soot, a metal that melts and evaporates to blow out a gas, or a metal that melts and evaporates to discolor. Metal.
【0012】このように、第1PTC素子板の破壊等に
よる故障時に発生する熱量で溶解、蒸発し、固化すると
煤となる金属により低熱量融点金属箔を形成すると、固
化時にPTC限流器の周囲に煤が付着するため、容易に
第1PTC素子板が故障したことを検知することが可能
になる。また、溶解、蒸発してガスが吹き出す金属によ
り低熱量融点金属箔を形成すると、PTC限流器の周囲
に異常な臭いが発生するため、容易に第1PTC素子板
が故障したことを検知することが可能になる。さらに、
溶解、蒸発して変色する金属により低熱量融点金属箔を
形成すると、PTC限流器の周囲が変色するため、容易
に第1PTC素子板が故障したことを検知することが可
能になる。As described above, when the low-calorie metal foil is formed of a metal that melts, evaporates, and solidifies with heat generated at the time of failure due to destruction of the first PTC element plate or the like, the surroundings of the PTC current limiter during solidification are formed. Since the soot adheres to the first PTC element plate, it is possible to easily detect that the first PTC element plate has failed. In addition, if a low-calorie metal foil is formed from a metal that melts and evaporates and a gas is blown out, an abnormal smell is generated around the PTC current limiter, so that it is easy to detect that the first PTC element plate has failed. Becomes possible. further,
When a low-calorie melting point metal foil is formed from a metal that discolors by melting and evaporating, the surroundings of the PTC current limiter change color, so that the failure of the first PTC element plate can be easily detected.
【0013】請求項4に記載の発明においては、第1P
TC素子板と第2PTC素子板との間に第1PTC素子
板あるいは第2PTC素子板が発生した熱を吸収して蓄
熱する蓄熱器を介在させるようにしている。このような
蓄熱器を設けることにより、第1PTC素子板あるいは
第2PTC素子板が発熱すると、これらの発熱した熱が
蓄熱器に熱伝導する。すると、第1PTC素子板あるい
は第2PTC素子板に長時間にわたって過負荷電流が流
れて第1PTC素子板が発熱しても、この熱を逐次、蓄
熱器が吸収するので、第1PTC素子板あるいは第2P
TC素子板は抵抗転移温度(あるいは相転移温度)に達
することが防止できるようになる。[0013] In the invention described in claim 4, the first P
Between the TC element plate and the second PTC element plate, a heat accumulator for absorbing heat generated by the first PTC element plate or the second PTC element plate and storing the heat is interposed. By providing such a heat accumulator, when the first PTC element plate or the second PTC element plate generates heat, the generated heat is conducted to the heat accumulator. Then, even if an overload current flows through the first PTC element plate or the second PTC element plate for a long time, and the first PTC element plate generates heat, the heat is successively absorbed by the regenerator, so that the first PTC element plate or the second PTC element plate is heated.
The TC element plate can be prevented from reaching the resistance transition temperature (or the phase transition temperature).
【0014】請求項5に記載の発明においては、金属電
極板の表面積を複合PTC素子体の両表面の第1PTC
素子板および第2PTC素子板の表面積より小さく形成
するとともに、金属電極板を第1PTC素子板および第
2PTC素子板の周辺部の表面が露出するように配置し
ている。このように、第1PTC素子板および第2PT
C素子板のそれぞれの表面の周縁部がそれぞれ露出する
ように形成すると、両電極板の端面間に十分な絶縁耐力
を維持することが可能となるので、第1PTC素子板お
よび第2PTC素子板のいずれかが抵抗転移温度(ある
いは相転移温度)に達して急激にその抵抗値が増大して
抵抗降下電圧により両電極板の端面間に過電圧が生じて
も、両電極板の端面間にフラッシュオーバが生じるとい
う不具合を防止できるようになる。According to the present invention, the surface area of the metal electrode plate is increased by the first PTC on both surfaces of the composite PTC element body.
The metal plate is formed so as to be smaller than the surface area of the element plate and the second PTC element plate, and the metal electrode plate is arranged so that the surfaces of the peripheral portions of the first PTC element plate and the second PTC element plate are exposed. Thus, the first PTC element plate and the second PT
When the peripheral portions of the respective surfaces of the C element plate are formed so as to be exposed, it is possible to maintain a sufficient dielectric strength between the end faces of the two electrode plates, so that the first PTC element plate and the second PTC element plate can be maintained. Even if either of them reaches the resistance transition temperature (or the phase transition temperature), the resistance value increases rapidly and an overvoltage occurs between the end faces of both electrode plates due to the resistance drop voltage, but the flashover occurs between the end faces of both electrode plates. Can be prevented from occurring.
【0015】請求項6に記載の発明においては、金属電
極板はその角部に面取り加工を施して、この角部に丸み
を形成した平面形状が略四角形状の板状体としている。
このように、両電極板の角部に丸みを設けるようにする
と、角部の電界はそれ以外の部分の電界と等しくなっ
て、電流密度も均一になるため、両電極板の角部に局部
的に電流が集中して、第1PTC素子板あるいは第2P
TC素子板が局部的に抵抗転移温度(あるいは相転移温
度)に達することを防止でき、第1PTC素子板および
第2PTC素子板の局部的な劣化を防止できるようにな
る。In the invention described in claim 6, the metal electrode plate is chamfered at its corner to form a plate having a substantially square planar shape with rounded corners.
If the corners of the two electrode plates are rounded in this manner, the electric field at the corners becomes equal to the electric field at the other portions and the current density becomes uniform, so that the electric current density becomes uniform. Current is concentrated in the first PTC element plate or the second PTC element plate.
It is possible to prevent the TC element plate from locally reaching the resistance transition temperature (or the phase transition temperature), and prevent the first PTC element plate and the second PTC element plate from locally deteriorating.
【0016】請求項7に記載の発明においては、複合P
TC素子体の側壁の角部に面取り加工を施して、この側
壁の角部に丸みを形成するようにしている。このよう
に、複合PTC素子体の側壁角部を面取り加工して、角
部に丸みを設けるようにすると、複合PTC素子体の側
壁角部の電界はそれ以外の部分の電界と等しくなって、
電流密度も均一になるため、複合PTC素子体の局部的
な劣化を防止できるようになる。In the invention according to claim 7, the composite P
The corner of the side wall of the TC element body is chamfered so that the corner of the side wall is rounded. As described above, when the corner portion of the side wall of the composite PTC element body is chamfered so that the corner portion is rounded, the electric field at the corner portion of the side wall of the composite PTC element body becomes equal to the electric field of the other portion.
Since the current density is also uniform, local deterioration of the composite PTC element body can be prevented.
【0017】請求項8に記載の発明においては、第1P
TC素子板と金属電極板および第2PTC素子板と金属
電極板とのそれぞれの接合部に、固着用金属箔を介在さ
せて第1PTC素子板と金属電極板および第2PTC素
子板と金属電極板とをそれぞれ固着するようにしてい
る。このように各電極板と各PTC素子板とを固着する
と、これらの固着面の接触面積が増大するため、その接
触抵抗が減少し、低内部抵抗の複合PTC素子体が得ら
れるようになる。In the invention described in claim 8, the first P
The first PTC element plate, the second PTC element plate, the second PTC element plate, the metal electrode plate, and the first PTC element plate, the second PTC element plate, the metal electrode plate, Are fixed to each other. When each electrode plate and each PTC element plate are fixed in this manner, the contact area of these fixing surfaces increases, so that the contact resistance decreases and a composite PTC element body with low internal resistance can be obtained.
【0018】請求項9に記載の発明においては、固着用
金属箔を、第1PTC素子板、第2PTC素子板および
金属電極板より硬度が小さい金属、あるいは第1PTC
素子板、第2PTC素子板および金属電極板より表面粗
さが小さい金属から形成している。このような硬度ある
いは表面粗さの関係を有する金属から形成された金属箔
を第1PTC素子板と電極板の間および第2PTC素子
板と電極板の間に配置して、これらの両電極板の両面を
金属箔が変形するような圧縮応力を加えて押圧すると、
金属箔が変形して各PTC素子板と電極板と金属箔を介
して緊密に結合して固着されるようになる。この結果、
第1PTC素子板と電極板および第2PTC素子板と電
極板との間のそれぞれの接合部の接触抵抗を減少させる
ことが可能になる。According to the ninth aspect of the present invention, the fixing metal foil is made of a metal having a lower hardness than the first PTC element plate, the second PTC element plate and the metal electrode plate, or the first PTC element plate.
