JPH10277923A5 - - Google Patents

Info

Publication number
JPH10277923A5
JPH10277923A5 JP1998033924A JP3392498A JPH10277923A5 JP H10277923 A5 JPH10277923 A5 JP H10277923A5 JP 1998033924 A JP1998033924 A JP 1998033924A JP 3392498 A JP3392498 A JP 3392498A JP H10277923 A5 JPH10277923 A5 JP H10277923A5
Authority
JP
Japan
Prior art keywords
polishing
mechanical
abrasive
polished
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998033924A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10277923A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP3392498A priority Critical patent/JPH10277923A/ja
Priority claimed from JP3392498A external-priority patent/JPH10277923A/ja
Publication of JPH10277923A publication Critical patent/JPH10277923A/ja
Publication of JPH10277923A5 publication Critical patent/JPH10277923A5/ja
Pending legal-status Critical Current

Links

JP3392498A 1997-02-03 1998-01-31 研磨装置及び研磨方法 Pending JPH10277923A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3392498A JPH10277923A (ja) 1997-02-03 1998-01-31 研磨装置及び研磨方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP3548297 1997-02-03
JP9-35482 1997-02-03
JP3392498A JPH10277923A (ja) 1997-02-03 1998-01-31 研磨装置及び研磨方法

Publications (2)

Publication Number Publication Date
JPH10277923A JPH10277923A (ja) 1998-10-20
JPH10277923A5 true JPH10277923A5 (de) 2005-08-18

Family

ID=26372696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3392498A Pending JPH10277923A (ja) 1997-02-03 1998-01-31 研磨装置及び研磨方法

Country Status (1)

Country Link
JP (1) JPH10277923A (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US7195544B2 (en) * 2004-03-23 2007-03-27 Cabot Microelectronics Corporation CMP porous pad with component-filled pores
JP2010214575A (ja) * 2009-03-19 2010-09-30 Sumitomo Bakelite Co Ltd 被研磨物保持材用積層板の製造方法、被研磨物保持材用積層板および被研磨物保持材
JP7433170B2 (ja) * 2020-09-07 2024-02-19 株式会社ノリタケカンパニーリミテド ウェハ研磨方法及びウェハ研磨装置
JP7650218B2 (ja) * 2021-10-19 2025-03-24 ノリタケ株式会社 研磨パッド及びその製造方法
JP7728223B2 (ja) * 2022-03-30 2025-08-22 ノリタケ株式会社 研磨パッド及びその製造方法
JP2023150173A (ja) * 2022-03-31 2023-10-16 株式会社ノリタケカンパニーリミテド 研磨パッド

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