JPH10303345A - Mounting structure of semiconductor chip on substrate - Google Patents

Abstract

(57) [Problem] To provide a mounting structure of a semiconductor chip on a substrate, which allows the semiconductor chip to be easily surface-mounted on a substrate by a pressure connection method. SOLUTION: A tongue piece 20 made of a flexible member is provided on a substrate 10, and a tongue piece 20 is formed on a substrate 10 immediately below the tongue piece 20 in which a gap 30 for bending and immersing the tongue piece 20 is provided. On the surface of the tongue piece 20, a connection terminal 50 electrically connected to the connection circuit 40 of the substrate 10 is formed. Then, with the conductive bump 80 made of Au or the like formed on the electrode 72 of the semiconductor chip mounted on the connection terminal 50 on the surface of the tongue piece 20, the semiconductor chip 70 is mounted on the substrate 10 using a spring material or the like. Press in the direction. And the electrode 7 of the semiconductor chip
The bump 80 formed on the second 2 is press-connected to the connection terminal 50 on the surface of the tongue piece 20 by using the elastic force of the tongue piece 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for mounting a semiconductor chip on a substrate so that the semiconductor chip can be detachably mounted on the substrate using a mechanical connection method.

[0002]

2. Description of the Related Art Surface-mounted semiconductor chips are generally
Solder bumps formed on the electrodes of the chip are connected by soldering to connection terminals on the substrate, and the semiconductor chip is surface-mounted on the substrate.

In this method, since the electrodes of the semiconductor chip are integrally soldered and connected to the connection terminals on the substrate, the fragile semiconductor chip or the fragile semiconductor chip is subjected to thermal stress acting between the semiconductor chip and the substrate on which the semiconductor chip is mounted. There is a possibility that cracks may occur in the substrate. Therefore, in this method, it is necessary to make the thermal expansion coefficients of the semiconductor chip and the substrate substantially equal.
Therefore, this method is limited by the material for forming the substrate.

When replacing a semiconductor chip surface-mounted on a substrate, it is necessary to heat and melt the solder connecting the electrodes of the semiconductor chip to the connection terminals on the substrate. It takes a lot of trouble and time to work.

To solve such a problem, there has been conventionally known a method of mechanically press-connecting an electrode of a semiconductor chip to a connection terminal on a substrate.

In this method, a semiconductor chip is pressed in the direction of a substrate by using a spring material or the like, and a bump made of Au or the like formed on an electrode of the semiconductor chip is press-connected to a connection terminal on the substrate. I have.

In this method, since the bumps formed on the electrodes of the semiconductor chip are press-connected to the connection terminals on the substrate so as to be movable in the lateral direction, thermal stress acts between the semiconductor chip and the substrate. In this case, the semiconductor chip can be finely moved left and right on the substrate in a direction to reduce the thermal stress. Then, it is possible to prevent the semiconductor chip or the substrate from being cracked by the thermal stress acting between the semiconductor chip and the substrate.

[0008]

However, in the above-mentioned press-connecting method, bumps formed on a plurality of electrodes of a semiconductor chip are electrically connected to a plurality of connection terminals on a substrate corresponding to the bumps. In order to do so, it is necessary to uniformly polish or the like to make the heights of the plurality of bumps uniform. Then, it is necessary to press-connect the plurality of bumps to the corresponding plurality of connection terminals arranged at the same height on the substrate with a uniform pressing force.

[0009] Therefore, in the press-connecting method described above, it takes a great deal of time and labor to grind the bumps formed on the plurality of electrodes of the semiconductor chip to make the heights of the bumps uniform. It took labor and effort.

The present invention can solve such problems.
A semiconductor chip-to-substrate mounting structure that allows the semiconductor chip to be easily surface-replaced to the substrate by a pressure contact connection
(Referred to as mounting structure).

[0011]

In order to achieve the above object, a first mounting structure of the present invention is a tongue piece made of a flexible member formed on a substrate, and a tongue piece directly below the tongue piece. A connection terminal electrically connected to the connection circuit of the substrate is formed on the surface of the tongue piece where a gap for immersing the tongue piece is formed, and the connection terminal is formed of conductive material formed on the electrode of the semiconductor chip. It is characterized in that the bumps are connected by pressure using the elastic force of the tongue pieces.

A second mounting structure according to the present invention is a tongue piece made of a flexible member formed on a substrate, and the surface of the tongue piece having a gap formed on the substrate immediately below the tongue piece. A connection terminal electrically connected to the connection circuit of the substrate is formed, and a conductive bump formed on the connection terminal is connected to the electrode of the semiconductor chip by pressure contact using the elastic force of the tongue. It is characterized by being done.