It is made of a metal having a smaller surface roughness than the element plate, the second PTC element plate and the metal electrode plate. A metal foil formed of a metal having such a relationship of hardness or surface roughness is arranged between the first PTC element plate and the electrode plate and between the second PTC element plate and the electrode plate, and both surfaces of these two electrode plates are made of metal foil. When pressed by applying compressive stress that deforms
The metal foil is deformed and tightly bonded and fixed via each PTC element plate, electrode plate and metal foil. As a result,
It is possible to reduce the contact resistance of the respective joints between the first PTC element plate and the electrode plate and between the second PTC element plate and the electrode plate.
【0019】請求項10に記載の発明においては、固着
用金属箔を、第1PTC素子板および第2PTC素子板
より硬度が大きくかつ金属電極板より硬度が小さい金
属、あるいは第1PTC素子板および第2PTC素子板
より表面粗さが大きくかつ金属電極板より表面粗さが小
さい金属から形成している。このような硬度あるいは表
面粗さの関係を有する金属から形成された金属箔を第1
PTC素子板と電極板の間および第2PTC素子板と電
極板の間に配置しても、これらの両電極板の両面を金属
箔が変形するような圧縮応力を加えて押圧すると、金属
箔が変形して各PTC素子板と電極板とが金属箔を介し
て緊密に結合して固着されるようになる。この結果、第
1PTC素子板と電極板および第2PTC素子板と電極
板との間のそれぞれの接合部の接触抵抗を減少させるこ
とが可能になる。According to the tenth aspect of the present invention, the fixing metal foil is made of a metal having a higher hardness than the first PTC element plate and the second PTC element plate and a lower hardness than the metal electrode plate, or a first PTC element plate and the second PTC element plate. It is formed from a metal having a larger surface roughness than the element plate and a smaller surface roughness than the metal electrode plate. A metal foil formed of a metal having such a relationship of hardness or surface roughness is used as a first metal foil.
Even when disposed between the PTC element plate and the electrode plate and between the second PTC element plate and the electrode plate, when both surfaces of these two electrode plates are pressed by applying compressive stress such that the metal foil is deformed, the metal foil is deformed and The PTC element plate and the electrode plate are tightly bonded and fixed via the metal foil. As a result, it is possible to reduce the contact resistance of each joint between the first PTC element plate and the electrode plate and between the second PTC element plate and the electrode plate.
【0020】[0020]
【発明の実施の形態】以下に、図に基づいて本発明のバ
ックアップ機能を備えたPTC限流器の一実施形態を説
明する。図1は本実施形態のPTC限流器10の概略構
成を示す断面図である。このPTC限流器10は、複合
PTC素子体10aと、この複合PTC素子体10aの
下面に固着用金属箔15aを介して接続した第1金属電
極板15と、複合PTC素子体10aの上面に固着用金
属箔16aを介して接続した第2金属電極板16とから
構成されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a PTC current limiter having a backup function according to the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing a schematic configuration of a PTC current limiter 10 according to the present embodiment. The PTC current limiter 10 includes a composite PTC element body 10a, a first metal electrode plate 15 connected to a lower surface of the composite PTC element body 10a via a fixing metal foil 15a, and an upper surface of the composite PTC element body 10a. And a second metal electrode plate 16 connected via a fixing metal foil 16a.
【0021】複合PTC素子体10aは、第1PTC素
子板11と、この第1PTC素子板11の上部に固着さ
れた低熱量融点金属箔12と、低熱量融点金属箔12の
上部に固着された蓄熱器13と、蓄熱器13の上部に固
着された第1PTC素子板11より抵抗値が増大する温
度が高くかつ抵抗増加に至るエネルギー量および電流量
が大きい板状の第2PTC素子板14とから構成してい
る。The composite PTC element body 10a includes a first PTC element plate 11, a low-calorie metal foil 12 fixed on the first PTC element plate 11, and a heat storage element fixed on the low-calorie metal foil 12. A heat exchanger 13 and a plate-shaped second PTC element plate 14 having a higher temperature at which the resistance value increases than the first PTC element plate 11 fixed to the upper part of the heat storage unit 13 and a large energy amount and current amount leading to an increase in resistance. doing.
【0022】第1PTC素子板11および第2PTC素
子板14としては、温度が上昇することにより抵抗値が
増大する正の抵抗温度係数を有する素子(PTC(Posi
tiveTemperature Coefficient)サーミスタ、以下、P
TC素子という)、例えば、V2O3−Cr2O3等のV2
O3系セラミックス、チタン酸ビスマス(BiTiO3)
セラミックスあるいはこれらの固溶体、クリストバライ
ト−カーボン系等複合セラミックス材料等の、その比抵
抗が急激に増大する温度(抵抗転移温度あるいは相転移
温度という、以下抵抗転移温度という)が200℃〜2
80℃程度のもので、常温での抵抗値が小さくかつ抵抗
転移温度になると急激に抵抗値が増大するPTC素子を
用いている。As the first PTC element plate 11 and the second PTC element plate 14, an element (PTC (Posi
tiveTemperature Coefficient) thermistor, P
That TC element), for example, V 2 O 3 -Cr 2 V 2 of O 3,
O 3 ceramics, bismuth titanate (BiTiO 3 )
The temperature at which the specific resistance of ceramics or a solid solution thereof or a composite ceramic material such as cristobalite-carbon system rapidly increases (hereinafter referred to as resistance transition temperature or phase transition temperature) is 200 ° C. to 2 ° C.
A PTC element having a resistance of about 80 ° C. and having a small resistance at room temperature and rapidly increasing in resistance at a resistance transition temperature is used.
【0023】そして、これらから選択したPTC素子を
平面形状が四角形の板状に成形したものを用いる。この
うち、第1PTC素子板11としては、抵抗転移温度が
230℃程度のPTC素子を用い、第2PTC素子板1
4としては、抵抗転移温度が280℃程度で抵抗増加に
至るエネルギー量および電流量が大きいPTC素子を用
いることが好ましい。A PTC element selected from these is formed into a rectangular plate shape in plan view. Among them, as the first PTC element plate 11, a PTC element having a resistance transition temperature of about 230 ° C. is used.
It is preferable to use a PTC element having a resistance transition temperature of about 280 ° C. and a large amount of energy and a large amount of current for increasing the resistance.
【0024】低熱量融点金属箔12は、第1PTC素子
板11の破壊等による故障時に発生する熱量で溶解、蒸
発し、固化すると煤となる金属を用い、平面形状が四角
形の箔状に成形し、第1PTC素子板11の上面に配置
して圧着、導電性接着剤による接着、ロウ付けあるいは
溶接等により固着している。この低熱量融点金属箔12
に用いる金属としては、例えば、その融点が350℃程
度の錫を主成分とする低融点金属を用いる。The low-calorie melting point metal foil 12 is formed of a metal that melts, evaporates, and solidifies into soot when it is melted by the amount of heat generated when the first PTC element plate 11 breaks down or the like. Are arranged on the upper surface of the first PTC element plate 11 and fixed by pressure bonding, bonding with a conductive adhesive, brazing or welding. This low calorie melting point metal foil 12
For example, a low melting point metal whose main melting point is tin whose melting point is about 350 ° C. is used.
【0025】ここで、第1PTC素子板11として、例
えば、抵抗転移温度が230℃程度のPTC素子で構成
したものを用い、0.5〜2.5サイクルの通電を許容
する場合、第1PTC素子板11は300℃程度の温度
まで上昇する。すると、増加した抵抗に基づく抵抗降下
電圧による貫通破壊、あるいは特定の部位に電流が集中
してヒートスポットとなる熱応力破壊等が生じるように
なる。このため、その融点が350℃程度の低融点金属
を用いて低熱量融点金属箔12を構成すると、このよう
な第1PTC素子板11の破壊時に、低熱量融点金属箔
12は溶解して蒸発し、固化すると煤となる。低熱量融
点金属箔12が煤となることにより、このPTC限流器
10の周囲に煤が付着するため、第1PTC素子板11
が故障したことを容易に検知することが可能になる。Here, as the first PTC element plate 11, for example, a PTC element having a resistance transition temperature of about 230 ° C. is used. The plate 11 rises to a temperature of about 300 ° C. Then, penetration breakdown due to a resistance drop voltage based on the increased resistance, or thermal stress breakdown that causes a current to concentrate on a specific portion to form a heat spot occurs. Therefore, when the low-calorie metal foil 12 is formed using a low-melting-point metal having a melting point of about 350 ° C., when the first PTC element plate 11 is broken, the low-calorie melting point metal foil 12 melts and evaporates. When solidified, it becomes soot. Since the low-calorie melting point metal foil 12 becomes soot, soot adheres around the PTC current limiter 10, so that the first PTC element plate 11
Can easily be detected as having failed.
