JPH1027963A - Multilayer printed wiring board and method of manufacturing the same - Google Patents

Abstract

(57) Abstract: An electroless plating film having an excellent adhesion strength is formed by forming an electroless plating film anchor on the surface of a resin insulating layer made of a heat-resistant resin. An object of the present invention is to provide a high-density multilayer printed wiring board which is formed and has excellent reliability easily and inexpensively. In a multilayer printed wiring board in which conductor patterns made of electroless plating and electrolytic plating and resin insulating layers made of a heat-resistant resin are alternately laminated, a thickness of 0.1 to 0.1 mm is applied to the surface of the resin insulating layer 4a. An 8 μm porous layer is provided to form an anchor of the electroless plating film, and the resin insulating layer 4a
The resin component comprises a plurality or a single thermosetting epoxy compound, and one of the components contains an alicyclic epoxy compound and has a structure as set forth in the claims.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board and a method for manufacturing the same, and more particularly, to alternately laminating a conductor pattern made of electroless plating and electrolytic plating and a resin insulating layer made of a heat-resistant resin. And a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, with the advance of electronic technology, electronic devices such as large-sized computers have been increased in density or speed of arithmetic functions. As a result, multilayer printed wiring boards, in which wiring circuits are formed in multiple layers for the purpose of increasing the density of printed wiring boards, have been spotlighted.
Conventionally, a typical multilayer printed wiring board is, for example, a multilayer printed wiring board in which an internal circuit is connected and made conductive. However, in such a multilayer printed wiring board, since a plurality of internal circuits are connected and conducted through through holes, the wiring circuit becomes too complicated, and it is difficult to realize high density or high speed. Met.

As a multilayer printed wiring board capable of overcoming such a problem, recently, a multilayer printed wiring board in which conductive patterns and organic insulating films are alternately built up has been developed. This multilayer printed wiring board is suitable for ultra-high density and high speed, but has a drawback in that it is difficult to form an electroless plating film on an organic insulating film with high reliability. For this reason, in such a multilayer printed wiring board, the conductor pattern is formed by a PVD method such as vapor deposition or sputtering or a combination of the PVD method and the electroless plating. The forming method has problems that productivity is low and cost is high.

Recently, as a method of forming an electroless plating film on such an organic insulating film with high reliability, an acid or an oxidizing agent (chromic acid, chromate, permanganate, etc.) is contained in a resin insulating layer. There has been proposed a method of roughening a surface in contact with an electroless plating film by mixing and dissolving and removing components soluble in water.

[0005] For example, as described in JP-A-64-47095, a heat-resistant resin insulating layer is used as a matrix, and an epoxy resin, a bismaleimide-triazine resin, and a polyester which are soluble in an oxidizing agent in a resin phase. There has been proposed a resin in which the surface of a resin insulating layer is roughened with an oxidizing agent to improve the anchor effect of forming an electroless plating film by mixing a resin such as a resin with a resin or an inorganic filler insoluble in the oxidizing agent.

[0006] Further, as disclosed in Japanese Patent Application Laid-Open No. Hei 7-34505, in which these effects are further enhanced, pseudo particles are formed with different sizes of resin particles soluble in an oxidizing agent to form a heat resistant matrix resin. A mixture of layers has been proposed. However, in these methods, the heat resistance of the resin particles dissolved with an oxidizing agent or the like in the heat-resistant resin insulating layer is inferior. The electroless plating film is formed while the soluble resin in the resin serving as the matrix remains in the resin as it is. Therefore, the heat resistance of the formed resin insulating layer depends on the heat resistance of the soluble resin, and as a result, there is a problem that a resin insulating layer having low heat resistance is formed.

[0007]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems of the conventional multilayer printed wiring board,
By forming an anchor of an electroless plating film on the surface of a resin insulating layer made of a heat resistant resin, a conductive pattern made of an electroless plating film and an electrolytic plating film having excellent adhesion strength is formed, and a high reliability having an excellent reliability is obtained. An object of the present invention is to provide a high-density multilayer printed wiring board easily and inexpensively.

[0008]

Means for Solving the Problems In order to achieve the above object in the present invention, first, in claim 1, a conductor pattern made of electroless plating and electrolytic plating and a resin insulating layer made of a heat resistant resin are alternately arranged. In the laminated multilayer printed wiring board, a thickness of 0.1 to
The present invention provides a multilayer printed wiring board characterized in that an 8 μm porous layer is provided to form an anchor for an electroless plating film.