In the first or second mounting structure,
Even if there is a height difference between the bumps formed on the plurality of electrodes of the semiconductor chip or the bumps formed on the connection terminals on the surfaces of the plurality of tongue pieces on the substrate, each of the bumps corresponds to the bump. The plurality of tongue pieces on the board are pressed directly against the connection terminals on the surface of each of the plurality of tongue pieces on the board, or the plurality of electrodes of the corresponding semiconductor chip, according to the height difference between the bumps. The substrate can be flexed into the gap on the substrate and immersed to a suitable depth. Then, by using the elastic force of the tongue, the plurality of bumps having the height difference are connected to the connection terminals on the surfaces of the plurality of tongues on the substrate corresponding to the bumps or the electrodes of the semiconductor chip corresponding to the bumps. Pressure connection can be made with a certain pressing force or more.

According to a third mounting structure of the present invention, a connection circuit of the substrate is provided on a surface of a projection formed of a flexible member formed on a substrate and having a void formed therein so that the projection is immersed therein. A connection terminal electrically connected to the semiconductor chip is formed, and a conductive bump formed on an electrode of the semiconductor chip is press-connected to the connection terminal by using an elastic force of the projection. I have.

A fourth mounting structure according to the present invention is a projection formed of a flexible member formed on a substrate, and the connection circuit of the substrate is formed on a surface of the projection having a void formed therein so that the projection is immersed therein. A connection terminal electrically connected to the connection terminal is formed, and a conductive bump formed on the connection terminal is connected to an electrode of the semiconductor chip by pressure contact using an elastic force of the projection. I have.

In the third or fourth mounting structure,
Even if there is a height difference between the conductive bumps on each of the plurality of electrodes of the semiconductor chip or the bumps on the connection terminals on the surface of each of the plurality of protrusions on the substrate, each of those bumps is placed on the corresponding substrate on the substrate. The plurality of protrusions on the substrate are pressed into the internal voids according to the height difference between the bumps by pressing the connection terminals on the surface of each protrusion or the plurality of electrodes of the corresponding semiconductor chip. And can be immersed in the appropriate depth. Then, by using the elastic force of the projection, the plurality of bumps having the height difference are connected to the plurality of connection terminals on the surface of each projection on the substrate or the plurality of electrodes of the semiconductor chip corresponding to the bumps. , And can be connected by pressure contact with a certain pressing force or more.

According to a fifth mounting structure of the present invention, a terminal electrically connected to an electrode of the semiconductor chip is formed on a surface of a resilient projection formed on the semiconductor chip, and the terminal is formed on the terminal. The conductive bumps are connected by pressure to the connection terminals on the substrate using the elastic force of the projections.

According to a sixth mounting structure of the present invention, a terminal electrically connected to an electrode of the semiconductor chip is formed on a surface of a resilient projection formed on the semiconductor chip, and the terminal is provided on the substrate. The conductive bumps formed on the connection terminals are connected by pressure using the elastic force of the projections.

In the fifth or sixth mounting structure,
Even if there is a height difference between the bumps formed on the terminals on the surface of each of the plurality of protrusions on the semiconductor chip, or the bumps formed on the plurality of connection terminals on the substrate, the bumps corresponding to the bumps are formed. The plurality of connection terminals on the substrate, or the corresponding plurality of protrusions formed on the semiconductor chip by pressing against the terminals on the surface of the plurality of protrusions on the semiconductor chip,
In accordance with the height difference between the bumps, the bumps can be squashed below the bumps by an appropriate amount. And each of those bumps,
To a plurality of connection terminals on the corresponding substrate, or to a plurality of projection surface terminals on the corresponding semiconductor chip,
By using the elastic force of the projection, pressure connection can be made with a certain pressing force or more.

A seventh mounting structure according to the present invention is a projection formed of a flexible member formed on a semiconductor chip, and the projection of the semiconductor chip is provided with a void inside the projection to allow the projection to enter. A terminal electrically connected to the electrode is formed, and a conductive bump formed on the terminal is connected to the connection terminal on the substrate by pressure contact using the elastic force of the projection. I have.

An eighth mounting structure according to the present invention is characterized in that a projection made of a flexible member formed on a semiconductor chip is provided on the surface of the projection having a void formed therein so that the projection can be immersed therein. A terminal electrically connected to the electrode is formed, and a conductive bump formed on the connection terminal on the substrate is press-connected to the terminal by using an elastic force of the projection. I have.