【0026】なお、低熱量融点金属箔12を構成する金
属としては、上記した第1PTC素子板11の破壊等に
よる故障時に発生する熱量で溶解、蒸発し、固化すると
煤となる錫を主成分とする低熱量融点金属以外にも、溶
解、蒸発してガスが吹き出す金属、あるいは溶解、蒸発
して変色する金属、さらには、融点が錫より高いアルミ
ニウム、金等の金属を極く薄い薄膜状とし、少量の熱量
で溶解、蒸発するものを用いることができる。The metal constituting the low-calorie melting point metal foil 12 is mainly composed of tin which melts, evaporates, and solidifies to become soot when it is melted, evaporated and solidified by the heat generated at the time of failure due to destruction of the first PTC element plate 11 or the like. In addition to low-melting-point metals, metals that melt and evaporate to blow out gas, or metals that dissolve and evaporate and change color, and metals such as aluminum and gold, whose melting points are higher than tin, are made into extremely thin films. One that dissolves and evaporates with a small amount of heat can be used.
【0027】溶解、蒸発してガスが吹き出す金属により
低熱量融点金属箔12を形成すると、PTC限流器10
の周囲に異常な臭いが発生するため、容易に第1PTC
素子板11が故障したことを検知することが可能にな
る。さらに、溶解、蒸発して変色する金属により低熱量
融点金属箔12を形成すると、PTC限流器10の周囲
が変色するため、容易に第1PTC素子板11が故障し
たことを検知することが可能になる。When the metal foil 12 having a low calorific value is formed of a metal from which a gas is blown by melting and evaporating, the PTC current limiting device 10
The first PTC is easily generated because an abnormal smell is generated around the
It becomes possible to detect that the element plate 11 has failed. Furthermore, when the low-calorie melting point metal foil 12 is formed of a metal that dissolves and evaporates and changes color, the periphery of the PTC current limiter 10 changes color, so that it is possible to easily detect that the first PTC element plate 11 has failed. become.
【0028】蓄熱器13は、銅、アルミニウム、ステン
レス等の熱伝導性が良好な金属からなる金属容器内に、
例えば、鉛−錫合金、はんだ等の融点が130〜150
℃の低融点金属を充填し、密閉して形成されている。こ
の蓄熱器13を上述した低熱量融点金属箔12が固着さ
れた第1PTC素子板11の低熱量融点金属箔12の上
面に配置し、蓄熱器13と低熱量融点金属箔12とを導
電性接着剤による接着、ロウ付けあるいは溶接等により
固着している。この蓄熱器13の上面に第2PTC素子
板14を配置し、蓄熱器13と第2PTC素子板14と
を導電性接着剤による接着、ロウ付けあるいは溶接等に
より固着している。The regenerator 13 is placed in a metal container made of a metal having good thermal conductivity such as copper, aluminum, stainless steel, etc.
For example, the melting point of a lead-tin alloy, solder, or the like is 130 to 150.
It is filled with a low-melting-point metal at ℃ and is sealed. The heat accumulator 13 is disposed on the upper surface of the low-calorie melting point metal foil 12 of the first PTC element plate 11 to which the low-calorie melting point metal foil 12 is fixed, and the heat accumulator 13 and the low-calorie melting point metal foil 12 are electrically conductively bonded. It is fixed by bonding with an agent, brazing or welding. The second PTC element plate 14 is arranged on the upper surface of the heat accumulator 13, and the heat accumulator 13 and the second PTC element plate 14 are fixed to each other by bonding, brazing, welding, or the like using a conductive adhesive.
【0029】このような蓄熱器13を設けることによ
り、第1PTC素子板11が発熱すると、これらの発熱
した熱が蓄熱器13に熱伝導する。すると、蓄熱器13
の金属容器内に密封、充填された低融点金属がこの熱を
吸収してその融点に達すると、低融点金属は融解して融
解熱に変換される。これにより、第1PTC素子板11
に長時間にわたって過負荷電流が流れて第1PTC素子
板11が発熱しても、この熱は逐次、低融点金属の融解
熱に変換されるため、第1PTC素子板11は抵抗転移
温度に達することが防止できるようになる。By providing such a heat storage device 13, when the first PTC element plate 11 generates heat, the generated heat is conducted to the heat storage device 13. Then, the regenerator 13
When the low melting point metal sealed and filled in the metal container absorbs this heat and reaches its melting point, the low melting point metal is melted and converted into heat of fusion. Thereby, the first PTC element plate 11
Even if an overload current flows for a long time and the first PTC element plate 11 generates heat, this heat is sequentially converted into heat of fusion of the low melting point metal, so that the first PTC element plate 11 reaches the resistance transition temperature. Can be prevented.
【0030】このようにして、第1PTC素子板11の
上面に低熱量融点金属箔12が固着され、低熱量融点金
属箔12の上面に蓄熱器13が固着され、蓄熱器13の
上面に第2PTC素子板14が固着されて積層体とした
複合PTC素子体10aが構成される。As described above, the low-calorie melting point metal foil 12 is fixed to the upper surface of the first PTC element plate 11, the regenerator 13 is fixed to the upper surface of the low-calorie melting point metal foil 12, and the second PTC A composite PTC element body 10a is formed by laminating the element plate 14 to form a laminate.
【0031】電極板15,16は銅、アルミニウム、ス
テンレス等の金属をその平面形状が四角形に成形された
金属板状体により形成している。そして、これらの電極
板15,16を上述のように構成した複合PTC素子体
10aの両面、即ち、電極板15を第1PTC素子板1
1の下面に、電極板16を第2PTC素子板14の上面
にそれぞれ配置し、これらの間に後述する固着用金属箔
15a,16aをそれぞれ配置して、両電極板15,1
6の表面を押圧することにより、両電極板15,16は
固着用金属箔15a,16aを介して複合PTC素子体
10aの両面に固着される。The electrode plates 15 and 16 are made of a metal such as copper, aluminum, stainless steel or the like in the form of a metal plate having a square planar shape. The electrode plates 15 and 16 are arranged on both surfaces of the composite PTC element body 10a as described above, that is, the electrode plate 15 is connected to the first PTC element plate 1.
1, an electrode plate 16 is arranged on the upper surface of the second PTC element plate 14, and fixing metal foils 15a, 16a, which will be described later, are arranged between them.
By pressing the surface of 6, the two electrode plates 15, 16 are fixed to both surfaces of the composite PTC element body 10a via the fixing metal foils 15a, 16a.
【0032】固着用金属箔15a,16aは、両PTC
素子板11,14の硬度をHaとし、両電極板15,1
6の硬度をHcとし、固着用金属箔15a,16aの硬
度をHbとした場合に、Ha>Hc>Hbの関係を有す
るか、あるいはHc>Ha>Hbの関係を有する硬度H
bの金属、例えば、錫、銅、アルミニウム、金等の金属
をその平面形状が四角形に成形された金属箔により形成
している。The fixing metal foils 15a and 16a are made of both PTCs.
The hardness of the element plates 11 and 14 is defined as Ha, and the electrode plates 15 and 1 are hardened.
6 is Hc and the hardness of the fixing metal foils 15a and 16a is Hb, the hardness H has a relationship of Ha>Hc> Hb or a hardness H having a relationship of Hc>Ha> Hb.
The metal b, for example, a metal such as tin, copper, aluminum, or gold is formed of a metal foil whose plane shape is formed into a square.