According to a second aspect of the present invention, the resin component of the resin insulating layer comprises a plurality or a single thermosetting epoxy compound, and one of the components includes an alicyclic epoxy compound.

According to a third aspect of the present invention, the alicyclic epoxy compound has a structure represented by the following formula (1).

Further, the present invention provides a method for manufacturing a multilayer printed wiring board comprising the following steps (a) to (e). (A) a step of preparing a photosensitive resin mixed solution containing a thermosetting epoxy compound and an alicyclic epoxy compound as main components; (b) applying the photosensitive resin mixed solution onto a substrate on which a conductor pattern is formed; Forming a resin insulating layer; (c) forming a porous layer on the surface of the resin insulating layer by treating the surface of the resin insulating layer with an alkaline solution; (d) forming the porous layer. A step of forming a conductor layer by performing electroless plating and electrolytic plating on the resin insulating layer thus formed, and forming a conductor pattern by patterning; (e) performing the above steps (b) to (d) as many times as necessary A process of repeatedly producing a multilayer printed wiring board.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. FIG. 1 is a sectional view showing a configuration of a multilayer printed wiring board according to the present invention. 2 (a) to 2 (f) are cross-sectional views showing the steps of manufacturing a multilayer printed wiring board according to the present invention. FIG. 3 is a schematic sectional view showing a part of the configuration of the multilayer printed wiring board according to the present invention.

[0013] The multilayer printed wiring board of the present invention is formed by applying a photosensitive resin mixed solution containing a photosensitive resin solution and a thermosetting epoxy compound as main components and heat-curing to form a heat-resistant resin insulating layer. The surface of the resin insulating layer is treated with an alkaline solution to provide a porous layer having a thickness of 0.1 to 8 μm, and electroless plating and electrolytic plating are performed to form a conductor layer, thereby producing a conductor pattern having excellent adhesion strength. Is what you do.

The photosensitive resin mixed solution comprises a photosensitive resin solution, a thermosetting epoxy compound (comprising an alicyclic epoxy compound and a thermosetting epoxy resin), an inorganic filler, a photoinitiator, a dispersant, and a solvent. It is obtained by mixing and stirring.

It is useful that the compounding ratio of the alicyclic epoxy compound forming the thermosetting epoxy compound to the thermosetting epoxy resin is 1: 1 to 1: 0 (weight ratio). In particular, the ratio is preferably in the range of 4: 1 to 2: 1 (weight ratio) for providing the porous layer on the surface of the resin insulating layer. The reason is that if the compounding amount of the alicyclic epoxy compound is smaller than the compounding amount of the thermosetting epoxy resin, it is difficult to perform treatment with an alkaline solution after heat curing, and it is difficult to form a porous layer, and the resin insulation This is because sufficient adhesion strength between the layer and the electroless plating film cannot be obtained.

The amount of the inorganic filler is 2 parts per 100 parts by weight (solid content) of the heat-resistant resin constituting the matrix.
Advantageously, it is in the range of from 100 to 100 parts by weight, in particular 5
It is preferable that the content be in the range of 40 to 40 parts by weight in order to obtain a sufficient adhesion strength between the resin insulating layer and the electroless plating film. If the amount of the inorganic filler is less than 2 parts by weight, sufficient adhesion strength between the resin insulating layer and the electroless plating film cannot be obtained. On the other hand, if it exceeds 100 parts by weight, it becomes difficult to form a porous layer on the surface of the resin insulating layer.

As a solvent for dissolving the heat-resistant resin,
Common solvents, for example, methyl ethyl ketone, methyl isobutyl ketone, methyl cellosolve, ethyl cellosolve,
Butyl carbitol, butyl cellulose, tetralin,
Dimethylformamide, n-methylpyrrolidone and the like can be used.

Hereinafter, a method for manufacturing a multilayer printed wiring board according to the present invention will be described in detail with reference to FIG.

First, a photoresist is applied to the first conductor layer 2 formed on the insulating substrate 1 and exposed in a predetermined pattern, and then developed to form a resist pattern 3 (FIG. 2).
(See (a)), the first conductor layer 2 is etched to form a first conductor pattern 2a (see FIG. 2B). As the insulating substrate 1, for example, a plastic substrate, a ceramic substrate, a metal substrate, a film substrate, or the like can be used. Specifically, a glass epoxy substrate, a low-temperature fired ceramic substrate, an aluminum nitride substrate, an aluminum substrate, an iron substrate, A polyimide film substrate or the like can be used. When a conductive substrate is used, an insulating layer is formed on both surfaces before use.