In the seventh or eighth mounting structure,
Even if there is a height difference between the bumps formed on the terminals on the surface of each of the plurality of protrusions on the semiconductor chip, or the bumps formed on the plurality of connection terminals on the substrate, the bumps corresponding to the bumps are formed. The plurality of connection terminals on the substrate, or the corresponding plurality of protrusions formed on the semiconductor chip by pressing against the terminals on the surface of the plurality of protrusions on the semiconductor chip,
In accordance with the height difference between the bumps, the bumps can be bent into the gaps inside the bumps so as to be appropriately immersed in the depth. Then, by applying the elastic force of the projection to each of the plurality of connection terminals on the corresponding substrate or the corresponding plurality of projection surface terminals on the semiconductor chip, a predetermined pressing force is applied to each of the bumps. Thus, the crimp connection can be performed.

[0023]

Next, embodiments of the present invention will be described with reference to the drawings. 1 to 3 show a preferred embodiment of the first mounting structure of the present invention. FIG. 1 is a plan view of the substrate, FIG. 2 is a sectional view taken along line AA of FIG. 1, and FIG. It is. Hereinafter, the first mounting structure will be described.

In the first mounting structure shown in the figure, the substrate 10 is formed by laminating three upper, middle and lower synthetic resin plates 12, 14 and 16.

On the surface of the upper synthetic resin plate 12, horseshoe-shaped slits 12a are formed in a matrix at predetermined pitches by laser processing or the like. A tongue piece 20 made of a synthetic resin plate 12 of a flexible member is formed on the substrate 10 inside each slit 12a.

In the synthetic resin plate 14 as an intermediate layer on the substrate 10 immediately below the tongue piece 20, gaps 30 for immersing the tongue piece 20 are formed in a grid at predetermined pitches in the vertical and horizontal directions.

A connection circuit 40 is formed on the upper surface of the lower synthetic resin plate 16. On the surface of the tongue piece 20, conductive connection terminals 50 are formed in layers. In the upper synthetic resin plate 12 corresponding to the base of the tongue piece 20 and the intermediate synthetic resin plate 14 immediately below, a via 60 formed by filling a through hole with a conductor is provided with a synthetic resin plate of the upper and intermediate layers. 12, 1
4 are continuously formed vertically. And
Via the via 60, the connection circuit 40 on the upper surface of the lower synthetic resin plate 16 and the connection terminal 50 on the surface of the tongue piece 20 are electrically connected.

The connection terminal 50 on the surface of the tongue piece 20 on the substrate 10
As shown in FIG. 3, a substantially hemispherical bump 80 made of conductive Au or the like formed on the electrode 72 of the semiconductor chip is pressed and connected using the elastic force of the tongue piece 20. ing.

Specifically, as shown in FIG. 3, the bumps 80 on the electrodes 72 of the semiconductor chip are mounted on the corresponding connection terminals 50 on the surface of the tongue piece 20 on the substrate 10, and 70 is pressed in the direction of the substrate 10 using a spring material (not shown) or the like. Then, the bumps 80 on the electrodes 72 of the semiconductor chip are placed on the corresponding substrate 1.
It is press-connected to the connection terminal 50 on the surface of the tongue piece 20 on the top.

The first mounting structure shown in FIGS. 1 to 3 is configured as described above. In this first mounting structure, as shown in FIG. Even if there is a height difference between the bumps 80 formed on the respective electrodes 72, the bumps 80 are pressed against the corresponding connection terminals 50 on the surfaces of the plurality of tongue pieces 20 on the substrate 10, and Of each of the plurality of tongue pieces 20 is
Of the space 30 on the substrate 10 immediately below the gap 30
And can be immersed in the appropriate depth. Then, the plurality of bumps 80 having the height difference are applied to the connection terminals 50 on the surfaces of the plurality of tongue pieces 20 on the substrate 10 corresponding thereto by using the elastic force of the tongue pieces 20 at a constant pressing force. As described above, the pressure connection can be reliably performed.

FIG. 4 shows a preferred embodiment of the second mounting structure of the present invention, and FIG. 4 is an explanatory view thereof. Hereinafter, the second mounting structure will be described.

In the second mounting structure shown in the figure, the bumps are not formed on the electrodes 72 of the semiconductor chip, and the tongue pieces 2 on the substrate 10 are formed.
A substantially hemispherical bump 90 made of conductive Au or the like is formed on the connection terminal 50 on the zero surface. Then, the bump 90 is connected to the corresponding electrode 72 of the semiconductor chip.
Then, pressure connection is performed using the elastic force of the tongue piece 20.