【0033】このようなHa>Hc>Hbの関係あるい
はHc>Ha>Hbの関係を有する硬度Hbの金属から
形成れた固着用金属箔15a、16aを第1PTC素子
板11と電極板15の間に配置および第2PTC素子板
14と電極板16の間に配置して、これらの両電極板1
5,16の両面を固着用金属箔15a,16aが変形す
るような圧縮応力を加えて押圧する。これにより、第1
PTC素子板11と固着用金属箔15aと電極板15と
がそれぞれ緊密に結合して固着されるとともに、第2P
TC素子板14と金属箔16aと電極板16とがそれぞ
れ緊密に結合して固着される。この結果、第1PTC素
子板11と電極板15および第2PTC素子板14と電
極板16との間のそれぞれの接合部の接触抵抗を減少さ
せることが可能になる。The fixing metal foils 15a and 16a made of a metal having a hardness of Hb having a relationship of Ha>Hc> Hb or a relationship of Hc>Ha> Hb are provided between the first PTC element plate 11 and the electrode plate 15. And between the second PTC element plate 14 and the electrode plate 16, and these two electrode plates 1
A compressive stress is applied to both sides of the fixing metal foils 15 and 16 so that the fixing metal foils 15a and 16a are deformed. Thereby, the first
The PTC element plate 11, the fixing metal foil 15a, and the electrode plate 15 are tightly bonded and fixed, respectively, and the second P
The TC element plate 14, the metal foil 16a, and the electrode plate 16 are tightly coupled and fixed. As a result, it is possible to reduce the contact resistance of each joint between the first PTC element plate 11 and the electrode plate 15 and between the second PTC element plate 14 and the electrode plate 16.
【0034】また、固着用金属箔15a,16aを、両
PTC素子板11,14の表面粗さAとし、両電極板1
5,16の表面粗さをCとし、固着用金属箔15a,1
6aの表面粗さをBとした場合に、A=C>Bの関係を
有する表面粗さBの金属、例えば、錫、銅、アルミニウ
ム、金等の金属をその平面形状が四角形に成形された金
属箔により形成しても、第1PTC素子板11と電極板
15および第2PTC素子板14と電極板16との間の
それぞれの接合部の接触抵抗を減少させることが可能に
なる。The fixing metal foils 15a and 16a are made to have the surface roughness A of both PTC element plates 11 and 14,
The surface roughness of each of the metal foils 15 and 15 is defined as C.
Assuming that the surface roughness of 6a is B, a metal having a surface roughness B having a relationship of A = C> B, for example, a metal such as tin, copper, aluminum, or gold is formed into a quadrangular planar shape. Even if it is formed of metal foil, it becomes possible to reduce the contact resistance of the respective joints between the first PTC element plate 11 and the electrode plate 15 and between the second PTC element plate 14 and the electrode plate 16.
【0035】さらに、両PTC素子板11,14の硬度
を一番小さくし、固着用金属箔15a,16aの硬度を
両PTC素子板11,14の硬度より大きくし、両電極
板15,16の硬度をさらに大きくしても、あるいは、
固着用金属箔15a,16aの表面粗さを一番大きく
し、これよりも両PTC素子板11,14および両電極
板15,16の表面粗さを小さくしても第1PTC素子
板11と電極板15および第2PTC素子板14と電極
板16との間のそれぞれの接合部の接触抵抗を減少させ
ることが可能になる。Further, the hardness of both PTC element plates 11 and 14 is minimized, and the hardness of fixing metal foils 15a and 16a is made larger than the hardness of both PTC element plates 11 and 14 so that both electrode plates 15 and 16 are hardened. Even if the hardness is further increased, or
Even if the surface roughness of the fixing metal foils 15a, 16a is maximized, and the surface roughness of both PTC element plates 11, 14 and both electrode plates 15, 16 is smaller than this, the first PTC element plate 11 and the electrode It is possible to reduce the contact resistance of each joint between the plate 15 and the second PTC element plate 14 and the electrode plate 16.
【0036】上述のように構成した第1PTC素子板1
1および第2PTC素子板14を備えた限流器10(以
下、PTC限流器10という)を送配電系統の電路Lに
直列に接続して、この電路Lに流れる過電流を制限(限
流)する場合の一例を示す図2に基づいて説明する。な
お、図2において、このPTC限流器10は交流電源3
0と負荷40からなる電路Lの交流電源30と負荷40
との間に遮断器20を介して直列に接続されている。First PTC element plate 1 constructed as described above
A current limiter 10 (hereinafter, referred to as a PTC current limiter 10) including the first and second PTC element plates 14 is connected in series to an electric circuit L of a power transmission and distribution system to limit an overcurrent flowing through the electric circuit L (current limiting). This will be described with reference to FIG. In FIG. 2, the PTC current limiter 10 is
0 and a load 40 and an AC power supply 30 and a load 40 on an electric circuit L.
Are connected in series via a circuit breaker 20.
【0037】(1)正常状態 まず、正常時の動作について説明すると、遮断器20が
閉じた状態(運転状態)において交流電源30より電路
Lに正常時の負荷電流I0が供給されている場合、負荷
40には、電極板15、固着用金属箔15a、複合PT
C素子体10a(第1PTC素子板11、低熱量融点金
属箔12、蓄熱器13、第2PTC素子板14)、金属
箔16aおよび電極板16を通して負荷電流I0が流れ
る。このとき、第1PTC素子板11および第2PTC
素子板14の抵抗値は小さいため、第1PTC素子板1
1および第2PTC素子板14を電路Lに接続しても電
力損失は小さい。(1) Normal State First, the operation in the normal state will be described. When the load current I 0 in the normal state is supplied to the electric circuit L from the AC power supply 30 when the circuit breaker 20 is closed (operating state). , The load 40, the electrode plate 15, the fixing metal foil 15a, the composite PT
The load current I 0 flows through the C element body 10a (the first PTC element plate 11, the low-calorie melting point metal foil 12, the heat storage unit 13, the second PTC element plate 14), the metal foil 16a, and the electrode plate 16. At this time, the first PTC element plate 11 and the second PTC
Since the resistance value of the element plate 14 is small, the first PTC element plate 1
Even if the first and second PTC element plates 14 are connected to the electric circuit L, the power loss is small.
【0038】(2)過負荷状態 ここで、何らかの理由により負荷40が過負荷状態にな
ると、電路Lに過負荷電流I1が流れるようになる。す
ると、第1PTC素子板11の抵抗転移温度は第2PT
C素子板14の抵抗転移温度より小さく、かつ、第2P
TC素子板14は抵抗増加に至るエネルギー量および電
流量が第1PTC素子板11より大きいため、第1PT
C素子板11はジュール熱により発熱して温度が上昇す
る。これにより、発熱した熱が蓄熱器13に熱伝導する
が、蓄熱器13の金属容器内に密封、充填された低融点
金属がこの熱を吸収してその融点に達すると、低融点金
属は融解して融解熱に変換される。この結果、第1PT
C素子板11に長時間にわたって過負荷電流が流れて第
1PTC素子板11が発熱しても、この熱は逐次、低融
点金属の融解熱に変換されるため、第1PTC素子板1
1は抵抗転移温度に達することが防止できるようにな
る。[0038] (2) overload condition where the load 40 is overloaded for some reason, so that an overload current I 1 flows through the path L. Then, the resistance transition temperature of the first PTC element plate 11 becomes the second PT
Lower than the resistance transition temperature of the C element plate 14 and the second P
Since the TC element plate 14 has a larger amount of energy and current to increase the resistance than the first PTC element plate 11, the first PT
The C element plate 11 generates heat due to Joule heat and the temperature rises. As a result, the generated heat is conducted to the heat accumulator 13, but when the low melting metal sealed and filled in the metal container of the heat accumulator 13 absorbs this heat and reaches the melting point, the low melting metal melts. And converted to heat of fusion. As a result, the first PT
Even if the overload current flows through the C element plate 11 for a long time and the first PTC element plate 11 generates heat, this heat is sequentially converted into the heat of fusion of the low melting point metal.
No. 1 can prevent reaching the resistance transition temperature.