Next, the photosensitive resin mixed solution is applied on the substrate on which the first conductor pattern 2a is formed, and the coating is dried to form a photosensitive resin insulating layer 4 (see FIG. 2C).
As a method of forming the photosensitive resin insulating layer, a method of applying the photosensitive resin mixed solution or a method of attaching a photosensitive resin film obtained by processing the photosensitive resin mixed solution into a film can be applied. As the coating method, for example, various means such as a roller coating method, a dip coating method, a spray coating method, a spinner coating method, a curtain coating method, and a screen printing method can be applied.

The photosensitive resin insulating layer usually has a thickness of 20 to
The thickness is preferably 100 μm, but it can be thicker if particularly high insulation is required.

Next, the photosensitive resin insulating layer is exposed and developed using a photomask in which a predetermined pattern is formed, and then heated and cured at a temperature of 150 ° C. or more to form a resin insulating layer having via hole forming holes 5. Form the layer 4a (FIG. 2D)
reference). Here, the via hole forming hole is formed by a photo process method, but a laser processing method can be applied as another forming method.

Next, the surface of the resin insulating layer 4a and the side walls of the via hole forming holes are subjected to surface treatment using an alkaline solution to form a porous layer of 0.1 to 8 μm on the resin surface. When the thickness of the porous layer is less than 0.1 μm, the adhesiveness becomes extremely weak, and when the thickness is 8 μm or more, the insulating property of the resin insulating layer deteriorates, and the heat resistance decreases. As a method of this surface treatment, a method in which the substrate on which the resin insulating layer is formed is immersed in an alkaline solution, or a method in which an alkaline solution is sprayed on the surface of the resin insulating layer can be applied. Furthermore, as the alkaline solution used in this step, a surfactant is mixed with an alkaline aqueous solution such as a 1 to 10% aqueous solution of sodium hydroxide, an aqueous solution of sodium carbonate, or an aqueous solution of sodium hydrogen carbonate in order to increase the affinity between the resin insulating layer. What was done.

Next, the via hole 6 and the second conductor layer 7 are formed by performing electroless plating and electrolytic plating on the resin insulating layer having the porous layer formed on the surface.
(E)). Examples of the types of the electroless plating and the electrolytic plating include copper plating, nickel plating, gold plating, silver plating, and tin plating, and copper plating is generally used.

Next, a photoresist is applied on the second conductor layer 7, and a second conductor pattern 7a is formed by a photo patterning process (see FIG. 2F). As a method for forming the conductor pattern, in addition to the method of forming the conductor layer by the photopatterning process after forming the conductor layer, the conductor pattern is formed in advance with a plating resist, and then the electroless plating is performed. Also, a method of directly forming a conductor pattern by performing electrolytic plating can be applied.

Through the above steps, a multilayer printed wiring board of the present invention having a two-layer conductor pattern is obtained. Further, in the case of manufacturing a multilayer wiring board having two or more layers, a desired multilayer printed wiring board can be obtained by sequentially repeating the resin insulating layer and the conductor pattern forming step.

[0027]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a multilayer printed wiring board according to an embodiment of the present invention.

Example 1 First, 52 parts by weight of a bisphenol A type epoxy acrylate (Lipoxy VR-90; manufactured by Showa Polymer Co., Ltd.) and 15 parts by weight of phthalic anhydride were stirred at 110 ° C. for 30 minutes in a methyl ethyl ketone solvent. An alkali developing type photosensitive resin solution (A) was prepared.

Next, a glass epoxy copper-clad laminate (FR-
4: Laminate a photosensitive dry film (manufactured by DuPont) on the first conductor layer 2 (copper foil) of Hitachi Chemical Co., Ltd. to form a photosensitive layer, and then use a photomask on which a desired pattern is formed. UV exposure and printing were performed. Next, development was performed with 1,1-trichloroethane to form a resist pattern 3 (see FIG. 2A).

Next, after removing copper in the non-conductor portion using a cupric chloride etching solution, the resist pattern 3 was peeled off with methylene chloride to form a first conductor pattern 2a (see FIG. 2B). ).