In other respects, the structure is the same as that of the first mounting structure shown in FIGS. 1 to 3. In the second mounting structure, the connection of the surfaces of the plurality of tongue pieces 20 on the substrate 10 is performed. Even if there is a height difference between the bumps 90 formed on the terminals 50, the bumps 90 are pressed against the plurality of electrodes 72 of the corresponding semiconductor chip 70, and the plurality of tongue pieces 20 on the substrate 10 are pressed. Can be bent into the gap 30 on the substrate 10 immediately below the bump 90 according to the height difference between the bumps 90, and can be immersed to an appropriate depth. Then, the plurality of bumps 90 having the difference in height are securely connected to the plurality of electrodes 72 of the corresponding semiconductor chip by using the elastic force of the tongue piece 20 at a certain pressing force or more. it can.

FIG. 5 or FIG. 6 shows a preferred embodiment of the third mounting structure of the present invention, and FIG. 5 or FIG. Hereinafter, the third mounting structure will be described.

In the third mounting structure shown in FIG.
A plurality of protrusions 100 made of a flexible member are formed on the upper side and arranged in a grid at a predetermined pitch. A void 110 is formed inside the protrusion 100 so that the protrusion 100 is immersed.

The projection 100 is formed of a flexible synthetic resin sheet, and has a dome-shaped bulge above the substrate 10. The protrusions 100 are heated and softened by heating a flexible and thermoplastic synthetic resin sheet, and the synthetic resin sheet is vertically and horizontally inserted into the synthetic resin sheet by being sandwiched vertically by a press molding die. They are formed side by side.

The periphery of the projection 100 is thermocompression-bonded to the portion of the substrate 10 on which the connection circuit 40 is formed and the portion of the substrate 10 following the portion.

In the third mounting structure shown in FIG. 5, a via 160 formed by filling a through-hole with a conductor is provided on the periphery of the protrusion 100 immediately above the portion of the substrate 10 on which the connection circuit 40 is formed. The peripheral portion is formed to penetrate vertically. A connection terminal 120 made of a metal plating layer or the like is formed in a layer on the surface of the projection 100. And
The connection terminal 120 is electrically connected to the connection circuit 40 formed on the substrate 10 via the via 160.

In the third mounting structure shown in FIG.
In the center of the protrusion 100, a via 130 formed by filling a through hole with a conductor is formed by vertically penetrating the protrusion 100. On the surface of the projection 100, a connection terminal 120 made of a metal plating layer or the like is formed. The connection terminal 120 is connected to the via 130. On the rear surface of the projection 100, a conductor circuit 150 made of a metal plating layer or the like is formed. One end and the other end of the conductor circuit 150 are connected to the connection circuit 40 and the via 130 of the substrate 10. Then, the connection terminal 120 is
It is electrically connected to the connection circuit 40 of the substrate 10 via the via 130 and the conductor circuit 150.

The connection terminal 120 formed on the surface of the projection 100
The conductive bumps 80 formed on the electrodes 72 of the semiconductor chip are connected by pressure using the elastic force of the projections 100.

Specifically, as shown in FIG. 5 or 6, the semiconductor chip 70 is mounted with the bumps 80 on the electrodes 72 of the semiconductor chip mounted on the corresponding connection terminals 120 on the surface of the projection 100. It is pressed toward the substrate 10 using a spring material (not shown) or the like. Then, the bumps 80 on the electrodes 72 of the semiconductor chip are moved to the corresponding projections 10.
It is press-connected to the connection terminal 120 on the zero surface.

The third mounting structure shown in FIG. 5 or FIG.
With the above-described configuration, in the third mounting structure, even if there is a height difference between the bumps 80 on the plurality of electrodes 72 of the semiconductor chip 70, the bumps 80 are replaced with the corresponding substrate. The plurality of protrusions 100 on the substrate 10 are pressed against the connection terminals 120 on the surface thereof, and the plurality of protrusions 100 on the substrate 10 are bent into the recesses 110 inside the bumps 80 in accordance with the height difference of the bumps 80 and appropriately deepened. Can be immersed. Then, the plurality of bumps 8 having the height difference
0, a plurality of projections 100 on the substrate 10 corresponding to the
By using the elastic force of the projection 100, the connection terminal 120 on the front surface can be securely connected to the connection terminal 120 with a certain pressing force or more.

FIG. 7 or FIG. 8 shows a preferred embodiment of the fourth mounting structure of the present invention, and FIG. 7 or FIG. Hereinafter, the fourth mounting structure will be described.

In the fourth mounting structure shown in the figure, a bump 140 made of conductive Au or the like is formed on the connection terminal 120 formed on the surface of the projection 100 without forming a bump on the electrode 72 of the semiconductor chip. ing. And the bump 140
Is connected to the electrode 72 of the semiconductor chip by pressure using the elastic force of the projection 100.