【0039】(3)第1短絡状態 ここで、何らかの理由により、PTC限流器10の下流
側の電路LのX地点に配設された負荷が短絡する事故が
生じると、短絡電流Is1が電路Lに流れるようにな
る。第1PTC素子板11および第2PTC素子板12
に定格電流以上の過電流ISが流れるようになると、第
1PTC素子板11の抵抗転移温度は第2PTC素子板
14の抵抗転移温度より小さく、かつ、第2PTC素子
板14は抵抗増加に至るエネルギー量および電流量が第
1PTC素子板11より大きいため、まず、第1PTC
素子板11はジュール熱により発熱して温度が上昇し
て、その温度が抵抗転移温度に達して、第1PTC素子
板11は急激にその比抵抗が増大し、その抵抗値が急激
に増大して即応的に限流動作を行う。このため、第2P
TC素子板14はそれ程温度上昇することはない。(3) First Short-Circuit State If, for some reason, an accident occurs in which the load disposed at the point X of the electric circuit L downstream of the PTC current limiter 10 is short-circuited, the short-circuit current Is 1 is reduced. It flows to the electric circuit L. First PTC element plate 11 and second PTC element plate 12
If to flow rated current or overcurrent I S is the resistance transition temperature of the 1PTC element plate 11 is smaller than the resistance transition temperature of the 2PTC element plate 14, and the 2PTC element plate 14 energy leading to increased resistance Since the amount and the current amount are larger than the first PTC element plate 11,
The element plate 11 generates heat due to Joule heat and the temperature rises, and the temperature reaches the resistance transition temperature. The specific resistance of the first PTC element plate 11 rapidly increases, and the resistance value rapidly increases. The current limiting operation is performed immediately. Therefore, the second P
The temperature of the TC element plate 14 does not rise so much.
【0040】短絡電流Is1が電路Lに流れるようにな
ると、図示しないセンサがこの過電流Is1を検出して
遮断器40を遮断させる。これにより、第1PTC素子
板11および第2PTC素子板14に短絡電流Is1が
流れなくなる。When the short-circuit current Is 1 flows through the electric circuit L, a sensor (not shown) detects this over-current Is 1 and shuts off the circuit breaker 40. Thus, a short-circuit current Is 1 stops flowing to the 1PTC element plate 11 and the 2PTC element plate 14.
【0041】一方、短絡事故が回復して遮断器40が復
帰すると、電路Lには正常な負荷電流I0が交流電源3
0より供給される。この場合、第1PTC素子板11お
よび第2PTC素子板14の温度は常温まで低下してい
ないと、第1PTC素子板11および第2PTC素子板
14の抵抗値は高い値となっているが、やがては冷却さ
れて第1PTC素子板11および第2PTC素子板14
の温度は逐次低下して、常温の低抵抗値となる。On the other hand, when the short-circuit fault is recovered and the circuit breaker 40 returns, the normal load current I 0
Supplied from 0. In this case, if the temperatures of the first PTC element plate 11 and the second PTC element plate 14 have not decreased to room temperature, the resistance values of the first PTC element plate 11 and the second PTC element plate 14 will be high, but eventually The first PTC element plate 11 and the second PTC element plate 14 are cooled.
Temperature gradually decreases to a low resistance value at normal temperature.
【0042】(4)第2短絡状態 さらに、何らかの理由により、PTC限流器10の下流
側の電路LのX地点に配設された負荷が短絡する事故が
発生し、この短絡事故に基づく短絡電流Is1が電路L
に流れるようになり、第1PTC素子板11および第2
PTC素子板12に定格電流以上の過電流ISが流れる
ようになって、上述したように、第1PTC素子板11
がジュール熱により発熱することとなるが、長期間の使
用により第1PTC素子板11が劣化していたり、ある
いは通常の短絡電流Is1以上の短絡電流Is2が流れて
電流増加速度に対応する抵抗増加が得られなかったり、
さらには、この短絡電流Is1に異常なサージ電圧が付
加された場合に、第1PTC素子板11に異常なストレ
スが加わって、第1PTC素子板11が貫通したり、あ
るいはフラッシュオーバが生じる。このような場合は、
いずれも最終的にアーク放電が生じることとなる。(4) Second Short-Circuit State Further, for some reason, a load short-circuited at the point X of the electric circuit L downstream of the PTC current limiter 10 occurs. The current Is 1 is the electric circuit L
And the first PTC element plate 11 and the second
Overcurrent I S that is equal to or greater than the rated current flows through the PTC element plate 12, and as described above, the first PTC element plate 11
Although the generate heat, corresponding to the long-term the 1PTC or element plate 11 has been deteriorated or current increase rate conventional short-circuit current Is 1 or more short-circuit current Is 2 flows, through the use resistors but by Joule heat Not gaining,
Furthermore, when the abnormal surge voltage to the short-circuit current Is 1 is added, and abnormal stress is applied to the 1PTC element plate 11, or the 1PTC element plate 11 through, or flashover occurs. In such a case,
In any case, arc discharge eventually occurs.
【0043】すると、第2PTC素子板14は抵抗増加
に至るエネルギー量および電流量が第1PTC素子板1
1より大きいため、破壊されることなく、第2PTC素
子板14の温度が抵抗転移温度に達して、第2PTC素
子板14は急激にその比抵抗が増大し、その抵抗値が急
激に増大して限流動作を行う。このとき、第1PTC素
子板11が貫通したり、あるいはフラッシュオーバが生
じたアーク熱あるいは電流の局部集中による偏熱等によ
り、低熱量融点金属箔12を構成する金属が溶解して、
蒸発する。この低熱量融点金属箔12を構成する金属
は、固化すると煤となったり、溶解、蒸発してガスが吹
き出したり、あるいは溶解、蒸発して変色する金属であ
るので、第1PTC素子板11が破壊されたことを容易
に知ることができるようになる。Then, the amount of energy and the amount of current leading to an increase in the resistance of the second PTC element plate 14 are reduced.
Since it is larger than 1, the temperature of the second PTC element plate 14 reaches the resistance transition temperature without being destroyed, the specific resistance of the second PTC element plate 14 rapidly increases, and the resistance value rapidly increases. Perform current limiting operation. At this time, the metal constituting the low calorific value melting point metal foil 12 is melted by the first PTC element plate 11 penetrating or by the arc heat generated by flashover or the localization of current due to local concentration of current, and the like.
Evaporate. The metal constituting the low-calorie melting point metal foil 12 is soot when solidified, melts and evaporates to emit a gas, or dissolves and evaporates to discolor, so that the first PTC element plate 11 is broken. You can easily know what was done.
【0044】第2PTC素子板14が限流動作して所定
の時間(0.5〜2.5サイクル)が経過して、図示し
ないセンサがこのような異常な短絡電流を検出して、遮
断器40を遮断動作させることとなる。これにより、第
1PTC素子板11および第2PTC素子板14に異常
な短絡電流が流れなくなる。短絡事故が回復した後、遮
断器20を投入するとき、低熱量融点金属箔12を構成
する金属が溶解、蒸発して、煤となってPTC限流器1
0の周囲に付着したり、PTC限流器10の周囲に異常
な臭いが発生していたり、あるいはPTC限流器10の
周囲が変色していることにより、第1PTC素子板11
が破壊されたことを容易に知ることができ、遮断器20
を投入する前にこの第1PTC素子板11が破壊された
PTC限流器10を交換することにより、電路Lに正常
な負荷電流I0が交流電源30より供給できるようにな
る。After a predetermined time (0.5 to 2.5 cycles) has elapsed after the second PTC element plate 14 has performed the current limiting operation, a sensor (not shown) detects such an abnormal short-circuit current, and 40 is turned off. As a result, an abnormal short-circuit current does not flow through the first PTC element plate 11 and the second PTC element plate 14. When the circuit breaker 20 is turned on after the recovery from the short-circuit accident, the metal constituting the low-calorie melting point metal foil 12 melts and evaporates to become soot, and the PTC current limiter 1
0, the PTC current limiter 10 has an abnormal smell around it, or the periphery of the PTC current limiter 10 is discolored.
Can be easily known that the circuit breaker has been destroyed.
By exchanging the PTC current limiter 10 in which the first PTC element plate 11 has been destroyed before the power supply, the normal load current I 0 can be supplied to the electric circuit L from the AC power supply 30.
【0045】なお、上述した実施形態においては、低熱
量融点金属箔12を第1PTC素子板11と蓄熱器13
の間に介在させる例について説明したが、低熱量融点金
属箔12は第1PTC素子板11と固着用金属箔15a
との間に介在させるようにしてもよい。In the above-described embodiment, the low-calorie melting point metal foil 12 is connected to the first PTC element plate 11 and the regenerator 13.
Although the example in which the low-calorie melting point metal foil 12 is interposed between the first PTC element plate 11 and the fixing metal foil 15a
May be interposed between.