Next, 40 parts by weight (solid content) of the alkali-developable photosensitive resin solution (A), 17.5 parts by weight of an alicyclic epoxy compound (EHPE3150; manufactured by Daicel Chemical Industries, Ltd.), and a thermosetting epoxy resin (Epiclon HP7200
H; manufactured by Dainippon Ink and Chemicals, 8.5 parts by weight, photoinitiator (Lu
Cirin TPO; 1.0 part by weight from BASF; 5.0 parts by weight of an inorganic filler (silica fine particles; manufactured by Denki Kagaku Kogyo); and 0.5 parts by weight of a dispersant (DISPERBYK; manufactured by BYK Chemie), a methyl isobutyl ketone solvent. In addition, the mixture was dispersed in a continuous horizontal sand mill for about 3 hours to prepare a photosensitive resin mixed solution (B).

Next, the photosensitive resin mixed solution (B) is applied on the insulating substrate 1 on which the first conductor pattern 2a is formed by curtain coating, dried at 70 ° C. for 20 minutes, and dried for about 50 minutes.
A photosensitive resin insulating layer 4 having a thickness of μm was formed (see FIG. 2C).

Next, the photosensitive resin insulating layer 4 is exposed to light of about 1000 mJ / cm ² using an ultra-high pressure mercury lamp using a photomask, photo-cured, and developed with an aqueous solution of about 1% sodium carbonate. After a drying process at 180 ° C. for one hour, a resin insulating layer 4a having via hole forming holes 5 was formed (see FIG. 2D).

Next, the thermally cured resin insulation layer 4a is
The mixture was treated for 20 minutes with an alkaline solution consisting of a mixture of a 3% aqueous sodium hydroxide solution at 10 ° C. and a 10% MLB solution (surfactant; manufactured by Shipley). Here, the resin insulating layer 4a
Was observed with an electron microscope, and it was confirmed that a porous layer 4a ′ of about 5 μm was formed on the surface of the resin insulating layer 4a (see FIG. 3).

Next, the porous layer 4 is formed on the surface of the resin insulating layer 4a.
After immersing the substrate on which a 'is formed in a palladium catalyst (manufactured by Shipley), the catalyst is activated and immersed in an electroless plating bath for about 30 minutes to form an electroless plating film having a thickness of about 0.5 μm. did. Thereafter, electrolytic copper plating was performed for about 2 hours to form a second conductor layer 7 having a via hole 6 and a thickness of about 30 μm (see FIG. 2E).

Next, after laminating a photosensitive dry film (manufactured by DuPont) on the second conductor layer 7 to form a photosensitive layer, ultraviolet exposure and baking are performed using a photomask on which a desired pattern is formed. Develop with 1,1,1-trichloroethane to form a resist pattern.
After the copper in the non-conductor portion was removed using a copper etchant, the resist pattern was peeled off with methylene chloride to form a second conductor pattern 7a (see FIG. 2 (f)). Through the above steps, a multilayer printed wiring board according to the present invention including two conductor patterns was obtained.

The above multilayer printed wiring board is soldered (260
C.) for about 20 seconds, no change was observed. Further, the plating peel strength of the conductor pattern was measured and found to be 1.0 kg / cm.

Here, a multilayer printed wiring board having a two-layer conductor pattern has been described. In the case of manufacturing a multilayer wiring board having two or more layers, the above-described steps are repeated a required number of times to obtain a desired multilayered wiring board. A printed wiring board is obtained.

<Example 2> First, 52 parts by weight of bisphenol A type epoxy acrylate (Ripoxy VR-90; manufactured by Showa Polymer Co., Ltd.) and 15 parts by weight of phthalic anhydride were stirred at 110 ° C for 30 minutes in a methyl ethyl ketone solvent. An alkali developing type photosensitive resin solution (A) was prepared.

Next, a glass epoxy copper-clad laminate (FR-
4; manufactured by Hitachi Chemical Co., Ltd.) on the first conductor layer 2 (copper foil)
A resist pattern 3 was formed in the same steps as in Example 1 (see FIG. 2A).

Next, a first conductor pattern 2a was formed in the same process as in Example 1 (see FIG. 2B).