In other respects, the structure is the same as that of the third mounting structure shown in FIG. 5 or FIG. 6, and in this fourth mounting structure, the connection terminals 120 on the surface of each of the plurality of projections 100 on the substrate 10 Even if there is a height difference between the upper bumps 140, each of the bumps 140 is replaced with the corresponding semiconductor chip 70.
Of the plurality of protrusions 100 on the substrate 10 according to the height difference of the respective bumps 140.
It can be flexed into the inner recess 110 and immersed to a suitable depth. Then, the plurality of bumps 140 having the difference in height can be securely pressed and connected to the corresponding plurality of electrodes 72 of the semiconductor chip by using the elastic force of the projection 100 at a certain pressing force or more.

FIG. 9 or FIG. 10 shows a preferred embodiment of the fifth mounting structure of the present invention, and FIG. 9 or FIG. 10 is an explanatory view thereof. Hereinafter, the fifth mounting structure will be described.

In the fifth mounting structure shown in FIG. 9, a substantially hemispherical projection 200 made of an elastic polyimide resin or the like is formed on the semiconductor chip 70 near the electrode 72 by potting or the like. On the surface of the protrusion 200, a terminal 210 made of a metal plating layer or the like is formed. One end of the terminal 210 is connected to the electrode 72 of the semiconductor chip near the protrusion 200 in series.

In the fifth mounting structure shown in FIG. 10, substantially hemispherical projections 220 made of a resilient polyimide resin or the like are formed on the semiconductor chip 70 near the electrodes 72 in a two-stage manner by potting or the like. ing. A terminal 210 made of a metal plating layer or the like is formed on the surface of the projection 220. One end of the terminal 210 is connected in series to the electrode 72 of the semiconductor chip near the protrusion 220.

On the terminals 210 on the surfaces of the projections 200 and 220, bumps 230 made of conductive Au or the like are formed. Then, the bump 230 is press-connected to the connection terminal 50 on the substrate 10 by using the elastic force of the projections 200 and 220.

More specifically, with the plurality of projections 200 and 220 on the semiconductor chip 70 mounted on the corresponding connection terminals 50 on the substrate 10, the semiconductor chip 70 is mounted on a spring material (not shown) or the like. And is pressed in the direction of the substrate 10. Then, the bumps 230 formed on the terminals 210 on the surfaces of the projections 200 and 220 are press-connected to the corresponding connection terminals 50 on the substrate 10 by using the elastic force of the projections 200 and 220.

The fifth mounting structure shown in FIG. 9 or FIG. 10 is configured as described above. In the fifth mounting structure, a plurality of projections 200 on the semiconductor chip 70 are provided.
Even if there is a height difference between the bumps 230 formed on the terminals 210 on the surface 220, each of the bumps 230 is pressed against a corresponding one of the plurality of connection terminals 50 on the substrate 10 to form a plurality of bumps on the semiconductor chip 70. Each projection 200, 220
Can be appropriately squashed below the bumps 230 by an appropriate amount according to the height difference between the bumps 230. Then, the plurality of bumps 230 having the difference in height are attached to the plurality of connection terminals 50 on the substrate 10 corresponding to the bumps 230, 22.
With the use of the elastic force of 0, pressure connection can be performed with a certain pressing force or more.

FIG. 11 or FIG. 12 shows a preferred embodiment of the sixth mounting structure of the present invention, and FIG. 11 or FIG. Hereinafter, the sixth mounting structure will be described.

In the sixth mounting structure of FIG. 11 or FIG.
A bump 240 made of conductive Au or the like is formed on the connection terminal 50 on the substrate 10 without forming a bump on the terminal 210 on the surface of the projections 200 and 220.

Then, the protrusions 20 on the semiconductor chip 70
The terminals 210 formed on the surfaces of the substrate 2 and the corresponding bumps 2 formed on the corresponding connection terminals 50 on the substrate 10
40 is press-connected by using the elastic force of the projections 200 and 220.

In other respects, the structure is the same as that of the fifth mounting structure shown in FIG. 9 or FIG. 10, and in this sixth mounting structure, it is formed on a plurality of connection terminals 50 on the substrate 10. Even if there is a height difference between the bumps 240, the bumps 240 are pressed against the corresponding terminals 210 on the surface of the plurality of projections 200 and 220 on the semiconductor chip 70, and the respective bumps 240 on the semiconductor chip 70 are pressed. 200, 220
Can be squashed appropriately and flat below the bumps 240 in accordance with the height difference. Then, the plurality of bumps 240 having the difference in height are fixed to the corresponding terminals 210 on the surfaces of the plurality of protrusions 200 and 220 on the semiconductor chip 70 by using the elastic force of the protrusions 200 and 220 to a certain degree. Pressing connection can be made with a pressing force or higher.