【0046】また、上述した実施形態においては、複合
PTC素子体10aを構成するに際して、第1PTC素
子板11と第2PTC素子板14との2枚のPTC素子
板からなる2段構成とする例について説明したが、PT
C素子板を3枚用いた3段構成あるいはPTC素子板を
4枚用いた4段構成等のように多段構成により複合PT
C素子体を構成するようにしてもよい。Further, in the above-described embodiment, when forming the composite PTC element body 10a, an example in which the composite PTC element body 10a has a two-stage configuration including two PTC element plates, that is, a first PTC element plate 11 and a second PTC element plate 14. I explained, PT
A multi-stage configuration such as a three-stage configuration using three C element plates or a four-stage configuration using four PTC element plates, etc.
You may make it comprise a C element body.
【0047】変形例1 上述した実施形態においては、複合PTC素子体10a
と両電極板15,16の表面積が同一の場合について説
明したが、これらの表面積が同一であると、第1および
第2PTC素子板11,14のいずれかが抵抗転移温度
に達して急激にその抵抗値が増大した場合に、この増大
した抵抗に基づく抵抗降下電圧により両電極板15,1
6の端面間に過電圧が生じる。Modification 1 In the embodiment described above, the composite PTC element body 10a
And the case where the surface areas of the two electrode plates 15 and 16 are the same, but if the surface areas are the same, one of the first and second PTC element plates 11 and 14 reaches the resistance transition temperature and suddenly increases. When the resistance value increases, the two electrode plates 15 and 1 are moved by a resistance drop voltage based on the increased resistance.
6, an overvoltage occurs between the end faces.
【0048】この複合PTC素子体10aの周縁の外部
は外気に接しており、この周縁の外気は第1PTC素子
板11あるいは第2PTC素子板14の温度上昇に伴い
上昇する。温度上昇した大気の絶縁耐力は常温に比して
低下するため、両電極板15,16の端面間に生じた過
電圧により、両電極板15,16の端面間にフラッシュ
オーバが生じるという不具合が生じる。そこで、このよ
うな不具合を防止するために、本第1変形例が考えられ
た。The outside of the periphery of the composite PTC element body 10a is in contact with the outside air, and the outside air of the periphery rises as the temperature of the first PTC element plate 11 or the second PTC element plate 14 rises. Since the dielectric strength of the atmosphere whose temperature has risen is lower than that at normal temperature, the overvoltage generated between the end faces of the electrode plates 15 and 16 causes a problem that flashover occurs between the end faces of the electrode plates 15 and 16. . Then, in order to prevent such a problem, the first modified example was considered.
【0049】ここで図3は本第1変形例のPTC限流器
を示し、図3(a)はその下面図であり、図3(b)は
図3(a)のA−A断面図である。本第1変形例におい
ては、図3に示すように、上述の実施形態と同様に平面
形状を四角形状に形成した両電極板15,16の表面積
を平面形状を四角形状に形成した複合PTC素子体10
aの表面積より小さく形成し、両電極板15,16を複
合PTC素子体10aの両表面の中央部に配置して、複
合PTC素子体10aの両表面の端縁周縁部がそれぞれ
両電極板15,16より露出するように形成している。
即ち、第1PTC素子板11および第2PTC素子板1
4のそれぞれの表面の端縁周縁部がそれぞれ両電極板1
5,16より露出するように形成している。Here, FIG. 3 shows a PTC current limiter of the first modification, FIG. 3 (a) is a bottom view, and FIG. 3 (b) is a sectional view taken along line AA of FIG. 3 (a). It is. In the first modified example, as shown in FIG. 3, a composite PTC element in which the surface area of both electrode plates 15 and 16 in which the planar shape is formed in a square shape as in the above embodiment is formed in a rectangular shape in plan view. Body 10
a, the two electrode plates 15 and 16 are arranged at the center of both surfaces of the composite PTC element body 10a, and the peripheral edges of both surfaces of the composite PTC element body 10a are , 16 so as to be exposed.
That is, the first PTC element plate 11 and the second PTC element plate 1
4 are both electrode plates 1
It is formed so as to be exposed from 5,16.
【0050】そして、実験によると、複合PTC素子体
10aの厚みプラス0.5mm以上の縁面距離を有して
いれば十分な絶縁耐力を維持することが可能であるの
で、第1PTC素子板11および第2PTC素子板14
の露出する部分の幅を0.25mmとすればよい。According to an experiment, if the composite PTC element body 10a has an edge surface distance of 0.5 mm or more, a sufficient dielectric strength can be maintained. And second PTC element plate 14
The width of the exposed portion may be 0.25 mm.
【0051】このように、第1PTC素子板11および
第2PTC素子板14のそれぞれの表面の端縁周縁部が
それぞれ露出するように形成すると、両電極板15,1
6の端面間に十分な絶縁耐力を維持することが可能とな
るので、第1PTC素子板11および第2PTC素子板
14のいずれかが抵抗転移温度に達して急激にその抵抗
値が増大して抵抗降下電圧により両電極板15,16の
端面間に過電圧が生じても、両電極板15,16の端面
間にフラッシュオーバが生じるという不具合を防止でき
るようになる。As described above, when the first PTC element plate 11 and the second PTC element plate 14 are formed so as to expose the peripheral edges of the respective surfaces, both electrode plates 15, 1 are formed.
6, it is possible to maintain a sufficient dielectric strength between the end faces, so that one of the first PTC element plate 11 and the second PTC element plate 14 reaches the resistance transition temperature, and the resistance value increases rapidly, and Even if an overvoltage occurs between the end faces of the two electrode plates 15 and 16 due to the voltage drop, it is possible to prevent a problem that flashover occurs between the end faces of the two electrode plates 15 and 16.
【0052】なお、本第1変形例を適用するに際して
は、両電極板15,16を金属電極板とする以外に、P
TC素子板11,14に直接メッキを施したり、メタリ
コンを照射するようにして電極を形成した場合にも本変
形例を適用できる。When the first modified example is applied, in addition to using both the electrode plates 15 and 16 as metal electrode plates,
This modification can also be applied to the case where the TC element plates 11 and 14 are directly plated or the electrodes are formed by irradiating the metallicon.
【0053】変形例2 上述した第1変形例においては、平面形状を四角形状に
形成した両電極板15,16を平面形状を四角形状に形
成した複合PTC素子体10aの両表面の中央部に配置
して、その端縁周縁部がそれぞれ露出するように形成す
るようにしている。このように両電極板15,16を配
置すると、両電極板15,16の角部に電界が集中して
この部分の電流密度が増加することとなる。角部の電流
密度が増加すると、第1PTC素子板11あるいは第2
PTC素子板14が局部的に抵抗転移温度に達するとい
う不具合を生じる。Modified Example 2 In the first modified example described above, the two electrode plates 15 and 16 each having a rectangular planar shape are provided at the center of both surfaces of a composite PTC element body 10a having a rectangular planar shape. They are arranged so that their peripheral edges are exposed. When the two electrode plates 15 and 16 are arranged in this manner, the electric field is concentrated on the corners of the two electrode plates 15 and 16 and the current density in this portion increases. When the current density at the corner increases, the first PTC element plate 11 or the second
There is a problem that the PTC element plate 14 locally reaches the resistance transition temperature.
【0054】具体的には、両電極板15,16間に電圧
を印加すると、図4の曲線で示すような電位分布が生じ
る。この電位分布曲線より明らかなように、両電極板1
5,16の角部の電界はそれ以外の部分の電界より密に
なり、電位傾度が高くなる。電位傾度が高くなるという
ことは、ある地点の電圧を分担する距離が短くなること
を意味するので、その間の抵抗値も相対的に小さくな
る。したがって、図4の矢印で示すように、両電極板1
5,16の角部の電流密度はそれ以外の部分の電流密度
より増加することとなる。Specifically, when a voltage is applied between the two electrode plates 15 and 16, a potential distribution as shown by the curve in FIG. 4 is generated. As is clear from this potential distribution curve, both electrode plates 1
The electric field at the corners of 5 and 16 becomes denser than the electric field at the other portions, and the potential gradient increases. An increase in the potential gradient means that a distance at which a voltage is shared at a certain point is shortened, so that a resistance value between them is relatively small. Therefore, as shown by the arrows in FIG.