Next, 30 parts by weight (solid content) of the alkali-developable photosensitive resin solution (A), 15 parts by weight of an alicyclic epoxy compound (EHPE3150; manufactured by Daicel Chemical Co., Ltd.)
5.0 parts by weight of a thermosetting epoxy resin (Epiclon HP7200H; manufactured by Dainippon Ink Co., Ltd.), a photoinitiator (Lucir)
inTPO: 1.0 part by weight from BASF; inorganic filler (Sylysia; from Fuji Silysia Chemical Ltd.) 5.0 parts by weight; dispersant (DISPERBYK; from Big Chemie)
0.5 parts by weight of a solvent for methyl isobutyl ketone was added thereto and dispersed in a continuous horizontal sand mill for about 3 hours to prepare a photosensitive resin mixed solution (C).

Next, the photosensitive resin mixture (C) is applied on the insulating substrate 1 on which the first conductor pattern 2a is formed by curtain coating, dried at 80 ° C. for 10 minutes, and dried for about 50 minutes.
A photosensitive resin insulating layer 4 having a thickness of μm was formed (see FIG. 2C).

Next, using a photomask in which a desired pattern is formed on the photosensitive resin insulating layer 4, exposure is performed at about 1000 mJ / cm ² by an ultra-high pressure mercury lamp, and photo-curing is performed. Develop with sodium aqueous solution, 200
The resin insulating layer 4a having the via hole forming hole 5 was formed through a drying process at 1 ° C. for 1 hour (see FIG. 2C).

Next, the thermally cured resin insulating layer 4a is
The mixture was treated for 20 minutes with an alkaline solution consisting of a mixture of a 3% aqueous sodium hydroxide solution at 10 ° C. and a 10% MLB solution (surfactant; manufactured by Shipley). Here, the resin insulating layer 4a
When observed with an electron microscope, it was confirmed that a porous layer 4a 'of about 7 μm was formed on the surface of the resin insulating layer 4a (see FIG. 3).

Next, the porous layer 4 is formed on the surface of the resin insulating layer 4a.
After immersing the substrate on which a 'is formed in a palladium catalyst (manufactured by Shipley), the catalyst is activated and immersed in an electroless plating bath for about 30 minutes to form an electroless plating film having a thickness of about 0.5 μm. did. Thereafter, electrolytic copper plating was performed for about 2 hours to form a second conductor layer 7 having a via hole 6 and a thickness of about 30 μm (see FIG. 2E).

Next, in the same process as in Example 1, the second conductor layer 7 on the resin insulation layer 4a was patterned to form a second conductor pattern 7a (see FIG. 2F). Through the above steps, a multilayer printed wiring board according to the present invention comprising a two-layer conductor pattern was obtained.

The multilayer printed wiring board produced as described above was immersed in a solder bath (260 ° C.) for about 20 seconds, but no change was observed. The measured peel strength of the conductive pattern was about 1.2 kg / cm.

Here, a multilayer printed wiring board having a two-layer conductor pattern has been described. In the case of manufacturing a multilayer wiring board having two or more layers, the above-described steps are repeated as many times as necessary to obtain a desired multilayer. A printed wiring board is obtained.

Comparative Example 1 First, 52 parts by weight of bisphenol A type epoxy acrylate (Lipoxy VR-90; manufactured by Showa Polymer Co., Ltd.) and 15 parts by weight of phthalic anhydride were stirred at 110 ° C. for 30 minutes in a methyl ethyl ketone solvent. An alkali developing type photosensitive resin solution (A) was prepared.

Next, a first conductor pattern 2a was formed on the insulating substrate 1 of a glass epoxy copper clad laminate (FR-4; manufactured by Hitachi Chemical Co., Ltd.) in the same process as in Example 1.

Next, 30 parts by weight (solid content) of the alkali-developable photosensitive resin solution (A), 5 parts by weight of an alicyclic epoxy compound (EHPE3150; manufactured by Daicel Chemical Co., Ltd.), and a thermosetting epoxy resin (Epiclon) HP7200H; manufactured by Dainippon Ink and Chemicals, 20 parts by weight, photoinitiator (Lucirin)
1.0 parts by weight of TPO; manufactured by BASF; 5.0 parts by weight of an inorganic filler (silica fine particles; manufactured by Denki Kagaku Kogyo); and 0.5 of a dispersant (DISPERBYK; manufactured by Big Chemie).
The weight part was added to a methyl isobutyl ketone solvent and dispersed in a continuous horizontal sand mill for about 3 hours to prepare a photosensitive resin mixed solution (D).