FIG. 13 shows a preferred embodiment for the seventh mounting structure of the present invention, and FIG. 13 is an explanatory view thereof. Hereinafter, the seventh mounting structure will be described.

In the seventh mounting structure shown in FIG.
A plurality of protrusions 250 made of a flexible member are formed on a grid at a predetermined pitch vertically and horizontally. A space 260 is formed inside the protrusion 250 so that the protrusion 250 is immersed.

The protrusion 250 is formed of a flexible synthetic resin sheet and has a dome shape. The protrusions 250 are formed by vertically and horizontally arranging the synthetic resin sheet vertically and horizontally by sandwiching the synthetic resin sheet up and down with a press molding die in a state where the synthetic resin sheet which is thermoplastic and thermoplastic is heated and softened. ing.

The synthetic resin sheet around the projection 250
The semiconductor chip 70 on which the electrode 72 is formed and the subsequent semiconductor chip 70 are thermocompression-bonded.

At the periphery of the protrusion 250 immediately above the electrode 72,
A via 270 in which a conductor is filled in a through hole is formed by vertically penetrating the periphery of the projection 250. A terminal 280 made of a metal plating layer or the like is formed on the surface of the projection 250. Terminal 280 is connected to via 270. The terminal 280 is electrically connected to the electrode 72 of the semiconductor chip via the via 270.

A bump 300 made of conductive Au or the like is formed on the terminal 280 on the surface of the projection 250.

The bump 300 formed on the terminal 280 on the surface of the projection 250 on the semiconductor chip 70 is press-connected to the connection terminal 50 on the substrate 10 by using the elastic force of the projection 250.

More specifically, as shown in FIG. 13, the terminals 280 on the surface of each of the plurality of projections 250 on the semiconductor chip 70 are formed.
With the upper bump 300 mounted on each of the plurality of connection terminals 50 on the substrate 10 corresponding thereto, the semiconductor chip 70
Is pressed in the direction of the substrate 10 using a spring material (not shown) or the like. Then, the bump 300 on the terminal 280 on the surface of each of the plurality of protrusions 250 on the semiconductor chip 70 is attached to the corresponding one of the plurality of connection terminals 50 on the substrate 10.
The pressure connection is performed by using the elastic force of 50.

The seventh mounting structure shown in FIG. 13 is configured as described above, and in the seventh mounting structure,
Terminal 2 on the surface of each of a plurality of protrusions 250 on semiconductor chip 70
Even if there is a difference in height between the bumps 300 on the semiconductor chip 70, the respective bumps 300 are pressed against the corresponding connection terminals 50 on the substrate 10, and the respective projections 250 on the semiconductor chip 70 In accordance with the height difference of the bump 300, the bump 300 can be bent into the space 260 inside the bump 300 to be appropriately immersed in the depth. Then, the plurality of bumps 300 having the difference in height can be pressed and connected to the corresponding plurality of connection terminals 50 on the substrate 10 by using the elastic force of the projection 250 at a certain pressing force or more.

FIG. 14 shows a preferred embodiment of the eighth mounting structure of the present invention, and FIG. 14 is an explanatory view thereof. Hereinafter, the eighth mounting structure will be described.

In the eighth mounting structure shown in FIG.
A bump 310 made of conductive Au or the like is formed on the connection terminal 50 on the substrate 10 without forming a bump on the terminal 280 on the surface of the protrusion 250 on the substrate 0. Then, the bump 310 is press-connected to the terminal 280 on the surface of the protrusion 250 on the semiconductor chip 70 by using the elastic force of the protrusion 250.

In other respects, the structure is the same as that of the seventh mounting structure shown in FIG. 13. In the eighth mounting structure, the bumps 31 on the plurality of connection terminals 50 on the substrate 10 are provided.
Even if there is a height difference between the bumps 310, each of the bumps 310 is replaced with a corresponding one of the plurality of projections 250 on the semiconductor chip 70.
The plurality of protrusions 250 on the semiconductor chip 70 can be pressed into the terminals 280 on the front surface and bent into the gaps 260 inside the bumps 310 in accordance with the height difference of the bumps 310 so as to be immersed to an appropriate depth. Then, the plurality of bumps 310 having the height difference are connected to the corresponding semiconductor chip 7.
0 on the terminals 280 on the surface of each of the plurality of protrusions 250
By using the elastic force of 50, pressure connection can be performed with a certain pressing force or more.