The current densities at the corners 5 and 16 are higher than the current densities at other portions.
【0055】そこで、本第2変形例においては、このよ
うな電流密度の不均一を防止して、第1PTC素子板1
1あるいは第2PTC素子板14が局部的に抵抗転移温
度に達することを防止するために考えられた。ここで、
図5は本第2変形例のPTC限流器を示し、図5(a)
はその下面図であり、図5(b)は図5(a)のB−B
断面図である。本第2変形例においては、図5に示すよ
うに、両電極板15,16の角部を円弧状に面取り(例
えば、0.5r)加工して、角部に丸みを設けるように
している。Therefore, in the second modified example, the first PTC element plate 1
This was conceived to prevent the first or second PTC element plate 14 from locally reaching the resistance transition temperature. here,
FIG. 5 shows a PTC current limiter of the second modified example, and FIG.
FIG. 5B is a bottom view, and FIG. 5B is a BB view of FIG.
It is sectional drawing. In the second modification, as shown in FIG. 5, the corners of both electrode plates 15 and 16 are chamfered into an arc shape (for example, 0.5r) so that the corners are rounded. .
【0056】このように、両電極板15,16の角部に
丸みを設けるようにすると、この丸みに沿った電位分布
曲線が得られるようになるので、角部の電界はそれ以外
の部分の電界と等しくなって、電流密度も均一になるた
め、第1PTC素子板11あるいは第2PTC素子板1
4が局部的に抵抗転移温度に達することを防止でき、第
1PTC素子板11あるいは第2PTC素子板14の局
部的な劣化を防止できるようになる。If the corners of the two electrode plates 15 and 16 are rounded as described above, a potential distribution curve along the roundness can be obtained. Since it becomes equal to the electric field and the current density becomes uniform, the first PTC element plate 11 or the second PTC element plate 1
4 can be prevented from locally reaching the resistance transition temperature, and the first PTC element plate 11 or the second PTC element plate 14 can be prevented from being locally deteriorated.
【0057】変形例3 上述した実施形態においては、複合PTC素子体10a
の平面形状が四角形となっているため、この平面形状が
四角形の側壁の角部の電界はそれ以外の部分の側壁の電
界より密になり、側壁角部の電流密度が大きくなって、
この部分に応力が集中するという不具合を生じた。Modification 3 In the above embodiment, the composite PTC element body 10a
Because the plane shape of the square is a quadrangle, the electric field at the corner of the side wall of the square becomes denser than the electric field of the other side wall, and the current density at the corner of the side wall increases,
The problem that stress concentrates on this part occurred.
【0058】そこで、本第3変形例においては、このよ
うな応力集中を防止するために考えられた。ここで、図
6は本第3変形例のPTC限流器を示し、図6(a)は
その下面図であり、図6(b)は図6(a)のC−C断
面図である。本第3変形例においては、図6に示すよう
に、複合PTC素子体10aの側壁角部を面取り加工す
るとともに側壁も面取り加工して、角部に丸みを設ける
ようにしている。Therefore, in the third modified example, an attempt was made to prevent such stress concentration. Here, FIG. 6 shows a PTC current limiter of the third modified example, FIG. 6 (a) is a bottom view thereof, and FIG. 6 (b) is a cross-sectional view taken along line CC of FIG. 6 (a). . In the third modified example, as shown in FIG. 6, the corner of the side wall of the composite PTC element body 10a is chamfered, and the side wall is also chamfered, so that the corner is rounded.
【0059】このように、複合PTC素子体10aの側
壁角部を面取り加工するとともに側壁も面取り加工し
て、角部に丸みを設けるようにすると、この丸みに沿っ
た電位分布曲線が得られるようになるので、複合PTC
素子体10aの側壁角部および側壁の電界はそれ以外の
部分の電界と等しくなって、電流密度も均一になるた
め、複合PTC素子体10aの局部的な劣化を防止でき
るようになる。As described above, when the corner of the side wall of the composite PTC element body 10a is chamfered and the side wall is also chamfered so that the corner is rounded, a potential distribution curve along the rounded corner is obtained. , So composite PTC
The electric fields at the corners and the side walls of the element body 10a become equal to the electric fields at the other parts and the current density becomes uniform, so that local deterioration of the composite PTC element body 10a can be prevented.
【0060】なお、このようにして側壁角部および側壁
を面取り加工した複合PTC素子体10aの第1PTC
素子板11あるいは第2PTC素子板14の露出部に、
図7に示すように、絶縁性樹脂17をコーテイングした
り、あるいは絶縁性樹脂17を塗布または焼き付け処理
を行うことにより、絶縁耐力に優れた複合PTC素子体
10aが得られるようになる。The first PTC element 10a of the composite PTC element body 10a having the chamfered side wall corners and side walls as described above.
In the exposed portion of the element plate 11 or the second PTC element plate 14,
As shown in FIG. 7, by coating the insulating resin 17 or applying or baking the insulating resin 17, a composite PTC element body 10a having excellent dielectric strength can be obtained.
【0061】なお、本発明のPTC限流器は上述の実施
形態およびその変形例に限定されものではなく、例え
ば、低圧配線用遮断器、高圧および特別高圧以上の遮断
器に内蔵あるいは別個に直列に配置して用いることもで
きる。また、サイリスタ装置の保護用として用いること
もできるし、あるいは低圧ネットワーク配電用の限流ヒ
ューズの代わりに用いることができる。The PTC current limiter of the present invention is not limited to the above-described embodiment and its modifications. For example, the PTC current limiter may be built in a circuit breaker for low-voltage wiring, a circuit breaker for high-voltage and extra-high-voltage or higher, or may be separately connected in series. Can also be used. It can also be used to protect thyristor devices, or can be used in place of current limiting fuses for low voltage network distribution.
【図1】 本発明のPTC限流器の一実施形態の概略構
成を示す断面図である。FIG. 1 is a sectional view showing a schematic configuration of an embodiment of a PTC current limiter of the present invention.
【図2】 本発明のPTC限流器を送配電系統の電路に
接続する一例を示す図である。FIG. 2 is a diagram showing an example of connecting a PTC current limiter of the present invention to an electric circuit of a power transmission and distribution system.
【図3】 第1変形例のPTC限流器を示し、図3
(a)はその下面図であり、図3(b)は図3(a)の
A−A断面図である。FIG. 3 shows a PTC current limiter according to a first modification;
FIG. 3A is a bottom view, and FIG. 3B is a sectional view taken along line AA of FIG.
【図4】 電極板間に電圧を印加することにより得られ
ると電位分布曲線一部を示す図である。FIG. 4 is a diagram showing a part of a potential distribution curve obtained by applying a voltage between electrode plates.
【図5】 第2変形例のPTC限流器を示し、図5
(a)はその下面図であり、図5(b)は図5(a)の
B−B断面図である。5 shows a PTC current limiter according to a second modified example, and FIG.
5A is a bottom view, and FIG. 5B is a cross-sectional view taken along the line BB of FIG. 5A.
【図6】 第3変形例のPTC限流器を示し、図6
(a)はその下面図であり、図6(b)は図6(a)の
C−C断面図である。6 shows a PTC current limiter according to a third modification, and FIG.
6A is a bottom view, and FIG. 6B is a cross-sectional view taken along the line CC of FIG. 6A.
【図7】 図6のPTC限流器の露出部に絶縁性樹脂を
被覆した状態を示す図である。FIG. 7 is a view showing a state in which an exposed portion of the PTC current limiter of FIG. 6 is covered with an insulating resin.
10…PTC限流器、10a…複合PTC素子体、11
…第1PTC素子板、12…低熱量融点金属箔、13…
蓄熱器、14…第1PTC素子板、15,16…電極
板、15a,16a…固着用金属箔、20…遮断器、3
0…交流電源、40…負荷10: PTC current limiter, 10a: Composite PTC element body, 11
... 1st PTC element plate, 12 ... low calorie melting point metal foil, 13 ...
Heat storage device, 14: first PTC element plate, 15, 16: electrode plate, 15a, 16a: fixing metal foil, 20: circuit breaker, 3
0: AC power supply, 40: Load
Claims (10)
TC素子を用いて構成したバックアップ機能を備えたP
TC限流器であって、 所定の温度になるとその抵抗値が急激に増大する板状の
第1PTC素子板と同第1PTC素子板より抵抗値が増
大する温度が高くかつ抵抗増加に至るエネルギー量およ
び電流量が大きい板状の第2PTC素子板との少なくと
も2つのPTC素子板を電気的に直列接続して構成した
複合PTC素子体と、 前記複合PTC素子体の両表面にそれぞれ電気的に接続
される金属電極板とを備えたことを特徴とするバックア
ップ機能を備えたPTC限流器。A plurality of Ps having different resistance increasing temperatures.
