JPH10321981A - Method of connecting wires for printed board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To avoid heating the soldered parts to high temps. by forming lands of metal foils integrated with a wiring pattern on the surface of a printed board, forming a resist film on this surface so at to cover a part thereof, laminating a metal plate and soldering wires to portions corresponding to the resist film. SOLUTION: On the surface of a printed board 1 a wiring pattern is formed, lands 3 of the metal foils as the wiring pattern 2 are formed together with the wiring pattern, a resist film 6 is formed on the surface of the lands 3, solder paste is applied, and a metal plate is laminated and heated with leaving gaps between the metal plate 3 and resist film 6, thereby avoiding heating the soldered parts at high temps.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board on which various electronic components are mounted, and to a wiring pattern formed on the surface of the printed circuit board, an input electric wire from outside or an output to outside. The present invention relates to a method of connecting various electric wires such as electric wires or a harness by soldering.

[0002]

2. Description of the Related Art Recently, a printed circuit board used for various kinds of electric equipment has a wiring pattern formed of a metal foil such as copper on the surface of the printed circuit board. There are cases where various electric wires such as an output electric wire to the outside or a harness or the like is directly connected.

In such a case, conventionally, a land portion made of the same metal foil as the wiring pattern is formed on the surface of the printed circuit board at the same time when the wiring pattern is formed. After soldering a metal plate such as nickel, the various electric wires or harnesses are connected to the metal plate by soldering.

[0004]

However, in the conventional method, the metal plate is soldered to the land portion of the printed circuit board on the back surface, and various electric wires or harnesses are connected to the surface of the metal plate. When soldering various wires or harnesses to the surface, the heat applied to the surface of the metal plate at this time is transmitted to the back surface of the metal plate, and the land on the printed board is Since the solder to the part is melted, there has been a problem that the mounting position of the metal plate on the printed board is shifted in the horizontal direction or the metal plate is often detached from the printed board.

An object of the present invention is to provide a connection method which can solve this problem.

[0006]

In order to achieve this technical object, the present invention provides a method of forming a land portion on a surface of a printed circuit board, the land portion being made of a metal foil integrated with a wiring pattern made of a metal foil on the surface. After forming a resist film on the surface of the portion so as to cover a part of the surface of the land portion, a metal plate is superimposed on the land portion and soldered on the back surface thereof, and then the metal plate is Various wires, harnesses, and the like are soldered to portions of the surface corresponding to the resist film. "
Things.

[0007]

As described above, the resist film is formed on the surface of the land portion formed on the printed circuit board so as to cover a part of the surface of the land portion. By laminating metal plates and soldering on the back surface, the metal plate is soldered to the land only on the surface of the land where no resist film is formed, and the resist film is Is not soldered.

Therefore, as described above, by soldering various wires or harnesses to the portion corresponding to the resist film on the surface of the metal plate, the heat generated when soldering the wires and the like is reduced. Since it is applied to a portion of the metal plate that is not soldered to the land, it is ensured that the portion of the metal plate that is soldered to the land has a high temperature. It can be reduced to

Therefore, according to the present invention, when various electric wires or harnesses are connected to a metal plate soldered to a land portion integral with a wiring pattern on a printed circuit board by soldering, the land portion of the metal plate is connected to the land portion of the metal plate. This has the effect of greatly reducing the possibility that the position of the metal plate attached to the printed circuit board will shift laterally or the metal plate will be detached from the printed circuit board due to the melting of the solder fixed thereto.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. In this figure, reference numeral 1 denotes a printed circuit board, and a wiring pattern 2 made of metal foil such as copper is formed on the surface of the printed circuit board 1 and a land made of the same metal foil as copper as the wiring pattern 2 is formed. The part 3 is formed integrally with the wiring pattern 2 when the wiring pattern 2 is formed.

Then, a metal plate 4 made of nickel or the like is superposed on the land portion 3 of the printed circuit board 1 and then soldered. Then, various electric wires 5 are soldered on the surface of the metal plate 4. To connect. In this case, as shown in FIGS. 2 to 4, a resist film 6 is applied to the surface of the land 3 on the printed board 1, for example, in a cross shape. It is formed so as to cover a part. The resist film 6 is formed by screen printing.

Next, as shown in FIG. 5, the metal plate 4 is overlaid on the surface of the land portion 3 of the printed circuit board 1, and soldered on the back surface. The soldering is performed by applying a solder paste on the surface of the land portion 3 in advance by screen printing or the like, and then superposing and heating the metal plate 4. By this soldering, the metal plate 4 is soldered to the land 3 only in a portion of the surface of the land 3 where the resist film 6 is not formed, and in the portion of the resist film 6 , It will not be soldered.

Then, various electric wires 5 are applied to a portion corresponding to the resist film 6 on the surface of the metal plate 4.
As shown in FIGS. 6 to 8, by soldering, heat at the time of soldering the electric wire 5 is applied to a portion of the metal plate 4 which is not soldered to the land portion 3. Therefore, it is possible to surely prevent the portion of the metal plate 4 that is soldered to the land portion 3 from becoming high in temperature.

As shown, by coating the resist film 6 in a cross shape, the metal plate 4 can be soldered to the lands 3 at its four corners. The strength of soldering to the land 3 can be secured. The metal plate 4
As described above, when soldering to the land portion 3, the resist film 6 is formed on the surface of the land portion 3, then the solder paste is applied, and the metal plate 4 is overlapped and heated. Since a gap is formed between the resist film 6 and the resist film 6 as shown in the figure, there is an advantage that the above-mentioned effect can be more reliably achieved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a disassembled state in an embodiment of the present invention.

FIG. 2 is a perspective view showing a state in which a resist film is partially formed on a surface of a land portion on a printed circuit board.

FIG. 3 is a sectional view taken along line III-III of FIG. 2;

FIG. 4 is a sectional view taken along line IV-IV of FIG. 2;

FIG. 5 is a perspective view showing a state where a metal plate is overlaid on the land.

FIG. 6 is a perspective view showing a state where an electric wire is connected to the metal plate by soldering.

FIG. 7 is a sectional view taken along the line VII-VII in FIG. 6;

8 is a sectional view taken along line VIII-VIII of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Wiring pattern 3 Land part 4 Metal plate 5 Electric wire 6 Resist film

Claims (1)

[Claims] 1. A land portion made of a metal foil integral with a wiring pattern made of a metal foil on the surface of the printed circuit board, and a resist film is formed on the surface of the land portion, and a part of the surface of the land portion is formed. Then, a metal plate is superimposed on the land portion, and soldered on the back surface thereof. Then, on a portion of the surface of the metal plate corresponding to the resist film, various types of A method of connecting an electric wire or the like to a printed circuit board, wherein an electric wire or a harness is soldered.