Next, the photosensitive resin mixed solution (D) is applied on the insulating substrate 1 on which the first conductive pattern 2a is formed by curtain coating, dried at 70 ° C. for 20 minutes, and dried for about 50 minutes.
A photosensitive resin insulating layer 4 having a thickness of μm was formed.

Next, using a photomask in which a desired pattern is formed on the photosensitive resin insulating layer 4, an exposure of about 1000 mJ / cm ² is performed by an ultra-high pressure mercury lamp, and photo-cured. Develop with sodium aqueous solution, 180
After a drying process at 1 ° C. for 1 hour, a resin insulating layer 4 a having via hole forming holes 5 was formed.

Next, the thermally cured resin insulation layer 4a is
The mixture was treated for 20 minutes with an alkaline solution consisting of a mixture of a 3% aqueous sodium hydroxide solution at 10 ° C. and a 10% MLB solution (surfactant; manufactured by Shipley). When the surface-treated resin insulating layer 4a was observed with an electron microscope, the resin insulating layer 4a
It was confirmed that no porous layer was formed on the surface.

Next, after being immersed in a palladium catalyst (manufactured by Shipley), the catalyst was activated and placed in an electroless plating bath for about 3 hours.
By immersion for 0 minutes, an electroless plating film having a thickness of about 0.5 μm was formed. Thereafter, electrolytic copper plating was performed for about 2 hours to form a second conductor layer 7 having a via hole 6 and a thickness of about 30 μm.

Next, in the same process as in Example 1, the second conductor layer 7 on the resin insulating layer 4a was patterned to form a second conductor pattern 7a, thereby producing a multilayer printed wiring board.

The multilayer printed wiring board prepared as described above was immersed in a solder bath (260 ° C.) for about 20 seconds. As a result, it was found that the conductor pattern was partially peeled from the substrate. The measured peel strength of the conductive pattern was about 0.2 kg / cm.

[0059]

According to the multilayer printed wiring board of the present invention, a porous layer is formed on the surface of the resin insulating layer by treating the resin insulating layer formed of a photosensitive resin mixture containing an alicyclic epoxy compound with an alkaline solution. Is formed, the adhesion between the conductive pattern formed by electroless plating and electrolytic plating and the resin insulating layer is strong, and a multi-layer printed wiring board with high heat resistance can be provided.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a configuration of a multilayer printed wiring board according to the present invention.

FIGS. 2A to 2F are cross-sectional views illustrating steps of manufacturing a multilayer printed wiring board according to the present invention.

FIG. 3 is a schematic sectional view showing a part of the configuration of the multilayer printed wiring board according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 2 ... 1st conductor layer 2a ... 1st conductor pattern 3 ... Resist pattern 4 ... Photosensitive resin insulation layer 4a ... Resin insulation layer 4a '... Porous layer 5 … Via hole forming hole 6… Via hole 7… Second conductor layer 7 a… Second conductor pattern

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Jiro Watanabe 1-5-1, Taito, Taito-ku, Tokyo Toppan Printing Co., Ltd.

Claims (4)

[Claims] 1. A multilayer printed wiring board in which conductive patterns made of electroless plating and electrolytic plating and resin insulating layers made of a heat-resistant resin are alternately laminated, a surface of the resin insulating layer having a thickness of 0.1 to 8 μm. A multilayer printed wiring board characterized in that an anchor of an electroless plating film is formed by providing a porous layer as described above. 2. The method according to claim 1, wherein the resin component of the resin insulating layer comprises a plurality or a single thermosetting epoxy compound, and one of the components includes an alicyclic epoxy compound. Multilayer printed wiring board. 3. The alicyclic epoxy compound according to claim 1, 3. A structure as set forth in claim 1, wherein:
The multilayer printed wiring board according to the above. 4. The method for manufacturing a multilayer printed wiring board according to claim 1, comprising the following steps (a) to (e). (A) a step of preparing a photosensitive resin mixed solution containing a thermosetting epoxy compound and an alicyclic epoxy compound as main components; (b) applying the photosensitive resin mixed solution onto a substrate on which a conductor pattern is formed; Forming a resin insulating layer by heat curing; (c) forming a porous layer on the surface of the resin insulating layer by treating the surface of the resin insulating layer with an alkaline solution; Forming a conductive layer by performing electroless plating and electrolytic plating on the resin insulating layer on which the porous layer has been formed, and performing a patterning process to form a conductive pattern; (e) the steps (b) to (d) A step of manufacturing a multilayer printed wiring board by repeating the steps as necessary.