P with backup function configured using TC element
A TC current limiter, wherein a plate-shaped first PTC element plate whose resistance value rapidly increases when a predetermined temperature is reached, and an energy amount at which the resistance value increases at a higher temperature than the first PTC element plate and which leads to an increase in resistance And a composite PTC element configured by electrically connecting at least two PTC element plates with a plate-shaped second PTC element plate having a large amount of current, and electrically connected to both surfaces of the composite PTC element body, respectively. A PTC current limiter having a backup function, comprising:
より溶解して蒸発する低熱量融点金属箔を前記第1PT
C素子板の表面に配設し、前記第1PTC素子板が損傷
して蒸発した金属により前記第1PTC素子板の損傷を
表示できるようにしたことを特徴とする請求項1に記載
のバックアップ機能を備えたPTC限流器。2. The method according to claim 1, wherein the first PTC element plate is melted and evaporated by a heat amount at the time of damage to the first PTC element plate.
2. The backup function according to claim 1, wherein the backup function is provided on a surface of the C element plate so that the damage of the first PTC element plate can be displayed by the metal evaporated and damaged by the first PTC element plate. Equipped with PTC current limiter.
て固化すると煤となる金属、溶解、蒸発してガスが吹き
出す金属、あるいは溶解、蒸発して変色する金属から形
成したことを特徴とする請求項2に記載のバックアップ
機能を備えたPTC限流器。3. The low-calorie metal foil is formed of a metal that melts and evaporates to form a soot when solidified, a metal that melts and evaporates to blow out a gas, or a metal that melts and evaporates and changes color. The PTC current limiter having a backup function according to claim 2.
素子板との間に前記第1PTC素子板あるいは前記第2
PTC素子板が発生した熱を吸収して蓄熱する蓄熱器を
介在させたことを特徴とする請求項1から請求項3のい
ずれかに記載のバックアップ機能を備えたPTC限流
器。4. The first PTC element plate and the second PTC
The first PTC element plate or the second
The PTC current limiter having a backup function according to any one of claims 1 to 3, wherein a heat storage unit that absorbs heat generated by the PTC element plate and stores the heat is interposed.
C素子体の両表面の前記第1PTC素子板および前記第
2PTC素子板の表面積より小さく形成するとともに、 前記金属電極板を前記第1PTC素子板および前記第2
PTC素子板の周辺部の表面が露出するように接続配置
したことを特徴とする請求項1から請求項4のいずれか
に記載のバックアップ機能を備えたPTC限流器。5. The composite PT having a surface area of
The first PTC element plate and the second PTC element plate are formed to be smaller than the surface areas of the first PTC element plate and the second PTC element plate on both surfaces of the C element body.
The PTC current limiter having a backup function according to any one of claims 1 to 4, wherein the PTC current limiter is provided with a connection so that a surface of a peripheral portion of the PTC element plate is exposed.
を施して、同角部に丸みを形成した平面形状が略四角形
状の板状体としたことを特徴とする請求項5に記載のバ
ックアップ機能を備えたPTC限流器。6. The metal electrode plate according to claim 5, wherein a corner of the metal electrode plate is chamfered to form a plate having a substantially square planar shape with a rounded corner. PTC current limiter with backup function.
取り加工を施して、同側壁の角部に丸みを形成したこと
を特徴とする請求項1から請求項6のいずれかに記載の
バックアップ機能を備えたPTC限流器。7. The composite PTC element body according to claim 1, wherein the corner of the side wall of the composite PTC element body is chamfered to form a round corner. PTC current limiter with backup function.
および前記第2PTC素子板と前記金属電極板とのそれ
ぞれの接合部に固着用金属箔を介在させて前記第1PT
C素子板と前記金属電極板および前記第2PTC素子板
と前記金属電極板とをそれぞれ固着したことを特徴とす
る請求項1から請求項7のいずれかに記載のバックアッ
プ機能を備えたPTC限流器。8. The first PTC element plate and the metal electrode plate, and the first PTC element plate and the metal electrode plate are each bonded to each other with a fixing metal foil interposed between the first PTC element plate and the metal electrode plate.
The PTC current limiting device having a backup function according to any one of claims 1 to 7, wherein the C element plate and the metal electrode plate and the second PTC element plate and the metal electrode plate are fixed to each other. vessel.
子板、前記第2PTC素子板および前記金属電極板より
硬度が小さい金属、あるいは前記第1PTC素子板、前
記第2PTC素子板および前記金属電極板より表面粗さ
が小さい金属から形成したことを特徴とする請求項8に
記載のバックアップ機能を備えたPTC限流器。9. The fixing metal foil is a metal having a lower hardness than the first PTC element plate, the second PTC element plate, and the metal electrode plate, or the first PTC element plate, the second PTC element plate, and the metal electrode. 9. The PTC current limiter having a backup function according to claim 8, wherein the PTC current limiter is formed of a metal having a smaller surface roughness than a plate.
子板および前記第2PTC素子板より硬度が大きくかつ
前記金属電極板より硬度が小さい金属、あるいは前記第
1PTC素子板および前記第2PTC素子板より表面粗
さが大きくかつ前記金属電極板より表面粗さが小さい金
属から形成したことを特徴とする請求項8に記載のバッ
クアップ機能を備えたPTC限流器。10. The fixing metal foil has a hardness higher than the first PTC element plate and the second PTC element plate and a lower hardness than the metal electrode plate, or the first PTC element plate and the second PTC element plate. 9. The PTC current limiter having a backup function according to claim 8, wherein the PTC current limiter is formed from a metal having a larger surface roughness and a smaller surface roughness than the metal electrode plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7841097A JPH10275711A (en) | 1997-03-28 | 1997-03-28 | Ptc current limiter provided with backup function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7841097A JPH10275711A (en) | 1997-03-28 | 1997-03-28 | Ptc current limiter provided with backup function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10275711A true JPH10275711A (en) | 1998-10-13 |
Family
ID=13661276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7841097A Pending JPH10275711A (en) | 1997-03-28 | 1997-03-28 | Ptc current limiter provided with backup function |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10275711A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100729011B1 (en) | 2006-02-22 | 2007-06-14 | 엘에스전선 주식회사 | PCC current-limiting module and 3-phase collective type current limiter using the same |
| KR100764297B1 (en) | 2006-02-22 | 2007-10-05 | 엘에스전선 주식회사 | Current breaker with PCC element |
| CN110785822A (en) * | 2017-05-24 | 2020-02-11 | Tdk电子股份有限公司 | Electrical devices with fuse elements |
| CN117728369A (en) * | 2024-02-18 | 2024-03-19 | 国网安徽省电力有限公司电力科学研究院 | PTC-based electromagnetic voltage transformer overvoltage suppression component |
-
1997
- 1997-03-28 JP JP7841097A patent/JPH10275711A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100729011B1 (en) | 2006-02-22 | 2007-06-14 | 엘에스전선 주식회사 | PCC current-limiting module and 3-phase collective type current limiter using the same |
| KR100764297B1 (en) | 2006-02-22 | 2007-10-05 | 엘에스전선 주식회사 | Current breaker with PCC element |
| CN110785822A (en) * | 2017-05-24 | 2020-02-11 | Tdk电子股份有限公司 | Electrical devices with fuse elements |
| JP2020521334A (en) * | 2017-05-24 | 2020-07-16 | ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトTdk Electronics Ag | Electrical components with fail-safe element |
| US11740280B2 (en) | 2017-05-24 | 2023-08-29 | Tdk Electronics Ag | Electric component with fail safe element |
| CN117728369A (en) * | 2024-02-18 | 2024-03-19 | 国网安徽省电力有限公司电力科学研究院 | PTC-based electromagnetic voltage transformer overvoltage suppression component |
| CN117728369B (en) * | 2024-02-18 | 2024-05-10 | 国网安徽省电力有限公司电力科学研究院 | PTC-based electromagnetic voltage transformer overvoltage suppression component |
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