In the first or second mounting structure, as shown in FIG.
A tongue piece 20 made of a conductive flexible synthetic resin material also serving as a connection terminal 50 via a pillar 22 made of a conductive flexible synthetic resin material, The tongue piece 20 in which the gap 30 is formed may be extended in the lateral direction.
Then, the bump 80 formed on the electrode 72 of the semiconductor chip is attached to the tongue piece 20 also serving as the connection terminal 50.
The bump 90 formed on the tongue piece 20 serving as the connection terminal 50 or the connection terminal 50 by using the elastic force of zero.
The electrode 72 of the semiconductor chip may be connected by pressure using the elastic force of the tongue piece 20.

Alternatively, as shown in FIG. 16, the pillar 22 and the tongue piece 20 are formed of a non-conductive flexible synthetic resin material, and the surfaces of the pillar 22 and the tongue piece 20 are covered with a metal plating layer or the like. It is also possible to form a conductor layer 24 for the connection terminal 50 which is a conductor layer 24 that is electrically connected to the connection circuit 40 on the substrate 10. The connection terminal 50 on the surface of the tongue piece 20
The bump 80 formed on the electrode 72 of the semiconductor chip is press-connected to the conductor layer 24 using the elastic force of the tongue piece 20, or the conductor layer for the connection terminal 50 on the surface of the tongue piece 20 is formed. The bumps 90 formed on the semiconductor chip 24 may be press-connected to the electrodes 72 of the semiconductor chip by using the elastic force of the tongue piece 20.

As shown in FIG. 17, the tongue piece 20 may be formed by arranging a plurality of small tongue pieces 22 on the substrate 10 in a radial pattern. Then, predetermined bumps 80 formed on the electrodes 72 of the semiconductor chip may be connected by pressure to the connection terminals 50 formed on the surfaces of the plurality of small tongue pieces 22 of the tongue piece 20. Then, the predetermined bump 80 is attached to the substrate 10.
You may make it electrically connect to the connection terminal 50 of the surface of the upper tongue piece 20 reliably.

In the fifth or sixth mounting structure, as shown in FIG. 18, the projections 200 and 220 are formed on the electrodes 72 of the semiconductor chip, and the projections 200 and 220 immediately above the electrodes 72 are formed. A via 74 formed by filling a through-hole with a conductor may be formed in the portion by vertically penetrating the protrusions 200 and 220. Then, the electrodes 72 of the semiconductor chip may be electrically connected to the terminals 210 on the surfaces of the projections 200 and 220 via the vias 74.

In the fifth mounting structure shown in FIG. 9 or FIG. 10, the bumps 230 are not formed on the terminals 210, and the terminals 210 are connected to the connection terminals 50 on the substrate 10, and the projections 200 and 220 are formed. May be directly connected by pressure using the elastic force possessed by the above, and even in such a case, a mounting structure having substantially the same operation as the fifth mounting structure shown in FIG. 9 or FIG. 10 can be provided.

Similarly, also in the sixth mounting structure shown in FIG. 11 or FIG. 12, the terminal 210 is connected to the connection terminal 50 on the substrate 10 without forming the bump 240 on the connection terminal 50 on the substrate 10. , May be directly connected by pressure using the elastic force of the projections 200 and 220. Even in such a case, the mounting structure having substantially the same operation as the sixth mounting structure shown in FIG. 11 or FIG. Can be provided.

[0074]

As described above, according to the first to eighth mounting structures of the present invention, the bumps formed on the respective electrodes of the semiconductor chip and the surfaces of the respective tongue pieces on the substrate are formed. A bump formed on the connection terminal, a bump formed on the connection terminal on each of the plurality of protrusion surfaces on the substrate, a bump formed on a terminal on each of the plurality of protrusion surfaces on the semiconductor chip, or a plurality of bumps on the substrate Even if there is a height difference between the bumps formed on the respective connection terminals, the respective bumps are replaced with a plurality of the respective connection terminals formed on the surface of the tongue piece on the substrate and a plurality of the respective electrodes of the semiconductor chip. A plurality of connection terminals on the surface of each of the plurality of protrusions on the substrate, a plurality of connection terminals on the substrate, or a plurality of terminals on the surface of each of the plurality of protrusions on the semiconductor chip, using a resilient force of the tongue or the protrusion, Pressure connection can be made reliably with a pressing force or higher. The plurality of bumps can be polished or the like to eliminate the need to make the heights of the bumps uniform.

[Brief description of the drawings]

FIG. 1 is a plan view of a substrate having a first mounting structure according to the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is an explanatory diagram of a first mounting structure of the present invention.

FIG. 4 is an explanatory diagram of a second mounting structure of the present invention.

FIG. 5 is an explanatory diagram of a third mounting structure of the present invention.

FIG. 6 is an explanatory diagram of a third mounting structure of the present invention.

FIG. 7 is an explanatory diagram of a fourth mounting structure of the present invention.

FIG. 8 is an explanatory diagram of a fourth mounting structure of the present invention.

FIG. 9 is an explanatory diagram of a fifth mounting structure of the present invention.

FIG. 10 is an explanatory diagram of a fifth mounting structure of the present invention.

FIG. 11 is an explanatory diagram of a sixth mounting structure of the present invention.

FIG. 12 is an explanatory diagram of a sixth mounting structure of the present invention.

FIG. 13 is an explanatory diagram of a seventh mounting structure of the present invention.

FIG. 14 is an explanatory diagram of an eighth mounting structure of the present invention.

FIG. 15 is a front sectional view of a substrate having the first or second mounting structure of the present invention.

FIG. 16 is a front sectional view of a substrate having the first or second mounting structure of the present invention.

FIG. 17 is a partially enlarged plan view of a substrate having the first or second mounting structure of the present invention.

FIG. 18 is a partially enlarged front sectional view of a semiconductor chip having a fifth or sixth mounting structure according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Substrate 12a Slit 20 Tongue piece 30 Void 40 Connection circuit 50 Connection terminal 70 Semiconductor chip 72 Semiconductor chip electrode 80, 90 Bump 100 Projection 110 Void 120 Connection terminal 130, 160 Via 140 Bump 200, 220 Projection 210 Terminal 230, 240 Bump 250 Projection 260 Void 270 Via 280 Terminal 300, 310 Bump

Claims (8)

[Claims] 1. A tongue piece made of a flexible member formed on a substrate, and a tongue piece surface on which a gap is formed on a substrate directly below the tongue piece, the connection circuit of the substrate being electrically connected to the tongue piece. To the substrate of the semiconductor chip in which electrically connected connection terminals are formed, and conductive bumps formed on the electrodes of the semiconductor chip are connected to the connection terminals by pressure contact using the elastic force of the tongue pieces. Mounting structure. 2. A tongue piece formed of a flexible member formed on a substrate, and a surface of the tongue piece formed with a space for immersing the tongue piece on a substrate immediately below the tongue piece is electrically connected to a connection circuit of the substrate. A connection terminal connected to the semiconductor chip is formed, and a conductive bump formed on the connection terminal is pressure-connected to an electrode of the semiconductor chip by using an elastic force of the tongue. Mounting structure. 3. A connection electrically connected to a connection circuit of the substrate on a surface of the projection formed of a flexible member formed on the substrate and having a void formed therein so as to be immersed therein. A mounting structure of a semiconductor chip on a substrate, wherein a terminal is formed and a conductive bump formed on an electrode of the semiconductor chip is press-connected to the connection terminal by using an elastic force of the projection. 4. A connection electrically connected to a connection circuit of the substrate on a surface of the projection formed of a flexible member formed on the substrate and having a void formed therein so that the projection is immersed therein. A mounting structure of a semiconductor chip on a substrate, wherein a terminal is formed, and a conductive bump formed on the connection terminal is press-connected to an electrode of the semiconductor chip by using an elastic force of the projection. 5. A terminal electrically connected to an electrode of the semiconductor chip is formed on a surface of an elastic projection formed on the semiconductor chip, and a conductive bump formed on the terminal is formed on a substrate. A mounting structure of a semiconductor chip mounted on a substrate, which is connected to an upper connection terminal by pressure using an elastic force of the projection. 6. A terminal electrically connected to an electrode of the semiconductor chip is formed on an elastic projection surface formed on the semiconductor chip, and the terminal is formed on a connection terminal on the substrate. A mounting structure of a semiconductor chip on a substrate, in which conductive bumps are connected by pressure using the elastic force of the projections. 7. A projection formed of a flexible member formed on a semiconductor chip, and electrically connected to an electrode of the semiconductor chip on a surface of the projection formed with a void inside the projection to immerse the projection. A semiconductor chip mounting structure in which a terminal is formed and a conductive bump formed on the terminal is press-connected to a connection terminal on the substrate by using an elastic force of the protrusion. 8. A projection formed of a flexible member formed on a semiconductor chip, and electrically connected to an electrode of the semiconductor chip on a surface of the projection formed with a void inside the projection for recessing the projection. A semiconductor chip mounting structure in which a terminal is formed, and a conductive bump formed on a connection terminal on the substrate is press-connected to the terminal by using an elastic force of the projection.